CN105199644A - Low-hygroscopicity anti-ageing epoxy-resin-based package adhesive - Google Patents
Low-hygroscopicity anti-ageing epoxy-resin-based package adhesive Download PDFInfo
- Publication number
- CN105199644A CN105199644A CN201510705330.5A CN201510705330A CN105199644A CN 105199644 A CN105199644 A CN 105199644A CN 201510705330 A CN201510705330 A CN 201510705330A CN 105199644 A CN105199644 A CN 105199644A
- Authority
- CN
- China
- Prior art keywords
- parts
- epoxy resin
- packaging plastic
- matrix packaging
- low
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000003712 anti-aging effect Effects 0.000 title claims abstract description 27
- 239000003822 epoxy resin Substances 0.000 title abstract description 9
- 229920000647 polyepoxide Polymers 0.000 title abstract description 9
- 239000000853 adhesive Substances 0.000 title abstract description 6
- 230000001070 adhesive effect Effects 0.000 title abstract description 6
- -1 poly(4-methyl-1-pentene) Polymers 0.000 claims abstract description 51
- 239000002994 raw material Substances 0.000 claims abstract description 24
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 claims abstract description 18
- 229920000305 Nylon 6,10 Polymers 0.000 claims abstract description 17
- 239000004743 Polypropylene Substances 0.000 claims abstract description 17
- 239000004841 bisphenol A epoxy resin Substances 0.000 claims abstract description 17
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 claims abstract description 17
- 239000000395 magnesium oxide Substances 0.000 claims abstract description 17
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 claims abstract description 17
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 claims abstract description 17
- 229920000306 polymethylpentene Polymers 0.000 claims abstract description 17
- 239000011116 polymethylpentene Substances 0.000 claims abstract description 17
- 229920001155 polypropylene Polymers 0.000 claims abstract description 17
- 238000005516 engineering process Methods 0.000 claims abstract description 14
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 13
- 238000002360 preparation method Methods 0.000 claims abstract description 13
- 239000004593 Epoxy Substances 0.000 claims description 37
- 238000004806 packaging method and process Methods 0.000 claims description 37
- 239000011159 matrix material Substances 0.000 claims description 36
- 239000004033 plastic Substances 0.000 claims description 36
- 229920003023 plastic Polymers 0.000 claims description 36
- 239000000463 material Substances 0.000 claims description 20
- XQSFXFQDJCDXDT-UHFFFAOYSA-N hydroxysilicon Chemical compound [Si]O XQSFXFQDJCDXDT-UHFFFAOYSA-N 0.000 claims description 16
- 125000000896 monocarboxylic acid group Chemical group 0.000 claims description 16
- 238000000465 moulding Methods 0.000 claims description 16
- 239000003921 oil Substances 0.000 claims description 16
- 229920001567 vinyl ester resin Polymers 0.000 claims description 16
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical group CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 claims description 14
- XLSZMDLNRCVEIJ-UHFFFAOYSA-N methylimidazole Natural products CC1=CNC=N1 XLSZMDLNRCVEIJ-UHFFFAOYSA-N 0.000 claims description 14
- OTEKOJQFKOIXMU-UHFFFAOYSA-N 1,4-bis(trichloromethyl)benzene Chemical compound ClC(Cl)(Cl)C1=CC=C(C(Cl)(Cl)Cl)C=C1 OTEKOJQFKOIXMU-UHFFFAOYSA-N 0.000 claims description 10
- 239000003054 catalyst Substances 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- 238000002834 transmittance Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 4
- QUAMTGJKVDWJEQ-UHFFFAOYSA-N octabenzone Chemical compound OC1=CC(OCCCCCCCC)=CC=C1C(=O)C1=CC=CC=C1 QUAMTGJKVDWJEQ-UHFFFAOYSA-N 0.000 abstract 2
- 239000005022 packaging material Substances 0.000 abstract 2
- 238000010521 absorption reaction Methods 0.000 abstract 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract 1
- 238000004100 electronic packaging Methods 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 229920002545 silicone oil Polymers 0.000 abstract 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 abstract 1
- 229920002554 vinyl polymer Polymers 0.000 abstract 1
- 230000032683 aging Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- 230000007774 longterm Effects 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 230000027772 skotomorphogenesis Effects 0.000 description 1
