CN110421928A - 一种高速高频领域用低成本、低损耗覆铜板的制备方法 - Google Patents

一种高速高频领域用低成本、低损耗覆铜板的制备方法 Download PDF

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CN110421928A
CN110421928A CN201910808267.6A CN201910808267A CN110421928A CN 110421928 A CN110421928 A CN 110421928A CN 201910808267 A CN201910808267 A CN 201910808267A CN 110421928 A CN110421928 A CN 110421928A
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copper
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clad plate
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杨永亮
郑宝林
陈长浩
栾好帅
王丽亚
王彦
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SHANDONG JINBAO ELECTRONICS CO Ltd
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Abstract

本发明属于覆铜板生产技术领域，涉及一种高速高频领域用低成本、低损耗覆铜板的制备方法。本发明制得的覆铜板板材的电性能等指标符合高速板的基本要求，可以满足5G领域的一些基本应用；且本发明采用苯并噁嗪和环氧树脂替代氰酸酯树脂，成本较同类产品降低20％以上，且避免了氰酸酯树脂对环境和人体的伤害。

Description

一种高速高频领域用低成本、低损耗覆铜板的制备方法
技术领域
本发明涉及一种覆铜板，尤其涉及一种高速高频领域用低成本、低损耗覆铜板的制备方法，属于覆铜板生产技术领域。
背景技术
随着5G时代的来临、自动驾驶、汽车防撞系统、高速大容量存贮器、定位系统、物联网等广泛应用，将要求所用电子材料和电子元器件等具有高频、高速和大容量存储及传输信号的功能。对信号传输的质量要求越来越高，要求信号传输速度要快，信号传输损失要小，与信号传输有关的覆铜板要求要有更低的介电常数和介质损耗。
传统环氧树脂及其固化体系已经难以满足高速高频领域覆铜板对板材电性能方面的要求。因而，一些高性能的树脂，如氰酸酯、改性聚苯醚、双马来酰亚胺、改性聚酰亚胺、BT树脂等已经开始逐步取代环氧树脂应用在高性能覆铜板领域。以上树脂性能优异，耐热性好，但是成本高昂，不适合应用在高速通信的中低端领域。
在专利CN 103342894A中公布了一种双马来酰亚胺预聚物+氰酸酯+活性酯为主体树脂的树脂组合物，其制备的覆铜板电性能达到DK(1GHz)为3.5-3.7，Df(1GHz)为0.006-0.008，可满足5G通讯领域的基本要求。
在专利CN 101967264A中公布了一种联苯环氧+氰酸酯+活性酯为主体树脂的树脂组合物，其制备的覆铜板电性能达到DK(1GHz)为3.7-3.8，Df(1GHz)为0.006-0.008，也可满足5G通讯领域的基本要求。
上述两篇专利中均用到成本高昂的氰酸酯树脂，导致覆铜板成本较高。现在竞争激烈的电子材料市场中，性能满足使用要求的同时，成本成了决定产品市场应用前途的一个重要因素。
发明内容
本发明针对上述现有技术存在的不足，提供一种高速高频领域用低成本、低损耗覆铜板的制备方法。
本发明解决上述技术问题的技术方案如下：一种高速高频领域用低成本、低损耗覆铜板的制备方法，步骤如下：
(1)树脂胶液的制备：将20-35份环氧树脂、7-12份活性酯固化剂、5-10份苯并噁嗪、0.1-0.5份促进剂、10-25份固体填料、2-5份增韧剂、5-12份阻燃剂和30-40份溶剂混合，搅拌均匀；
(2)将电子级玻纤布浸渍在步骤(1)制得的胶液中，在150-190℃条件下烘干，控制含胶量为45±5％，流动度为16±4％，制得半固化片；
(3)取若干张步骤(2)制得的半固化片叠加在一起，在双面各覆有一张铜箔，在180-200℃条件下热压90-150min，制得覆铜板。
在上述技术方案的基础上，本发明还可以做如下改进。
进一步，步骤(1)中所述环氧树脂为联苯型环氧树脂、聚苯醚改性环氧树脂或双环戊二烯苯酚环氧树脂中的一种或两种以上混合；
步骤(1)中所述活性酯固化剂为双环戊二烯苯酚改性酯或酚醛树脂改性酯，其中酯基末端为苯环或苯醌结构；
