CN110396276A - The small spacing lamp bead encapsulating epoxy resin constituent of high-end LED and preparation method - Google Patents
The small spacing lamp bead encapsulating epoxy resin constituent of high-end LED and preparation method Download PDFInfo
- Publication number
- CN110396276A CN110396276A CN201910374162.4A CN201910374162A CN110396276A CN 110396276 A CN110396276 A CN 110396276A CN 201910374162 A CN201910374162 A CN 201910374162A CN 110396276 A CN110396276 A CN 110396276A
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- China
- Prior art keywords
- epoxy resin
- lamp bead
- small spacing
- parts
- end led
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4215—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The present invention provides the small spacing lamp bead encapsulating epoxy resin constituent of high-end LED and preparation methods, by weight, including following raw material: 10-50 parts of epoxy resin HE-200；20-70 parts of epoxy resin；50-90 parts of anhydride curing agent；0.1-5 parts of amine type accelerator.Present invention introduces the HE-200 with high flexibility, low total chlorine, so that product has the characteristics that color inhibition type, high tenacity, high bonding, high temperature resistant, ultralow chloride content, it can reach high-end LED encapsulation Halogen standard, so that product is with the obvious advantage in resistant to thermal aging, anti-ultraviolet ageing, cold-and-heat resistent impact and light decay aspect of performance.
Description
Technical field
The present invention relates to epoxy resin field of new materials, in particular to the high-end small spacing lamp bead encapsulating epoxy resin of LED
Constituent and preparation method.
Background technique
LED is a kind of energy-efficient cleaning light source, is most promising one of high-tech area.It is sealed as LED
Dress material, epoxy resin and organosilicon are most important two classes, and wherein epoxy resin is in LED encapsulation with occupying master in material
Lead status.
Bonding, sealing, thermostabilization, the insulation performance of epoxy resin are good, but epoxy resin material is in heatproof, resistance to old
Change, anti-yellowing property has very big space to be solved.In practical applications, after high/low temperature recycles, made of epoxy resin
LED counterdie glue easily cracks, and falls off, and the aging phenomena such as xanthochromia cause LED life to drastically reduce.Wherein patent name is one
Disclosed in the preparation method (CN104403277B) of kind of LED encapsulation high-performance epoxy resin composition after product solidifies-
30 DEG C to 125 degrees Celsius after high/low temperature recycles, dead lamp rate still > 5%, high and low temperature resistance and dead lamp rate are still to be improved.
Organosilicon material is resistance to ultraviolet, and advantageous in heat resistance, the comparison used in high-end LED package application is more, In
It is dominated in domestic high-end LED encapsulation by foreign brand name.The shortcomings that organic siliconresin, is that bonding force is poor, easily falls off with chip,
And price.
Therefore, a kind of high-end LED encapsulation material for having both epoxy resin and organic siliconresin advantage is developed, LED is overcome to exist
There is cracking and falls off in anti-high and low-temp circulation, heat-proof aging, resistance to ultraviolet xanthochromia performance, is that current urgently to be resolved, most market is answered
With the technology of prospect.
Summary of the invention
In order to solve the above-mentioned technical problem, the small spacing lamp bead encapsulating epoxy resin group of high-end LED is disclosed in the present invention
At object and preparation method, the technical scheme is that be implemented:
The high-end small spacing lamp bead encapsulating epoxy resin constituent of LED, by weight, including following raw material: epoxy resin HE-
200 10-50 parts；20-70 parts of epoxy resin；50-90 parts of anhydride curing agent；0.1-5 parts of amine type accelerator.
Preferably, the epoxy resin HE-200 is pure transparency liquid, and viscosity is 4000-8000cps, epoxy at room temperature
Equivalent 200-240g/eq, total chlorine≤100ppm.
Preferably, the epoxy resin is from cycloaliphatic epoxy resin, modified cycloaliphatic epoxy resin, hydrogenated bisphenol A epoxy
Resin, aliphatic epoxy resin, bisphenol A type epoxy resin, modified bisphenol A epoxy resin, bisphenol f type epoxy resin, heterocyclic type
One of epoxy resin is a variety of.
Preferably, the anhydride curing agent is selected from one or both of hexahydrophthalic anhydride, methyl hexahydrophthalic anhydride.
Preferably, the amine type accelerator is selected from DMP-30, HI-54K, and one in imidazoles and other tertiary amines promotors
Kind or two kinds.
The preparation method of the small spacing lamp bead encapsulating epoxy resin constituent of the high-end LED the following steps are included:
Step 1: it prepares epoxy resin component: weighing epoxy resin HE-200 in proportion and epoxy resin is uniformly mixed to obtain epoxy
Resin components；
Step 2: preparation curing agent component: anhydride curing agent and amine type accelerator mixing are weighed in proportion, stirs evenly, must consolidate
Agent component；
Step 3: matching glue: epoxy resin component and curing agent component be mixed evenly, and forms glue, the glue middle ring
Oxygen equivalent: anhydride equivalent=1:0.9.
