CN110482481A - 一种末端膨大微结构阵列仿生黏附材料的制备方法 - Google Patents
一种末端膨大微结构阵列仿生黏附材料的制备方法 Download PDFInfo
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- CN110482481A CN110482481A CN201910608241.7A CN201910608241A CN110482481A CN 110482481 A CN110482481 A CN 110482481A CN 201910608241 A CN201910608241 A CN 201910608241A CN 110482481 A CN110482481 A CN 110482481A
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/38—Moulds or cores; Details thereof or accessories therefor characterised by the material or the manufacturing process
- B29C33/3842—Manufacturing moulds, e.g. shaping the mould surface by machining
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
- B81C1/00111—Tips, pillars, i.e. raised structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/42—Moulds or cores; Details thereof or accessories therefor characterised by the shape of the moulding surface, e.g. ribs or grooves
- B29C33/424—Moulding surfaces provided with means for marking or patterning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B1/00—Devices without movable or flexible elements, e.g. microcapillary devices
- B81B1/006—Microdevices formed as a single homogeneous piece, i.e. wherein the mechanical function is obtained by the use of the device, e.g. cutters
- B81B1/008—Microtips
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00206—Processes for functionalising a surface, e.g. provide the surface with specific mechanical, chemical or biological properties
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
- B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
- B81C1/00261—Processes for packaging MEMS devices
- B81C1/00301—Connecting electric signal lines from the MEMS device with external electrical signal lines, e.g. through vias
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C99/00—Subject matter not provided for in other groups of this subclass
- B81C99/0075—Manufacture of substrate-free structures
- B81C99/0085—Manufacture of substrate-free structures using moulds and master templates, e.g. for hot-embossing
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J109/00—Adhesives based on homopolymers or copolymers of conjugated diene hydrocarbons
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
- C25D1/10—Moulds; Masks; Masterforms
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/12—Electroplating: Baths therefor from solutions of nickel or cobalt
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C2045/0094—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor injection moulding of small-sized articles, e.g. microarticles, ultra thin articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2083/00—Use of polymers having silicon, with or without sulfur, nitrogen, oxygen, or carbon only, in the main chain, as moulding material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2105/00—Condition, form or state of moulded material or of the material to be shaped
- B29K2105/0097—Glues or adhesives, e.g. hot melts or thermofusible adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2031/00—Other particular articles
- B29L2031/727—Fastening elements
- B29L2031/729—Hook and loop-type fasteners
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2203/00—Basic microelectromechanical structures
- B81B2203/03—Static structures
- B81B2203/0361—Tips, pillars
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
- B81B2207/00—Microstructural systems or auxiliary parts thereof
- B81B2207/05—Arrays
- B81B2207/056—Arrays of static structures
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B81—MICROSTRUCTURAL TECHNOLOGY
- B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
- B81C2201/00—Manufacture or treatment of microstructural devices or systems
- B81C2201/03—Processes for manufacturing substrate-free structures
- B81C2201/034—Moulding
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Metallurgy (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Analytical Chemistry (AREA)
- Computer Hardware Design (AREA)
- Molecular Biology (AREA)
- General Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Micromachines (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
Description
Claims (5)
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