- 239000012780 transparent material Substances 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 230000003245 working effect Effects 0.000 description 1
Landscapes
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
A disclosed low-hygroscopicity anti-ageing epoxy-resin-based package adhesive comprises the following raw materials in parts by weight: 56-85 parts of hydrogenated bisphenol A epoxy resin, 3-10 parts of nylon 610, 2-8 parts of poly(4-methyl-1-pentene), 1-5 parts of hydroxyl silicone oil, 2-6 parts of vinyl versatate, 1-3 parts of zirconia, 1-4 parts of magnesium oxide, 2-5 parts of 2-hydroxy-4-n-octoxybenzophenone, 3-8 parts of maleic anhydride graft polypropylene, 9-20 parts of a curing agent, and 2-8 parts of a curing accelerator. The invention also discloses a preparation technology for the low-hygroscopicity anti-ageing epoxy-resin-based package adhesive. The prepared epoxy-resin-based package adhesive is relatively low in water absorption rate, shows good anti-ageing property through the relatively low 1000 h yellowness index, also possesses good light transmittance, is applicable as an electronic packaging material and especially applicable as an LED packaging material.
Description
Technical field
The invention belongs to packaged material field, particularly relate to the anti-aging epoxy resin-matrix packaging plastic of a kind of agent of low hygroscopicity and preparation technology thereof.
Background technology
Packaged material is one of important composition forming LED component; its Main Function enters sealing and protection to chip; avoid chip to be subject to the impact of the temperature and humidity in surrounding environment, also play simultaneously and prevent chip be subject to external mechanical vibrations and impact the destruction produced.Packaged material used now has epoxy resin, polycarbonate, glass, organosilicon etc. transparent material.Its epoxy resin because its good connectivity, stopping property, electric insulating quality, cost of manufacture are low, easy machine-shaping etc. becomes one of predominant package material.But the water absorbability of epoxide resin material self is strong, is difficult to the erosion in the long-term opposing external world of packaging and maintains good electrical insulating property.In addition, because the chip in LED component can constantly emitting ultraviolet light, what packaged material was long-term is also easy to launch etiolation through UV-irradiation, the transmittance of packaged material is caused to decline, thus reduce luminous efficiency and the luminosity of LED, therefore, the water absorbability and the easy aging that improve epoxy resin structure adhesive seem particularly important.
Summary of the invention
The technical problem solved is: in order to improve the water absorbability of epoxy resin structure adhesive and easy aging, extends the work-ing life of packaged material and increases luminous efficiency, provides a kind of low moist anti-aging epoxy resin-matrix packaging plastic and preparation technology thereof.
Technical scheme: in order to solve the problem, the invention provides a kind of low moist anti-aging epoxy resin-matrix packaging plastic, comprise raw material according to parts by weight as follows: bisphenol-A epoxy resin 56 ~ 85 parts, NYLON610 3 ~ 10 parts, poly(4-methyl-1-pentene) 2 ~ 8 parts, hydroxy silicon oil 1 ~ 5 part, tertiary monocarboxylic acid vinyl ester 2 ~ 6 parts, zirconium white 1 ~ 3 part, 1 ~ 4 part, magnesium oxide, 2-hydroxyl-4-N-octyloxybenzophenone 2 ~ 5 parts, maleic anhydride inoculated polypropylene 3 ~ 8 parts, 9 ~ 20 parts, solidifying agent and curing catalyst 2 ~ 8 parts.
Preferably, low moist anti-aging epoxy resin-matrix packaging plastic, comprises raw material according to parts by weight as follows: bisphenol-A epoxy resin 74 parts, NYLON610 5 parts, poly(4-methyl-1-pentene) 4 parts, hydroxy silicon oil 3 parts, tertiary monocarboxylic acid vinyl ester 4 parts, zirconium white 2 parts, 3 parts, magnesium oxide, 2-hydroxyl-4-N-octyloxybenzophenone 4 parts, maleic anhydride inoculated polypropylene 5 parts, 12 parts, solidifying agent and curing catalyst 4 parts.
Preferably, described solidifying agent is biphenol hexichol or mphenylenediamine.
Preferably, described curing catalyst is methylimidazole.
The preparation technology of low moist anti-aging epoxy resin-matrix packaging plastic described above, comprises the following steps:
Take the raw material of above-mentioned mass fraction;
By even to the NYLON610 in raw material, poly(4-methyl-1-pentene), tertiary monocarboxylic acid vinyl ester, zirconium white, magnesium oxide, maleic anhydride inoculated polypropylene, solidifying agent and curing catalyst heated and stirred;
Add bisphenol-A epoxy resin, hydroxy silicon oil and 2-hydroxyl-4-N-octyloxybenzophenone more successively, continue to stir;
First the material mixed is carried out vacuum defoamation, is then placed in mould curing molding, curing molding temperature is 140 ~ 170 DEG C, and solidified forming time is 4 ~ 8h;
After cooling, namely the demoulding obtains epoxy resin-matrix packaging plastic.
Preferably, described curing molding temperature is for described in 160 DEG C, and solidified forming time is 5h.
Preferably, described solidifying agent is biphenol hexichol, and described curing catalyst is methylimidazole.
The present invention has following beneficial effect: the water-intake rate of the epoxy resin-matrix packaging plastic prepared by the present invention is lower is 0.11% ~ 0.19%, and the 1000h yellowness index ageing resistance that also lower display is good, simultaneously, prepared epoxy resin-matrix packaging plastic also has good transmittance, be applicable to acting on electronic package material, be particularly useful for as LED encapsulation material.
Embodiment
In order to understand the present invention further, below in conjunction with embodiment, invention preferred embodiment is described, but should be appreciated that these describe just for further illustrating the features and advantages of the present invention, instead of limiting to the claimed invention.
Embodiment 1
A kind of low moist anti-aging epoxy resin-matrix packaging plastic, comprises raw material according to parts by weight as follows: bisphenol-A epoxy resin 56 parts, NYLON610 3 parts, poly(4-methyl-1-pentene) 2 parts, hydroxy silicon oil 1 part, tertiary monocarboxylic acid vinyl ester 2 parts, zirconium white 1 part, 1 part, magnesium oxide, 2-hydroxyl-4-N-octyloxybenzophenone 2 parts, maleic anhydride inoculated polypropylene 3 parts, biphenol hexichol 9 parts and methylimidazole 2 parts.
The preparation technology of low moist anti-aging epoxy resin-matrix packaging plastic described above, comprises the following steps:
Take the raw material of above-mentioned mass fraction;
By even to the NYLON610 in raw material, poly(4-methyl-1-pentene), tertiary monocarboxylic acid vinyl ester, zirconium white, magnesium oxide, maleic anhydride inoculated polypropylene, biphenol hexichol and methylimidazole heated and stirred;
Add bisphenol-A epoxy resin, hydroxy silicon oil and 2-hydroxyl-4-N-octyloxybenzophenone more successively, continue to stir;
First the material mixed is carried out vacuum defoamation, is then placed in mould curing molding, curing molding temperature is 140 DEG C, and solidified forming time is 4h;
After cooling, namely the demoulding obtains epoxy resin-matrix packaging plastic.
Embodiment 2
A kind of low moist anti-aging epoxy resin-matrix packaging plastic, comprises raw material according to parts by weight as follows: bisphenol-A epoxy resin 70 parts, NYLON610 6 parts, poly(4-methyl-1-pentene) 5 parts, hydroxy silicon oil 3 parts, tertiary monocarboxylic acid vinyl ester 4 parts, zirconium white 2 parts, 3 parts, magnesium oxide, 2-hydroxyl-4-N-octyloxybenzophenone 3 parts, maleic anhydride inoculated polypropylene 5 parts, mphenylenediamine 15 parts and methylimidazole 5 parts.
The preparation technology of low moist anti-aging epoxy resin-matrix packaging plastic described above, comprises the following steps:
Take the raw material of above-mentioned mass fraction;
By even to the NYLON610 in raw material, poly(4-methyl-1-pentene), tertiary monocarboxylic acid vinyl ester, zirconium white, magnesium oxide, maleic anhydride inoculated polypropylene, mphenylenediamine and methylimidazole heated and stirred;
Add bisphenol-A epoxy resin, hydroxy silicon oil and 2-hydroxyl-4-N-octyloxybenzophenone more successively, continue to stir;
First the material mixed is carried out vacuum defoamation, is then placed in mould curing molding, curing molding temperature is 155 DEG C, and solidified forming time is 6h;
After cooling, namely the demoulding obtains epoxy resin-matrix packaging plastic.
Embodiment 3
A kind of low moist anti-aging epoxy resin-matrix packaging plastic, comprises raw material according to parts by weight as follows: bisphenol-A epoxy resin 85 parts, NYLON610 10 parts, poly(4-methyl-1-pentene) 8 parts, hydroxy silicon oil 5 parts, tertiary monocarboxylic acid vinyl ester 6 parts, zirconium white 3 parts, 4 parts, magnesium oxide, 2-hydroxyl-4-N-octyloxybenzophenone 5 parts, maleic anhydride inoculated polypropylene 8 parts, mphenylenediamine 20 parts and methylimidazole 8 parts.
The preparation technology of low moist anti-aging epoxy resin-matrix packaging plastic described above, comprises the following steps:
Take the raw material of above-mentioned mass fraction;
By even to the NYLON610 in raw material, poly(4-methyl-1-pentene), tertiary monocarboxylic acid vinyl ester, zirconium white, magnesium oxide, maleic anhydride inoculated polypropylene, mphenylenediamine and methylimidazole heated and stirred;
Add bisphenol-A epoxy resin, hydroxy silicon oil and 2-hydroxyl-4-N-octyloxybenzophenone more successively, continue to stir;
First the material mixed is carried out vacuum defoamation, is then placed in mould curing molding, curing molding temperature is 170 DEG C, and solidified forming time is 8h;
After cooling, namely the demoulding obtains epoxy resin-matrix packaging plastic.
Embodiment 4
A kind of low moist anti-aging epoxy resin-matrix packaging plastic, comprises raw material according to parts by weight as follows: bisphenol-A epoxy resin 74 parts, NYLON610 5 parts, poly(4-methyl-1-pentene) 4 parts, hydroxy silicon oil 3 parts, tertiary monocarboxylic acid vinyl ester 4 parts, zirconium white 2 parts, 3 parts, magnesium oxide, 2-hydroxyl-4-N-octyloxybenzophenone 4 parts, maleic anhydride inoculated polypropylene 5 parts, biphenol hexichol 12 parts and methylimidazole 4 parts.
The preparation technology of low moist anti-aging epoxy resin-matrix packaging plastic described above, comprises the following steps:
Take the raw material of above-mentioned mass fraction;
By even to the NYLON610 in raw material, poly(4-methyl-1-pentene), tertiary monocarboxylic acid vinyl ester, zirconium white, magnesium oxide, maleic anhydride inoculated polypropylene, biphenol hexichol and methylimidazole heated and stirred;
Add bisphenol-A epoxy resin, hydroxy silicon oil and 2-hydroxyl-4-N-octyloxybenzophenone more successively, continue to stir;
First the material mixed is carried out vacuum defoamation, is then placed in mould curing molding, curing molding temperature is 150 DEG C, and solidified forming time is 5h;
After cooling, namely the demoulding obtains epoxy resin-matrix packaging plastic.
Embodiment 5
A kind of low moist anti-aging epoxy resin-matrix packaging plastic, comprises raw material according to parts by weight as follows: bisphenol-A epoxy resin 81 parts, NYLON610 6 parts, poly(4-methyl-1-pentene) 3 parts, hydroxy silicon oil 4 parts, tertiary monocarboxylic acid vinyl ester 5 parts, zirconium white 1 part, 2 parts, magnesium oxide, 2-hydroxyl-4-N-octyloxybenzophenone 3 parts, maleic anhydride inoculated polypropylene 6 parts, biphenol hexichol 18 parts and methylimidazole 5 parts.
The preparation technology of low moist anti-aging epoxy resin-matrix packaging plastic described above, comprises the following steps:
Take the raw material of above-mentioned mass fraction;
By even to the NYLON610 in raw material, poly(4-methyl-1-pentene), tertiary monocarboxylic acid vinyl ester, zirconium white, magnesium oxide, maleic anhydride inoculated polypropylene, biphenol hexichol and methylimidazole heated and stirred;
Add bisphenol-A epoxy resin, hydroxy silicon oil and 2-hydroxyl-4-N-octyloxybenzophenone more successively, continue to stir;
First the material mixed is carried out vacuum defoamation, is then placed in mould curing molding, curing molding temperature is 160 DEG C, and solidified forming time is 5h;
After cooling, namely the demoulding obtains epoxy resin-matrix packaging plastic.
Performance test
Performance test is carried out to the epoxy resin-matrix packaging plastic prepared by above each embodiment below, refers to following table:
Wherein, comparative example (*) is common epoxy encapsulation glue material.As seen from the above table, the water-intake rate <0.2% of the epoxy resin-matrix packaging plastic prepared by embodiment 1 ~ 5, far below the water-intake rate of 0.31% in comparative example (*); And the 1000h yellowness index epoxy resin-matrix packaging plastic also shown prepared by each embodiment is better than comparative example (*), simultaneously, epoxy resin-matrix packaging plastic prepared by each embodiment also has good transmittance, is applicable to acting on electronic package material, is particularly useful for as LED encapsulation material.
Claims (7)
1. one kind low moist anti-aging epoxy resin-matrix packaging plastic, it is characterized in that, comprise raw material according to parts by weight as follows: bisphenol-A epoxy resin 56 ~ 85 parts, NYLON610 3 ~ 10 parts, poly(4-methyl-1-pentene) 2 ~ 8 parts, hydroxy silicon oil 1 ~ 5 part, tertiary monocarboxylic acid vinyl ester 2 ~ 6 parts, zirconium white 1 ~ 3 part, 1 ~ 4 part, magnesium oxide, 2-hydroxyl-4-N-octyloxybenzophenone 2 ~ 5 parts, maleic anhydride inoculated polypropylene 3 ~ 8 parts, 9 ~ 20 parts, solidifying agent and curing catalyst 2 ~ 8 parts.
2. low moist anti-aging epoxy resin-matrix packaging plastic according to claim 1, it is characterized in that, comprise raw material according to parts by weight as follows: bisphenol-A epoxy resin 74 parts, NYLON610 5 parts, poly(4-methyl-1-pentene) 4 parts, hydroxy silicon oil 3 parts, tertiary monocarboxylic acid vinyl ester 4 parts, zirconium white 2 parts, 3 parts, magnesium oxide, 2-hydroxyl-4-N-octyloxybenzophenone 4 parts, maleic anhydride inoculated polypropylene 5 parts, 12 parts, solidifying agent and curing catalyst 4 parts.
3. low moist anti-aging epoxy resin-matrix packaging plastic according to claim 1 and 2, it is characterized in that, described solidifying agent is biphenol hexichol or mphenylenediamine.
4. low moist anti-aging epoxy resin-matrix packaging plastic according to claim 1 and 2, it is characterized in that, described curing catalyst is methylimidazole.
5. the preparation technology of low moist anti-aging epoxy resin-matrix packaging plastic according to claim 1, is characterized in that, comprise the following steps:
Take the raw material of above-mentioned mass fraction;
By even to the NYLON610 in raw material, poly(4-methyl-1-pentene), tertiary monocarboxylic acid vinyl ester, zirconium white, magnesium oxide, maleic anhydride inoculated polypropylene, solidifying agent and curing catalyst heated and stirred;
Add bisphenol-A epoxy resin, hydroxy silicon oil and 2-hydroxyl-4-N-octyloxybenzophenone more successively, continue to stir;
First the material mixed is carried out vacuum defoamation, is then placed in mould curing molding, curing molding temperature is 140 ~ 170 DEG C, and solidified forming time is 4 ~ 8h;
After cooling, namely the demoulding obtains epoxy resin-matrix packaging plastic.
6. the preparation technology of low moist anti-aging epoxy resin-matrix packaging plastic according to claim 5, it is characterized in that, described curing molding temperature is 160 DEG C, and described solidified forming time is 5h.
7. the preparation technology of low moist anti-aging epoxy resin-matrix packaging plastic according to claim 5, it is characterized in that, described solidifying agent is biphenol hexichol, and described curing catalyst is methylimidazole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510705330.5A CN105199644B (en) | 2015-10-27 | 2015-10-27 | The anti-aging epoxy resin-matrix packaging plastic of agent of low hygroscopicity and its preparation technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510705330.5A CN105199644B (en) | 2015-10-27 | 2015-10-27 | The anti-aging epoxy resin-matrix packaging plastic of agent of low hygroscopicity and its preparation technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105199644A true CN105199644A (en) | 2015-12-30 |
| CN105199644B CN105199644B (en) | 2017-12-12 |
Family
ID=54947611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510705330.5A Active CN105199644B (en) | 2015-10-27 | 2015-10-27 | The anti-aging epoxy resin-matrix packaging plastic of agent of low hygroscopicity and its preparation technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105199644B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108977147A (en) * | 2018-06-29 | 2018-12-11 | 安徽尼古拉电子科技有限公司 | A kind of anti-aging epoxy resin-matrix packaging plastic and preparation method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101696264A (en) * | 2009-11-06 | 2010-04-21 | 中昊晨光化工研究院 | Epoxy resin sealing material and method for preparing same |
| CN102286260A (en) * | 2011-06-28 | 2011-12-21 | 上海景涵实业有限公司 | Non-yellowing high-transmittance insulated epoxy adhesive for light emitting diode (LED) and preparation method and use thereof |
| CN103555250A (en) * | 2013-11-18 | 2014-02-05 | 长春永固科技有限公司 | High-transparency ultraviolet aging-resistant non-conductive chip adhesive |
| CN104356978A (en) * | 2014-12-03 | 2015-02-18 | 张亦彬 | Preparation method of adhesive |
-
2015
- 2015-10-27 CN CN201510705330.5A patent/CN105199644B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101696264A (en) * | 2009-11-06 | 2010-04-21 | 中昊晨光化工研究院 | Epoxy resin sealing material and method for preparing same |
| CN102286260A (en) * | 2011-06-28 | 2011-12-21 | 上海景涵实业有限公司 | Non-yellowing high-transmittance insulated epoxy adhesive for light emitting diode (LED) and preparation method and use thereof |
| CN103555250A (en) * | 2013-11-18 | 2014-02-05 | 长春永固科技有限公司 | High-transparency ultraviolet aging-resistant non-conductive chip adhesive |
| CN104356978A (en) * | 2014-12-03 | 2015-02-18 | 张亦彬 | Preparation method of adhesive |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108977147A (en) * | 2018-06-29 | 2018-12-11 | 安徽尼古拉电子科技有限公司 | A kind of anti-aging epoxy resin-matrix packaging plastic and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN105199644B (en) | 2017-12-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103289317B (en) | A kind of LED encapsulation material and its preparation method and application | |
| CN103641998B (en) | The white epoxy resin composition that LED reflector is used | |
| CN106349645B (en) | Thermosetting epoxy resin composition for encapsulating optical semiconductor element and optical semiconductor device using the same | |
