CN110429167B - LED packaging method for realizing high spatial color uniformity - Google Patents
LED packaging method for realizing high spatial color uniformity Download PDFInfo
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- CN110429167B CN110429167B CN201910644219.8A CN201910644219A CN110429167B CN 110429167 B CN110429167 B CN 110429167B CN 201910644219 A CN201910644219 A CN 201910644219A CN 110429167 B CN110429167 B CN 110429167B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 52
- 238000000034 method Methods 0.000 title claims abstract description 29
- 239000000843 powder Substances 0.000 claims abstract description 95
- 239000003292 glue Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 238000010438 heat treatment Methods 0.000 claims abstract description 5
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 239000011248 coating agent Substances 0.000 claims abstract description 4
- 238000000576 coating method Methods 0.000 claims abstract description 4
- 239000000853 adhesive Substances 0.000 claims description 34
- 230000001070 adhesive effect Effects 0.000 claims description 34
- 239000000463 material Substances 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 235000019353 potassium silicate Nutrition 0.000 claims description 3
- 239000000741 silica gel Substances 0.000 claims description 3
- 229910002027 silica gel Inorganic materials 0.000 claims description 3
- 229910052710 silicon Inorganic materials 0.000 claims description 3
- 239000010703 silicon Substances 0.000 claims description 3
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 239000002244 precipitate Substances 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 30
- 238000010586 diagram Methods 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000008393 encapsulating agent Substances 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052755 nonmetal Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/508—Wavelength conversion elements having a non-uniform spatial arrangement or non-uniform concentration, e.g. patterned wavelength conversion layer, wavelength conversion layer with a concentration gradient of the wavelength conversion material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0041—Processes relating to semiconductor body packages relating to wavelength conversion elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses an LED packaging method for realizing high spatial color uniformity, which controls the spatial distribution of fluorescent powder through the action of laser and packaging fluorescent powder glue: bonding the LED chip at the center of the groove on the substrate and realizing electric connection; fully mixing fluorescent powder and packaging glue into fluorescent powder glue, and coating the fluorescent powder glue on the periphery of the LED chip to form a fluorescent powder layer; irradiating a fluorescent powder layer by using laser, wherein the laser vertically points to an LED chip, and the action forms of the laser and the fluorescent powder glue are two, one is that when the adopted packaging glue is easy to cure, the laser enables the fluorescent powder glue at the irradiation position to be cured, and then the laser naturally stands to enable the fluorescent powder in an uncured area to be completely precipitated to form a space fluorescent powder pattern, and the other is that when the adopted packaging glue is not easy to cure, the laser enables the middle temperature and the edge temperature of the fluorescent powder layer to be high, the solution flows to the middle, and the fluorescent powder is gathered at the middle LED chip under the wrapping of the solution; and heating and curing the fluorescent powder glue. The method achieves high spatial color uniformity.
Description
Technical Field
The invention belongs to the technical field of LED packaging, and particularly relates to an LED packaging method for realizing high spatial color uniformity.
Background
LED (light Emitting diodes) is a semiconductor light Emitting device manufactured based on P-N junction electroluminescence principle, has the advantages of high electro-optical conversion efficiency, long service life, environmental protection, energy saving, small volume, etc., and has begun to be widely applied in many fields such as landscape lighting, automobile headlights, street lamps and backlight, etc., and along with the popularization of LEDs, the requirements of people on LED lighting have gradually changed from "lighting" to "lighting comfort", so that the uniformity of spatial color becomes one of the indexes for evaluating LED lighting quality.
The high-power white light LED is generally formed by mixing two-wavelength light (blue light + yellow light) or three-wavelength light (blue light + green light + red light), the white light LED widely adopted at present is formed by a blue LED chip (GaN) and yellow fluorescent powder (YAG or TAG), the parameters of the fluorescent powder layer in the LED package, particularly the geometric morphology of the fluorescent powder layer seriously influences the important optical properties of the LED, such as luminous efficiency, color temperature, space color uniformity and the like, therefore, the key for realizing high space color uniformity of LED product illumination is to realize ideal fluorescent powder distribution, and in the current LED package, most of the fluorescent powder between the LED chips does not participate in the conversion from the blue light to the yellow light, thereby causing great waste of fluorescent powder materials and increasing the manufacturing cost of the LED package.
Disclosure of Invention
The invention aims to provide an LED packaging method for realizing high spatial color uniformity.
