CN110257777B

CN110257777B - Evaporation cover and evaporation equipment

Info

Publication number: CN110257777B
Application number: CN201910694403.3A
Authority: CN
Inventors: 贾松霖; 陈营营
Original assignee: Yungu Guan Technology Co Ltd
Current assignee: Yungu Guan Technology Co Ltd
Priority date: 2019-07-30
Filing date: 2019-07-30
Publication date: 2021-11-02
Anticipated expiration: 2039-07-30
Also published as: CN110257777A

Abstract

The invention discloses an evaporation cover and evaporation equipment, wherein the evaporation cover is used for the evaporation equipment, the evaporation equipment comprises an evaporation source, and the evaporation cover comprises: the shielding piece is provided with a shielding surface facing the evaporation source; the cleaning part is arranged between the shielding surface and the evaporation source and can move relative to the shielding surface to clean the shielding surface. The evaporation cover provided by the invention can clean impurities on the evaporation cover in time, improve the use stability of the evaporation cover, avoid polluting evaporation equipment and improve the evaporation efficiency of a substrate to be evaporated.

Description

Evaporation cover and evaporation equipment

Technical Field

The invention relates to the technical field of evaporation, in particular to an evaporation cover and evaporation equipment.

Background

With the progress of science and technology and the development of society, people have higher and higher requirements on display devices, and further, the standards of devices and processes for preparing the display devices are promoted to be higher and higher. Since the Organic Light-Emitting Diode (OLED) has the advantages of self-luminescence, no need of a backlight source, high contrast, thin thickness, wide viewing angle, simple structure and process, etc., the OLED display panel is widely used.

One of the most important links in the production process of OLED display panels is the application of organic layers onto a substrate to be evaporated to form a critical light emitting display unit. The development of high-precision coating technology is the key to restrict the production of OLED. At present, a method of vacuum deposition or vacuum thermal evaporation is mainly adopted, after a substance to be formed into a film is heated, evaporated or sublimated, the substance is condensed or deposited on the surface of a low-temperature workpiece or a substrate to be evaporated, so as to form a film structure of the OLED, but factors such as existence of impurities and low efficiency limit industrialization of a display panel.

Therefore, a new evaporation mask and an evaporation apparatus are needed.

Disclosure of Invention

The embodiment of the invention provides an evaporation cover and evaporation equipment, which can clean impurities on the evaporation cover in time, improve the use stability of the evaporation cover, avoid polluting the evaporation equipment and improve the evaporation efficiency of a substrate to be evaporated.

In one aspect, an evaporation cover is provided according to an embodiment of the present invention, and is used for an evaporation apparatus, where the evaporation apparatus includes an evaporation source, and the evaporation cover includes: the shielding piece is provided with a shielding surface facing the evaporation source; the cleaning part is arranged between the shielding surface and the evaporation source and can move relative to the shielding surface to clean the shielding surface.

According to an aspect of the embodiment of the present invention, the evaporation mask further includes a connecting member, and the cleaning part is movably connected to the shielding surface side of the shielding member through the connecting member.

According to one aspect of an embodiment of the invention, the connecting member comprises a sliding assembly by which the cleaning portion is slidably connected to the screen; optionally, the sliding assembly includes a sliding rail and a sliding block, one of the sliding rail and the sliding block is connected with the cleaning part, and the other is arranged on the shielding part.

According to an aspect of the embodiment of the invention, the connecting piece comprises a rotating assembly, the rotating assembly comprises a first fulcrum and a second fulcrum which are arranged at intervals, the cleaning part is a strip-shaped body formed by extending between the first fulcrum and the second fulcrum, and the cleaning part is rotatably arranged relative to the shielding piece around at least one of the first fulcrum and the second fulcrum.

According to one aspect of the embodiment of the invention, the cleaning device comprises a protruding part arranged on the cleaning part, and the protruding part is formed by extending from the outer peripheral surface of the cleaning part to the direction far away from the cleaning part.

According to one aspect of the embodiment of the invention, the strippable film is arranged on the shielding surface of the shielding piece and is detachably connected with the shielding piece; optionally, the cleaning part can be connected with the strippable film, the strippable film includes a positioning part, the cleaning part includes a connecting part matched with the positioning part, and the cleaning part can be connected with the strippable film through the connecting part.

According to one aspect of an embodiment of the present invention, a peelable film includes a first film and a high temperature resistant coating disposed on the first film, the high temperature resistant coating being disposed proximate to a source of evaporation; optionally, the surface of the first film close to the high temperature resistant coating has a connection structure, and the high temperature resistant coating is embedded in the connection structure and connected with the first film.

According to one aspect of the embodiment of the invention, the evaporation mask comprises a bracket, wherein the bracket is provided with a central axis; the shield is arranged on the holder and can rotate at least about the central axis.

According to one aspect of the embodiment of the invention, the shielding piece comprises a first baffle plate, the first baffle plate is arranged on the bracket, the first baffle plate is provided with a plurality of evaporation holes along the thickness direction of the first baffle plate, evaporation materials in an evaporation state can permeate the evaporation holes, and in the evaporation state, the projection of the first baffle plate covers the evaporation source along the extension direction of the central axis; and/or the shielding piece comprises a second baffle plate, the second baffle plate is continuously arranged along the extension direction of the second baffle plate, and the projection of the second baffle plate is arranged on the outer peripheral side of the evaporation source along the extension direction of the central axis in the evaporation state.

In another aspect, an embodiment of the present invention provides an evaporation apparatus, including the evaporation mask described above.

According to another aspect of the embodiment of the invention, the evaporation device further comprises a collecting device, the collecting device is arranged on one side of the shielding piece close to the shielding surface and is used for collecting the impurities cleaned by the cleaning part.

