CN105199644B - The anti-aging epoxy resin-matrix packaging plastic of agent of low hygroscopicity and its preparation technology - Google Patents
The anti-aging epoxy resin-matrix packaging plastic of agent of low hygroscopicity and its preparation technology Download PDFInfo
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- CN105199644B CN105199644B CN201510705330.5A CN201510705330A CN105199644B CN 105199644 B CN105199644 B CN 105199644B CN 201510705330 A CN201510705330 A CN 201510705330A CN 105199644 B CN105199644 B CN 105199644B
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- 239000004593 Epoxy Substances 0.000 title claims abstract description 44
- 239000011159 matrix material Substances 0.000 title claims abstract description 43
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 41
- 239000004033 plastic Substances 0.000 title claims abstract description 41
- 229920003023 plastic Polymers 0.000 title claims abstract description 41
- 230000003712 anti-aging effect Effects 0.000 title claims abstract description 27
- 239000003795 chemical substances by application Substances 0.000 title claims abstract description 17
- 238000005516 engineering process Methods 0.000 title claims abstract description 15
- 238000002360 preparation method Methods 0.000 title claims abstract description 14
- -1 polypropylene Polymers 0.000 claims abstract description 56
- CPLXHLVBOLITMK-UHFFFAOYSA-N Magnesium oxide Chemical compound [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 36
- 239000002994 raw material Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 25
- XQSFXFQDJCDXDT-UHFFFAOYSA-N hydroxysilicon Chemical compound [Si]O XQSFXFQDJCDXDT-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 18
- 239000003921 oil Substances 0.000 claims abstract description 18
- 229920001567 vinyl ester resin Polymers 0.000 claims abstract description 18
- 239000004743 Polypropylene Substances 0.000 claims abstract description 14
- 229920001155 polypropylene Polymers 0.000 claims abstract description 14
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims abstract description 13
- 229910001928 zirconium oxide Inorganic materials 0.000 claims abstract description 13
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims abstract description 12
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 11
- 238000000465 moulding Methods 0.000 claims description 18
- 229920000306 polymethylpentene Polymers 0.000 claims description 16
- 239000011116 polymethylpentene Substances 0.000 claims description 16
- 238000003756 stirring Methods 0.000 claims description 16
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical group CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 14
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 14
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 claims description 12
- 229940018564 m-phenylenediamine Drugs 0.000 claims description 12
- 229920000305 Nylon 6,10 Polymers 0.000 claims description 9
- 238000001816 cooling Methods 0.000 claims description 8
- 238000010438 heat treatment Methods 0.000 claims description 8
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 claims description 7
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 claims description 7
- 239000011976 maleic acid Substances 0.000 claims description 7
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 claims description 7
- 238000007711 solidification Methods 0.000 claims 2
- 230000008023 solidification Effects 0.000 claims 2
- 150000008065 acid anhydrides Chemical class 0.000 claims 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 claims 1
- 238000010521 absorption reaction Methods 0.000 abstract description 4
- 238000005538 encapsulation Methods 0.000 abstract description 4
- 238000002834 transmittance Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 abstract 1
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical group CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 abstract 1
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 9
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229910052726 zirconium Inorganic materials 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000004425 Makrolon Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
Abstract
The invention discloses a kind of anti-aging epoxy resin-matrix packaging plastic of agent of low hygroscopicity, and it is as follows to include raw material according to parts by weight：2 ~ 8 parts of 56 ~ 85 parts of bisphenol-A epoxy resin, 3 ~ 10 parts of NYLON610,2 ~ 8 parts of 1 amylene of poly- 4 methyl, 1 ~ 5 part of hydroxy silicon oil, 2 ~ 6 parts of versatic acid vinyl esters, 1 ~ 3 part of zirconium oxide, 1 ~ 4 part of magnesia, 2 ~ 5 parts of 2 hydroxyl, 4 N octyloxybenzophenones, 3 ~ 8 parts of maleic anhydride inoculated polypropylene, 9 ~ 20 parts of curing agent and curing accelerator.The invention also discloses the preparation technology of the anti-aging epoxy resin-matrix packaging plastic of the agent of low hygroscopicity.The water absorption rate of epoxy resin-matrix packaging plastic prepared by the present invention is relatively low, and the resistance to ag(e)ing that the relatively low display of 1000h yellowness index is good, meanwhile, prepared epoxy resin-matrix packaging plastic also has good light transmittance, it is suitable as being used for electronic package material, is particularly suitable for use as LED encapsulation material.