The technical scheme adopted by the invention is as follows:
an LED packaging method for realizing high spatial color uniformity controls the spatial distribution of fluorescent powder through the action of laser and fluorescent powder glue, and comprises the following steps:
s1, bonding the LED chip at the center of the groove on the substrate and completing the wire bonding process to realize electric connection;
s2, mixing the fluorescent powder and the packaging adhesive fully to form fluorescent powder adhesive, and coating the fluorescent powder adhesive on the periphery of the LED chip to form a fluorescent powder layer;
s3, irradiating the fluorescent powder layer by laser, wherein the laser points to the middle of the LED chip vertically, and the action forms of the laser and the fluorescent powder glue are two, one is that when the adopted packaging glue is easy to cure, the laser cures the fluorescent powder glue at the irradiation position, and then the laser naturally stands to completely precipitate the fluorescent powder in the uncured area to form a space fluorescent powder pattern; the other is that when the adopted packaging adhesive is not easy to cure, the laser enables the middle temperature of the fluorescent powder layer to be high and the edge temperature to be low, the packaging adhesive flows to the middle, and the fluorescent powder is gathered at the middle LED chip under the wrapping of the packaging adhesive;
and S4, heating and curing the fluorescent powder glue.
Further, in step S3, when the adopted packaging adhesive is easy to cure, the laser power is 2W-15W, the irradiation time is 10-500S, and the natural standing time is 1-10 hours; when the adopted packaging adhesive is not easy to cure, the laser power is 2W-20W, and the irradiation time is 10-600 s.
Furthermore, the concentration of the fluorescent powder in the fluorescent powder glue is 0.01 g/ml-2.0 g/ml.
Further, the LED chip is a chip made of a GaN binary material or a chip made of an AlGaNP quaternary material.
Further, the fluorescent powder glue is coated by means of spray head spraying or syringe dripping.
Further, the laser is blue light or infrared light, and the shape of the light spot is circular or square.
Further, the packaging adhesive is silica gel, epoxy resin or liquid glass.
Further, the fluorescent powder is YAG fluorescent powder or TAG fluorescent powder.
Further, the substrate material is copper, aluminum, silicon, ceramic or PCB board.
Further, the reflective layer material on the surface of the substrate is silver.
The invention has the beneficial effects that:
the method improves the distribution of the fluorescent powder by laser, can improve the geometric shape of the fluorescent powder layer, thereby improving the spatial color uniformity and realizing high spatial color uniformity, and can gather the peripheral useless fluorescent powder to the middle for utilization when the adopted packaging adhesive is not easy to cure, thereby saving the using amount of the fluorescent powder and reducing the packaging cost.
Drawings
Fig. 1 is a schematic diagram of an encapsulation process according to a first embodiment of the present invention (in the first embodiment, an encapsulation adhesive that is not easily cured is used, and the phosphor is gathered toward the middle), wherein (a), (b), and (c) are performed sequentially, and (d) is a detailed process of (b).
Fig. 2 is a diagram of the phosphor powder concentration process at different times according to an embodiment of the present invention (in an embodiment, an encapsulation adhesive that is not easily cured is used, and the phosphor powder is concentrated toward the middle).
Fig. 3 is a cross-sectional comparison diagram of phosphor paste before and after phosphor concentration in an embodiment of the invention (in an embodiment, a non-curable encapsulant is used, and phosphor is concentrated toward the middle), wherein (a) is before concentration and (b) is after concentration.
FIG. 4 is a graph comparing the color temperature curves of a phosphor paste coated normally according to a first embodiment of the present invention (first embodiment is an embodiment using a non-curable encapsulant and the phosphor is concentrated toward the center), wherein the square is the normal coating and the circle is the first embodiment.
FIG. 5 is a comparative phosphor usage scale for example one of the present invention and a normally coated phosphor paste (example one uses a less curable encapsulant with the phosphor converging toward the middle).
Fig. 6 is a schematic diagram of a packaging process in a second embodiment of the present invention (in the second embodiment, a curable packaging adhesive, a cured phosphor adhesive at an irradiation position, and a form of action in which the phosphor in an uncured region is completely deposited to form a spatial phosphor pattern, that is, a form of action of selective curing) are adopted.
Fig. 7 is a comparison graph of color temperature curves of the second embodiment of the present invention, in which the phosphor paste is normally coated and then naturally stood until completely precipitated, and the color temperature curves of the normally coated phosphor paste are compared (in the second embodiment, the easily curable encapsulation paste, the phosphor paste at the irradiation position is cured, and the phosphor in the uncured region is completely precipitated to form the action form of the spatial phosphor pattern, i.e., the action form of selective curing), in which the square is the second embodiment, the triangle is normally coated, and the circle is normally coated and then naturally stood until completely precipitated.
Detailed Description
The invention is further described below with reference to the figures and examples.
