CN110518108A - 一种led灯条制备方法 - Google Patents
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Abstract
本发明公开了一种LED灯条制备方法，包括以下步骤：选用铝基板，在铝基板一侧面上设置加强筋，在另一侧面上设置散热垫，在散热垫上固定电路板；在电路板上安装LED芯片，在LED芯片底部涂刷固化胶并与电路板连接；打线连接LED芯片，并与电路板上电极相连；在电路板和LED芯片上部填充密封树脂；在密封树脂上安装透镜；本发明的LED灯条制备方法，结构简单，操作方便，成本低，电路板与基板之间连接可靠，不会发生接触不良、漏电等问题。
Description
技术领域
本发明属于LED灯条领域，更具体的说涉及一种LED灯条制备方法。
背景技术
发光二极管(LED)以其采用恒流驱动，具有节能环保、体积小、低功耗、使用寿命长而大获发展。相比于传统白炽灯，LED发光由于其点光源和方向性的特点，使得很难直接替代传统白炽灯的使用，所以现在人们将LED通过封装制程将LED芯片制成灯丝条，接入电流电源后便可像钨丝灯一样全角度发光。其中LED灯丝灯中的LED通常以串联或并联，或串并结合和的方式固定在一起，通过连线连接，然后装配上必要的驱动电源、灯头等零件形成完整的LED灯泡，这不仅具备了常规LED灯的节能环保、寿命长的优点，还实现了常规白炽灯全角度发光的特性，深受照明市场欢迎。
LED灯丝灯虽然具备了传统白炽灯全角度发光的特性，但是目前使用的灯丝灯条仍然存在产品质量不稳定，一致性差的缺点，通常容易出现虚焊导致接触不良、金球焊偏导致漏电死灯、封装步骤复杂成本居高不下，以及成品良率低等情形。另外，现有的LED灯丝芯片依附基板，单向连续分布在基板两侧，既影响了部分光线的透射，又阻碍热的散出。
发明内容
本发明的目的在于提供一种LED灯条制备方法，结构简单，操作方便，成本低，电路板与基板之间连接可靠，不会发生接触不良、漏电等问题。
本发明技术方案一种LED灯条制备方法，包括以下步骤：
(1)选用铝基板，在铝基板一侧面上设置加强筋，在另一侧面上设置散热垫，在散热垫上固定电路板；
(2)在电路板上安装LED芯片，在LED芯片底部涂刷固化胶并与电路板连接；
(3)打线连接LED芯片，并与电路板上电极相连；
(4)在电路板和LED芯片上部填充密封树脂；
(5)在密封树脂上安装透镜。
优选的，所述加强筋呈网格状分布在铝基板侧面。
优选的，所述加强筋与铝基板一体成型。
优选的，所述散热垫为纳米石墨烯粉。
优选的，所述固化胶为环氧树脂。
优选的，所述密封树脂通过纳米石墨烯改性。
本发明技术方案的有益效果是：
本发明技术方案的一种LED灯条制备方法，本方法操作简单方便，成本低，电路板与基板之间连接可靠，不会发生接触不良、漏电等问题。
具体实施方式
为便于本领域技术人员理解本发明技术方案，现对本发明技术方案做进一步的说明。
一种LED灯条制备方法，包括以下步骤：
(1)选用铝基板，在铝基板一侧面上设置加强筋，在另一侧面上设置散热垫，在散热垫上固定电路板；加强筋的设置主要是为了降低铝基板自身的厚度，铝基板厚度降低后，其强度也会大大降低，设置网格状的加强筋，提高铝基板的强度，避免其变形或弯曲；铝基板厚度降低，便于散热，提高散热效率；散热垫设置在电路板与铝基板之间，便于电路板在铝基板上的固定，避免了焊接连接，同时也有效的避免了灯条在运输等过程中发生振动而导致灯条上的另一部件松动甚至脱落的问题；
(2)在电路板上安装LED芯片，在LED芯片底部涂刷固化胶并与电路板连接；LED芯片通过固化胶与电路板连接，连接可靠稳定，连接接触面积大，不会发生脱落等问题；
(3)打线连接LED芯片，并与电路板上电极相连；
(4)在电路板和LED芯片上部填充密封树脂；利用密封树脂进行封装，实现对电路板和LED芯片及其上的导线、电极及其相互之间的连接方式进行保护，进行固定，有效的避免了灯条中各个元器件发生松动问题；
(5)在密封树脂上安装透镜。