According to the evaporation cover and the evaporation equipment provided by the embodiment of the invention, the evaporation cover comprises the shielding piece and the cleaning part, the shielding piece is provided with the shielding surface capable of facing the evaporation source, and the evaporation cover can adjust the evaporation material evaporated by the evaporation source through the shielding surface. Simultaneously, still be provided with the clearance portion owing to the coating by vaporization covers, clearance portion sets up between occlusion surface and the coating by vaporization source, and clearance portion can for occlusion surface motion, through the motion of clearance portion for clearance portion can in time clear up the impurity on the occlusion surface, improves the stability in use of coating by vaporization cover. When the coating by vaporization cover is used on the coating by vaporization equipment, in time clear up the impurity of deposit on the coating by vaporization cover through clearance portion, can avoid adsorbing the impurity that blocks on the face and drop in the coating by vaporization equipment, avoid polluting the coating by vaporization equipment, improve the coating by vaporization efficiency of treating the coating by vaporization base plate.

Drawings

Other features, objects and advantages of the invention will become apparent from the following detailed description of non-limiting embodiments thereof, when read in conjunction with the accompanying drawings, in which like reference characters designate the same or similar parts throughout the figures thereof, and which are not to scale.

Fig. 1 is a schematic structural diagram of an evaporation apparatus according to an embodiment of the present invention;

FIG. 2 is an enlarged view at A in FIG. 1;

fig. 3 is a schematic structural diagram of an evaporation apparatus according to another embodiment of the present invention;

fig. 4 is a schematic structural diagram of an evaporation apparatus according to another embodiment of the present invention;

FIG. 5 is a schematic structural diagram of an evaporation mask and an evaporation source according to an embodiment of the present invention;

FIG. 6 is a schematic three-dimensional structure of a vapor deposition shield according to one embodiment of the present invention;

FIG. 7 is a schematic three-dimensional structure of a vapor deposition shield according to another embodiment of the present invention;

FIG. 8 is a schematic cross-sectional view of the evaporation shield of FIG. 7;

FIG. 9 is a schematic three-dimensional structure of a vapor deposition shield according to yet another embodiment of the present invention;

FIG. 10 is a schematic cross-sectional view of the evaporation shield of FIG. 9;

FIG. 11 is a schematic cross-sectional view of a cleaning section according to an embodiment of the present invention;

FIG. 12 is a schematic cross-sectional view of a cleaning part according to another embodiment of the present invention;

FIG. 13 is a schematic cross-sectional view of a cleaning part according to still another embodiment of the present invention;

FIG. 14 is a schematic cross-sectional view of a vapor deposition shield according to yet another embodiment of the present invention;

FIG. 15 is an enlarged schematic view of the structure at B in FIG. 14;

FIG. 16 is a schematic view of the construction of a peelable film in one embodiment of the invention;

fig. 17 is a schematic structural view of a shielding member and an evaporation source according to an embodiment of the present invention.

In the figure:

100-evaporation mask;

10-a scaffold; 11-central axis;

20-a shield; 21-a shielding face; 22-a first baffle; 221-evaporation hole; 23-a second baffle, 24-an auxiliary connecting piece;

30-a cleaning part; 31-a projection; 32-a rotating shaft; 33-a connecting portion;

40-a connector; 41-a sliding assembly; 411-a slide rail; 412-a slider; 42-a rotating assembly; 421-a first fulcrum; 422-a second fulcrum; 423-rotating shaft; 44-a sliding shaft; 45-a sliding track;

50-a peelable film; 51-a positioning section; 52-a first film; 521-a linking structure; 53-high temperature resistant coating;

210-an evaporation source; 211-evaporation source opening;

300-evaporation equipment; 310-a collecting device; 320-evaporation chamber; 330-sliding mechanism.

400-a substrate to be evaporated;

500-impurities;

y-rotation direction; n-length direction.

Detailed Description

Features and exemplary embodiments of various aspects of the present invention will be described in detail below, and in order to make objects, technical solutions and advantages of the present invention more apparent, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. It will be apparent to one skilled in the art that the present invention may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present invention by illustrating examples of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.

It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.

Features and exemplary embodiments of various aspects of the present invention will be described in detail below. Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.

For a better understanding of the present invention, the evaporation mask 100 and the evaporation apparatus 300 according to the embodiment of the present invention will be described in detail below with reference to fig. 1 to 17.

Referring to fig. 1 to 4 together, fig. 1 is a schematic structural diagram of an evaporation apparatus according to an embodiment of the present invention, and fig. 2 is an enlarged view of a point a in fig. 1; fig. 3 is a schematic structural diagram of an evaporation apparatus according to another embodiment of the present invention; fig. 4 is a schematic structural view of an evaporation apparatus according to still another embodiment of the present invention. The embodiment of the invention provides an evaporation device 300, which comprises an evaporation source 210 and an evaporation chamber 320, wherein the evaporation source 210 is arranged in the evaporation chamber 320, and evaporation materials are evaporated by the evaporation source 210 so as to evaporate a substrate 400 to be evaporated, which is arranged in the evaporation chamber 320.

The evaporation material is a material to be film-formed, that is, after the evaporation material is evaporated on the substrate 400 to be vapor-deposited, an organic film layer is formed on the substrate 400 to be vapor-deposited for preparing a functional film layer of the display panel.

In some optional embodiments, the evaporation apparatus 300 further includes a substrate stage, the substrate stage is fixedly disposed in the evaporation chamber 320, and the substrate 400 to be evaporated disposed in the evaporation chamber 320 is accurately positioned by the substrate stage, so that the positions of the substrate 400 to be evaporated and the evaporation source 210 are more accurate, and the evaporation material is accurately formed at the corresponding position of the substrate 400 to be evaporated.

