CN210640200U - Adjustable sheet turning device - Google Patents
Adjustable sheet turning device Download PDFInfo
- Publication number
- CN210640200U CN210640200U CN201921453934.5U CN201921453934U CN210640200U CN 210640200 U CN210640200 U CN 210640200U CN 201921453934 U CN201921453934 U CN 201921453934U CN 210640200 U CN210640200 U CN 210640200U
- Authority
- CN
- China
- Prior art keywords
- rotating shaft
- silicon wafer
- adjustable
- silicon
- turnover
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn - After Issue
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 73
- 229910052710 silicon Inorganic materials 0.000 claims abstract description 72
- 239000010703 silicon Substances 0.000 claims abstract description 72
- 235000012431 wafers Nutrition 0.000 claims abstract description 61
- 230000007306 turnover Effects 0.000 claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 24
- 230000005540 biological transmission Effects 0.000 claims abstract description 12
- 238000005192 partition Methods 0.000 claims description 12
- 230000003014 reinforcing effect Effects 0.000 claims description 10
- 230000006872 improvement Effects 0.000 description 7
- 239000003638 chemical reducing agent Substances 0.000 description 4
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002372 labelling Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a turn over piece device with adjustable, the device include the support, are equipped with on the support: the silicon wafer clamping device comprises a rotating shaft, wherein two overturning rotating discs are sleeved on the rotating shaft, a plurality of accommodating grooves for accommodating silicon wafers are arranged on the overturning rotating discs at intervals along the radial direction, and the accommodating grooves on the two overturning discs are matched to clamp and fix the silicon wafers; the driving mechanism is connected with the rotating shaft and drives the rotating shaft to rotate, and the rotating shaft can drive the turnover plate to turn the silicon wafer from one surface to the other surface; a through hole matched with the size of the silicon wafer is axially arranged on the rotating shaft, and the silicon wafer can be translated from one side of the rotating shaft to the other side through the through hole; the transmission mechanism is used for transmitting the silicon wafers into the accommodating tank and receiving the turned silicon wafers, and the transmission mechanism is also used for translating the silicon wafers from one side of the rotating shaft to the other side of the rotating shaft through the through holes. The utility model discloses a turn over piece device with adjustable can realize the upset of silicon chip when needs upset, and the upset is efficient to can guarantee that the silicon chip is steady to pass through when not needing the upset.
Description
Technical Field
The utility model relates to a silicon chip processing equipment technical field, in particular to piece device turns over with adjustable.
Background
Generally, the process for processing a solar cell silicon wafer comprises the following steps: 1. texturing, namely corroding the surface of the silicon wafer into a pyramid-shaped appearance; 2. diffusing, and forming a PN junction on the surface of the silicon wafer; 3. etching, namely removing PN junctions at the edge of the silicon wafer to prevent a battery from being short-circuited; 4. removing the PSG, cleaning the surface of the silicon wafer, and removing the silicon dioxide layer; 5. PECVD, plating an antireflection film on the surface of a silicon wafer; 6. printing and sintering, printing an electrode and a back surface field, and drying and sintering.
In above-mentioned technology processing step, need overturn the silicon chip sometimes, disclose a quick tilting mechanism of silicon chip in utility model patent that publication number is CN207116380U, it can realize quick upset to the silicon chip, and to different silicon chips and different processing methods, when the silicon chip circulates between different stations, need overturn sometimes and need not overturn, this just needs one kind can realize the upset when needs overturn, guarantees the device that the silicon chip steadily passes through when not needing the upset.
