CN109714886A - A method of realizing that aluminum-based circuit board line layer is grounded using Tenon technique - Google Patents
A method of realizing that aluminum-based circuit board line layer is grounded using Tenon technique Download PDFInfo
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- CN109714886A CN109714886A CN201910159167.5A CN201910159167A CN109714886A CN 109714886 A CN109714886 A CN 109714886A CN 201910159167 A CN201910159167 A CN 201910159167A CN 109714886 A CN109714886 A CN 109714886A
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- aluminum
- circuit board
- based circuit
- fastener
- line layer
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Abstract
The invention discloses a kind of methods for realizing aluminum-based circuit board line layer ground connection using Tenon technique, comprising steps of S1, the holes drilled through simultaneously on the line layer, dielectric layer and aluminum substrate of aluminum-based circuit board, obtain control deep via and through-hole orifice ring in the control gun drilling of through-hole both ends；S2, the fastener is embedded in the control deep via；S3, silk-screen tin cream is carried out to the line layer of aluminum-based circuit board, screen printing net plate covers the through-hole orifice ring and the fastener in the insertion fastener Position Design windowing, tin cream；S4, pass through Reflow Soldering, the tin cream welds the line layer of the aluminum-based circuit board and the fastener, the fastener is connect with the aluminum substrate, and the line layer of the aluminum-based circuit board is connected by the fastener with the aluminum substrate, to realize the line layer ground connection of the aluminum-based circuit board；The present invention realizes aluminum-based circuit board line layer ground connection by Tenon mode, improves the safety that product uses.
Description
Technical field
The present invention relates to metal-base printed wiring board manufacture technology fields, a kind of in particular to realize aluminium using Tenon technique
The method of base circuit board line layer ground connection.
Background technique
Metal-base printed wiring board is a kind of special printed wiring board, mainly there is copper base, aluminum substrate, Copper-Aluminum compound
The types such as plate, stainless steel substrate are applied on high-power, high heat dissipation product.Copper-based wiring board can pass through drilling, plating side
Formula, by line layer and copper-based conducting, to realize that line layer is grounded, aluminum-based circuit board can not be realized by the plating mode that drills
Line layer is connected with metal aluminium base, and line layer can not be grounded, and there are security risks when use.
Summary of the invention
The purpose of the present invention is to provide one kind by Tenon mode, realizes aluminum-based circuit board line layer ground connection, improves and produce
The method for the safety that product use.
In order to overcome above-mentioned defect in the prior art the present invention adopts the following technical scheme:
A method of realizing that aluminum-based circuit board line layer is grounded using Tenon technique, wherein include the following steps:
S1, on the line layer, dielectric layer and aluminum substrate of aluminum-based circuit board simultaneously holes drilled through, through-hole both ends control gun drilling
Obtain control deep via and through-hole orifice ring；
S2, fastener is embedded in the control deep via；
S3, silk-screen tin cream is carried out to the line layer of aluminum-based circuit board, screen printing net plate is opened in the insertion fastener Position Design
Window, tin cream cover the through-hole orifice ring and the fastener；
S4, pass through Reflow Soldering, the tin cream welds the line layer of the aluminum-based circuit board and the fastener, the fastener
It is connect with the aluminum substrate, the line layer of the aluminum-based circuit board is connected by the fastener with the aluminum substrate, to realize
The line layer of the aluminum-based circuit board is grounded.
Further, in the step S1, copper face is exposed in the aluminum-based circuit board welding masking developing windowing, to the aluminium base line
Road plate carries out organic protection weldering.
Further, in the step S1, after the through-hole both ends control gun drilling, it is 0.3mm that hole depth is mastered in the control
±0.1mm；Width >=0.2mm of the through-hole orifice ring.
Further, the aluminum-based circuit board carries out line layer production, and while making route, line layer is set as one
Round PAD or rectangular PAD, and be connected with the route being grounded is needed.
Further, in the step S1, to the aluminium base plate surface pasting protective film；After the aluminum substrate control gun drilling,
By the burr in aluminium base plate surface, burr removal, then welded by organic protection or turmeric is surface-treated.
Further, in the step S2, the fastener is pre-processed, it is deep that the diameter of the fastener is equal to the control
The aperture of through-hole；The fastener height is identical as the aluminum-based circuit board plate thickness of finished product.