Optionally, in order to improve the evaporation efficiency of the substrate 400 to be evaporated, a plurality of evaporation sources 210 may be disposed in the evaporation apparatus 300, and the plurality of evaporation sources 210 are disposed in the evaporation chamber 320 at intervals, so that the plurality of substrates 400 to be evaporated may be simultaneously evaporated.

In the process of treating evaporation plating base plate 400 at evaporation plating source 210 and carrying out the evaporation plating, the evaporation plating material of evaporation state can adsorb on evaporation plating cover 100, forms evaporation plating impurity 500, if not in time clear up, can influence the effectual evaporation plating material of evaporation plating source 210, perhaps when impurity 500 drops to evaporation plating cavity 320 in, can pollute evaporation plating cavity 320.

Referring to fig. 5, fig. 5 is a schematic structural diagram of an evaporation mask and an evaporation source according to an embodiment of the invention. The evaporation source 210 provided by the embodiment of the present invention includes an evaporation crucible including an evaporation source opening 211, and the evaporation mask 100 can rotate around the central axis 11 to cover the evaporation source opening 211.

Optionally, the evaporation mask 100 may rotate around the central axis 11, so that the position of the evaporation mask 100 may be adjusted as required, for example, when the evaporation material is in an evaporation state, the evaporation mask 100 may rotate around the central axis 11, so that the evaporation mask 100 covers the evaporation source opening 211 to adjust the evaporation material; alternatively, when the substrate 400 to be vapor-deposited is replaced, the vapor deposition cover 100 may be rotated so that the vapor deposition cover 100 covers the vapor deposition source opening 211, and the vapor deposition cover 100 may shield the vapor deposition material, thereby reducing interference with the replacement substrate 400 to be vapor-deposited. By providing the evaporation cover 100 in the evaporation apparatus 300, the evaporation material can be better adjusted, and the uniformity of evaporation of the substrate 400 to be evaporated can be improved.

In an alternative embodiment, evaporation source 210 may be a point evaporation source, a line evaporation source, or a surface evaporation source. The point evaporation source has only one evaporation source opening 211 above the evaporation crucible, and the film formation region of the substrate 400 to be evaporated is a small range centered on the evaporation source opening 211, and is generally applied to evaporation film formation of the substrate 400 to be evaporated with a small size, wherein the film formation region is a region in which an evaporation material can be deposited on the substrate to be evaporated to form a film structure. The line vapor deposition source is a shape in which a plurality of vapor deposition source openings 211 are linearly arranged above a vapor deposition crucible, and when the substrate 400 to be vapor deposited is stationary, a region where a film layer is formed on the substrate 400 to be vapor deposited by the line vapor deposition source is also aligned. The surface evaporation source is a structure in which a plurality of evaporation source openings 211 are arranged over an evaporation crucible over the entire surface so that the region where a film layer is formed is the entire surface region corresponding to the entire surface of the evaporation source openings 211.

When applied to the vapor deposition apparatus 300, the vapor deposition source 210 is rotated about the central axis 11 by the vapor deposition shield 100, so that the vapor deposition shield 100 can cover the vapor deposition source opening 211 to control the vapor deposition material.

In order to optimize the performance of the evaporation source 210 and ensure the evaporation efficiency of the evaporation apparatus 300 and the stability of the evaporation apparatus 300, the embodiment of the present invention further provides an evaporation shield 100, wherein the evaporation shield 100 can be produced and sold separately as an independent component, and can also be used in combination with the evaporation source 210 of each embodiment, that is, in the evaporation source 210 of each embodiment, at least one evaporation shield 100 can be used in combination, so as to improve the evaporation efficiency of the evaporation source 210.

For better understanding of the evaporation mask 100 according to the embodiment of the present invention, the evaporation mask 100 according to the embodiment of the present invention will be described in detail below with reference to fig. 6 to 17.

Fig. 5 to 13 are also shown, fig. 6 is a schematic three-dimensional structure of an evaporation mask according to an embodiment of the present invention, fig. 7 is a schematic three-dimensional structure of an evaporation mask according to another embodiment of the present invention, fig. 8 is a schematic cross-sectional structure of an evaporation mask shown in fig. 7, fig. 9 is a schematic three-dimensional structure of an evaporation mask according to yet another embodiment of the present invention, fig. 10 is a schematic cross-sectional structure of an evaporation mask shown in fig. 9, and fig. 11 to 13 are schematic cross-sectional structures of a cleaning portion according to some embodiments of the present invention.

The vapor deposition shield 100 according to the embodiment of the present invention is used for a vapor deposition device 300, and the vapor deposition shield 100 includes a shielding member 20 and a cleaning section 30. The shutter 20 has a shutter surface 21 facing the vapor deposition source 210, the cleaning section 30 is provided between the shutter surface 21 and the vapor deposition source 210, and the cleaning section 30 is movable relative to the shutter surface 21 to clean the shutter surface 21.

According to the vapor deposition shield 100 and the vapor deposition apparatus 300 of the embodiment of the present invention, the vapor deposition shield 100 includes the shielding member 20 and the cleaning section 30, the shielding member 20 has the shielding surface 21 that can face the vapor deposition source 210, and the vapor deposition material evaporated by the vapor deposition source 210 can be adjusted by providing the shielding surface 21 in the vapor deposition shield 100. Meanwhile, the evaporation cover 100 is further provided with the cleaning part 30, the cleaning part 30 is arranged between the shielding surface 21 and the evaporation source 210, the cleaning part 30 can move relative to the shielding surface 21, and the cleaning part 30 can timely clean impurities 500 on the shielding surface 21 through the movement of the cleaning part 30, so that the use stability of the evaporation cover 100 is improved. When the evaporation cover 100 is used on the evaporation equipment 300, the cleaning part 30 can clean the impurity 500 deposited on the evaporation cover 100 in time, so that the impurity 500 adsorbed on the shielding surface 21 can be prevented from dropping in the evaporation equipment 300, the evaporation equipment 300 is prevented from being polluted, and the evaporation efficiency of the substrate 400 to be evaporated is improved.