所述加强筋呈网格状分布在铝基板侧面，所述加强筋与铝基板一体成型，所述散热垫为纳米石墨烯粉；散热垫一方面作为固定基座连接电路板与铝基板，另一方面其导热性能良好，保证了其散热能力，甚至起到了将电路板上热量快速的导入铝基板上，利于铝基板将电路板上热量快速的散发出去。
所述固化胶为环氧树脂，所述密封树脂通过纳米石墨烯改性；经过石墨烯改性后的密封树脂，具有良好的导热性能，便于LED芯片散热。
本发明技术方案在上面进行了示例性描述，显然本发明具体实现并不受上述方式的限制，只要采用了本发明的方法构思和技术方案进行的各种非实质性改进，或未经改进将发明的构思和技术方案直接应用于其它场合的，均在本发明的保护范围之内。
Claims (6)
1.一种LED灯条制备方法，其特征在于，包括以下步骤：
(1)选用铝基板，在铝基板一侧面上设置加强筋，在另一侧面上设置散热垫，在散热垫上固定电路板；
(2)在电路板上安装LED芯片，在LED芯片底部涂刷固化胶并与电路板连接；
(3)打线连接LED芯片，并与电路板上电极相连；
(4)在电路板和LED芯片上部填充密封树脂；
(5)在密封树脂上安装透镜。
2.根据权利要求1所述的一种LED灯条制备方法，其特征在于，所述加强筋呈网格状分布在铝基板侧面。
3.根据权利要求2所述的一种LED灯条制备方法，其特征在于，所述加强筋与铝基板一体成型。
4.根据权利要求1所述的一种LED灯条制备方法，其特征在于，所述散热垫为纳米石墨烯粉。
5.根据权利要求1所述的一种LED灯条制备方法，其特征在于，所述固化胶为环氧树脂。
6.根据权利要求1所述的一种LED灯条制备方法，其特征在于，所述密封树脂通过纳米石墨烯改性。
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN104774470A (zh) * | 2015-03-25 | 2015-07-15 | 清华大学深圳研究生院 | 一种用于大功率led的密封剂及大功率led |
| CN106129240A (zh) * | 2016-08-05 | 2016-11-16 | 江苏新宝玛光电制造有限公司 | 基于石墨烯材质的大功率led芯片及其cob封装方法 |
| CN205752147U (zh) * | 2016-05-04 | 2016-11-30 | 深圳市领德奥普电子有限公司 | 节能散热式灯板 |
| CN205985070U (zh) * | 2016-08-30 | 2017-02-22 | 湖北惠商电路科技有限公司 | 一种led线路板组件 |
| CN207504002U (zh) * | 2017-11-21 | 2018-06-15 | 江油星联电子科技有限公司 | 一种新型高端化铝基板 |
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- 2019-07-09 CN CN201910616855.XA patent/CN110518108A/zh active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104774470A (zh) * | 2015-03-25 | 2015-07-15 | 清华大学深圳研究生院 | 一种用于大功率led的密封剂及大功率led |
| CN205752147U (zh) * | 2016-05-04 | 2016-11-30 | 深圳市领德奥普电子有限公司 | 节能散热式灯板 |
| CN106129240A (zh) * | 2016-08-05 | 2016-11-16 | 江苏新宝玛光电制造有限公司 | 基于石墨烯材质的大功率led芯片及其cob封装方法 |
| CN205985070U (zh) * | 2016-08-30 | 2017-02-22 | 湖北惠商电路科技有限公司 | 一种led线路板组件 |
| CN207504002U (zh) * | 2017-11-21 | 2018-06-15 | 江油星联电子科技有限公司 | 一种新型高端化铝基板 |
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