Further, the fastener side sets the protrusion there are four 50um, two end chamfer of fastener.
Further, in the step S2, after the fastener is embedded in the aluminum-based circuit board, the fastener upper end is described in
Distance≤20um of the upper surface of aluminum-based circuit board.
Further, in the step S4, the fastener connect the resistance value < 10m Ω after conducting with aluminum substrate.
Beneficial effects of the present invention:
1, by Tenon mode, the binding force of fastener and aluminum substrate is improved；Realize that aluminum-based circuit board line layer is led with aluminium base
Improve the safety that product uses with connecting.
2, under the premise of same plate thickness, aluminum-based circuit board cost is 1/10th of copper-based wiring board cost；Have
Considerable economic benefit.
3, using Physical Processing mode replacing electroplating chemical mode, reduce the discharge of industrial wastewater, have to environmental protection
Great contributed value；Have good ecological benefits.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present invention, constitutes part of this application, not
Inappropriate limitation of the present invention is constituted, in the accompanying drawings:
Fig. 1 is aluminum-based circuit board line layer ground structure schematic diagram of the embodiment of the present invention；
Fig. 2 is the non-silk-screen tin cream structural schematic diagram of aluminum-based circuit board of the embodiment of the present invention；
Fig. 3 is fastener structural schematic diagram of the embodiment of the present invention.
In attached drawing: 1- aluminum-based circuit board；2- fastener；3- aluminum substrate；4- controls deep via；5- line layer；6- tin cream；7- medium
Layer；8- protrusion；9- through-hole orifice ring.
Specific embodiment
Below in conjunction with attached drawing and specific embodiment, the present invention will be described in detail, herein with schematic implementation of the invention
Example and explanation are used to explain the present invention, but not as a limitation of the invention.
As shown in Figure 1 to Figure 3, this embodiment scheme provides a kind of utilization Tenon technique realization aluminum-based circuit board line layer
The method of ground connection, wherein include the following steps:
S1, the holes drilled through simultaneously on the line layer 5, dielectric layer 7 and aluminum substrate 3 of aluminum-based circuit board 1, are controlled deep at through-hole both ends
Drilling obtains control deep via 4 and through-hole orifice ring 9；
S2, fastener 2 is embedded in the control deep via 4；
S3, silk-screen tin cream is carried out to the line layer 5 of aluminum-based circuit board 1, screen printing net plate is being embedded in 2 Position Design of fastener
Windowing, tin cream 6 cover the through-hole orifice ring 9 and the fastener 2；
S4, pass through Reflow Soldering, the tin cream 6 welds the line layer 5 of the aluminum-based circuit board 1 and the fastener 2, described
Fastener 2 is connect with the aluminum substrate 3, and the line layer 5 of the aluminum-based circuit board 1 is led by the fastener 2 with the aluminum substrate 3
It is logical, to realize that the line layer 5 of the aluminum-based circuit board 1 is grounded.
Specifically, in the step S1, copper is exposed in 1 welding masking developing of the aluminum-based circuit board windowing in this embodiment scheme
Face carries out organic protection weldering to the aluminum-based circuit board 1.
Specifically, in the step S1, after the through-hole both ends control gun drilling, the control is mastered in this embodiment scheme
4 depth of hole is 0.3mm ± 0.1mm；Width >=0.2mm of the through-hole orifice ring 9.
Specifically, the aluminum-based circuit board 1 carries out line layer production in this embodiment scheme, and while making route, line
Road floor is set as a circle PAD or rectangular PAD, and is connected with the route being grounded is needed.
Specifically, in this embodiment scheme, in the step S1, to the 3 surface pasting protective film of aluminum substrate；Prevent aluminium base
3 surface of plate scratches, liquid medicine corrodes；After the aluminum substrate 3 controls gun drilling, burr, the burr on 3 surface of aluminum substrate are removed, then
It is welded by organic protection or turmeric is surface-treated.
Specifically, in the step S2, the fastener 2 is pre-processed in this embodiment scheme, the fastener 2
Diameter is equal to the aperture of the control deep via 4；2 height of fastener is identical as 1 plate thickness of aluminum-based circuit board of finished product.