In some alternative embodiments, the vapor deposition shield 100 comprises a bracket 10, the bracket 10 has a central axis 11, and the shielding member 20 is disposed on the bracket 10, and the shielding member 20 is at least rotatable around the central axis 11. Because the bracket 10 is provided with the central axis 11, the shielding member 20 can rotate around the central axis 11, so that the position of the shielding member 20 relative to the bracket 10 can be adjusted, the shielding member 20 can be adjusted according to the requirement of a user, which is convenient for vapor deposition of the substrate 400 to be vapor deposited, the shielding member 20 is further provided with a shielding surface 21 capable of facing the vapor deposition source 210, and the shielding surface 21 on the shielding member 20 can face the vapor deposition source 210 by rotating the shielding member 20 relative to the bracket 10, so as to adjust the vapor deposition material evaporated by the vapor deposition source 210.

In some optional embodiments, the evaporation shield 100 further includes a connecting member 40, and the cleaning part 30 is movably connected to the shielding surface 21 side of the shielding member 20 through the connecting member 40. By arranging the connecting piece 40, the cleaning part 30 moves along a predetermined track on the shielding surface 21, so that the shielding surface 21 is effectively cleaned, and the use stability of the evaporation cover 100 is improved.

Of course, the connecting member 40 may be disposed on the bracket 10, or may be connected to the shielding member 20, but the invention is not limited thereto, as long as the cleaning part 30 can be movably connected to the shielding member 20 through the connecting member 40. The following description will be given taking an example in which the connector 40 is provided on the shutter 20.

In specific implementation, when the substrate 400 to be vapor-deposited is to be vapor-deposited, the vapor-deposition source 210 heats the vapor-deposition material, and when the evaporation rate is reached, the support 10 rotates the shielding member 20 to adjust the vapor-deposition material; when the shielding surface 21 of the shielding material 20 needs to be cleaned, the cleaning unit 30 is controlled to start up to clean the impurities 500 accumulated on the inner surface of the shielding material 20 without affecting the vapor deposition.

Referring to fig. 6, in some alternative embodiments, the connecting member 40 includes a sliding member 41, and the cleaning portion 30 is slidably connected to the shutter 20 via the sliding member 41. Optionally, the sliding assembly 41 includes a sliding rail 411 and a sliding block 412, one of the sliding rail 411 and the sliding block 412 is connected to the cleaning portion 30, and the other is disposed on the shielding member 20. In practice, the sliding block 412 may be connected to the cleaning portion 30, and the sliding rail 411 may be connected to the shielding member 20 through the auxiliary connecting member 24. When the shielding member 20 rotates around the central axis 11, the sliding rail 411 can also rotate synchronously with the shielding member 20, and because the sliding rail 411 is connected with the sliding block 412, the cleaning portion 30 can also rotate synchronously with the shielding member 20, so that when the shielding member 20 rotates to any angle, the cleaning portion 30 can clean the impurities 500 on the shielding member 20 in time. By arranging the cleaning part 30 on the sliding component 41 and movably connecting with the shielding member 20, the cleaning part 30 can slide along the shielding surface 21 according to a predetermined track, and in the sliding process, the impurities 500 adsorbed on the shielding surface 21 are cleaned by the friction action between the cleaning part 30 and the shielding surface 21, and the impurities 500 can be impurities 500 such as evaporation materials adsorbed on the shielding surface 21. Through in time clearing up impurity 500, can reduce impurity 500 on the one hand and drop to the coating by vaporization cavity 320 in, on the other hand, when having evaporation orifice 221 on the coating by vaporization cover 100, through clearing up the shielding surface 21 to the coating by vaporization cover 100, prevent that impurity 500 from blockking up evaporation orifice 221. It is understood that one of the slide rail 411 and the slider 412 may be connected to the cleaning section 30, and the other may be disposed in the evaporation apparatus 300, for example, the other is fixedly disposed in the evaporation apparatus 300, so that when the shutter 20 rotates to a position corresponding to the cleaning section 30, the foreign matter 500 on the shutter 20 is cleaned by the cleaning section 30.

Alternatively, when the shield 20 is of a planar structure, the sliding rail 411 may extend along the length direction N of the shield 20, so that the cleaning portion 30 can slide along the length direction N to clean the shield 20. Further, the slide rail 411 is disposed on the outer periphery of the shielding member 20, the cleaning portion 30 may be a planar structure, and the cleaning portion 30 is disposed in the planar structure, so that the cleaning portion 30 can be in better contact with the shielding surface 21 of the shielding member 20, and the cleaning portion 30 is convenient to clean the impurities 500 on the shielding surface 21. Optionally, the cleaning portion 30 includes a cleaning surface, and the cleaning surface is adapted to the shielding surface 21, so that the cleaning portion 30 can uniformly clean the shielding surface 21 in the process of sliding along the shielding surface 21. Of course, the shielding member 20 may also have a circular arc structure or other irregular shapes, which will not be described in detail.

Referring to fig. 7 and 8, in some alternative embodiments, the connecting member 40 includes a sliding rail 45 and a sliding shaft 44 engaged with the sliding rail 45, the sliding shaft 44 is sleeved on the sliding rail 45, one of the sliding rail 45 and the sliding shaft 44 is connected to the cleaning portion 30, and the other is connected to the shielding member 20. Optionally, the outer circumferential surface of the sliding rail 45 has a threaded structure, and the sliding shaft 44 is sleeved on the sliding rail 45, for example, the sliding rail 45 may be a lead screw, the sliding shaft 44 is matched with the lead screw, and the sliding shaft 44 is driven to rotate by rotating the sliding rail 45, so that the sliding shaft 44 moves along the axial direction of the sliding rail 45 relative to the sliding rail 45. Through the relative movement of the sliding shaft 44 and the sliding rail 45, and the cleaning part 30 moves synchronously with the sliding shaft 44, the cleaning part 30 can move along the shielding surface 21 to clean the impurities 500 of the shielding surface 21.

