CN110290643A - Substrate pass structure, processing method and pcb board - Google Patents
Substrate pass structure, processing method and pcb board Download PDFInfo
- Publication number
- CN110290643A CN110290643A CN201910575439.XA CN201910575439A CN110290643A CN 110290643 A CN110290643 A CN 110290643A CN 201910575439 A CN201910575439 A CN 201910575439A CN 110290643 A CN110290643 A CN 110290643A
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- CN
- China
- Prior art keywords
- hole
- nose end
- aperture
- goes out
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09827—Tapered, e.g. tapered hole, via or groove
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses substrate pass structure, processing method and pcb boards, it includes substrate body (1), X-shaped through-hole is offered in the substrate body, the X-shaped through-hole goes out nose end (2), second nose end (3) and inner hole (4) out including first, the inner hole goes out nose end and second positioned at first and goes out between nose end, and the aperture of the inner hole goes out nose end and second less than first and goes out the aperture of nose end.The beneficial effects of the invention are as follows fundamentally find the method for solving the problems, such as this by changing drilling pass, expand the special technologic improvement experiment with " X-type hole " replacement " cylinder bore ", by assessing exterior appearance basic indistinction compared with normal panel, drilling pass is presented " X-type " and substantially meets requirement, it is clean in plate face and hole after cleaning, substantially it is remained without slag, Sputter processing can be carried out；Metal penetrability will be got well compared with normal process plate in " X-type " hole hole, and metal continuity will be got well in hole.
Description
Technical field
The present invention relates to PCB circuit board manufacturing field more particularly to substrates, processing method and pcb board.
Background technique
As high-power electronic product develops towards miniaturization, high speed direction, the substrate materials such as traditional FR-4, aluminum substrate
Material has been no longer desirable for the development that PCB industry is applied towards high-power, wisdom, traditional with the progress of science and technology
LTCC, DBC technology are gradually replaced by DPC, LAM technology.Printing electricity is more in line with by the laser technology of representative of LAM technology
Road plate high density interconnection, fining development.Laser boring is the front end of current PCB industry, mainstream cheesing techniques, and such technology is high
It imitates, quickly, precisely, there is biggish application value.In current laser drill processing technology, using " cylinder "
Processing method will be filled full metal, reached metal and led by the multi-step process such as Sputter, heavy copper, plating in drilling hole
Electric effect forms complete circuit.Such as Chinese utility model patent publication number CN205883713U discloses a kind of ceramic through-hole
Substrate a, comprising: ceramic substrate offers at least one through hole through its front and the back side on the ceramic substrate；Filling
Electrically conductive ink in the through hole；And it is printed in the route at the front and the back side.The through hole is exactly cylinder
Shape, still there is very big drawback in " cylinder " processing method, in subsequent metal filling manufacturing procedure, it is difficult to by drilling hole
Interior intermediate region metal tamps, and it is bad to be also easy to produce resistance value, meanwhile, filling difficulty is big, and at high cost, speed is slow.
Summary of the invention
The technical problem to be solved by the present invention is to existing substrate laser drilling processing techniques to be existed using " cylinder "
Many drawbacks provide a kind of substrate pass structure thus.
The innovation of the invention consists in that it is big fundamentally to solve metal filling difficulty to change pass structure, at high cost, speed
Degree is slow, and intermediate region metal is not easy the problem of tamping.This is the point of penetration that those skilled in the art never thought.
The technical scheme is that substrate pass structure, it includes substrate body, offers X in the substrate body
Shape through-hole, the X-shaped through-hole include first going out nose end, second going out nose end and inner hole, and the inner hole is located at first and goes out nose end and the
Two go out between nose end, and the aperture of the inner hole goes out nose end and second less than first and goes out the aperture of nose end.
The first aperture for going out nose end is 61 μm -92 μm described in above scheme, and the second aperture for going out nose end is 70 μm of -82 μ
M, the aperture of inner hole are 47-53 μm.
A kind of pcb board, it includes any substrate pass structure of above scheme.
The processing method of substrate pass structure processes two tapers corresponding positive and negative to substrate two sides by laser respectively
Hole realizes that aperture of portalling is big, the small X-type through-hole of hole internal orifice dimension.
Another processing method of substrate pass structure first leads the realization of substrate machining small diameter through-hole by laser
It is logical, according still further to prescribed requirement, portal in tow sides carry out secondary operation respectively, processes aperture of portalling and go out the X-type met the requirements
Through-hole.
The beneficial effects of the invention are as follows the method for solving the problems, such as this is fundamentally found by changing drilling pass, expand
Tested with the special technologic improvement of " X-type hole " replacement " cylinder bore ", by assessment exterior appearance compared with normal panel substantially without
Difference, drilling pass is presented " X-type " and substantially meets requirements, clean in plate face and hole after cleaning, substantially without slag residual, can carry out
Sputter processing；Metal penetrability will be got well compared with normal process plate in " X-type " hole hole, and metal continuity will be got well in hole.
Detailed description of the invention
Fig. 1 is schematic diagram of the present invention；
Fig. 2 is pass photo of the present invention；
Fig. 3 is aperture photo of the present invention；
Fig. 4 is metal penetrability photo in prior art hole；
Fig. 5 is metal penetrability photo in hole of the present invention；
Fig. 6 is metal continuity photo in prior art hole；
Fig. 7 is metal continuity photo in hole of the present invention；
In figure, 1, substrate body, 2, first goes out nose end, and 3, second goes out nose end, 4, inner hole.
Specific embodiment
With reference to the accompanying drawing, technical scheme in the embodiment of the invention is clearly and completely described.Obviously, it is retouched
The embodiment stated is only a part of the embodiment of the present invention, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment without making creative work, belongs to protection model of the invention
It encloses.