Specifically, 2 side of fastener sets the protrusion 8 there are four 50um, 2 both ends of fastener in this embodiment scheme
Chamfering.Protrusion 8 is arranged in the fastener 2, it is therefore an objective to increase the binding force of the fastener 2 with control 4 side wall of deep via；The fastener 2
The purpose of two end chamfers is to be embedded in the through-hole orifice ring 9 convenient for the fastener 2.
Specifically, in this embodiment scheme, in the step S2, after the fastener 2 is embedded in the aluminum-based circuit board 1, institute
State 2 upper end of fastener to the upper surface of the aluminum-based circuit board 1 distance≤20um.
Specifically, in the step S4, the fastener 2 connect the resistance after conducting with aluminum substrate 3 in this embodiment scheme
Value < 10m Ω.
The present embodiment is further described through, the specific production process of aluminum-based circuit board 1:
1), 1 sawing sheet of aluminum-based circuit board；
2), the aluminium base face paste protective film (preventing aluminium face from scratching, liquid medicine corrosion) of aluminum-based circuit board；
3), aluminum-based circuit board line layer makes, and line layer designs a circle PAD or rectangular PAD while making route,
And it is connected with the route being grounded is needed；
4), aluminum-based circuit board 1 carries out anti-welding processing；
5), 1 holes drilled through of aluminum-based circuit board；
6), control gun drilling: in aluminum-based circuit board 1 after holes drilled through, through-hole both ends control gun drilling and obtain control deep via 4 and through-hole
Orifice ring 9, the via depth are 0.3mm ± 0.1mm；Width >=0.2mm of the through-hole orifice ring；
7) it, tests；
8), gong plate, dyestripping；
9), aluminium base face nog plate: burr, burr are removed；
10) it, is welded again by organic protection or turmeric is surface-treated line layer；
11), embedding fastener 2: the control deep via 4 is embedded in the fastener 2；
11.1) after, the fastener 2 is embedded in the aluminum-based circuit board 1,2 upper end of fastener to the aluminum-based circuit board 1
Distance≤20um of upper surface；
12), silk-screen tin cream: the aluminum substrate 3 carries out silk-screen tin cream, and screen printing net plate is being embedded in 2 Position Design of fastener
Fastener 2 is connect by windowing, tin cream 6 with orifice ring；
13), PCB patch
14), by Reflow Soldering, tin cream 6 welds the aluminum-based circuit board 1 and the fastener 2, the fastener 2 with it is described
Aluminum substrate 3 connects, and the aluminum-based circuit board 1 is connected by the fastener 2 with the aluminum substrate 3, to realize the aluminium base line
The line layer 5 of road plate 1 is grounded；
15), the fastener 2 connect the resistance < 10m Ω after conducting with aluminum substrate 3.
By holes drilled through, control deep via 4, insertion fastener 2 in aluminum-based circuit board 1, in PCB patch, in embedding fastener 2
Tin cream is scraped in aluminum-based circuit board 1, when PCB passes through Reflow Soldering, aluminum-based circuit board 1 is connect by tin cream 6 with fastener 2, fastener 2 and aluminium
Base connection, it is final to realize that line layer 5 is grounded.By Tenon mode, the binding force of fastener 2 and aluminum substrate 3 is improved；Realize aluminium base line
Ground connection is connected with aluminium base and improves the safety that product uses for the line layer 5 of road plate.Under the premise of same plate thickness, aluminium base route
Plate cost is 1/10th of copper-based wiring board cost；With considerable economic benefit.Using Physical Processing mode replacing electroplating
Chemical mode reduces the discharge of industrial wastewater, has great contributed value to environmental protection；Have good ecological benefits.
It is provided for the embodiments of the invention technical solution above to be described in detail, specific case used herein
The principle and embodiment of the embodiment of the present invention are expounded, the explanation of above embodiments is only applicable to help to understand this
The principle of inventive embodiments；At the same time, for those skilled in the art, according to an embodiment of the present invention, in specific embodiment party
There will be changes in formula and application range, in conclusion the contents of this specification are not to be construed as limiting the invention.