Those skilled in the art are had found by research: the content height of halogens chlorine will cause moisture diffusion in atmosphere and arrive in resin
Semiconductor inside and chloride binding, increase the mobility of impurity, so that impurity is reached wafer surface, corrosion failure is caused to act on,
Phenomena such as wet-hot aging performance decline, causes failure, aging.
Epoxy resin HE-200 is the modified bisphenol A epoxy resin of a kind of high flexibility, low total chlorine, and the present invention is in high-end LED
Epoxy resin HE-200 is introduced in small spacing lamp bead encapsulating epoxy resin constituent, so that the small spacing lamp bead encapsulation of high-end LED
Have the characteristics that ultralow chloride content with epoxy resin component, can reach high-end LED encapsulation Halogen standard, be greatly improved height
The small spacing lamp bead encapsulating epoxy resin constituent comprehensive performance of LED is held, so that product is in resistant to thermal aging, anti-ultraviolet ageing, anti-
Cooling thermal impact and light decay aspect of performance are with the obvious advantage, while having the characteristics that color inhibition, high activity, high tenacity, high temperature resistant etc..
Specific embodiment
The technical scheme in the embodiments of the invention will be clearly and completely described below, it is clear that described implementation
Example is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without creative efforts belongs to the model that the present invention protects
It encloses.
Specific embodiment:
The high-end small spacing lamp bead encapsulating epoxy resin constituent of LED by weight, including following raw material: epoxy resin HE-
200 30 parts；50 parts of cycloaliphatic epoxy resin；20 parts of hydrogenated bisphenol A epoxy resin；95 parts of hexahydrophthalic anhydride；3 parts of DMP-30.
The preparation method of the aforementioned small spacing lamp bead encapsulating epoxy resin constituent of high-end LED the following steps are included:
Step 1: it prepares epoxy resin component: weighing epoxy resin HE-200, cycloaliphatic epoxy resin and A Hydrogenated Bisphenol A in proportion
A epoxy resin is uniformly mixed to obtain epoxy resin component；
Step 2: preparation curing agent component: hexahydrophthalic anhydride and DMP-30 mixing are weighed in proportion, stirs evenly, obtains curing agent group
Part；
Step 3: matching glue: epoxy resin component and curing agent component be mixed evenly, and forms glue, the glue middle ring
Oxygen equivalent: anhydride equivalent=1:0.9.
Performance test: control set product and the present embodiment product are tested for the property experiment jointly, the control group produces
The difference of product and the present embodiment product is: epoxy resin HE-200, other raw materials and weight part ratio are not contained in control group
Example is constant.
Experiment is tested for the property after the present embodiment product and control set product are used to the small spacing lamp bead of encapsulating LED.
(1) 300 cooling thermal impact tests cold-and-heat resistent shock-testing: are done within the scope of -60 DEG C ~ 140 DEG C.The present embodiment product
The aging phenomena such as cracking, xanthochromia are not found, and test passes through；There are the aging phenomena such as cracking, xanthochromia in control set product, in test
Only.
(2) anti-ultraviolet ageing test: in 300-400nm(6*40w)/60 DEG C under the conditions of place 8h, the present embodiment product is not
It was found that the aging phenomena such as cracking, xanthochromia, there is xanthochromia in control set product.
(3) light decay is tested: the small spacing lamp bead of 100 LED is used continuously 1000 hours, and the present embodiment product is substantially unglazed
It declines, compares set product light decay 3% or so.
The small spacing lamp bead failure rate test of (4) 100 LED: 100 cold cyclings, this implementation under the conditions of -60 DEG C ~ 140 DEG C
Example hazard rate is 1-2%, and control group hazard rate is 10%.
It should be pointed out that the foregoing is merely illustrative of the preferred embodiments of the present invention, it is not intended to limit the invention, it is all
Within the spirit and principles in the present invention, any modification, equivalent replacement, improvement and so on should be included in guarantor of the invention
Within the scope of shield.
Claims (6)
1. the high-end small spacing lamp bead encapsulating epoxy resin constituent of LED, which is characterized in that by weight, including following original
Material:
10-50 parts of epoxy resin HE-200；
20-70 parts of epoxy resin；
50-90 parts of anhydride curing agent；
0.1-5 parts of amine type accelerator.
2. the small spacing lamp bead encapsulating epoxy resin constituent of high-end LED according to claim 1, which is characterized in that institute
State epoxy resin HE-200 be pure transparency liquid, at room temperature viscosity be 4000-8000cps, epoxide equivalent 200-240g/eq,
Total chlorine≤100ppm.
3. the small spacing lamp bead encapsulating epoxy resin constituent of high-end LED according to claim 1, which is characterized in that institute
It states epoxy resin and is selected from cycloaliphatic epoxy resin, modified cycloaliphatic epoxy resin, hydrogenated bisphenol A epoxy resin, aliphatic epoxy
Resin, bisphenol A type epoxy resin, modified bisphenol A epoxy resin, bisphenol f type epoxy resin, one of heterocyclic-type epoxy resin
Or it is a variety of.
