CN110491817A - A kind of adjustable slice turning device - Google Patents
A kind of adjustable slice turning device Download PDFInfo
- Publication number
- CN110491817A CN110491817A CN201910828479.0A CN201910828479A CN110491817A CN 110491817 A CN110491817 A CN 110491817A CN 201910828479 A CN201910828479 A CN 201910828479A CN 110491817 A CN110491817 A CN 110491817A
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- Prior art keywords
- shaft
- silicon wafer
- hole
- turning device
- overturning
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 60
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 60
- 239000010703 silicon Substances 0.000 claims abstract description 60
- 230000007306 turnover Effects 0.000 claims abstract description 37
- 230000007246 mechanism Effects 0.000 claims abstract description 34
- 230000005540 biological transmission Effects 0.000 claims abstract description 18
- SBEQWOXEGHQIMW-UHFFFAOYSA-N silicon Chemical compound [Si].[Si] SBEQWOXEGHQIMW-UHFFFAOYSA-N 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 38
- 230000006872 improvement Effects 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 239000003638 chemical reducing agent Substances 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000006117 anti-reflective coating Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000008216 herbs Nutrition 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 230000006641 stabilisation Effects 0.000 description 1
- 238000011105 stabilization Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67718—Changing orientation of the substrate, e.g. from a horizontal position to a vertical position
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of adjustable slice turning devices, the device includes bracket, and bracket is equipped with: shaft, is arranged with two turnover discs in shaft, radially spaced on turnover disc to be provided with multiple holding tanks for being used to accommodate silicon wafer, silicon chip clamping is fixed in the holding tank cooperation on two turnover discs；Driving mechanism, driving mechanism are connect with shaft, the rotation of driving mechanism drive shaft, and shaft can drive turnover disc by silicon wafer from one side overturning to another side；Edge, which is axially arranged with, in shaft can be moved on one side another side from shaft by through hole with the matched through hole of die size, silicon wafer；Transmission mechanism, transmission mechanism are used to that silicon wafer to be sent in holding tank to and be accepted the silicon wafer after overturning, and transmission mechanism is also used to that silicon wafer is moved to another side from shaft on one side by through hole.Adjustable slice turning device of the invention can be able to achieve the overturning of silicon wafer when needing to overturn, and overturning is high-efficient, and can guarantee that silicon wafer smoothly passes when not needing overturning.
Description
Technical field
The present invention relates to silicon wafer processing equipment technical field, in particular to a kind of adjustable slice turning device.
Background technique
Generally, include with next step to the process of silicon chip of solar cell: 1, making herbs into wool, by silicon chip surface corruption
Lose the pattern of pyramid；2, it spreads, silicon chip surface forms PN junction；3, it etches, the PN junction of silicon chip edge is removed, electricity is prevented
Pond short circuit；4, PSG is removed, cleaning silicon chip surface removes silicon dioxide layer；5, PECVD plates one layer of antireflective coating in silicon chip surface；
6, printing-sintering, prints electrode and back surface field, and dries sintering.
In above-mentioned recipe step, it is sometimes desirable to by silicon wafer turnover, in the invention of Publication No. CN207116380U
A kind of silicon wafer fast turnover mechanism is disclosed in patent, can to silicon wafer realize quickly overturning, and for different silicon wafers with
And different processing methods, when silicon wafer circulates between different station, it is sometimes desirable to which overturning does not need to overturn sometimes, this is just needed
One kind can be able to achieve overturning when needing to overturn, and not need to guarantee the device that silicon wafer smoothly passes when overturning.
Summary of the invention
In view of the deficiencies of the prior art, it is an object of that present invention to provide a kind of structurally reasonable, multi-functional adjustable flaps
Device.It is adopted the following technical scheme that
A kind of adjustable slice turning device comprising bracket, the bracket are equipped with:
Shaft, is arranged with two turnover discs in the shaft, on the turnover disc it is radially spaced be provided with it is multiple for holding
Receive the holding tank of silicon wafer, silicon wafer is fixed in the holding tank cooperation on two turnover disc；
Driving mechanism, the driving mechanism are connect with the shaft, and the driving mechanism drives the shaft rotation, described
Shaft can drive the turnover disc by silicon wafer from one side overturning to another side；
In the shaft along be axially arranged with the matched through hole of die size, silicon wafer can be by the through hole from described
Shaft is moved to another side on one side；
Transmission mechanism, the transmission mechanism are used to that silicon wafer to be sent in the holding tank to and be accepted the silicon wafer after overturning,
The transmission mechanism is also used to that silicon wafer is moved to another side from the shaft on one side by the through hole.