Example 1
As shown in fig. 1, an LED packaging method for achieving high spatial color uniformity controls spatial distribution of phosphor through the action of laser and phosphor glue, comprising the steps of: bonding an LED chip at the central position of a groove on a substrate and completing a lead bonding process to realize electric connection; then, the fluorescent powder and the packaging adhesive are fully mixed to form fluorescent powder adhesive, and the fluorescent powder adhesive is coated on the periphery of the LED chip to form a fluorescent powder layer, and the fluorescent powder layer is limited in a groove area (as shown in figures 1 to 3, the appearance of the fluorescent powder layer is in a spherical cap shape due to the action of surface tension); then, irradiating the fluorescent powder layer by using laser, wherein the laser vertically points to the middle of the LED chip, packaging glue which is not easy to cure is adopted, the laser enables the middle temperature of the fluorescent powder layer to be high and the edge temperature to be low, the packaging glue flows to the middle, and the fluorescent powder is gathered at the middle LED chip under the wrapping of the packaging glue; finally, the phosphor paste is heated and cured (baking and heating in a baking oven at 150 ℃ for 1 hour). According to the method, the distribution of the fluorescent powder is improved by using laser, the geometric shape of the fluorescent powder layer can be improved, so that the spatial color uniformity is improved, as shown in fig. 4, the high spatial color uniformity is realized, as shown in fig. 2 and 3, the peripheral useless fluorescent powder can be gathered to the middle for utilization, as shown in fig. 5, the using amount of the fluorescent powder is saved, and the packaging cost is reduced.
In the first example, the laser power was about 10w and the irradiation time was about 40 s.
Example 2
As shown in fig. 6, an LED packaging method for achieving high spatial color uniformity controls spatial distribution of phosphor through the action of laser and phosphor glue, including the steps of: bonding an LED chip at the central position of a groove on a substrate and completing a lead bonding process to realize electric connection; then, the fluorescent powder and the packaging adhesive are fully mixed to form fluorescent powder adhesive, and the fluorescent powder adhesive is coated on the periphery of the LED chip to form a fluorescent powder layer, and the fluorescent powder layer is limited in a groove area (as shown in figures 1 to 3, the appearance of the fluorescent powder layer is in a spherical cap shape due to the action of surface tension); then, irradiating the fluorescent powder layer by using laser, wherein the laser vertically points to the middle of the LED chip, the packaging adhesive which is easy to cure is adopted, the laser enables the fluorescent powder adhesive at the irradiation position to be cured, and then the laser naturally stands to enable the fluorescent powder in the uncured area to be completely precipitated to form a space fluorescent powder graph; finally, the phosphor paste is heated and cured (baking and heating in a baking oven at 150 ℃ for 1 hour). The method improves the distribution of the fluorescent powder by laser, can improve the geometric shape of the fluorescent powder layer, thereby improving the spatial color uniformity, and realizes high spatial color uniformity as shown in fig. 7.
In the second example, the laser power was about 15w, the irradiation time was about 10s, and the natural standing time was about 6 hours.
In the present invention, the concentration of the phosphor in the phosphor gel may be 0.01g/ml to 2.0g/ml, and in the first and second embodiments, the concentration of the phosphor in the phosphor gel is 1.5g/ml and the amount of the phosphor gel is 1.2 μ l.
In the invention, the fluorescent powder glue is coated by a spray head or a syringe in a dropping way.
The invention has no special requirements on the wavelength and the spot shape of the laser, the laser can be blue light, infrared light or light with other wavelengths, and the spot shape can be round, square or other geometric shapes. In this example, the spot is circular, 0.5mm in diameter, and 440nm in wavelength.
The invention has no special requirement on the material of the packaging adhesive, and the packaging adhesive can be silica gel, epoxy resin, liquid glass or other transparent packaging adhesives.
The invention has no special requirement on the material of the fluorescent powder, and the fluorescent powder can be YAG, TAG or other fluorescent powder.
The invention has no special requirement on the material of the substrate, and the substrate can be a metal substrate material such as copper, aluminum and the like, and can also be a non-metal substrate material such as silicon, ceramic, PCB and the like.
The invention has no special requirement on the material of the reflecting layer on the surface of the substrate, and the reflecting layer on the surface of the substrate can be silver or other reflecting materials.
The invention has no special requirement on the LED chip, and the LED chip can be a chip composed of binary materials such as GaN and the like, a chip composed of quaternary materials such as AlGaNP and the like or other chips.
The above description is a preferred embodiment of the present invention, but the present invention should not be limited to the disclosure of the embodiment and the drawings. Therefore, it is intended that all equivalents and modifications which do not depart from the spirit of the invention disclosed herein are deemed to be within the scope of the invention.