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CN201910608241.7A CN110482481B (zh) | 2019-07-08 | 2019-07-08 | 一种末端膨大微结构阵列仿生黏附材料的制备方法 |
PCT/CN2020/095630 WO2021004225A1 (zh) | 2019-07-08 | 2020-06-11 | 一种末端膨大微结构阵列仿生黏附材料的制备方法 |
US17/288,536 US11254566B2 (en) | 2019-07-08 | 2020-06-11 | Preparation method of bionic adhesive material with tip-expanded microstructural array |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910608241.7A CN110482481B (zh) | 2019-07-08 | 2019-07-08 | 一种末端膨大微结构阵列仿生黏附材料的制备方法 |
Publications (2)
Publication Number | Publication Date |
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CN110482481A true CN110482481A (zh) | 2019-11-22 |
CN110482481B CN110482481B (zh) | 2023-04-04 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201910608241.7A Active CN110482481B (zh) | 2019-07-08 | 2019-07-08 | 一种末端膨大微结构阵列仿生黏附材料的制备方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US11254566B2 (zh) |
CN (1) | CN110482481B (zh) |
WO (1) | WO2021004225A1 (zh) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111348619A (zh) * | 2020-03-18 | 2020-06-30 | 广东工业大学 | 一种基于光学操控的纳米孔阵列的可控加工方法及装置 |
CN111993657A (zh) * | 2020-08-12 | 2020-11-27 | 南京艾德恒信科技有限公司 | 一种基于微通孔镍基模具的仿生黏附结构平压制造方法 |
WO2021004225A1 (zh) * | 2019-07-08 | 2021-01-14 | 南京溧航仿生产业研究院有限公司 | 一种末端膨大微结构阵列仿生黏附材料的制备方法 |
CN112590083A (zh) * | 2020-12-10 | 2021-04-02 | 南京航空航天大学 | 基于微纳增材制备仿生黏附材料的方法 |
CN112939621A (zh) * | 2021-04-06 | 2021-06-11 | 南京航空航天大学 | 一种透气型仿生黏附材料及其制备方法 |
CN112959576A (zh) * | 2021-01-28 | 2021-06-15 | 清华大学 | 喇叭状微结构阵列粘附表面的制备工艺 |
CN112987493A (zh) * | 2021-03-19 | 2021-06-18 | 华南理工大学 | 一种大深宽比结构薄膜的制备装置及其制备方法 |
CN113651289A (zh) * | 2021-07-07 | 2021-11-16 | 北京大学 | 吸盘结构成型模具的制备方法和吸盘结构的制备方法 |
WO2022040916A1 (zh) * | 2020-08-25 | 2022-03-03 | 南京艾德恒信科技有限公司 | 一种基于微通孔镍基模具的仿生黏附结构平压制造方法 |
CN115122549A (zh) * | 2022-06-22 | 2022-09-30 | 西北工业大学 | 一种柔性伞状微结构阵列超表面及其制造方法 |
WO2024060574A1 (zh) * | 2022-09-20 | 2024-03-28 | 武汉大学 | 用于仿生结构黏附剂的桥接柱状阵列结构及制备方法 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7256773B2 (ja) * | 2020-04-24 | 2023-04-12 | 信越化学工業株式会社 | 平坦性制御方法、塗膜の形成方法、平坦性制御装置、及び塗膜形成装置 |
US11478976B2 (en) * | 2020-08-12 | 2022-10-25 | Nanjing Adhesion Technology Co., Ltd | Flat-pressing manufacturing method of bionic adhesive structure based on micro through-hole nickel-based mold |
CN113354948A (zh) * | 2021-06-03 | 2021-09-07 | 南京航空航天大学 | 一种末端膨大的仿生黏附材料高效制造方法 |
CN114953496B (zh) * | 2022-05-11 | 2023-04-28 | 北京航空航天大学 | 一种阵列化微型吸盘成型制造方法 |
WO2024038479A1 (ja) * | 2022-08-15 | 2024-02-22 | 河西工業株式会社 | 成型金型、成型金型の製造方法、及び、成型品の製造方法 |
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US5632878A (en) * | 1994-02-01 | 1997-05-27 | Fet Engineering, Inc. | Method for manufacturing an electroforming mold |
CN1232372A (zh) * | 1996-11-09 | 1999-10-20 | 戈特利布捆扎机械有限公司 | 制造热塑塑料粘接扣的方法和装置 |
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- 2019-07-08 CN CN201910608241.7A patent/CN110482481B/zh active Active
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- 2020-06-11 US US17/288,536 patent/US11254566B2/en active Active
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CN103274354A (zh) * | 2013-05-17 | 2013-09-04 | 哈尔滨工业大学 | 一种仿壁虎结构粘合剂的制备方法 |
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US20160144538A1 (en) * | 2014-11-20 | 2016-05-26 | National Tsing Hua University | Biomimetic adhesive layer and method of manufacturing the same |
CN105836696A (zh) * | 2016-03-24 | 2016-08-10 | 西安交通大学 | 一种基于电致动的干粘附复合结构及制造工艺 |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11254566B2 (en) | 2019-07-08 | 2022-02-22 | Nanjing University Of Aeronautics And Astronautics | Preparation method of bionic adhesive material with tip-expanded microstructural array |
WO2021004225A1 (zh) * | 2019-07-08 | 2021-01-14 | 南京溧航仿生产业研究院有限公司 | 一种末端膨大微结构阵列仿生黏附材料的制备方法 |
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CN112939621A (zh) * | 2021-04-06 | 2021-06-11 | 南京航空航天大学 | 一种透气型仿生黏附材料及其制备方法 |
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CN115122549A (zh) * | 2022-06-22 | 2022-09-30 | 西北工业大学 | 一种柔性伞状微结构阵列超表面及其制造方法 |
WO2024060574A1 (zh) * | 2022-09-20 | 2024-03-28 | 武汉大学 | 用于仿生结构黏附剂的桥接柱状阵列结构及制备方法 |
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