In order to ensure that the cleaning part 30 is more stably connected with the connecting part 40, the cleaning part 30 is in a U-shaped structure, and the sliding rail 45 is inserted into the U-shaped structure of the cleaning part 30, so that the stress of the sliding rail 45 is uniform in the movement process, and the operation stability of the shielding piece 20 is improved.

Referring to fig. 9 and 10, in some alternative embodiments, the evaporation mask 100 includes a rotating assembly 42, and optionally, the connecting member 40 includes the rotating assembly 42, the rotating assembly 42 includes a rotating shaft 423, a first fulcrum 421 and a second fulcrum 422, the cleaning portion 30 is a strip extending between the first fulcrum 421 and the second fulcrum 422, and the cleaning portion 30 is rotatably disposed around at least one of the first fulcrum 421 and the second fulcrum 422 relative to the shielding member 20.

Alternatively, when the evaporation source 210 is a point evaporation source, the deposition material evaporated from the evaporation source 210 can be diffused in all directions by the guiding action of the shielding member by providing the shielding member 20 as a shielding member having a hemispherical structure. When the shutter 20 has the hemispherical structure, the rotating assembly 42 includes rotating shafts 423, the rotating shafts 423 are disposed at both ends of the shutter 20 in the long axis direction, the first fulcrum 421 is located on one of the rotating shafts 423, and the second fulcrum 422 is located on the other rotating shaft 423. Optionally, when the shielding member 20 has a hemispherical structure, the rotating shaft 423 is disposed at two ends of the radial direction of the hemispherical structure, the cleaning portion 30 is connected to the rotating shaft 423, the cleaning portion 30 rotates along the shielding surface 21 by the rotation of the rotating shaft 423 along the rotation direction Y, and during the rotation, the impurities 500 adsorbed on the shielding surface 21 are cleaned by the friction between the cleaning portion 30 and the shielding surface 21. In some embodiments, the cross section of the strip is semicircular, and the structure of the strip is adapted to the shape of the shielding surface 21, so that the cleaning portion 30 can uniformly clean the shielding surface 21.

Referring to fig. 11 to 13, in an alternative embodiment, the evaporation mask 100 includes a protrusion 31 disposed on the cleaning portion 30, the cleaning portion 30 includes the protrusion 31 and a rotating shaft 32, the cleaning portion 30 is connected to the rotating shaft 423 through the rotating shaft 32, the protrusion 31 is formed by extending from an outer peripheral surface of the cleaning portion 30 to a direction away from the cleaning portion 30, and the protrusion 31 is disposed in contact with the shielding surface 21. Alternatively, the protrusion 31 may have one or a combination of a zigzag structure, a trapezoidal structure, and a rectangular structure. By arranging the protruding part 31 on the cleaning part 30, the contact area between the cleaning part 30 and the shielding surface 21 can be increased, and meanwhile, due to the existence of the protruding part 31, the cleaning part 30 can be more beneficial to cleaning the impurities 500 on the shielding surface 21. Optionally, the rotating shaft 32 itself may also rotate, so that the cleaning portion 30 not only can rotate along the shielding surface 21 under the driving of the rotating shaft 423, but also can rotate by itself, and the protruding portion 31 can better clean the impurities 500.

Referring to fig. 14 to 16, fig. 14 is a schematic cross-sectional structure diagram of an evaporation mask according to still another embodiment of the present invention, fig. 15 is a schematic structural diagram of a peelable film according to an embodiment of fig. 14, and fig. 16 is a schematic structural diagram of a peelable film according to an embodiment of the present invention. In some alternative embodiments, a peelable film 50 is provided on the face 21 of the shield 20, the peelable film 50 being removably connected to the shield 20; optionally, the cleaning part 30 may be connected to the peelable film 50, the peelable film 50 includes a positioning portion 51, the cleaning part 30 includes a connecting portion 33 that is matched with the positioning portion 51, and the cleaning part 30 can be connected to the peelable film 50 through the connecting portion 33. It is understood that a plurality of connecting portions 33 may be provided in the cleaning portion 30 to improve the stability of the connection between the peelable film 50 and the cleaning portion 30, thereby facilitating the peeling of the peelable film 50. Alternatively, the connecting portion 33 may be a bump structure; the positioning portion 51 may be a fitting hole, and the connecting portion 33 can be fitted with the positioning portion 51 during the rotation of the cleaning portion 30, so that the cleaning portion 30 peels off the peelable film 50.

Since the shielding member 20 is disposed in the evaporation chamber 320 of the evaporation apparatus 300 for use, when the evaporation apparatus 300 is in an operating state, that is, when the evaporation material in the evaporation source 210 is in an evaporation state, the temperature in the evaporation chamber 320 is higher, and the temperature of the evaporated evaporation material is also higher, in some alternative embodiments, the peelable film 50 has a high temperature resistance, and the material of the peelable film 50 may be a polytetrafluoroethylene separating film, a high temperature resistant release film, a single silicon release film, or the like, but is not limited to the above materials.