| CN102634290A (en) | Double-component transparent epoxy resin LED (light emitting diode) patch packing adhesive | |
| CN102286260A (en) | Non-yellowing high-transmittance insulated epoxy adhesive for light emitting diode (LED) and preparation method and use thereof | |
| JP2007308683A (en) | Epoxy resin curing agent, epoxy resin composition, epoxy resin cured product and optical member using the same | |
| CN109777039A (en) | A kind of sheet-shaped LED epoxy resin composition for packaging glue cake and preparation method thereof and packaging technology | |
| CN103265923A (en) | Epoxy resin composite for high-power LED (light-emitting diode) encapsulation and preparation method thereof | |
| JP2014156591A (en) | Thermosetting resin composition and cured product of the same, substrate for mounting optical semiconductor elements, and optical semiconductor device | |
| CN107779150A (en) | A kind of LED display epoxy pouring sealant and preparation method thereof | |
| CN107118725B (en) | Electronic pouring sealant with fast dry glue, high toughness and yellowing resistance and preparation method thereof | |
| JP5453707B2 (en) | Zirconia-containing epoxy resin composition, transparent composite containing the same, light-emitting element, and optical semiconductor device | |
| CN105199644A (en) | Low-hygroscopicity anti-ageing epoxy-resin-based package adhesive | |
| CN102070875A (en) | Epoxy resin glue for photoelectron attenuation-resistant packaging | |
| CN108192284B (en) | High-temperature yellowing resistant transparent epoxy molding compound and preparation method thereof | |
| CN104710964A (en) | LED packaged silica gel and preparation method thereof | |
| JP4805500B2 (en) | Transparent casting resin material for use in LEDs with SMT capability having high temperature and high brightness or emission intensity | |
| CN105400211A (en) | LED packaging material | |
| CN107820507B (en) | High-hardness LED packaging material and preparation method thereof | |
| CN105368004B (en) | A kind of high-performance liquid embedding composition and application | |
| CN105086898B (en) | For assembling the uvioresistant transparent casting glue of flexible LED lamp bar | |
| CN104893253A (en) | LED (light-emitting diode) packaging material | |
| CN105199324A (en) | High temperature-resistant high-heat radiation epoxy resin-based encapsulating material and preparation method thereof | |
| JP4762841B2 (en) | Glass material composition for protecting optical semiconductor element and optical semiconductor device using the same | |
| CN107254132A (en) | A kind of stable type acrylic diamond and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190424 Address after: 401331 Two 21-5, No. 12 South Road, University Town, Shapingba District, Chongqing Patentee after: Chongqing Morning Knowledge Speed Core Technology Co.,Ltd. Address before: Room 2307, 70 Zhongshan East Road, Mudu Town, Wuzhong District, Suzhou City, Jiangsu Province Patentee before: SUZHOU KUANWEN ELECTRONIC SCIENCE & TECHNOLOGY Co.,Ltd. |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20210701 Address after: 215225 Hehua village, Shengze Town, Wujiang District, Suzhou City, Jiangsu Province Patentee after: Suzhou Boser New Material Technology Co.,Ltd. Address before: 401331 Two 21-5, No. 12 South Road, University Town, Shapingba District, Chongqing Patentee before: Chongqing Morning Knowledge Speed Core Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210809 Address after: 215222 Room 401, building 23, No. 1188, West 2nd Ring Road, Shengze Town, Wujiang District, Suzhou City, Jiangsu Province Patentee after: Suzhou qishuo Information Technology Co.,Ltd. Address before: 215225 Hehua village, Shengze Town, Wujiang District, Suzhou City, Jiangsu Province Patentee before: Suzhou Boser New Material Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20230801 Address after: No. 9, Fazhan Wu Road, Xinqi Industrial Zone, Leliu Town, Shunde District, Foshan City, Guangdong Province, 528399 Patentee after: Foshan city Shunde District Weihao Technology Development Co.,Ltd. Address before: 215222 Room 401, building 23, No. 1188, West 2nd Ring Road, Shengze Town, Wujiang District, Suzhou City, Jiangsu Province Patentee before: Suzhou qishuo Information Technology Co.,Ltd. |
|
| TR01 | Transfer of patent right |