Description
Technical field
The invention belongs to encapsulating material field, more particularly to a kind of anti-aging epoxy resin-matrix packaging plastic of agent of low hygroscopicity and its
Preparation technology.
Background technology
Encapsulating material is one of important composition for forming LED component, and its main function is to enter sealing and protection to chip, is kept away
Exempt from chip is influenceed by the temperature and humidity in surrounding environment, at the same also act as prevent chip by external mechanical vibrations and
Destroyed caused by impact.Used encapsulating material has epoxy resin, makrolon, glass, organosilicon etc. transparent material now
Material.Its epoxy resin due to its good connectivity, sealing, electric insulating quality, low manufacture cost, easy processing shaping etc. into
For one of predominant package material.However, the hygroscopicity of epoxide resin material itself is strong, it is difficult to pack the long-term resistance external world
Corrode and maintain good electrical insulating property.Further, since chip in LED component can constantly emitting ultraviolet light, package material
The long-term process ultraviolet light of material is also easy to launch aetiolation, causes the light transmittance of encapsulating material to decline, so as to reduce
LED luminous efficiency and luminous brightness, therefore, the hygroscopicity and property easy to aging for improving epoxy resin structure adhesive seem particularly
It is important.
The content of the invention
Technical problems to be solved are：In order to improve the hygroscopicity of epoxy resin structure adhesive and property easy to aging, extend
The service life of encapsulating material and increase luminous efficiency, there is provided a kind of anti-aging epoxy resin-matrix packaging plastic of low humidity and its system
Standby technique.
Technical scheme：In order to solve the above problems, the invention provides a kind of anti-aging epoxy resin-matrix encapsulation of low humidity
Glue, it is as follows to include raw material according to parts by weight：56 ~ 85 parts of bisphenol-A epoxy resin, 3 ~ 10 parts of NYLON610, poly- 4- first
2 ~ 8 parts of base -1- amylenes, 1 ~ 5 part of hydroxy silicon oil, 2 ~ 6 parts of versatic acid vinyl esters, 1 ~ 3 part of zirconium oxide, 1 ~ 4 part of magnesia, 2- hydroxyls
2 ~ 5 parts of base -4-N- octyloxybenzophenones, 3 ~ 8 parts of maleic anhydride inoculated polypropylene, 9 ~ 20 parts of curing agent and curing accelerator 2 ~
8 parts.
Preferably, the anti-aging epoxy resin-matrix packaging plastic of low humidity, it is as follows to include raw material according to parts by weight：A Hydrogenated Bisphenol A
74 parts of A types epoxy resin, 5 parts of NYLON610,4 parts of poly(4-methyl-1-pentene), 3 parts of hydroxy silicon oil, 4 parts of versatic acid vinyl esters,
2 parts of zirconium oxide, 3 parts of magnesia, 4 parts of 2- hydroxyl -4-N- octyloxybenzophenones, 5 parts of maleic anhydride inoculated polypropylene, curing agent
12 parts and 4 parts of curing accelerator.
Preferably, the curing agent is biphenol hexichol or m-phenylene diamine (MPD).
Preferably, the curing accelerator is methylimidazole.
The preparation technology of the anti-aging epoxy resin-matrix packaging plastic of low humidity described above, comprises the following steps：
Weigh the raw material of above-mentioned mass fraction；
By the NYLON610 in raw material, poly(4-methyl-1-pentene), versatic acid vinyl esters, zirconium oxide, magnesia, maleic acid
Acid anhydride graft polypropylene, curing agent and curing accelerator heating stirring are uniform；
Bisphenol-A epoxy resin, hydroxy silicon oil and 2- hydroxyl -4-N- octyloxybenzophenones are sequentially added, after
It is continuous to stir；
Well mixed material is subjected to vacuum defoamation first, is subsequently placed in curing molding in mould, curing molding temperature
For 140 ~ 170 DEG C, solidified forming time is 4 ~ 8h；
It is stripped after cooling and produces epoxy resin-matrix packaging plastic.
Preferably, the curing molding temperature is solidified forming time 5h described in 160 DEG C.
Preferably, the curing agent is biphenol hexichol, and the curing accelerator is methylimidazole.
The invention has the advantages that：The water absorption rate of epoxy resin-matrix packaging plastic prepared by the present invention is relatively low to be
0.11% ~ 0.19%, and the resistance to ag(e)ing that the relatively low display of 1000h yellowness index is good, meanwhile, prepared epoxy resin-matrix envelope
Dress glue also has good light transmittance, is suitable as being used for electronic package material, is particularly suitable for use as LED encapsulation material.