By providing the peelable film 50 on the shielding surface 21 of the vapor deposition cover 100, the vapor deposition material in an evaporated state can be adsorbed on the peelable film 50, and the operator periodically peels the peelable film 50 from the vapor deposition cover 100 to clean the vapor deposition cover 100. It is understood that 10 sheets of peelable films 50 can be attached to the shielding surface 21 of the vapor deposition shield 100 at a time according to the user's needs and the cleaning time period, and of course, the number of peelable films 50 attached to the shielding surface 21 can be set according to the user's needs. In order to increase the stability of the connection between the peelable film 50 and the vapor deposition shield 100, the peelable film 50 may be adhered to the shielding surface 21 of the vapor deposition shield 100, or may be mechanically connected to the inner surface of the vapor deposition shield 100, for example, a snap connection, and the invention is not limited thereto.

In order to increase the high temperature resistance of the peelable film 50 and improve the usability of the peelable film 50, the peelable film 50 includes a first film 52 and a high temperature resistant coating 53 provided on the first film 52, the high temperature resistant coating 53 being provided near the evaporation source 210. Optionally, the surface of the first film 52 near the refractory coating 53 has a connection structure 521, and the refractory coating 53 is embedded in the connection structure 521 to connect with the first film 52.

Specifically, in some embodiments, the connection structure 521 may be a protrusion structure and/or a groove structure, wherein the protrusion structure may be formed by extending from the surface of the first film 52 facing the high temperature resistant coating 53 to the far away from the surface, and the groove structure may be formed by extending from the surface of the first film 52 facing the high temperature resistant coating 53 to the inside of the first film 52, and optionally, the connection structure 521 is one or a combination of a trapezoid structure, a triangle structure, or an arc structure. By arranging the connecting structure 521 on the first film 52, the surface of the first film 52 facing the high-temperature-resistant coating 53 can be a concave-convex surface, the high-temperature-resistant coating 53 is embedded into the connecting structure 521, the base area of the first film 52 and the high-temperature-resistant coating 53 can be increased, the connection between the first film 52 and the high-temperature-resistant coating 53 is more stable, and the peelable film 50 can be peeled off conveniently. Meanwhile, the surface of the peelable film 50 is set to be a concave-convex surface, so that the peelable film 50 is deformed, the peelable film 50 can be deformed to match with the structure of the shielding piece 20, and the peelable film 50 is better connected to the shielding piece 20.

In some alternative embodiments, peelable film 50 may be prepared by the following method.

Step 1, etching the first film 52 to form a connection structure 521 on one surface of the first film 52 in the thickness direction.

Step 2, a high temperature resistant coating is coated on the surface of the first film 52 on which the connection structure 521 is formed.

And 3, heating the high-temperature-resistant film to remove moisture, oxygen and the like in the high-temperature-resistant coating 53.

Step 4, the first film 52 is cured to a matching configuration, depending on the configuration of the mask face 21 of the mask 20.

The peelable film 50 prepared by the method has high temperature resistance and a stable structure, can deform adaptively according to the structure of the shielding piece 20, can better adapt to the structure of the shielding piece 20, and is convenient to connect with the shielding piece 20.

Referring to fig. 17, fig. 17 is a schematic structural view of a shielding member and an evaporation source according to an embodiment of the invention. In some alternative embodiments, the shielding element 20 includes a first baffle plate 22, the first baffle plate 22 is disposed on the bracket 10, the first baffle plate 22 is provided with a plurality of evaporation holes 221 along the thickness direction thereof, the evaporation holes 221 can be penetrated by evaporation material in an evaporation state, and in the evaporation state, the connecting element 40 is disposed at the edge position of the shielding element 20; and/or, the shielding member 20 includes a second baffle 23, the second baffle 23 is disposed on the bracket 10 and spaced from the first baffle 22, the second baffle 23 is continuously disposed along the extending direction of the second baffle 23, and in the evaporation state, the projection of the second baffle 23 is disposed on the outer peripheral side of the evaporation source opening 211 along the extending direction of the central axis 11.

Further, first baffle 22 is provided with a plurality of evaporation holes 221 along the direction of self thickness, so that first baffle 22 is used for adjusting the coating by vaporization rate of the coating by vaporization material that coating by vaporization source opening 211 of coating by vaporization source 210 evaporates, optionally, treat that coating by vaporization base plate 400 and coating by vaporization mask are located coating by vaporization source opening 211 top, treat that coating by vaporization base plate 400 and coating by vaporization mask are stationary under the circumstances, in unit coating by vaporization time, treat that the coating by vaporization layer that corresponds coating by vaporization source opening 211 central point department on the coating by vaporization base plate 400 is thickest, it is far away apart from coating by vaporization source opening 211 central point, the coating by vaporization layer is thinner, just so lead to treating that the coating by vaporization layer on the coating base plate 400 is inhomogeneous. For producing the vapor deposition film layer on the substrate 400 to be vapor deposited by the point vapor deposition source 210, the substrate 400 to be vapor deposited and the vapor deposition mask plate covering one side of the vapor deposition surface of the substrate 400 to be vapor deposited are driven by the driving device to rotate at a constant speed in the vapor deposition process, so as to improve the uniformity of the thickness of the film layer around the vapor deposition film layer produced on the substrate 400 to be vapor deposited, so that the substrate 400 to be vapor deposited and the vapor deposition mask plate rotate at a constant speed with the center of the substrate 400 to be vapor deposited as the center of rotation, which is difficult to avoid in a rotation period of the substrate 400 to be vapor deposited, the vapor deposition film layer formed by the vapor deposition material in the center area of the substrate 400 to be vapor deposited is still thicker than the vapor deposition film formed in the peripheral area of the substrate 400 to be vapor deposited, and the above film thickness difference cannot be reduced even if the substrate 400 to be vapor deposited and the vapor deposition mask plate rotate at a constant speed. Therefore, in some optional embodiments, the transmittance of the evaporation material provided in the shielding member 20 gradually increases from the center to the edge, and when the evaporation material evaporated from the evaporation source opening 211 of the evaporation source 210 passes through the evaporation holes 221 in the shielding member 20, the difference in deposition rate of the evaporation material in the central region and the peripheral region of the substrate 400 to be evaporated is reduced by the adjusting effect of the shielding member 20 on the transmittance of the evaporation material, so that the thickness uniformity of the evaporation film layer on the substrate 400 to be evaporated can be improved. Wherein, the size of the evaporation holes 221 may be gradually increased from the center of the first baffle 22 to the edge, or the density of the evaporation holes 211 may be gradually increased from the center of the first baffle 22 to the edge.