As a further improvement of the present invention, two through slots radially extended are symmetrically arranged on the turnover disc, it is described
Two openings of through hole are connected to two through slots respectively, and silicon wafer can be under the driving of the transmission mechanism by wherein consistent
Through slot enters the through hole, then is detached from from another through slot from the through hole.
As a further improvement of the present invention, axle sleeve is arranged in the shaft, the turnover disc is sheathed on the axle sleeve
On, the axle sleeve is equipped with the notch for being connected to the through slot and through hole.
As a further improvement of the present invention, radially spaced on the turnover disc to be provided with multiple demarcation plates, two is adjacent
The holding tank is formed between the demarcation plate.
As a further improvement of the present invention, it is equipped with stiffening plate on two faces of the demarcation plate, the stiffening plate
Extend the demarcation plate in edge.
As a further improvement of the present invention, the stiffening plate is screwed on the demarcation plate.
As a further improvement of the present invention, the transmission mechanism includes conveyer belt, and the conveyer belt is arranged in described in two
Between turnover disc.
As a further improvement of the present invention, the driving mechanism includes stepper motor.
Beneficial effects of the present invention:
Adjustable slice turning device of the invention can be able to achieve the overturning of silicon wafer when needing to overturn, and overturning is high-efficient, and
By the way that through hole is arranged in shaft, guarantee that silicon wafer smoothly passes when not needing overturning.The apparatus structure is reasonable, automates journey
Degree is high, can greatly improve production efficiency.
The above description is only an overview of the technical scheme of the present invention, in order to better understand the technical means of the present invention,
And it can be implemented in accordance with the contents of the specification, and in order to allow above and other objects, features and advantages of the invention can
It is clearer and more comprehensible, it is special below to lift preferred embodiment, and cooperate attached drawing, detailed description are as follows.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of adjustable slice turning device in the embodiment of the present invention；
Fig. 2 is the schematic diagram of internal structure of adjustable slice turning device in the embodiment of the present invention；
Fig. 3 is the structural schematic diagram of shaft in the embodiment of the present invention；
Fig. 4 is the structural schematic diagram of turnover disc in the embodiment of the present invention；
Fig. 5 is the structural schematic diagram of bottom bracket axle of the embodiment of the present invention.
Description of symbols: 100, bracket；101, bearing block；110, stepper motor；120, shaft；121, through hole；130, subtract
Fast machine；140, shaft coupling；150, turnover disc；151, demarcation plate；152, holding tank；153, stiffening plate；154, through slot；160, axis
Set；161, notch；200, silicon wafer.
Specific embodiment
The present invention will be further explained below with reference to the attached drawings and specific examples, so that those skilled in the art can be with
It more fully understands the present invention and can be practiced, but illustrated embodiment is not as a limitation of the invention.
It as shown in Figs. 1-5, is the adjustable slice turning device in the embodiment of the present invention, which includes bracket
100, bracket 100 is equipped with two bearings seat 101, shaft 120, driving mechanism and transmission mechanism, and the both ends of shaft 120 are respectively arranged on
On two axle bed seats 101.
Be arranged with two turnover discs 150 in shaft 120, on turnover disc 150 it is radially spaced be provided with it is multiple for accommodating silicon
The holding tank 152 of piece, the cooperation of holding tank 152 on two turnover discs 150 is fixed by silicon wafer 200, and the width of holding tank 152 is greater than silicon
The thickness of piece 200.
Driving mechanism is connect with shaft 120, and driving mechanism drive shaft 120 rotates, and shaft 120 can drive turnover disc 150
By silicon wafer 200 from one side overturning to another side.
Specifically, above-mentioned driving mechanism includes stepper motor 110, speed reducer 130 and shaft joint 140, stepper motor 110 with
Speed reducer 130 connects, and speed reducer 130 is connect by shaft joint 140 with shaft 120.
In shaft 120 along be axially arranged with the matched through hole 121 of die size, silicon wafer 200 can by through hole 121 from
Shaft 120 is moved to another side on one side.
Transmission mechanism is used to that silicon wafer 200 to be sent in holding tank 152 to and be accepted the silicon wafer 200 after overturning, transmission mechanism
It is also used to that silicon wafer is moved to another side from shaft 120 on one side by through hole 121.
Specifically, transmission mechanism includes conveyer belt and driving motor, conveyer belt is arranged between two turnover discs 150, driving
Motor driven conveyer belt.
As shown in figure 4, being symmetrically arranged with two through slots 154 radially extended on turnover disc 150, the two of through hole 121 are opened
Mouth is connected to two through slots 154 respectively, and silicon wafer 200, which can be entered under the driving of transmission mechanism by a wherein through slot 154, to be passed through
Through-hole 121, then be detached from from another through slot 154 from through hole 121.