Embodiment
For a further understanding of the present invention, invention preferred embodiment is described with reference to embodiment, but should
Work as understanding, these descriptions are simply further explanation the features and advantages of the present invention, rather than the limit to the claims in the present invention
System.
Embodiment 1
A kind of anti-aging epoxy resin-matrix packaging plastic of low humidity, it is as follows to include raw material according to parts by weight：Hydrogenated bisphenol A type
56 parts of epoxy resin, 3 parts of NYLON610,2 parts of poly(4-methyl-1-pentene), 1 part of hydroxy silicon oil, 2 parts of versatic acid vinyl esters, oxygen
Change 1 part of zirconium, 1 part of magnesia, 2 parts of 2- hydroxyl -4-N- octyloxybenzophenones, 3 parts of maleic anhydride inoculated polypropylene, biphenol two
2 parts of 9 parts of benzene and methylimidazole.
The preparation technology of the anti-aging epoxy resin-matrix packaging plastic of low humidity described above, comprises the following steps：
Weigh the raw material of above-mentioned mass fraction；
By the NYLON610 in raw material, poly(4-methyl-1-pentene), versatic acid vinyl esters, zirconium oxide, magnesia, maleic acid
Acid anhydride graft polypropylene, biphenol hexichol and methylimidazole heating stirring are uniform；
Bisphenol-A epoxy resin, hydroxy silicon oil and 2- hydroxyl -4-N- octyloxybenzophenones are sequentially added, after
It is continuous to stir；
Well mixed material is subjected to vacuum defoamation first, is subsequently placed in curing molding in mould, curing molding temperature
For 140 DEG C, solidified forming time 4h；
It is stripped after cooling and produces epoxy resin-matrix packaging plastic.
Embodiment 2
A kind of anti-aging epoxy resin-matrix packaging plastic of low humidity, it is as follows to include raw material according to parts by weight：Hydrogenated bisphenol A type
70 parts of epoxy resin, 6 parts of NYLON610,5 parts of poly(4-methyl-1-pentene), 3 parts of hydroxy silicon oil, 4 parts of versatic acid vinyl esters, oxygen
Change 2 parts of zirconium, 3 parts of magnesia, 3 parts of 2- hydroxyl -4-N- octyloxybenzophenones, 5 parts of maleic anhydride inoculated polypropylene, m-phenylene diamine (MPD)
15 parts and 5 parts of methylimidazole.
The preparation technology of the anti-aging epoxy resin-matrix packaging plastic of low humidity described above, comprises the following steps：
Weigh the raw material of above-mentioned mass fraction；
By the NYLON610 in raw material, poly(4-methyl-1-pentene), versatic acid vinyl esters, zirconium oxide, magnesia, maleic acid
Acid anhydride graft polypropylene, m-phenylene diamine (MPD) and methylimidazole heating stirring are uniform；
Bisphenol-A epoxy resin, hydroxy silicon oil and 2- hydroxyl -4-N- octyloxybenzophenones are sequentially added, after
It is continuous to stir；
Well mixed material is subjected to vacuum defoamation first, is subsequently placed in curing molding in mould, curing molding temperature
For 155 DEG C, solidified forming time 6h；
It is stripped after cooling and produces epoxy resin-matrix packaging plastic.
Embodiment 3
A kind of anti-aging epoxy resin-matrix packaging plastic of low humidity, it is as follows to include raw material according to parts by weight：Hydrogenated bisphenol A type
85 parts of epoxy resin, 10 parts of NYLON610,8 parts of poly(4-methyl-1-pentene), 5 parts of hydroxy silicon oil, 6 parts of versatic acid vinyl esters, oxygen
Change 3 parts of zirconium, 4 parts of magnesia, 5 parts of 2- hydroxyl -4-N- octyloxybenzophenones, 8 parts of maleic anhydride inoculated polypropylene, m-phenylene diamine (MPD)
20 parts and 8 parts of methylimidazole.
The preparation technology of the anti-aging epoxy resin-matrix packaging plastic of low humidity described above, comprises the following steps：
Weigh the raw material of above-mentioned mass fraction；
By the NYLON610 in raw material, poly(4-methyl-1-pentene), versatic acid vinyl esters, zirconium oxide, magnesia, maleic acid
Acid anhydride graft polypropylene, m-phenylene diamine (MPD) and methylimidazole heating stirring are uniform；
Bisphenol-A epoxy resin, hydroxy silicon oil and 2- hydroxyl -4-N- octyloxybenzophenones are sequentially added, after
It is continuous to stir；
Well mixed material is subjected to vacuum defoamation first, is subsequently placed in curing molding in mould, curing molding temperature
For 170 DEG C, solidified forming time 8h；
It is stripped after cooling and produces epoxy resin-matrix packaging plastic.