SUMMERY OF THE UTILITY MODEL
The utility model aims to overcome the defects in the prior art and provide a piece device with adjustable rational in infrastructure, it is multi-functional. The technical scheme is as follows:
the utility model provides a turn over piece device with adjustable, its includes the support, be equipped with on the support:
the silicon wafer overturning device comprises a rotating shaft, wherein two overturning rotating discs are sleeved on the rotating shaft, a plurality of accommodating grooves for accommodating silicon wafers are arranged on the overturning rotating discs at intervals along the radial direction, and the accommodating grooves on the two overturning discs are matched to fix the silicon wafers;
the driving mechanism is connected with the rotating shaft and drives the rotating shaft to rotate, and the rotating shaft can drive the turnover disc to turn the silicon wafer from one surface to the other surface;
the rotating shaft is axially provided with a through hole matched with the size of the silicon wafer, and the silicon wafer can be translated from one side of the rotating shaft to the other side through the through hole;
the transmission mechanism is used for transmitting the silicon wafers into the accommodating groove and receiving the turned silicon wafers, and the transmission mechanism is also used for translating the silicon wafers from one side of the rotating shaft to the other side of the rotating shaft through the through holes.
As a further improvement of the present invention, the turning plate is symmetrically provided with two through grooves extending along the radial direction, two openings of the through hole are respectively communicated with the through grooves, and the silicon wafer can enter the through hole through one of the through grooves under the driving of the transmission mechanism, and then the through hole is separated from the through hole through the other through groove.
As a further improvement, the cover is equipped with the axle sleeve in the pivot, the upset dish cover is located on the axle sleeve, be equipped with the intercommunication on the axle sleeve link up the breach of groove and perforating hole.
As a further improvement, the turnover plate is provided with a plurality of division plates and is double-phase adjacent along the radial interval, and the division plates are formed between the division plates.
As a further improvement of the present invention, reinforcing plates are provided on both sides of the partition plate, and the edge of the reinforcing plate extends out of the partition plate.
As a further improvement of the present invention, the reinforcing plate is fixed to the partition plate by screws.
As a further improvement, the conveying mechanism comprises a conveyor belt, the conveyor belt is arranged between the turnover plates.
As a further improvement of the present invention, the driving mechanism includes a stepping motor.
The utility model has the advantages that:
the utility model discloses a turn over piece device with adjustable can realize the upset of silicon chip when needs upset, and the upset is efficient to through set up the perforating hole in the pivot, guarantee that the silicon chip is steady when not needing the upset and pass through. The device is rational in infrastructure, and degree of automation is high, can improve production efficiency by a wide margin.
The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.
Drawings
Fig. 1 is a schematic structural view of an adjustable sheet turning device in an embodiment of the present invention;
fig. 2 is a schematic view of the internal structure of an adjustable sheet turnover device in the embodiment of the present invention;
fig. 3 is a schematic structural view of a rotating shaft in an embodiment of the present invention;
fig. 4 is a schematic structural diagram of the turnover table in the embodiment of the present invention;
fig. 5 is a schematic structural diagram of the shaft sleeve in the embodiment of the present invention.
Description of the labeling: 100. a support; 101. a bearing seat; 110. a stepping motor; 120. a rotating shaft; 121. a through hole; 130. a speed reducer; 140. a coupling; 150. turning over the turntable; 151. a partition plate; 152. accommodating grooves; 153. a reinforcing plate; 154. a through groove; 160. a shaft sleeve; 161. a notch; 200. and (3) a silicon wafer.
Detailed Description
The present invention is further described with reference to the following drawings and specific embodiments so that those skilled in the art can better understand the present invention and can implement the present invention, but the embodiments are not to be construed as limiting the present invention.
As shown in fig. 1-5, for the adjustable sheet turning device in the embodiment of the present invention, the adjustable sheet turning device includes a support 100, two bearing seats 101, a rotating shaft 120, a driving mechanism and a transmission mechanism are disposed on the support 100, and two ends of the rotating shaft 120 are respectively disposed on the two shaft seats 101.
The rotating shaft 120 is sleeved with two turning disks 150, a plurality of accommodating grooves 152 for accommodating silicon wafers are arranged on the turning disks 150 at intervals along the radial direction, the accommodating grooves 152 on the two turning disks 150 are matched to fix the silicon wafers 200, and the width of the accommodating grooves 152 is larger than the thickness of the silicon wafers 200.