Claims (9)
1. a kind of method for realizing aluminum-based circuit board line layer ground connection using Tenon technique, which comprises the steps of:
S1, on the line layer, dielectric layer and aluminum substrate of aluminum-based circuit board simultaneously holes drilled through, through-hole both ends control gun drilling obtain
Control deep via and through-hole orifice ring；
S2, fastener is embedded in the control deep via；
S3, silk-screen tin cream is carried out to the line layer of aluminum-based circuit board, screen printing net plate is being embedded in the fastener Position Design windowing, tin
Cream covers the through-hole orifice ring and the fastener；
S4, pass through Reflow Soldering, the tin cream welds the line layer of the aluminum-based circuit board and the fastener, the fastener and institute
Aluminum substrate connection is stated, the line layer of the aluminum-based circuit board is connected by the fastener with the aluminum substrate, thus described in realizing
The line layer of aluminum-based circuit board is grounded.
2. a kind of method for realizing aluminum-based circuit board line layer ground connection using Tenon technique according to claim 1, special
Sign is:
In the step S1, copper face is exposed in the aluminum-based circuit board welding masking developing windowing, carries out to the aluminum-based circuit board organic
Protection weldering.
3. a kind of method for realizing aluminum-based circuit board line layer ground connection using Tenon technique according to claim 1, special
Sign is:
In the step S1, after the through-hole both ends control gun drilling, it is 0.3mm ± 0.1mm that hole depth is mastered in the control；It is described logical
Width >=0.2mm of hole orifice ring.
4. a kind of method for realizing aluminum-based circuit board line layer ground connection using Tenon technique according to claim 1, special
Sign is:
The aluminum-based circuit board carries out line layer production, and while making route, line layer is set as a circle PAD or rectangular
PAD, and be connected with the route being grounded is needed.
5. a kind of method for realizing aluminum-based circuit board line layer ground connection using Tenon technique according to claim 1, special
Sign is:
In the step S1, to the aluminium base plate surface pasting protective film；It, will be in aluminium base plate surface after the aluminum substrate control gun drilling
Burr, burr removal, then welded by organic protection or turmeric is surface-treated.
6. a kind of method for realizing aluminum-based circuit board line layer ground connection using Tenon technique according to claim 1, special
Sign is:
In the step S2, the fastener is pre-processed, the diameter of the fastener is equal to the aperture of the control deep via；Institute
It is identical as the aluminum-based circuit board plate thickness of finished product to state fastener height.
7. a kind of method for realizing aluminum-based circuit board line layer ground connection using Tenon technique according to claim 6, special
Sign is:
The fastener side sets the protrusion there are four 50um, two end chamfer of fastener.
8. a kind of method for realizing aluminum-based circuit board line layer ground connection using Tenon technique according to claim 1, special
Sign is:
In the step S2, after the fastener is embedded in the aluminum-based circuit board, the fastener upper end to the aluminum-based circuit board
Distance≤20um of upper surface.
9. a kind of method for realizing aluminum-based circuit board line layer ground connection using Tenon technique according to claim 1, special
Sign is:
In the step S4, the fastener connect the resistance value < 10m Ω after conducting with aluminum substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910159167.5A CN109714886A (en) | 2019-03-04 | 2019-03-04 | A method of realizing that aluminum-based circuit board line layer is grounded using Tenon technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910159167.5A CN109714886A (en) | 2019-03-04 | 2019-03-04 | A method of realizing that aluminum-based circuit board line layer is grounded using Tenon technique |
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| Publication Number | Publication Date |
|---|---|
| CN109714886A true CN109714886A (en) | 2019-05-03 |
Family
ID=66265590
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910159167.5A Withdrawn CN109714886A (en) | 2019-03-04 | 2019-03-04 | A method of realizing that aluminum-based circuit board line layer is grounded using Tenon technique |
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| Country | Link |
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| CN (1) | CN109714886A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112930024A (en) * | 2021-01-25 | 2021-06-08 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
| CN113473719A (en) * | 2021-07-06 | 2021-10-01 | 皆利士多层线路版(中山)有限公司 | Heat dissipation aluminum substrate and preparation method thereof |
-
2019
- 2019-03-04 CN CN201910159167.5A patent/CN109714886A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112930024A (en) * | 2021-01-25 | 2021-06-08 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
| CN112930024B (en) * | 2021-01-25 | 2022-05-03 | 景旺电子科技(龙川)有限公司 | Metal-based circuit board and manufacturing method thereof |
| CN113473719A (en) * | 2021-07-06 | 2021-10-01 | 皆利士多层线路版(中山)有限公司 | Heat dissipation aluminum substrate and preparation method thereof |
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Application publication date: 20190503 |