Embodiment 4
A kind of anti-aging epoxy resin-matrix packaging plastic of low humidity, it is as follows to include raw material according to parts by weight：Hydrogenated bisphenol A type
74 parts of epoxy resin, 5 parts of NYLON610,4 parts of poly(4-methyl-1-pentene), 3 parts of hydroxy silicon oil, 4 parts of versatic acid vinyl esters, oxygen
Change 2 parts of zirconium, 3 parts of magnesia, 4 parts of 2- hydroxyl -4-N- octyloxybenzophenones, 5 parts of maleic anhydride inoculated polypropylene, biphenol two
4 parts of 12 parts of benzene and methylimidazole.
The preparation technology of the anti-aging epoxy resin-matrix packaging plastic of low humidity described above, comprises the following steps：
Weigh the raw material of above-mentioned mass fraction；
By the NYLON610 in raw material, poly(4-methyl-1-pentene), versatic acid vinyl esters, zirconium oxide, magnesia, maleic acid
Acid anhydride graft polypropylene, biphenol hexichol and methylimidazole heating stirring are uniform；
Bisphenol-A epoxy resin, hydroxy silicon oil and 2- hydroxyl -4-N- octyloxybenzophenones are sequentially added, after
It is continuous to stir；
Well mixed material is subjected to vacuum defoamation first, is subsequently placed in curing molding in mould, curing molding temperature
For 150 DEG C, solidified forming time 5h；
It is stripped after cooling and produces epoxy resin-matrix packaging plastic.
Embodiment 5
A kind of anti-aging epoxy resin-matrix packaging plastic of low humidity, it is as follows to include raw material according to parts by weight：Hydrogenated bisphenol A type
81 parts of epoxy resin, 6 parts of NYLON610,3 parts of poly(4-methyl-1-pentene), 4 parts of hydroxy silicon oil, 5 parts of versatic acid vinyl esters, oxygen
Change 1 part of zirconium, 2 parts of magnesia, 3 parts of 2- hydroxyl -4-N- octyloxybenzophenones, 6 parts of maleic anhydride inoculated polypropylene, biphenol two
5 parts of 18 parts of benzene and methylimidazole.
The preparation technology of the anti-aging epoxy resin-matrix packaging plastic of low humidity described above, comprises the following steps：
Weigh the raw material of above-mentioned mass fraction；
By the NYLON610 in raw material, poly(4-methyl-1-pentene), versatic acid vinyl esters, zirconium oxide, magnesia, maleic acid
Acid anhydride graft polypropylene, biphenol hexichol and methylimidazole heating stirring are uniform；
Bisphenol-A epoxy resin, hydroxy silicon oil and 2- hydroxyl -4-N- octyloxybenzophenones are sequentially added, after
It is continuous to stir；
Well mixed material is subjected to vacuum defoamation first, is subsequently placed in curing molding in mould, curing molding temperature
For 160 DEG C, solidified forming time 5h；
It is stripped after cooling and produces epoxy resin-matrix packaging plastic.
Performance test
Performance test is carried out to the epoxy resin-matrix packaging plastic prepared by various embodiments above below, refers to following table：
Wherein, comparative example（*）For common epoxy encapsulation glue material.As seen from the above table, prepared by embodiment 1 ~ 5
The water absorption rate of epoxy resin-matrix packaging plastic<0.2%, far below comparative example（*）In 0.31% water absorption rate；And 1000h xanthochromias
Index displays that the epoxy resin-matrix packaging plastic prepared by each embodiment is better than comparative example（*）, meanwhile, prepared by each embodiment
Epoxy resin-matrix packaging plastic also has good light transmittance, is suitable as being used for electronic package material, is particularly suitable for use as LED envelopes
Package material.
Claims (7)
1. a kind of anti-aging epoxy resin-matrix packaging plastic of low humidity, it is characterised in that it is as follows to include raw material according to parts by weight：
56 ~ 85 parts of bisphenol-A epoxy resin, 3 ~ 10 parts of NYLON610,2 ~ 8 parts of poly(4-methyl-1-pentene), hydroxy silicon oil 1 ~ 5
Part, 2 ~ 6 parts of versatic acid vinyl esters, 1 ~ 3 part of zirconium oxide, 1 ~ 4 part of magnesia, 2- hydroxyl -4-N- octyloxybenzophenones 2 ~ 5
2 ~ 8 parts of part, 3 ~ 8 parts of maleic anhydride inoculated polypropylene, 9 ~ 20 parts of curing agent and curing accelerator；
The preparation technology of the anti-aging epoxy resin-matrix packaging plastic of described low humidity, comprises the following steps：
Weigh the raw material of above-mentioned mass fraction；
NYLON610 in raw material, poly(4-methyl-1-pentene), versatic acid vinyl esters, zirconium oxide, magnesia, maleic anhydride are connect
Branch polypropylene, curing agent and curing accelerator heating stirring are uniform；
Bisphenol-A epoxy resin, hydroxy silicon oil and 2- hydroxyl -4-N- octyloxybenzophenones are sequentially added, continues to stir
Mix uniformly；
Well mixed material is subjected to vacuum defoamation first, is subsequently placed in curing molding in mould, curing molding temperature is 140
~ 170 DEG C, solidified forming time is 4 ~ 8h；
It is stripped after cooling and produces epoxy resin-matrix packaging plastic.
2. the anti-aging epoxy resin-matrix packaging plastic of low humidity according to claim 1, it is characterised in that according to parts by weight
It is as follows including raw material：74 parts of bisphenol-A epoxy resin, 5 parts of NYLON610,4 parts of poly(4-methyl-1-pentene), hydroxy silicon oil 3
Part, 4 parts of versatic acid vinyl esters, 2 parts of zirconium oxide, 3 parts of magnesia, 4 parts of 2- hydroxyl -4-N- octyloxybenzophenones, maleic acid
4 parts of 5 parts of acid anhydride graft polypropylene, 12 parts of curing agent and curing accelerator.
3. the anti-aging epoxy resin-matrix packaging plastic of low humidity according to claim 1 or 2, it is characterised in that the solidification
Agent is biphenol hexichol or m-phenylene diamine (MPD).
4. the anti-aging epoxy resin-matrix packaging plastic of low humidity according to claim 1 or 2, it is characterised in that the solidification
Accelerator is methylimidazole.
5. the preparation technology of the anti-aging epoxy resin-matrix packaging plastic of low humidity according to claim 1, it is characterised in that bag
Include following steps：
Weigh the raw material of above-mentioned mass fraction；
NYLON610 in raw material, poly(4-methyl-1-pentene), versatic acid vinyl esters, zirconium oxide, magnesia, maleic anhydride are connect
Branch polypropylene, curing agent and curing accelerator heating stirring are uniform；
Bisphenol-A epoxy resin, hydroxy silicon oil and 2- hydroxyl -4-N- octyloxybenzophenones are sequentially added, continues to stir
Mix uniformly；
Well mixed material is subjected to vacuum defoamation first, is subsequently placed in curing molding in mould, curing molding temperature is 140
~ 170 DEG C, solidified forming time is 4 ~ 8h；
It is stripped after cooling and produces epoxy resin-matrix packaging plastic.
6. the preparation technology of the anti-aging epoxy resin-matrix packaging plastic of low humidity according to claim 5, it is characterised in that institute
Curing molding temperature is stated as 160 DEG C, the solidified forming time is 5h.
7. the preparation technology of the anti-aging epoxy resin-matrix packaging plastic of low humidity according to claim 5, it is characterised in that institute
It is biphenol hexichol to state curing agent, and the curing accelerator is methylimidazole.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510705330.5A CN105199644B (en) | 2015-10-27 | 2015-10-27 | The anti-aging epoxy resin-matrix packaging plastic of agent of low hygroscopicity and its preparation technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201510705330.5A CN105199644B (en) | 2015-10-27 | 2015-10-27 | The anti-aging epoxy resin-matrix packaging plastic of agent of low hygroscopicity and its preparation technology |
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| CN105199644B true CN105199644B (en) | 2017-12-12 |
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| CN101696264B (en) * | 2009-11-06 | 2012-12-26 | 中昊晨光化工研究院 | Epoxy resin sealing material and method for preparing same |
| CN102286260A (en) * | 2011-06-28 | 2011-12-21 | 上海景涵实业有限公司 | Non-yellowing high-transmittance insulated epoxy adhesive for light emitting diode (LED) and preparation method and use thereof |
| CN103555250A (en) * | 2013-11-18 | 2014-02-05 | 长春永固科技有限公司 | High-transparency ultraviolet aging-resistant non-conductive chip adhesive |
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