The driving mechanism is connected to the rotating shaft 120, the driving mechanism drives the rotating shaft 120 to rotate, and the rotating shaft 120 can drive the flipping disk 150 to flip the silicon wafer 200 from one side to the other side.
Specifically, the driving mechanism includes a stepping motor 110, a speed reducer 130, and a coupling 140, wherein the stepping motor 110 is connected to the speed reducer 130, and the speed reducer 130 is connected to the rotating shaft 120 through the coupling 140.
The spindle 120 is provided with a through hole 121 matching the size of the silicon wafer along the axial direction, and the silicon wafer 200 can be translated from one side of the spindle 120 to the other side through the through hole 121.
The transmission mechanism is used for transmitting the silicon wafer 200 into the accommodating groove 152 and receiving the turned silicon wafer 200, and is also used for translating the silicon wafer from one side of the rotating shaft 120 to the other side through the through hole 121.
Specifically, the transmission mechanism includes a conveyor belt and a driving motor, the conveyor belt is arranged between the two turnover turntables 150 in a penetrating manner, and the driving motor drives the conveyor belt.
As shown in fig. 4, the flipping disk 150 is symmetrically provided with two through grooves 154 extending in the radial direction, two openings of the through hole 121 are respectively communicated with the two through grooves 154, and the silicon wafer 200 can enter the through hole 121 through one of the through grooves 154 and then be separated from the through hole 121 from the other through groove 154 under the driving of the transferring mechanism.
In this embodiment, the turn-over plate 150 is provided with a plurality of partition plates 151 at intervals in a radial direction, and a receiving groove 152 is formed between two adjacent partition plates 151.
Preferably, reinforcing plates 153 are mounted on both sides of the partition plate 151, and the reinforcing plates 153 are fixed to the partition plate 151 by screws. More preferably, the edge of the reinforcing plate 153 extends out of the partition plate 151, so that the silicon wafer 200 can be clamped and fixed more stably.
In this embodiment, a sleeve 160 is sleeved on the rotating shaft 120, and the turnover plate 150 is sleeved on the sleeve 160, as shown in fig. 5, a notch 161 communicating the through groove 154 and the through hole 121 is formed on the sleeve 160.
The silicon wafer 200 is conveyed to one side of the turnover disc 150 by the conveyor belt, when the silicon wafer 200 needs to be turned over, the stepping motor 110 drives the rotating shaft 120 to rotate, so that one accommodating groove 152 is in a horizontal position, two edges of the silicon wafer 200 are respectively inserted into the accommodating grooves 152 on the two turnover discs 150 under the drive of the conveyor belt, the stepping motor 110 drives the rotating shaft 120 to rotate to turn the silicon wafer 200 over 180 degrees until the other surface of the silicon wafer 200 faces upwards, meanwhile, the silicon wafer 200 is placed on the conveyor belt, and the silicon wafer 200 is separated from the accommodating groove 152 under the drive of the conveyor belt. It should be noted that when the stepping motor 110 drives the flipping disk 150 to rotate, the silicon wafer 200 needs to jump over the through slot 154 to prevent the silicon wafer 200 from entering the through slot 154.
When the silicon wafer 200 needs to be translated from one side of the rotating shaft 120 to the other side, the stepping motor 110 drives the turning plate 150 to rotate until the through grooves 154 are in parallel, two sides of the silicon wafer 200 are respectively inserted into the through grooves 154 on one side of the two turning plates 150 under the driving of the conveyor belt, then the silicon wafer 200 enters the through groove 154 on the other side through the through hole 121 and is separated from the through groove 154 on the other side under the driving of the conveyor belt, and thus the silicon wafer 200 is translated from one side of the rotating shaft 120 to the other side.
