CN110325303B - 铜颗粒以及其制造方法 - Google Patents

铜颗粒以及其制造方法 Download PDF

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Publication number
CN110325303B
CN110325303B CN201880012738.6A CN201880012738A CN110325303B CN 110325303 B CN110325303 B CN 110325303B CN 201880012738 A CN201880012738 A CN 201880012738A CN 110325303 B CN110325303 B CN 110325303B
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China
Prior art keywords
copper
copper particles
particles
oxygen
oxide layer
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CN201880012738.6A
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English (en)
Chinese (zh)
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CN110325303A (zh
Inventor
松山敏和
织田晃祐
上住义明
远藤安俊
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Mitsui Mining and Smelting Co Ltd
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Mitsui Mining and Smelting Co Ltd
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B22F1/16—Metallic particles coated with a non-metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2201/00—Treatment under specific atmosphere
    • B22F2201/03—Oxygen
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2301/00—Metallic composition of the powder or its coating
    • B22F2301/10—Copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F2302/00—Metal Compound, non-Metallic compound or non-metal composition of the powder or its coating
    • B22F2302/25—Oxide

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  • Powder Metallurgy (AREA)
  • Manufacture Of Metal Powder And Suspensions Thereof (AREA)
  • Conductive Materials (AREA)
CN201880012738.6A 2017-03-31 2018-03-28 铜颗粒以及其制造方法 Active CN110325303B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017072054 2017-03-31
JP2017-072054 2017-03-31
PCT/JP2018/012780 WO2018181482A1 (ja) 2017-03-31 2018-03-28 銅粒子及びその製造方法

Publications (2)

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CN110325303A CN110325303A (zh) 2019-10-11
CN110325303B true CN110325303B (zh) 2022-01-11

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CN201880012738.6A Active CN110325303B (zh) 2017-03-31 2018-03-28 铜颗粒以及其制造方法

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JP (1) JP7050756B2 (ja)
KR (1) KR102403998B1 (ja)
CN (1) CN110325303B (ja)
TW (1) TWI803486B (ja)
WO (1) WO2018181482A1 (ja)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6721934B2 (ja) * 2018-12-04 2020-07-15 メック株式会社 積層造形用銅粉末、積層造形用銅粉末の製造方法、積層造形物の製造方法及び積層造形物
JP6956766B2 (ja) * 2019-08-07 2021-11-02 Ｊｘ金属株式会社 銅粉ペーストを用いた接合方法
JP6956765B2 (ja) * 2019-08-07 2021-11-02 Ｊｘ金属株式会社 銅粉ペーストを用いた接合方法
JP6704083B1 (ja) * 2019-11-22 2020-06-03 東邦チタニウム株式会社 銅粉体とその製造方法
JP7490528B2 (ja) 2020-01-10 2024-05-27 東邦チタニウム株式会社 銅粉体
CN113019468A (zh) * 2021-03-05 2021-06-25 昆明理工大学 一种铜基Cu-Cu2O-CuO三元复合核壳材料的制备方法

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103182504A (zh) * 2011-12-27 2013-07-03 三星电机株式会社 铜粉、铜膏以及用于制备铜粉的方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6280641B1 (en) * 1998-06-02 2001-08-28 Mitsubishi Gas Chemical Company, Inc. Printed wiring board having highly reliably via hole and process for forming via hole
IL152119A0 (en) * 2000-04-10 2003-05-29 Tetronics Ltd Twin plasma torch apparatus
JP3674501B2 (ja) * 2000-11-30 2005-07-20 株式会社村田製作所 感光性銅ペースト、銅パターンの形成方法、及びセラミック多層基板の製造方法
JP5048556B2 (ja) * 2007-03-14 2012-10-17 フィブロ−テック，インコーポレイテッド 微粒子銅粉末を生成する方法
CN102784643B (zh) * 2011-05-19 2014-09-24 中国科学院过程工程研究所 一种利用有机硅废触体回收的铜粉制备的三元铜催化剂及制备方法
CN102350499B (zh) * 2011-09-28 2013-05-08 河北工业大学 一种Cu/Cu2O核壳复合微球的制备方法
CN203495238U (zh) * 2013-10-08 2014-03-26 江苏泰禾金属工业有限公司 一种铜粉粉碎装置
JP5826435B1 (ja) * 2014-02-14 2015-12-02 三井金属鉱業株式会社 銅粉
JP6303022B2 (ja) * 2014-10-03 2018-03-28 三井金属鉱業株式会社 銅粉

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103182504A (zh) * 2011-12-27 2013-07-03 三星电机株式会社 铜粉、铜膏以及用于制备铜粉的方法

Also Published As

Publication number Publication date
WO2018181482A1 (ja) 2018-10-04
CN110325303A (zh) 2019-10-11
KR102403998B1 (ko) 2022-05-31
KR20190132351A (ko) 2019-11-27
JPWO2018181482A1 (ja) 2020-02-06
TWI803486B (zh) 2023-06-01
JP7050756B2 (ja) 2022-04-08
TW201841702A (zh) 2018-12-01

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