In specific implementation, when the evaporation apparatus according to the embodiment of the present invention is used to evaporate a film layer on a substrate 400 to be evaporated, the substrate 400 to be evaporated and an evaporation mask plate covering the substrate 400 to be evaporated are disposed above the evaporation source opening 211, an evaporation material evaporated from the evaporation source opening 211 is evaporated upward and deposited on the evaporation mask plate, the evaporation material is deposited on the substrate 400 to be evaporated through the evaporation mask plate at a hollow position on the evaporation mask plate, and after the evaporation is completed, the evaporation mask plate is removed, and an evaporation film layer matching a pattern on the evaporation mask plate is formed on the substrate 400 to be evaporated. Be provided with evaporation coating cover 100 above evaporation coating source opening 211, be provided with shielding piece 20 on evaporation coating cover 100, shielding piece 20 can include first baffle 22, when first baffle 22 covers on evaporation coating source opening 211, evaporation coating material can be further to being close to the evaporation coating substrate 400 direction evaporation of treating through evaporation orifice 221 on shielding piece 20, and simultaneously, evaporation coating material transmissivity through evaporation orifice 221 is by the center to edge crescent, so, can adjust the compensation to the speed of directly depositing the film to treating on evaporation coating substrate 400 through evaporation coating source opening 211, make the homogeneity on the evaporation coating film layer that treats formation of film on evaporation coating substrate 400 obtain promoting, thereby improve the display effect of the display panel of preparation.

In some embodiments, the holder 10 is rotatably disposed in the evaporation chamber 320, and the shielding member 20 can be rotated by the rotation of the holder 10 with the holder 10 as a rotation axis, so that when the shielding member 20 is needed to be used, the shielding member 20 is rotated to cover a position above the evaporation source opening 211 of the evaporation source 210, and when the shielding member 20 is not used, the shielding member 20 is rotated away from the position above the evaporation source opening 211 of the evaporation source 210.

Before treating evaporation plating base plate 400 evaporation coating, or after treating evaporation plating base plate 400's evaporation plating completion, rotate support 10, second baffle 23 can remove to cover on evaporation plating source opening 211 of evaporation plating source 210, in order to block the outside evaporation of the coating by vaporization material in evaporation plating source 210, at this moment, when treating evaporation plating base plate 400 is changed in the evaporation plating process, only need to rotate support 10, remove second baffle 23 and cover on evaporation plating source opening 211 of evaporation plating source 210, seal evaporation plating source opening 211, block the outside evaporation of coating by vaporization material, when treating evaporation plating base plate 400 to change and accomplish and begin the evaporation plating, rotate support 10 again and cover first baffle 22 of shielding member 20 on the evaporation plating source opening 211 of removal evaporation plating source 210, the coating by vaporization material that evaporates evaporation plating source opening 211 evaporates is deposited and is treated the evaporation plating rate of each department on evaporation plating base plate 400 and is adjusted.

It should be noted that the second barrier 23 is usually a one-piece metal plate, and may be an iron plate or an aluminum plate, when the metal plate covers the vapor deposition source opening 211 of the vapor deposition source 210, the vapor deposition material is completely sealed and cannot be evaporated from the vapor deposition source opening 211, and furthermore, a grid-shaped metal wire may be further provided on the side of the metal plate close to the vapor deposition source 210, that is, when the metal plate covers the vapor deposition source opening 211 of the vapor deposition source 210, the vapor deposition material evaporated and blocked on the surface of the metal plate can be adsorbed and collected by the metal wire, so as to reduce the possibility that the blocked vapor deposition material falls into the vapor deposition source 210 in the process of the second barrier 23 blocking the vapor deposition source opening 211.

When the evaporation source 210 is applied to the evaporation apparatus 300, in order to prevent the impurities 500 cleaned by the cleaning section 30 from falling into the evaporation chamber 320, the evaporation apparatus 300 according to the embodiment of the present invention further includes a collecting device 310 for cleaning the impurities 500 cleaned by the cleaning section 30, so as to prevent the impurities from contaminating the evaporation apparatus 300, and further improve the evaporation efficiency of the substrate 400 to be evaporated.

Referring to fig. 3 and 4, in some alternative embodiments, the evaporation apparatus 300 includes a plurality of evaporation sources 210 disposed at intervals, and when the evaporation sources 210 are point evaporation sources 210, a collecting device 310 is disposed between two adjacent evaporation sources 210, and optionally, the collecting device 310 may be disposed on an outer peripheral side of the evaporation sources 210, for example, may also be disposed at a corner position of the evaporation chamber 320, so as to provide a maximum space for the substrate 400 to be evaporated.

Optionally, the collecting device 310 includes an upper box and a lower box, the upper box includes a cover plate, the lower box includes a bottom plate and a side plate, the bottom plate and the cover plate enclose a containing chamber, and the containing chamber may be used to contain the impurities 500 cleaned by the cleaning part 30. The upper box body can be rotationally connected with the lower box body through the pin joint device, and can also be connected through the sliding assembly, so that the upper box body and the lower box body can generate relative motion. Optionally, the pivot joint device may have a hinge structure, or a buffer member may be disposed in the accommodating chamber, and the upper tank and the lower tank are connected together by deformation of the buffer member, so as to prevent the impurities 500 accommodated in the collecting device 310 from entering the evaporation chamber 320 again and contaminating the evaporation chamber 320.