步骤(1)中所述苯并噁嗪的介电常数＜3.5；
步骤(1)中所述促进剂为2-甲基咪唑、2-乙基-4-甲基咪唑、2-十一烷基咪唑或4-二甲氨基吡啶中的一种或两种以上混合；
步骤(1)中所述固体填料为经过表面活性剂或偶联剂处理的二氧化硅、球型二氧化硅、空心玻璃球、氧化铝、氧化镁或陶瓷粉中的一种或两种以上混合，粒度为0.5-10μm；
步骤(1)中所述增韧剂为核壳丁苯橡胶或丁晴橡胶；
步骤(1)中所述阻燃剂为四溴双酚A、十溴二苯醚、十溴二苯乙烷或溴代三嗪中的一种或两种以上混合；
步骤(1)中所述溶剂为丙酮、丁酮、乙二醇单甲醚、丙二醇甲醚、DMF或甲苯中的一种或两种以上混合。
更进一步，所述表面活性剂为BYK-W903或BYK-W940中的一种或两种混合；所述偶联剂为KH-560。
进一步，步骤(2)中所述电子级玻纤布经过硅烷偶联剂处理，为E玻纤布或NE玻纤布的任意一种；玻纤布为开纤布或非开纤布。
更进一步，所述的硅烷偶联剂为KH-560。
进一步，所述的含胶量是指浸胶用树脂乳液纯固体占浸胶料片重量的百分比；所述的流动度是指浸胶用树脂乳液在15MPa、160±2℃下流出的重量占浸胶用树脂乳液总重量的百分比。
本发明的有益效果是：
1、本发明使用低介电的苯并噁嗪替代氰酸酯，因选用的苯并噁嗪本身具有优良的介电性、耐热性和尺寸稳定性，保证了产品的介电性能、耐热性和尺寸稳定性无明显衰减迹象，且成本大幅降低。
2、本发明制得的覆铜板板材的电性能等指标符合高速板的基本要求，DK(10GHz)为3.5-3.8,Df(10GHz)为0.007-0.009，可以满足5G领域的一些基本应用；且本发明采用苯并噁嗪和环氧树脂替代氰酸酯树脂，成本较同类产品降低20％以上，且避免了氰酸酯树脂对环境和人体的伤害。
具体实施方式
以下结合实例对本发明的原理和特征进行描述，所举实例只用于解释本发明，并非用于限定本发明的范围。
实施例1
一种高速高频领域用低成本、低损耗覆铜板的制备方法，步骤如下：
(1)树脂胶液的制备：将25份双环戊二烯苯酚环氧树脂、9份酚醛树脂改性酯、6份苯并噁嗪、0.1份2-甲基咪唑、20份二氧化硅、4份核壳丁苯橡胶、8份四溴双酚A和32份丙酮混合，搅拌均匀；
(2)将电子级玻纤布浸渍在步骤(1)制得的胶液中，在170℃条件下烘干，控制含胶量为45±5％，流动度为16±4％，制得半固化片；
(3)取若干张步骤(2)制得的半固化片叠加在一起，在双面各覆有一张铜箔，在190℃条件下热压110min，制得覆铜板。
实施例2
一种高速高频领域用低成本、低损耗覆铜板的制备方法，步骤如下：
(1)树脂胶液的制备：将15份双环戊二烯苯酚环氧树脂、10份联苯型环氧树脂、10份双环戊二烯苯酚改性酯、5份苯并噁嗪、0.1份2-乙基-4-甲基咪唑、18份氧化铝、4份丁晴橡胶、8份十溴二苯醚和38份丙二醇甲醚混合，搅拌均匀；
(2)将电子级玻纤布浸渍在步骤(1)制得的胶液中，在160℃条件下烘干，控制含胶量为45±5％，流动度为16±4％，制得半固化片；
(3)取若干张步骤(2)制得的半固化片叠加在一起，在双面各覆有一张铜箔，在185℃条件下热压120min，制得覆铜板。
对比例1
一种覆铜板的制备方法，步骤如下：
(1)树脂胶液的制备：将10份双环戊二烯苯酚环氧树脂、10份联苯型环氧树脂、10份双环戊二烯苯酚改性酯、10份氰酸酯预聚体、0.1份2-乙基-4-甲基咪唑、18份氧化铝、4份丁晴橡胶、8份十溴二苯醚和38份丙二醇甲醚混合，搅拌均匀；
(2)将电子级玻纤布浸渍在步骤(1)制得的胶液中，在170℃条件下烘干，控制含胶量为45±5％，流动度为16±4％，制得半固化片；
(3)取若干张步骤(2)制得的半固化片叠加在一起，在双面各覆有一张铜箔，在220℃条件下热压120min，制得覆铜板。
表1为实施例1、实施例2和对比例1所得样品的各项性能对照表。
表1
序号 指标名称 单位 实施例1 实施例2 对比例1
1 剥离强度 N/mm 1.73 1.81 1.77
2 耐浸焊/288℃ min ＞60 ＞60 ＞60
3 Tg(DSC) ℃ 155 160 180
4 DK(1GHz) —— 3.5 3.7 3.6
5 Df(1GHz) —— 0.008 0.0075 0.006
6 单位面积成本 元/㎡ 150 155 205
由表1可以看出，本发明制得的覆铜板耐热性、电性能满足高速板的基本要求。使用苯并噁嗪和环氧树脂替代氰酸酯树脂，其成本只有氰酸酯树脂的1/10，所用综合成本较同类产品低20％以上，具有较强的市场竞争力。
以上所述仅为本发明的较佳实施例，并不用以限制本发明，凡在本发明的精神和原则之内，所作的任何修改、等同替换、改进等，均应包含在本发明的保护范围之内。