4. the small spacing lamp bead encapsulating epoxy resin constituent of high-end LED according to claim 1, which is characterized in that institute
It states anhydride curing agent and is selected from one or both of hexahydrophthalic anhydride, methyl hexahydrophthalic anhydride.
5. the small spacing lamp bead encapsulating epoxy resin constituent of high-end LED according to claim 1, which is characterized in that institute
It states amine type accelerator and is selected from one of DMP-30, HI-54K, imidazoles and other tertiary amines promotors or two kinds.
6. the small spacing lamp bead encapsulating epoxy resin constituent of high-end LED according to claim 1, which is characterized in that its
Preparation method the following steps are included:
Step 1: it prepares epoxy resin component: weighing epoxy resin HE-200 and epoxy resin in proportion, be uniformly mixed, obtain ring
Oxygen resin components；
Step 2: preparation curing agent component: anhydride curing agent and amine type accelerator mixing are weighed in proportion, stirs evenly, must consolidate
Agent component；
Step 3: matching glue: epoxy resin component and curing agent component be mixed evenly, and forms glue, the glue middle ring
Oxygen equivalent: anhydride equivalent=1:0.9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910374162.4A CN110396276A (en) | 2019-05-07 | 2019-05-07 | The small spacing lamp bead encapsulating epoxy resin constituent of high-end LED and preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910374162.4A CN110396276A (en) | 2019-05-07 | 2019-05-07 | The small spacing lamp bead encapsulating epoxy resin constituent of high-end LED and preparation method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110396276A true CN110396276A (en) | 2019-11-01 |
Family
ID=68323018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910374162.4A Pending CN110396276A (en) | 2019-05-07 | 2019-05-07 | The small spacing lamp bead encapsulating epoxy resin constituent of high-end LED and preparation method |
Country Status (1)
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111073522A (en) * | 2019-12-04 | 2020-04-28 | 络合高新材料(上海)有限公司 | Special epoxy adhesive for bonding UV (ultraviolet) photocuring PVC (polyvinyl chloride) base materials |
| CN113218956A (en) * | 2021-05-13 | 2021-08-06 | 厦门多彩光电子科技有限公司 | Welding wire evaluation method for LED lamp bead |
Citations (5)
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| CN101831143A (en) * | 2010-05-06 | 2010-09-15 | 宁波德洲精密电子有限公司 | High-performance liquid epoxy resin composition for packaging LEDs |
| CN104804688A (en) * | 2015-04-21 | 2015-07-29 | 汕头市骏码凯撒有限公司 | Outdoor LED packing matt epoxy resin package adhesive and preparation method thereof |
| CN105255428A (en) * | 2015-10-09 | 2016-01-20 | 烟台德邦先进硅材料有限公司 | Packaging epoxy resin mixture and preparation method thereof |
| JP2017095548A (en) * | 2015-11-19 | 2017-06-01 | 信越化学工業株式会社 | Thermosetting epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor deice using the same |
| CN109651760A (en) * | 2018-12-11 | 2019-04-19 | 汕头市骏码凯撒有限公司 | The epoxy molding plastic and preparation method thereof of colorless and transparent high temperature high voltage resistant boiling after a kind of solidification |
-
2019
- 2019-05-07 CN CN201910374162.4A patent/CN110396276A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101831143A (en) * | 2010-05-06 | 2010-09-15 | 宁波德洲精密电子有限公司 | High-performance liquid epoxy resin composition for packaging LEDs |
| CN104804688A (en) * | 2015-04-21 | 2015-07-29 | 汕头市骏码凯撒有限公司 | Outdoor LED packing matt epoxy resin package adhesive and preparation method thereof |
| CN105255428A (en) * | 2015-10-09 | 2016-01-20 | 烟台德邦先进硅材料有限公司 | Packaging epoxy resin mixture and preparation method thereof |
| JP2017095548A (en) * | 2015-11-19 | 2017-06-01 | 信越化学工業株式会社 | Thermosetting epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor deice using the same |
| CN109651760A (en) * | 2018-12-11 | 2019-04-19 | 汕头市骏码凯撒有限公司 | The epoxy molding plastic and preparation method thereof of colorless and transparent high temperature high voltage resistant boiling after a kind of solidification |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111073522A (en) * | 2019-12-04 | 2020-04-28 | 络合高新材料(上海)有限公司 | Special epoxy adhesive for bonding UV (ultraviolet) photocuring PVC (polyvinyl chloride) base materials |
| CN113218956A (en) * | 2021-05-13 | 2021-08-06 | 厦门多彩光电子科技有限公司 | Welding wire evaluation method for LED lamp bead |
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Application publication date: 20191101 |