Claims (10)
1. A LED packaging method for realizing high spatial color uniformity is characterized in that: controlling the space distribution of the fluorescent powder through the action of the laser and the fluorescent powder glue, comprising the steps of,
s1, bonding the LED chip at the center of the groove on the substrate and completing the wire bonding process to realize electric connection;
s2, mixing the fluorescent powder and the packaging adhesive fully to form fluorescent powder adhesive, and coating the fluorescent powder adhesive on the periphery of the LED chip to form a fluorescent powder layer;
s3, irradiating the fluorescent powder layer by laser, wherein the laser points to the middle of the LED chip vertically, and the action forms of the laser and the fluorescent powder glue are two, one is that when the adopted packaging glue is easy to cure, the laser cures the fluorescent powder glue at the irradiation position, and then the laser naturally stands to completely precipitate the fluorescent powder in the uncured area to form a space fluorescent powder pattern; the other is that when the adopted packaging adhesive is not easy to cure, the laser enables the middle temperature of the fluorescent powder layer to be high and the edge temperature to be low, the packaging adhesive flows to the middle, and the fluorescent powder is gathered at the middle LED chip under the wrapping of the packaging adhesive;
and S4, heating and curing the fluorescent powder glue.
2. The method of claim 1 for packaging an LED to achieve high spatial color uniformity, wherein: in step S3, when the adopted packaging adhesive is easy to cure, the laser power is 2W-15W, the irradiation time is 10-500S, and the natural standing time is 1-10 hours; when the adopted packaging adhesive is not easy to cure, the laser power is 2W-20W, and the irradiation time is 10-600 s.
3. The method of claim 1 for packaging an LED to achieve high spatial color uniformity, wherein: the concentration of the fluorescent powder in the fluorescent powder glue is 0.01 g/ml-2.0 g/ml.
4. The method of claim 1 for packaging an LED to achieve high spatial color uniformity, wherein: the LED chip is a chip made of GaN binary materials or a chip made of AlGaNP quaternary materials.
5. The method of claim 1 for packaging an LED to achieve high spatial color uniformity, wherein: the fluorescent powder glue is coated by a spray head or a syringe in a dripping way.
6. The method of claim 1 for packaging an LED to achieve high spatial color uniformity, wherein: the laser is blue light or infrared light, and the shape of the light spot is circular or square.
7. The method of claim 1 for packaging an LED to achieve high spatial color uniformity, wherein: the packaging adhesive is silica gel, epoxy resin or liquid glass.
8. The method of claim 1 for packaging an LED to achieve high spatial color uniformity, wherein: the fluorescent powder is YAG fluorescent powder or TAG fluorescent powder.
9. The method of claim 1 for packaging an LED to achieve high spatial color uniformity, wherein: the substrate material is copper, aluminum, silicon, ceramic or PCB board.
10. The method of claim 1 for packaging an LED to achieve high spatial color uniformity, wherein: the material of the reflecting layer on the surface of the substrate is silver.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101553936A (en) * | 2006-05-31 | 2009-10-07 | 飞利浦拉米尔德斯照明设备有限责任公司 | Cross control by alteration of wavelength converting member |
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| JPWO2014119295A1 (en) * | 2013-01-31 | 2017-01-26 | パナソニックＩｐマネジメント株式会社 | Method for manufacturing light emitting device |
| US9698314B2 (en) * | 2013-03-15 | 2017-07-04 | General Electric Company | Color stable red-emitting phosphors |
| CN103681983B (en) * | 2013-06-17 | 2016-02-24 | 深圳市绎立锐光科技开发有限公司 | A kind of light-emitting component applies method and the air jet system of phosphor powder layer |
| CN103325926B (en) * | 2013-06-19 | 2015-07-22 | 华中科技大学 | LED packaging structure used in on-board chip and fluorescent powder coating method thereof |
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| CN104465965B (en) * | 2014-12-09 | 2018-06-19 | 武汉大学 | A kind of fluorescent powder film preparation method for white light LEDs wafer-level packaging |
| CN105070794B (en) * | 2015-07-14 | 2017-06-16 | 武汉大学 | LED fluorescent powder coating unit and method based on induced with laser |
| KR20170093320A (en) * | 2016-02-04 | 2017-08-16 | 주식회사 효성 | Phosphor plate with light-diffusing material |
| DE102016212070A1 (en) * | 2016-07-04 | 2018-01-04 | Osram Gmbh | LIGHTING DEVICE AND VEHICLE HEADLIGHTS WITH LIGHTING DEVICE |
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| CN101553936A (en) * | 2006-05-31 | 2009-10-07 | 飞利浦拉米尔德斯照明设备有限责任公司 | Cross control by alteration of wavelength converting member |
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| Title |
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| 彩色PDP荧光粉的发展现状与制备方法;尚淑娟等;《稀土》;20100615(第03期);全文 * |
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