The utility model discloses a turn over piece device with adjustable can realize the upset of silicon chip when needs upset, and the upset is efficient to through set up the perforating hole in the pivot, guarantee that the silicon chip is steady when not needing the upset and pass through. The device is rational in infrastructure, and degree of automation is high, can improve production efficiency by a wide margin.
The above embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. Equivalent substitutes or changes made by the technical personnel in the technical field on the basis of the utility model are all within the protection scope of the utility model. The protection scope of the present invention is subject to the claims.
Claims (8)
1. The utility model provides a turn over piece device with adjustable which characterized in that, includes the support, be equipped with on the support:
the silicon wafer overturning device comprises a rotating shaft, wherein two overturning rotating discs are sleeved on the rotating shaft, a plurality of accommodating grooves for accommodating silicon wafers are arranged on the overturning rotating discs at intervals along the radial direction, and the accommodating grooves on the two overturning discs are matched to fix the silicon wafers;
the driving mechanism is connected with the rotating shaft and drives the rotating shaft to rotate, and the rotating shaft can drive the turnover disc to turn the silicon wafer from one surface to the other surface;
the rotating shaft is axially provided with a through hole matched with the size of the silicon wafer, and the silicon wafer can be translated from one side of the rotating shaft to the other side through the through hole;
the transmission mechanism is used for transmitting the silicon wafers into the accommodating groove and receiving the turned silicon wafers, and the transmission mechanism is also used for translating the silicon wafers from one side of the rotating shaft to the other side of the rotating shaft through the through holes.
2. The adjustable wafer turnover device according to claim 1, wherein the turnover plate is symmetrically provided with two through grooves extending in the radial direction, two openings of the through holes are respectively communicated with the two through grooves, and the silicon wafer can enter the through holes through one of the through grooves and then be separated from the through holes through the other through groove under the driving of the transmission mechanism.
3. The adjustable flap device as claimed in claim 2, wherein a sleeve is sleeved on the rotating shaft, the turnover plate is sleeved on the sleeve, and a gap for communicating the through groove and the through hole is formed in the sleeve.
4. The adjustable blade turnover device of claim 1, wherein said turnover disk has a plurality of partition plates spaced radially thereon, and said receiving slot is formed between two adjacent partition plates.
5. The adjustable flap apparatus of claim 4, wherein reinforcing plates are mounted on both faces of the divider plate, the edges of the reinforcing plates extending beyond the divider plate.
6. The adjustable blade turnover device of claim 5, wherein said reinforcing plate is fixed to said partition plate by screws.
7. The adjustable plate turnover device as claimed in claim 1, wherein said transmission mechanism includes a conveyor belt, said conveyor belt is disposed between two said turnover plates.
8. The adjustable blade turnover device of claim 1, wherein said drive mechanism comprises a stepper motor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921453934.5U CN210640200U (en) | 2019-09-03 | 2019-09-03 | Adjustable sheet turning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921453934.5U CN210640200U (en) | 2019-09-03 | 2019-09-03 | Adjustable sheet turning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210640200U true CN210640200U (en) | 2020-05-29 |
Family
ID=70797010
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921453934.5U Withdrawn - After Issue CN210640200U (en) | 2019-09-03 | 2019-09-03 | Adjustable sheet turning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210640200U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110491817A (en) * | 2019-09-03 | 2019-11-22 | 罗博特科智能科技股份有限公司 | A kind of adjustable slice turning device |
-
2019
- 2019-09-03 CN CN201921453934.5U patent/CN210640200U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110491817A (en) * | 2019-09-03 | 2019-11-22 | 罗博特科智能科技股份有限公司 | A kind of adjustable slice turning device |
| CN110491817B (en) * | 2019-09-03 | 2024-04-26 | 罗博特科智能科技股份有限公司 | Adjustable sheet turning device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20200529 Effective date of abandoning: 20240426 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20200529 Effective date of abandoning: 20240426 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |