CN206650097U - A kind of rotary silicon chip laser incising edge equipment - Google Patents
A kind of rotary silicon chip laser incising edge equipment Download PDFInfo
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- CN206650097U CN206650097U CN201720291423.2U CN201720291423U CN206650097U CN 206650097 U CN206650097 U CN 206650097U CN 201720291423 U CN201720291423 U CN 201720291423U CN 206650097 U CN206650097 U CN 206650097U
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- laser
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- disk body
- edge equipment
- silicon
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The utility model discloses a kind of rotary silicon chip laser incising edge equipment, including with four workbench for being used to place the rotating disk of silicon chip and four laser generators set along workbench peripheral circumferential, the card of rotating disk is located on table surface and card can rotate in the horizontal plane, each laser generator corresponds to a rotating disk, the laser ablation silicon chips periphery PN junction that the side surface circumference of the silicon chip on emitting head one rotating disk of alignment of each laser generator is launched so as to emitting head.The utility model can drive the disk body of silicon slice rotating using laser generator and cooperation, the laser of laser generator transmitting can effectively remove the PN junction of silicon chips periphery, disconnect positive N-type silicon and back side N-type silicon, prevent battery short circuit, and the photoelectric transformation efficiency of battery is not interfered with, while can ensure that cell piece front edge outward appearance is good；The utility model is particularly suitable for use in the etching processing procedures of high efficient two-sided N type crystal silicon solar batteries, greatly simplifies the technological process of two-sided N-type high-efficiency battery.
Description
Technical field
It the utility model is related to a kind of rotary silicon chip laser incising edge equipment.
Background technology
In photovoltaic solar industry, the manufacture of solar cell is needed by making herbs into wool, diffusion, etching, plated film, silk-screen printing
With this six big process of sintering.Wherein, making herbs into wool and etching belong to chemical etching process.The purpose of making herbs into wool is formed in the front of silicon chip
Be advantageous to the matte of sun light absorbs；The purpose of etching is to remove the PN junction of silicon chip surrounding, avoid solar cell front and
Short circuit occurs for the back side, but is unable to the positive PN junction of etching silicon wafer.
At present, industry is mainly performed etching using horizontal chain wet-method etching equipment to silicon chip, the operation principle of the equipment
It is to be placed on silicon chip on the swing roller of etching acid tank, the liquid level of control etching acid solution, decoction is only infiltrated the side of silicon chip
And the back side, roller drive silicon chip to complete the etching of silicon chips periphery PN junction and back side PN junction by etching acid tank, prevent that battery is short
Road.
But there is following defect during wet etching for horizontal chain wet-method etching equipment：
(1) during wet etching, it is impossible to avoid acid solution infiltration therefore, still can be deposited to the front edge of silicon chip completely
Influence the photoelectric transformation efficiency of battery the problem of, while the problem of also bring along cell piece front edge bad order.
(2) wet etching includes multiple processing steps such as strong acid etching, alkali cleaning, DI washings, air-dried, it is necessary to the supply of decoction
It is high with discharge, safety and environmental protection facility, equipment bulky complex, equipment and process costs.
Utility model content
The purpose of this utility model be to provide it is a kind of it is simple in construction, cost is cheap, does not interfere with the opto-electronic conversion of battery
Efficiency and the good rotary silicon chip laser incising edge equipment of the cell piece front edge outward appearance that can ensure.
The purpose of this utility model is realized by following technical measures：A kind of rotary silicon chip laser incising edge equipment,
It is characterized in that：It is included with four workbench for being used to place the rotating disk of silicon chip and set along workbench peripheral circumferential four
Individual laser generator, the card of rotating disk is located on the table top of workbench and the card can rotate in the horizontal plane, each laser
Generator corresponds to a rotating disk, the emitting head of each laser generator be aligned the side surface circumference of the silicon chip on a rotating disk so as to
The PN junction of the laser ablation of the emitting head transmitting silicon chips periphery.
The utility model can drive the disk body of silicon slice rotating using laser generator and cooperation, and laser generator transmitting swashs
Light can effectively remove the PN junction of silicon chips periphery, disconnect positive N-type silicon and back side N-type silicon, prevent battery short circuit, and will not
The photoelectric transformation efficiency of battery is influenceed, while can ensure that cell piece front edge outward appearance is good；In addition, the utility model structure
Simply, cost is cheap, and the photovoltaic solar industry for being particularly suitable for cost sensitivity uses, and is easy to be widely popularized, and is expected to substitute industry
The wet-method etching equipment on boundary；The utility model is particularly suitable for use in the etching processing procedures of high efficient two-sided N type crystal silicon solar batteries, can be big
Simplify the technological process of two-sided N-type high-efficiency battery greatly.
As a kind of preferred embodiment of the present utility model, the rotating disk mainly by the disk body for placing silicon chip, with
The transmission mechanism of disk body lower surface connection and the motor composition for driving disk body to rotate, the card is the disk body
Upper surface, the motor pass through transmission mechanism transmission driving disk body rotate.
As a kind of improvement of the present utility model, the disk body inner hollow, it is provided with and is used in the upper surface of the disk body
The vacuum absorption holes of the fixed silicon chip of absorption, the vacuum absorption holes inside disk body with communicating and being connected with vacuum extractor.
As a kind of embodiment of the present utility model, the laser generator is Nd：YAG laser.
The spot diameter for the laser that laser generator described in the utility model is sent is 10~250 microns.
The wavelength for the laser that laser generator described in the utility model is sent is 1064nm, 532nm or 355nm.
As further improvement of the utility model, the rotary speed of the disk body is adjustable.
Disk body described in the utility model is shaped as circular, square or hexagon etc..
Compared with prior art, the utility model has the advantages of following notable：
(1) the utility model can drive the disk body of silicon slice rotating using laser generator and cooperation, laser generator transmitting
Laser can effectively remove the PN junction of silicon chips periphery, disconnect positive N-type silicon and back side N-type silicon, prevent battery short circuit, and not
The photoelectric transformation efficiency of battery can be influenceed, while it is also ensured that cell piece front edge outward appearance is good.
(2) the utility model is simple in construction, and cost is cheap, and the photovoltaic solar industry for being particularly suitable for cost sensitivity uses,
It is easy to be widely popularized, is expected to the wet-method etching equipment for substituting industry.
(3) the utility model is particularly suitable for use in the etching processing procedure of high efficient two-sided N type crystal silicon solar batteries, can greatly simplify
The technological process of two-sided N-type high-efficiency battery.
Brief description of the drawings
Below in conjunction with accompanying drawing, the utility model is described in further detail.
Fig. 1 is schematic top plan view of the present utility model.
Embodiment
As shown in figure 1, being a kind of rotation silicon chip laser incising edge equipment of the utility model, it includes that there are four to be used to place
The workbench 3 of the rotating disk 2 of silicon chip 1 and four laser generators 4 set along the peripheral circumferential of workbench 3, laser generator 4 use
Nd：YAG laser, the spot diameter for the laser that laser generator 4 is sent is 10~250 microns, and laser generator 4 is sent
The wavelength of laser be 1064nm, 532nm or 355nm.The card of rotating disk 2 is located on the table top of workbench 3 and card can be in water
Rotation with surface, each laser generator 4 correspond to a rotating disk 2, and the emitting head of each laser generator 4 is directed at a rotating disk
The PN junction on the laser ablation periphery of silicon chip 1 that the periphery of the silicon chip 1 on 2 is launched so as to emitting head.
In the present embodiment, rotating disk 2 is mainly by the disk body 5 for placing silicon chip, the driver being connected with the lower surface of disk body 5
Structure and the motor composition for driving disk body 5 to rotate, card is the upper surface of disk body 5, being shaped as disk body 5 be circular,
Square or hexagon etc., motor are driven driving disk body 5 by transmission mechanism and rotated, and transmission mechanism can be and disk body 5
The connection of lower card a vertical pivot, the lower end of vertical pivot docked with the power output shaft of motor so as to realize the rotation of disk body 5,
The rotary speed of disk body 5 is adjustable.The inner hollow of disk body 5, the vacuum for being used for adsorbing fixed silicon chip 1 is provided with the upper surface of disk body 5
Adsorption hole, vacuum absorption holes inside disk body 5 with communicating and being connected with vacuum extractor.
The utility model can drive the disk body of silicon slice rotating using laser generator and cooperation, and laser generator transmitting swashs
Light can effectively remove the PN junction of silicon chips periphery, and not interfere with the photoelectric transformation efficiency of battery, while it is also ensured that electricity
Pond piece front edge outward appearance is good.
Embodiment not limited to this of the present utility model, according to the above of the present utility model, according to the general of this area
Logical technological know-how and customary means, under the premise of the above-mentioned basic fundamental thought of the utility model is not departed from, disk of the present utility model
Spot diameter, the laser generator for the laser that the shape of body, the type of laser generator, laser generator are sent are sent
Wavelength of laser etc. also has other embodiments.Therefore, the utility model can also make other diversified forms modification,
Replace or change, all fall within the utility model rights protection scope.
Claims (8)
- A kind of 1. rotary silicon chip laser incising edge equipment, it is characterised in that：It is included with four rotating disks for being used to place silicon chip Workbench and along workbench peripheral circumferential set four laser generators, the card of rotating disk be located on the table top of workbench and The card can rotate in the horizontal plane, and each laser generator corresponds to a rotating disk, the emitting head of each laser generator The PN junction for the laser ablation silicon chips periphery that the side surface circumference of silicon chip on one rotating disk of alignment is launched so as to emitting head.
- 2. rotary silicon chip laser incising edge equipment according to claim 1, it is characterised in that：The rotating disk mainly by for The disk body for placing silicon chip, the transmission mechanism being connected with disk body lower surface and the motor composition for driving disk body to rotate, institute The upper surface that card is the disk body is stated, the motor is driven driving disk body by transmission mechanism and rotated.
- 3. rotary silicon chip laser incising edge equipment according to claim 2, it is characterised in that：The disk body inner hollow, The vacuum absorption holes for being used for adsorbing fixed silicon chip, the vacuum absorption holes and phase inside disk body are provided with the upper surface of the disk body It is logical simultaneously to be connected with vacuum extractor.
- 4. rotary silicon chip laser incising edge equipment according to claim 3, it is characterised in that：The laser generator is Nd：YAG laser.
- 5. rotary silicon chip laser incising edge equipment according to claim 4, it is characterised in that：The laser generator is sent out The spot diameter of the laser gone out is 10~250 microns.
- 6. rotary silicon chip laser incising edge equipment according to claim 5, it is characterised in that：The laser generator is sent out The wavelength of the laser gone out is 1064nm, 532nm or 355nm.
- 7. rotary silicon chip laser incising edge equipment according to claim 6, it is characterised in that：The rotary speed of the disk body It is adjustable.
- 8. rotary silicon chip laser incising edge equipment according to claim 7, it is characterised in that：The disk body is shaped as justifying Shape, square or hexagon.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720291423.2U CN206650097U (en) | 2017-03-23 | 2017-03-23 | A kind of rotary silicon chip laser incising edge equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720291423.2U CN206650097U (en) | 2017-03-23 | 2017-03-23 | A kind of rotary silicon chip laser incising edge equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206650097U true CN206650097U (en) | 2017-11-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720291423.2U Active CN206650097U (en) | 2017-03-23 | 2017-03-23 | A kind of rotary silicon chip laser incising edge equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206650097U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108747032A (en) * | 2018-06-20 | 2018-11-06 | 君泰创新（北京）科技有限公司 | A kind of cell piece membrane removal method and system |
| CN109300779A (en) * | 2018-08-29 | 2019-02-01 | 晶澳（扬州）太阳能科技有限公司 | A kind of processing method and processing device of silicon wafer |
-
2017
- 2017-03-23 CN CN201720291423.2U patent/CN206650097U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108747032A (en) * | 2018-06-20 | 2018-11-06 | 君泰创新（北京）科技有限公司 | A kind of cell piece membrane removal method and system |
| CN109300779A (en) * | 2018-08-29 | 2019-02-01 | 晶澳（扬州）太阳能科技有限公司 | A kind of processing method and processing device of silicon wafer |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 322000 Zhejiang city in Jinhua Province town of Yiwu City, Su Fuk Road No. 126 Co-patentee after: Guangdong Asahi Polytron Technologies Inc Patentee after: Zhejiang love Solar Energy Technology Co., Ltd. Address before: 322000 Zhejiang city in Jinhua Province town of Yiwu City, Su Fuk Road No. 126 Co-patentee before: Guangdong Aiko Solar Energy Technology Co., Ltd. Patentee before: Zhejiang love Solar Energy Technology Co., Ltd. |