CN110383471A - 用于制造用于集成电路封装的引线框架的方法 - Google Patents

用于制造用于集成电路封装的引线框架的方法 Download PDF

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CN110383471A
CN110383471A CN201880016377.2A CN201880016377A CN110383471A CN 110383471 A CN110383471 A CN 110383471A CN 201880016377 A CN201880016377 A CN 201880016377A CN 110383471 A CN110383471 A CN 110383471A
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lead frame
lead
preforming
frame carrier
die attached
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Y·C·霍
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Abstract

所描述的示例包括制造半导体管芯封装的方法(100)。方法(100)包括以预定配置在引线框架载体上布置(118)至少一个预成型管芯附接焊盘和至少两个预成型引线以形成引线框架，将半导体管芯附接(120)到至少一个预成型管芯附接焊盘，将半导体管芯线键合(122)到至少两个预成型引线，形成(124)包括半导体管芯和至少两个预成型引线的至少一部分的模制结构，并从引线框架载体移除(126)模制结构。

Description

用于制造用于集成电路封装的引线框架的方法
技术领域
背景技术
集成电路器件通常包括集成电路芯片和引线框架，它们密封在保护外壳内。它们广泛用于各种产品，例如消费电子产品、计算机、汽车、电信和军事应用。引线框架将集成电路芯片电连接到器件外部的电路。引线框架通常由高导电导热的材料形成，例如铜或铜合金。引线框架材料被冲压或蚀刻成多个引线，以及称为管芯附接焊盘的中心区域，集成电路芯片附接到该中心区域上。芯片通常通过线键合电连接到引线，并且器件被包封以提供机械和环境保护。
用于集成电路封装的常规引线框架通常使用金属蚀刻工艺来制造，以从体衬底或其他材料上的导电材料层产生管芯附接焊盘和引线。这种工艺包括蚀刻导电材料层以形组分立的导体结构(例如，管芯附接焊盘和引线)。由于蚀刻技术的物理限制，蚀刻工艺通常将这些传统引线框架上的管芯附接焊盘和/或相邻引线之间的间隔限制到导电材料层的至少一个厚度。而且，在蚀刻工艺期间从衬底去除的导电层部分在制造工艺中产生浪费。用于通过蚀刻或其他工艺生产新引线框架配置的制造商交付时间也可能很长。
发明内容
在所描述的示例中，方法包括从导电材料片单个化多个导电结构，以预定配置将多个单个化导电结构布置在引线框架载体上，以及在引线框架载体上布置至少一个管芯附接焊盘以形成至少一个引线框架，所述引线框架具有所述至少一个管芯附接焊盘和与所述至少一个管芯附接焊盘间隔开的多个引线。在一个示例中：导电结构包括具有第一金属组分、尺寸、形状或厚度的第一组导电结构和具有第二金属组分、尺寸、形状或厚度的第二组导电结构；并且，以预定配置将多个结构布置在引线框架载体上以形成至少一个引线框架，包括使用来自所述至少一个引线框架中的每个组的至少一个导电结构。在引线框架载体上布置多个单个化导电结构可包括使用模板。模板包括在对应于预定配置的位置处的开口，并且模板被应用在引线框架载体上。单个化的导电结构通过模板中的开口放置在引线框架载体上。在另一个示例中，拾取和放置机构用于在引线框架载体上布置预成型的管芯附接焊盘和预成型引线。
制造半导体管芯封装的另一示例方法包括以预定配置在引线框架载体上布置至少一个预成型管芯附接焊盘和至少两个预成型引线以形成引线框架，将半导体管芯附接到至少一个预成型的管芯附接焊盘，将半导体管芯线键合到至少两个预成型引线，形成包括半导体管芯和至少两个预成型引线的至少一部分的模制结构，以及从引线框架载体移除模制结构。
制造半导体管芯封装的又一示例方法包括从一个或更多个导电材料片单个化多个导电结构，所述导电结构包括至少一个管芯附接焊盘和至少一个引线，以预定配置在引线框架载体上布置至少一个管芯附接焊盘和至少一个引线以形成至少一个引线框架，将半导体管芯附接到所述至少一个管芯附接焊盘，将所述半导体管芯线键合到所述至少一个引线框架，在半导体管芯和引线框架上应用模制，并从引线框架载体移除模制的半导体管芯和引线框架。
附图说明
图1是示出根据一个实施例的制造半导体芯片封装的示例方法的流程图。
图2是根据图1的方法从材料片单个化多个管芯附接焊盘和引线的透视图。
图3是示例引线和管芯附接焊盘的透视图，其具有在图1的方法的单个化步骤期间形成的模具锁定特征。
图4是示出用于在图1的方法的布置步骤中在引线框架载体上布置预成型结构的一个示例性替代方案的流程图。
图5是图4的示例方法的实施方式的透视图。
图6是示出用于在图1的布置步骤中在引线框架载体上布置预成型结构的另一示例替代方案的流程图。
图7是图6的示例方法的实施方式的透视图。
图8是示出根据示例实施例的具有来自管芯封装的模制条带的引线框架的管芯封装的单个化的透视图。
具体实施方式
在附图中，相同的附图标记始终表示相同的元件，并且各种特征不一定按比例绘制。在本说明书中，术语“耦合(couple或couples)”包括间接或直接电气或机械连接或其组合。例如，如果第一设备耦合到第二设备或与第二设备耦合，则该连接可以通过直接电连接，或通过经由一个或更多个中间设备和连接的间接电连接。
示例实施例包括制造引线框架的方法，该方法使用几乎所有的导体材料(用于引线框架导体结构的引入原材料)并且产生具有间隔开的导体结构(和/或其他类型的结构)的引线框架，间隔小于一个导电层厚度。该方法实现了新的引线框架配置的快速生成，而无需重新设计并且可以减少制造商的交付时间。在一个实施例中，预成型的管芯附接焊盘和预成型引线布置在引线框架载体上以形成至少一个引线框架。然后将半导体管芯安装到管芯附接焊盘，线键合到引线，模制并且单个化以产生半导体封装。
图1说明根据示例实施例的用于制造半导体管芯封装的方法100。所示实施例中的示例半导体管芯封装是四方扁平无引脚封装(QFN封装)，但是示例实施例的方面适用于其他类型的封装。
该方法从工艺步骤112开始，在此获得导电材料片。例如，导电材料可以是铜、铝或任何其他合适的导电材料。在一个示例中，导电材料片包括预镀有NiPdAu的铜层。可以用任何所需的电镀材料或电镀材料堆预先电镀该材料片，以确保在下游处理期间适当地键合组件。而且，在工艺步骤114中，材料片可以，例如，可选地镀有各种其他导电金属(例如，NiPdAu)，和/或粗糙化或经过化学表面处理以增强后续处理步骤中的模具粘合。
在工艺步骤116中，从材料片单个化单独的导体结构。例如，单独导体结构可以是预成型的管芯附接焊盘和/或预成型引线。单独结构的单个化可以以任何合适的方式进行，例如通过锯切、蚀刻、激光切割或其他单个化工艺。从材料片单个化预成型的管芯附接焊盘和/或引线通常有利于材料片的几乎100％的利用。此外，如结合图3更详细地描述的，可以使用一个或更多个单个化步骤来铣削或以其他方式形成模具锁定特征，例如阶梯边缘或其他轮廓，以在模制引线框架时增强集成。
在工艺步骤118中，将单个化导体结构以预定配置布置或以其他方式放置在引线框架载体上，以产生多个引线框架。在本说明书中，引线框架通常包括至少一个管芯附接焊盘和布置在管芯附接焊盘附近的多个引线。除了引线框架之外，示例实施例的各方面可用于制造各种结构，因此示例实施例的方法不限于任何特定的引线框架(或其他)结构。
如下文更详细描述的，可以以多种方式执行单个化结构的定位，例如使用拾取和放置机构和/或通过使用模板。在一个实施例中，单个化结构通过粘合带层等固定到引线框架载体上，所述粘合带层等将单个化结构保持在适当位置以用于后续处理步骤。而且，示例实施例的各方面可以应用于生成宽范围的引线框架配置。
在工艺步骤120中，以另外的传统方法将半导体管芯附接到每个引线框架的管芯附接焊盘。然后在工艺步骤122中将半导体管芯线键合到每个相应引线框架的引线。然后在工艺步骤124中在管芯、管芯焊盘、引线等的至少一部分上形成模制结构。在模制结构形成之后，在工艺步骤126中，模制结构与引线框架载体分离并单个化(例如通过锯切)以产生单独的半导体封装。
图2示出示例材料片210。片210可以是导电材料片，例如铜等。如上文结合工艺步骤114所述，片210可具有在其上形成的各种镀层和/或可粗糙化或以其他方式被处理(例如，化学表面处理)以增强后续处理步骤中的模具粘合。根据工艺步骤116，片210可以分成多个单独的结构，例如多个引线212(由附图标记214标识的单独引线)和/或多个管芯附接焊盘216(由附图标记218标识的单独管芯附接焊盘)。在一些实施例中，引线214和管芯附接焊盘218可由共同材料制成和/或从共同的材料片单个化。在其他实施例中，引线214和管芯附接焊盘218可由不同材料制成和/或从不同材料片单个化。在任一情况下，在从材料片单个化之后，所示示例中的单独结构包括预成型的管芯附接焊盘和/或预成型引线。
参考图3，在单个化工艺期间可以在单个化结构中形成某些模具锁定特征。在一个实施例中，模具锁定特征可包括引线314或管芯附接焊盘318，其分别具有一个或更多个阶梯边缘316和320。阶梯边缘提供额外的结构和/或表面轮廓，用于将预成型的引线和/或管芯附接焊盘与模制结构集成。因此，在从(一个或更多个)材料片单个化单独结构期间，可以在从材料片分离之前，期间或之后从结构的边缘区域去除额外的材料。在一个实施例中，沟槽至少部分地穿过材料片形成，并且单独结构在沟槽内的位置中与材料片分离。该方法产生在图3中的引线314和管芯318上示出的阶梯边缘轮廓。其他边缘形状轮廓也是可能的，例如斜面或燕尾形。如上所述，不管形成和/或以其他方式获得预成型引线和/或管芯附接焊盘的方式，结构以预定配置布置在引线框架载体上以形成引线框架，每个引线框架具有管芯附接焊盘和多个引线，其与管芯附接焊盘隔开并彼此间隔开。
再次参考图1，并进一步参考图4和图5，工艺步骤118是将单个化结构以预定配置布置或以其他方式放置在引线框架载体上以产生多个引线框架的步骤。图4示出了使用拾取和放置机构执行工艺步骤118的示例方法418，用于将单个化结构布置在引线框架载体上。
方法418包括工艺步骤422和424，其中拾取预成形的管芯附接焊盘然后将其放置在引线框架载体上。在工艺步骤426和428中，拾取引线并将其放置在引线框架载体上。方法418继续到决策框430，其中该方法返回到工艺步骤422，直到引线框架载体完成(例如，已形成所有引线框架)，此时方法418继续处理图1中的步骤120。因此，方法418可以包括拾取和在引线框架载体上放置多个管芯附接焊盘，以及拾取和在每个管芯附接焊盘附近放置多个预成型引线，从而在引线框架载体上形成多个引线框架。
在一个示例中，在组装下一个引线框架之前，完整地组装每个引线框架。在另一个例子中，拾取几个或所有管芯附接焊盘并将其放置在引线框架载体上，然后，拾取预成型的引线并将其放置在每个管芯附接焊盘附近以完成每个引线框架。在其他示例中，拾取一些或所有引线框架的预成型引线并将其放置在引线框架载体上，然后拾取并放置管芯附接焊盘以完成引线框架。可以使用任何合适的拾取和放置管芯附接焊盘和引线的顺序。
图5示出示例布置，其中拾取和放置机器510用于将多个引线212和多个管芯附接焊盘216以预定配置布置在引线框架载体514上以形成多个引线框架518。提供带或其他层522，用于在引线214和管芯附接焊盘218定位在引线框架载体514上之后，将引线214和管芯附接焊盘218临时固定到引线框架载体514。
参考图6和7，其示出用于执行图1的工艺步骤118的另一示例方法618。在该方法中，连续使用两个模板，用于将每个引线框架的单独结构定位在引线框架衬底上。因此，在工艺步骤622中，第一模板定位在引线框架载体上。在工艺步骤624中，将预成型引线(或管芯附接焊盘，如果适用的话)通过第一模板中的开口沉积在引线框架载体上。
在工艺步骤626中，将第二模板定位在引线框架载体上。在工艺步骤628中，以与上文所述相同的方式将预成型的管芯附接焊盘(或引线，如果适用的话)通过第二模板中的开口沉积在引线框架载体上。然后，方法618返回到图1的工艺步骤120。
图7示意性地示出前述工艺618，尽管仅示出一个模板710。模板710包括用于接收管芯附接焊盘218的多个第一开口714和用于接收引线214的多个第二开口718。管芯附接焊盘218和引线214可以使用任何合适的方方法，例如振动等，被引导到模板中的相应开口中。。
参考图8，其示出在图1的工艺步骤120、122和124之后，具有多个引线框架518的引线框架载体514。这样，每个引线框架518具有管芯806，其附接到其相应的管芯附接焊盘218，以及线键合到引线214。已在组件上形成模制结构810。形成管芯封装816的最后步骤是从管芯封装的模制条带单个化每个管芯封装。为此，将带522从引线框架载体514和模制结构810上剥离，从而将模制结构810与载体514分离。然后，经由锯切或任何其他合适的方法，将各个管芯封装沿着单个化线832单个化成多个单独的管芯封装。
示例性实施例的方面有助于比使用蚀刻或冲压工艺通常可实现的引线间隔更短的引线间隔，并且它们还可以通过允许使用比引线厚的管芯附接焊盘来促进产生具有相对更高功率容量的引线框架。较厚的管芯附接焊盘可以改善给定引线框架的热特性。其他引线框架构造方法，例如蚀刻方法，具有相同厚度的管芯附接焊盘和引线。而且，蚀刻工艺具有基材厚度的上限。示例性实施例可用于产生具有管芯附接焊盘的引线框架，所述管芯附接焊盘具有更宽的厚度范围和不同于引线的厚度。而且，如上所述，不同的材料可用于管芯附接焊盘和引线。所有这些特征导致的引线框架定制水平通过先前方法通常是不可获得的。
示例实施例的方面也非常适合于快速生产新的引线框架配置。与其他方法不同，示例实施例不需要生产用于制造新引线框架配置的任何特殊工具。目前的拾取和放置机器可用于生产宽范围配置的引线框架，而无需首先生成特殊工具，例如冲压或蚀刻工具。目前的拾取和放置机器能力允许以+/-10微米并且比率小于约2％的放置。示例实施例的各方面适用于任何精度的拾取和放置方法。类似地，上文提到的模板通常可以比否则将使用的其他专用工具更快地生产。这允许比其他一些方法更快地生产引线框架的新配置。
示例实施例的方面非常适合于生产具有各种配置的引线框架，例如：分离的管芯附接焊盘(具有多个管芯附接焊盘和/或不同相应材料的管芯附接焊盘的引线框架)、不同的基底材料(具有与引线不同材料的管芯附接焊盘的引线框架)、更厚的管芯焊盘(具有比引线厚的管芯焊盘的引线框架)、紧密间隔的引线(引线框架具有引线，其水平间隔小于一个引线材料厚度)、具有较小线/间隔的集成无源组件(具有安装在电路板上的芯片附近的无源组件的引线框架)、熔断引线(引线框架具有两根或多根熔合在一起的引线)、引线上芯片(具有直接安装在引线上的芯片的引线框架)、双/多排引线(引线框架具有两排或多排引线，排可具有不同的高度或厚度)、引线上倒装芯片(引线框架具有焊接到引线的芯片)、非导电管芯附接焊盘(PCB和/或带有嵌入式芯片的衬底)。
在权利要求的范围内，所描述的实施例中的修改是可能的，并且其他实施例也是可能的。

Claims (20)

1.一种制造引线框架的方法，所述方法包括：
从导电材料片单个化多个导体结构；
通过以预定配置将多个单个化的导体结构布置在引线框架载体上来形成多个引线；和
在所述引线框架载体上布置至少一个管芯附接焊盘，以形成至少一个引线框架，所述引线框架具有所述至少一个管芯附接焊盘和与所述至少一个管芯附接焊盘间隔开的所述多个引线。
2.根据权利要求1所述的方法，其中，在引线框架载体上布置所述多个单个化的导体结构包括使用拾取和放置机器将单独的导体结构定位在所述引线框架载体上。
3.根据权利要求2所述的方法，其中所述导体结构包括具有第一金属组分、尺寸、形状或厚度的第一组导体结构和具有第二金属组分、尺寸、形状或厚度的第二组导体结构，并且以预定配置将所述多个单个化的导体结构布置在引线框架载体上以形成至少一个引线框架包括使用来自所述至少一个引线框架中的每个组的至少一个导体结构。
4.根据权利要求1所述的方法，其中，在引线框架载体上布置所述多个单个化导体结构包括使用模板，其中所述模板包括在与所述预定配置相对应的位置中的开口，并且其中所述模板被应用于所述引线框架载体上，并且所述单个化的导体结构通过所述模板中的所述开口放置在所述引线框架载体上。
5.根据权利要求4所述的方法，其中所述导体结构包括所述至少一个管芯附接焊盘和至少一个引线，所述至少一个管芯附接焊盘大于所述至少一个引线，所述方法还包括使用第一模板，用于将所述至少一个管芯焊盘布置在所述引线框架载体上，并且随后使用第二模板将所述至少一个引线布置在所述引线框架载体上。
6.根据权利要求1所述的方法，还包括利用插入在所述导体结构和所述引线框架载体之间的粘合带将所述导体结构固定到所述引线框架载体。
7.根据权利要求1所述的方法，其中从导电材料片单个化多个导体结构包括在所述单独的导体结构上形成模具锁定特征。
8.根据权利要求7所述的方法，其中形成所述锁模特征包括形成台阶边缘，所述台阶边缘通过以下步骤而形成：在所述材料片中形成具有第一宽度的沟槽并且在所述沟槽内的位置处提供所述材料片以生成所述阶梯边缘。
9.一种制造半导体管芯封装的方法，所述方法包括：
以预定配置在引线框架载体上布置至少一个预成型管芯附接焊盘和至少两个预成型引线，以形成引线框架；
将半导体管芯附接到所述至少一个预成型管芯附接焊盘；
将半导体管芯线键合到所述至少两个预成型引线；
形成包括所述半导体管芯和所述至少两个预成型引线的至少一部分的模制结构；
从所述引线框架载体移除所述模制结构。
10.根据权利要求9所述的方法，其中所述预成型管芯附接焊盘包括PCB。
11.根据权利要求10所述的方法，其进一步包括将无源组件附接到邻近所述半导体管芯的所述PCB。
12.根据权利要求9所述的方法，其中所述至少两个预成型引线包括导体结构形式的第一组预成型引线和导体结构形式的第二组预成型引线，所述第一组预成型引线具有第一金属组分、尺寸、形状或厚度，以及所述第二组预成形引线具有第二金属组分、尺寸、形状或厚度，并且其中以预定配置在引线框架载体上布置所述至少两个预成型引线以形成引线框架包括使用来自所述引线框架中的每个组的至少一个导体结构。
13.根据权利要求9所述的方法，其中以预定配置在引线框架载体上布置至少一个预成型管芯附接焊盘和至少两个预成型引线以形成引线框架包括使用拾取和放置机器。
14.根据权利要求9所述的方法，其中所述布置所述至少一个预成型管芯附接焊盘和至少两个预成型引线包括使用模板，其中所述模板包括在对应于所述预定配置的位置处的开口，并且其中所述模板被应用在所述引线框架载体上，并且所述至少一个预成型管芯附接焊盘和所述至少两个预成型引线通过所述模板中的所述开口放置在所述引线框架载体上。
15.根据权利要求14所述的方法，其中所述至少一个预成型管芯附接焊盘的面积尺寸大于所述至少两个预成型引线的面积尺寸，所述方法还包括使用第一模板用于将所述至少一个预成型管芯附接焊盘布置在所述引线框架载体上，并且，随后使用第二模板将所述至少两个预成型引线布置在所述引线框架载体上。
16.根据权利要求9所述的方法，还包括将所述至少一个预成型管芯附接焊盘和至少两个预成型引线固定到所述引线框架载体，其之间插入有粘合带。
17.根据权利要求9所述的方法，还包括通过从导电材料片单个化导体结构来形成所述至少一个预成型管芯附接焊盘和所述至少两个预成型引线中的至少一个。
18.根据权利要求9所述的方法，还包括将所述半导体管芯线键合到所述至少两个预成型引线，在所述半导体管芯和引线框架的至少一部分上应用模制，并从所述引线框架载体移除已模制的半导体管芯和引线框架。
19.一种制造半导体管芯封装的方法，所述方法包括：
从一个或更多个导电材料片单个化多个导体结构，所述导体结构包括至少一个管芯附接焊盘和至少一个引线；
将所述至少一个管芯附接焊盘和所述至少一个引线以预定配置布置在引线框架载体上，以形成至少一个引线框架；
将与所述管芯附接焊盘相关联的半导体管芯线键合到所述至少一个引线框架；
在所述半导体管芯和至少一个引线上应用模制；和
从所述引线框架载体移除已模制的半导体管芯和引线框架。
20.根据权利要求19所述的方法，其中所述至少一个管芯附接焊盘和至少一个引线是从不同材料片单个化的，由此所述至少一个引线框架具有由不同材料构成的管芯附接焊盘和至少一个引线。
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