As shown in Figure 1, the present invention includes substrate body 1, X-shaped through-hole, the X-shaped through-hole are offered in the substrate body
Go out nose end 2, second including first and go out nose end 3 and inner hole 4, the inner hole goes out nose end and second positioned at first and goes out between nose end, institute
The aperture for stating inner hole goes out nose end and second less than first and goes out the aperture of nose end.
There are two types of processing schemes of the invention, scheme one: (double piercing) processes two to substrate two sides by laser respectively
The method of a bellmouth corresponding positive and negative realizes that aperture of portalling is big, small " X-type " via hole of hole internal orifice dimension.Scheme two: it (wears three times
Hole) conducting is realized to substrate machining small diameter through-hole by laser first, according still further to prescribed requirement, portal respectively in tow sides
Secondary operation is carried out, aperture of portalling is processed and goes out the bellmouth met the requirements, realize the purpose of " X-type " via hole.
Embodiment 1: the described first aperture for going out nose end is 61 μm -92 μm, and the second aperture for going out nose end is 70 μm -82 μm,
The aperture of inner hole is 47-53 μm.
Embodiment 2: the described first aperture for going out nose end is 61 μm -92 μm, and the second aperture for going out nose end is 70 μm -82 μm,
The aperture of inner hole is 47-53 μm.
Embodiment 3: the described first aperture for going out nose end is 61 μm -92 μm, and the second aperture for going out nose end is 70 μm -82 μm,
The aperture of inner hole is 47-53 μm.
To X-shaped through-hole progress appearance shape, drill pass and aperture of portalling, the assessment of inner hole aperture, as Figure 2-3,
Exterior appearance basic indistinction compared with normal panel, drilling pass are presented " X-type " and substantially meet requirement；After cleaning in plate face and hole
Completely, it is remained substantially without slag, Sputter processing can be carried out.
The assessment of Sputter process point: it is shot under substrate metal thickness condition as described in Table 1, obtains the photograph of Fig. 4-7
Piece, as shown in Figures 4 and 5, metal penetrability is essentially identical compared with normal process plate in " X-type " hole hole, as shown in Figures 6 and 7, X
The more normal pass of Cu depth of cracking closure in shape hole is deeper, and the continuous implementations of metal are preferable in hole.
Table 1
Table 1 shows that the metal thickness on surface is consistent, and difference is not too greatly, to eliminate the inconsistent shadow of the metal thickness plated film on surface
It rings.Prove to be strictly since the change of pass structure causes metal penetrability and continuity in hole preferable.
Claims (5)
1. substrate pass structure, it includes substrate body (1), it is characterized in that: X-shaped through-hole is offered in the substrate body, institute
Stating X-shaped through-hole includes first going out nose end (2), second going out nose end (3) and inner hole (4), and the inner hole is located at the first nose end and the out
Two go out between nose end, and the aperture of the inner hole goes out nose end and second less than first and goes out the aperture of nose end.
2. substrate pass structure as described in claim 1, it is characterized in that: the described first aperture for going out nose end is 61 μm -92 μm,
Second aperture for going out nose end is 70 μm -82 μm, and the aperture of inner hole is 47-53 μm.
3. a kind of pcb board, it is characterized in that it includes the substrate pass structure as described in claim 1-2 is any.
4. the processing method of the substrate pass structure as described in claim 1-2 is any, it is characterized in that: by laser to substrate two
Face processes two bellmouths corresponding positive and negative respectively, realizes that aperture of portalling is big, the small X-type through-hole of hole internal orifice dimension.
5. the processing method of the substrate pass structure as described in claim 1-2 is any, it is characterized in that: first by laser to base
Plate machining small diameter through-hole realizes conducting, according still further to prescribed requirement, portals in tow sides carry out secondary operation respectively, process
Hole aperture goes out the X-type through-hole met the requirements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910575439.XA CN110290643A (en) | 2019-06-28 | 2019-06-28 | Substrate pass structure, processing method and pcb board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910575439.XA CN110290643A (en) | 2019-06-28 | 2019-06-28 | Substrate pass structure, processing method and pcb board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110290643A true CN110290643A (en) | 2019-09-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201910575439.XA Pending CN110290643A (en) | 2019-06-28 | 2019-06-28 | Substrate pass structure, processing method and pcb board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111741604A (en) * | 2020-07-04 | 2020-10-02 | 吉安满坤科技股份有限公司 | Manufacturing method of automobile printed circuit board |
| CN112601357A (en) * | 2020-11-24 | 2021-04-02 | 景旺电子科技(龙川)有限公司 | Through hole of circuit board and preparation method thereof |
| CN117355038A (en) * | 2023-11-10 | 2024-01-05 | 江西红板科技股份有限公司 | X-shaped hole processing method and system for circuit board soft board |
-
2019
- 2019-06-28 CN CN201910575439.XA patent/CN110290643A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111741604A (en) * | 2020-07-04 | 2020-10-02 | 吉安满坤科技股份有限公司 | Manufacturing method of automobile printed circuit board |
| CN112601357A (en) * | 2020-11-24 | 2021-04-02 | 景旺电子科技(龙川)有限公司 | Through hole of circuit board and preparation method thereof |
| CN117355038A (en) * | 2023-11-10 | 2024-01-05 | 江西红板科技股份有限公司 | X-shaped hole processing method and system for circuit board soft board |
| CN117355038B (en) * | 2023-11-10 | 2024-03-19 | 江西红板科技股份有限公司 | X-shaped hole processing method and system for circuit board soft board |
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