In the present embodiment, radially spaced on turnover disc 150 to be provided with multiple demarcation plates 151, two adjacent separator plates 151
Between formed holding tank 152.
Preferably, it is equipped with stiffening plate 153 on two faces of demarcation plate 151, stiffening plate 153 is screwed in separation
On plate 151.It is furthermore preferred that the edge of stiffening plate 153 extends demarcation plate 151, gripping more to silicon wafer 200 can be made
Add stabilization.
In the present embodiment, axle sleeve 160 is arranged in shaft 120, turnover disc 150 is sheathed on axle sleeve 160, such as Fig. 5 institute
Show, axle sleeve 160 is equipped with the notch 161 of connection through slot 154 and through hole 121.
Silicon wafer 200 is transmitted to 150 side of turnover disc by conveyer belt, when needing to overturn silicon wafer 200, stepper motor 110
Drive shaft 120 rotates, and is in a horizontal position a holding tank 152, and the both sides of silicon wafer 200 are inserted into respectively under conveyer belt drive
In holding tank 152 on two turnover discs 150, silicon wafer 200 is overturn 180 degree by the rotation of 110 drive shaft 120 of stepper motor, until silicon
Silicon wafer 200 while being placed on conveyer belt by the another of piece 200 up, and silicon wafer 200 is driven by the conveyor belt from holding tank
It is detached from 152.It should be pointed out that needing to skip through slot 154 when stepper motor 110 drives turnover disc 150 to rotate, preventing
Silicon wafer 200 enters through slot 154.
When needing silicon wafer 200 from shaft 120 when being moved to another side on one side, stepper motor 110 drives turnover disc 150
It turns to through slot 154 and is in parallel position, the both sides of silicon wafer 200 are inserted on two turnover discs 150 respectively under conveyer belt drive
Side through slot 154 in, then silicon wafer 200 is entered in other side through slot 154 by through hole 121, and in conveyer belt band
It is detached from out of other side through slot 154 under dynamic, is moved to another side on one side to realize from shaft 120.
Adjustable slice turning device of the invention can be able to achieve the overturning of silicon wafer when needing to overturn, and overturning is high-efficient, and
By the way that through hole is arranged in shaft, guarantee that silicon wafer smoothly passes when not needing overturning.The apparatus structure is reasonable, automates journey
Degree is high, can greatly improve production efficiency.
Above embodiments are only to absolutely prove preferred embodiment that is of the invention and being lifted, and protection scope of the present invention is not
It is limited to this.Those skilled in the art's made equivalent substitute or transformation on the basis of the present invention, in guarantor of the invention
Within the scope of shield.Protection scope of the present invention is subject to claims.
Claims (8)
1. a kind of adjustable slice turning device, which is characterized in that including bracket, the bracket is equipped with:
Shaft, is arranged with two turnover discs in the shaft, on the turnover disc it is radially spaced be provided with it is multiple for accommodating silicon
Silicon wafer is fixed in the holding tank of piece, the holding tank cooperation on two turnover disc；
Driving mechanism, the driving mechanism are connect with the shaft, and the driving mechanism drives the shaft rotation, the shaft
The turnover disc can be driven silicon wafer from one side overturning to another side；
In the shaft along be axially arranged with the matched through hole of die size, silicon wafer can be by the through hole from the shaft
Be moved to another side on one side；
Transmission mechanism, the transmission mechanism is used to that silicon wafer to be sent in the holding tank and accepted the silicon wafer after overturning, described
Transmission mechanism is also used to that silicon wafer is moved to another side from the shaft on one side by the through hole.
2. adjustable slice turning device as described in claim 1, which is characterized in that be symmetrically arranged with two on the turnover disc radially
Two openings of the through slot of extension, the through hole are connected to two through slots respectively, and silicon wafer can be in the transmission mechanism
Driving is lower to enter the through hole by a wherein through slot, then is detached from from another through slot from the through hole.
3. adjustable slice turning device as claimed in claim 2, which is characterized in that axle sleeve is arranged in the shaft, it is described to turn over
Turntable is sheathed on the axle sleeve, and the axle sleeve is equipped with the notch for being connected to the through slot and through hole.
4. adjustable slice turning device as described in claim 1, which is characterized in that radially spaced on the turnover disc to be provided with
Multiple demarcation plates form the holding tank between the two adjacent demarcation plates.
5. adjustable slice turning device as claimed in claim 4, which is characterized in that be equipped with and add on two faces of the demarcation plate
Strong plate, the edge of the stiffening plate extend the demarcation plate.
6. adjustable slice turning device as claimed in claim 5, which is characterized in that the stiffening plate is screwed in described
On demarcation plate.
7. adjustable slice turning device as described in claim 1, which is characterized in that the transmission mechanism includes conveyer belt, described
Conveyer belt is arranged between two turnover discs.
8. adjustable slice turning device as described in claim 1, which is characterized in that the driving mechanism includes stepper motor.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910828479.0A CN110491817B (en) | 2019-09-03 | 2019-09-03 | Adjustable sheet turning device |
| PCT/CN2019/117956 WO2021042551A1 (en) | 2019-09-03 | 2019-11-13 | Adjustable wafer overturning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910828479.0A CN110491817B (en) | 2019-09-03 | 2019-09-03 | Adjustable sheet turning device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN110491817A true CN110491817A (en) | 2019-11-22 |
| CN110491817B CN110491817B (en) | 2024-04-26 |
Family
ID=68556102
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910828479.0A Active CN110491817B (en) | 2019-09-03 | 2019-09-03 | Adjustable sheet turning device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110491817B (en) |
| WO (1) | WO2021042551A1 (en) |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327674A (en) * | 2003-04-24 | 2004-11-18 | Dainippon Screen Mfg Co Ltd | Substrate inversion unit and substrate treatment apparatus having the same |
| JP2007035866A (en) * | 2005-07-26 | 2007-02-08 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
| CN101465309A (en) * | 2009-01-09 | 2009-06-24 | 富创得科技（沈阳）有限公司 | Translational overturn type automatic conveying device for silicon wafer |
| CN101814586A (en) * | 2009-12-01 | 2010-08-25 | 东莞宏威数码机械有限公司 | Clamping type substrate turnover device |
| JP2013031940A (en) * | 2011-08-01 | 2013-02-14 | Hitachi Plant Technologies Ltd | Panel printing apparatus |
| WO2013187090A1 (en) * | 2012-06-15 | 2013-12-19 | 大日本スクリーン製造株式会社 | Substrate inverting apparatus and substrate processing apparatus |
| JP2017022318A (en) * | 2015-07-14 | 2017-01-26 | 東京エレクトロン株式会社 | Substrate processing apparatus |
| JP2019131372A (en) * | 2018-01-31 | 2019-08-08 | 三星ダイヤモンド工業株式会社 | Substrate inverting device |
| CN210640200U (en) * | 2019-09-03 | 2020-05-29 | 罗博特科智能科技股份有限公司 | Adjustable sheet turning device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20000020990A (en) * | 1998-09-25 | 2000-04-15 | 윤종용 | Spindle fork assembly in semiconductor manufacturing device |
| CN105034555B (en) * | 2015-08-20 | 2017-10-31 | 浙江艾能聚光伏科技股份有限公司 | A kind of solar cell plate printer flaps device |
| CN105692150A (en) * | 2015-12-30 | 2016-06-22 | 无锡赛晶太阳能有限公司 | Novel silicon wafer overturning device |
| CN107452656A (en) * | 2017-08-07 | 2017-12-08 | 罗博特科智能科技股份有限公司 | A kind of silicon chip fast turnover mechanism |
-
2019
- 2019-09-03 CN CN201910828479.0A patent/CN110491817B/en active Active
- 2019-11-13 WO PCT/CN2019/117956 patent/WO2021042551A1/en active Application Filing
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004327674A (en) * | 2003-04-24 | 2004-11-18 | Dainippon Screen Mfg Co Ltd | Substrate inversion unit and substrate treatment apparatus having the same |
| JP2007035866A (en) * | 2005-07-26 | 2007-02-08 | Dainippon Screen Mfg Co Ltd | Substrate treatment apparatus |
| CN101465309A (en) * | 2009-01-09 | 2009-06-24 | 富创得科技（沈阳）有限公司 | Translational overturn type automatic conveying device for silicon wafer |
| CN101814586A (en) * | 2009-12-01 | 2010-08-25 | 东莞宏威数码机械有限公司 | Clamping type substrate turnover device |
| JP2013031940A (en) * | 2011-08-01 | 2013-02-14 | Hitachi Plant Technologies Ltd | Panel printing apparatus |
| WO2013187090A1 (en) * | 2012-06-15 | 2013-12-19 | 大日本スクリーン製造株式会社 | Substrate inverting apparatus and substrate processing apparatus |
| JP2017022318A (en) * | 2015-07-14 | 2017-01-26 | 東京エレクトロン株式会社 | Substrate processing apparatus |
| JP2019131372A (en) * | 2018-01-31 | 2019-08-08 | 三星ダイヤモンド工業株式会社 | Substrate inverting device |
| CN210640200U (en) * | 2019-09-03 | 2020-05-29 | 罗博特科智能科技股份有限公司 | Adjustable sheet turning device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2021042551A1 (en) | 2021-03-11 |
| CN110491817B (en) | 2024-04-26 |
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