Claims (6)

1.一种高速高频领域用低成本、低损耗覆铜板的制备方法，其特征在于，步骤如下：
(1)树脂胶液的制备：将20-35份环氧树脂、7-12份活性酯固化剂、5-10份苯并噁嗪、0.1-0.5份促进剂、10-25份固体填料、2-5份增韧剂、5-12份阻燃剂和30-40份溶剂混合，搅拌均匀；
(2)将电子级玻纤布浸渍在步骤(1)制得的胶液中，在150-190℃条件下烘干，控制含胶量为45±5％，流动度为16±4％，制得半固化片；
(3)取若干张步骤(2)制得的半固化片叠加在一起，在双面各覆有一张铜箔，在180-200℃条件下热压90-150min，制得覆铜板。
2.根据权利要求1所述的制备方法，其特征在于，步骤(1)中所述环氧树脂为联苯型环氧树脂、聚苯醚改性环氧树脂或双环戊二烯苯酚环氧树脂中的一种或两种以上混合；
步骤(1)中所述活性酯固化剂为双环戊二烯苯酚改性酯或酚醛树脂改性酯，其中酯基末端为苯环或苯醌结构；
步骤(1)中所述促进剂为2-甲基咪唑、2-乙基-4-甲基咪唑、2-十一烷基咪唑或4-二甲氨基吡啶中的一种或两种以上混合；
步骤(1)中所述固体填料为经过表面活性剂或偶联剂处理的二氧化硅、球型二氧化硅、空心玻璃球、氧化铝、氧化镁或陶瓷粉中的一种或两种以上混合，粒度为0.5-10μm；
步骤(1)中所述增韧剂为核壳丁苯橡胶或丁晴橡胶；
步骤(1)中所述阻燃剂为四溴双酚A、十溴二苯醚、十溴二苯乙烷或溴代三嗪中的一种或两种以上混合；
步骤(1)中所述溶剂为丙酮、丁酮、乙二醇单甲醚、丙二醇甲醚、DMF或甲苯中的一种或两种以上混合。
3.根据权利要求2所述的制备方法，其特征在于，所述表面活性剂为BYK-W903或BYK-W940中的一种或两种混合；所述偶联剂为KH-560。
4.根据权利要求1所述的制备方法，其特征在于，步骤(2)中所述电子级玻纤布经过硅烷偶联剂处理，为E玻纤布或NE玻纤布的任意一种；玻纤布为开纤布或非开纤布。
5.根据权利要求4所述的制备方法，其特征在于，所述的硅烷偶联剂为KH-560。
6.根据权利要求1所述的制备方法，其特征在于，所述的含胶量是指浸胶用树脂乳液纯固体占浸胶料片重量的百分比；所述的流动度是指浸胶用树脂乳液在15MPa、160±2℃下流出的重量占浸胶用树脂乳液总重量的百分比。
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