In a specific embodiment, when the evaporation material of the evaporation source 210 is in an evaporation state, the upper and lower cases are tightly closed, and after a period of time has elapsed since the evaporation of the substrate 400 to be evaporated, the shutter 20 may be rotated above the collection device 310 to open the upper case or the cover plate, and then the impurities 500 may be removed by the cleaning unit 30 on the shutter 20, so that the impurities 500 may fall into the collection device 310, and the shutter 20 may be periodically cleaned.

It is understood that the shielding element 20 can rotate around the central axis 11 of the holder 10, wherein the holder 10 can be rotatably connected in the evaporation chamber 320, and the holder 10 can rotate relative to the evaporation source 210 to rotate the shielding element 20, but of course, the holder 10 can also be fixedly disposed in the evaporation chamber 320, and the shielding element 20 can be movably connected to the holder 10.

Optionally, when the evaporation source 210 is a line evaporation source, the collecting device 310 may be disposed on the periphery of the line evaporation source, optionally, two collecting devices 310 may be disposed at two opposite ends of the line evaporation source, and the sliding mechanism 330 may be disposed between the two collecting devices 310, for example, a sliding rod extending between the two collecting devices 310 may be used, the shielding member 20 is disposed on the sliding mechanism 330, and when the shielding member 20 needs to be cleaned, the shielding member 20 may move along the sliding rod, so that the shielding member 20 moves above the collecting device 310, and the cleaning portion 30 slides along the shielding surface 21 to clean the shielding member 20.

By providing a plurality of collecting devices 310, it is possible to collect impurities 500 as much as possible, reduce the number of times of opening the evaporation chamber 320, and prevent contamination of the evaporation chamber 320.

In summary, in the vapor deposition shield 100 and the vapor deposition device 300 according to the embodiments of the present invention, the vapor deposition shield 100 includes the shielding member 20 and the cleaning section 30, the shielding member 20 has the shielding surface 21 that can face the vapor deposition source 210, and the vapor deposition material evaporated by the vapor deposition source 210 can be adjusted by providing the shielding surface 21 in the vapor deposition shield 100. Meanwhile, the evaporation cover 100 is further provided with the cleaning part 30, the cleaning part 30 is arranged between the shielding surface 21 and the evaporation source 210, the cleaning part 30 can move relative to the shielding surface 21, and the cleaning part 30 can timely clean impurities 500 on the shielding surface 21 through the movement of the cleaning part 30, so that the use stability of the evaporation cover 100 is improved. When the evaporation cover 100 is used on the evaporation equipment 300, the cleaning part 30 can clean the impurity 500 deposited on the evaporation cover 100 in time, so that the impurity 500 adsorbed on the shielding surface 21 can be prevented from dropping in the evaporation equipment 300, the evaporation equipment 300 is prevented from being polluted, and the evaporation efficiency of the substrate 400 to be evaporated is improved. When the evaporation cover 100 is applied to the evaporation equipment 300, the impurities 500 adsorbed on the shielding surface 21 can be prevented from dropping in the evaporation equipment 300 by timely cleaning the cleaning part 30, so that the evaporation equipment 300 is prevented from being polluted, and the evaporation efficiency of the substrate 400 to be evaporated is improved.

The evaporation source 210 and the evaporation apparatus 300 provided in the embodiments of the present invention include the evaporation cover 100 according to the above embodiments, so that the impurities 500 in the evaporation chamber 320 can be reduced, the evaporation chamber 320 is prevented from being polluted, the evaporation apparatus 300 can have better stability, and the evaporation efficiency of the substrate 400 to be evaporated can be improved.

The vapor deposition mask 100 according to the above embodiments of the present invention is described by taking the application to the vapor deposition source 210 and the vapor deposition apparatus 300 as an example, but it is to be understood that the present invention is not limited to the above-described environment, and may be applied to other fields requiring the vapor deposition mask 100.

In accordance with the above embodiments of the present invention, these embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention and various embodiments with various modifications as are suited to the particular use contemplated. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. The utility model provides an evaporation plating cover for evaporation plating equipment, evaporation plating equipment includes the evaporation plating source, its characterized in that, evaporation plating cover includes:

a shielding piece having a shielding surface facing the evaporation source;

the cleaning part is arranged between the shielding surface and the evaporation source, is connected to the shielding piece and can move relative to the shielding surface to clean the shielding surface;

the cleaning part is movably connected to the shielding surface of the shielding piece through the connecting piece.

2. The evaporation shield according to claim 1, wherein the connecting member comprises a sliding assembly, and the cleaning portion is slidably connected to the shielding member through the sliding assembly.

3. The evaporation shield according to claim 2, wherein the sliding assembly comprises a sliding rail and a sliding block, one of the sliding rail and the sliding block is connected with the cleaning part, and the other is arranged on the shielding member.

4. The evaporation mask according to claim 1, wherein the connecting member comprises a rotating member, the rotating member comprises a first fulcrum and a second fulcrum which are arranged at intervals, the cleaning portion is a strip-shaped body formed by extending between the first fulcrum and the second fulcrum, and the cleaning portion is rotatably arranged relative to the shielding member around at least one of the first fulcrum and the second fulcrum.

5. The evaporation shield according to claim 1, further comprising a protrusion provided on the cleaning portion, wherein the protrusion is formed by extending from an outer peripheral surface of the cleaning portion in a direction away from the cleaning portion.

6. A deposition shield according to any of claims 1-5, wherein a peelable film is provided on the shield face of the shield, the peelable film being removably connected to the shield.

7. The evaporation shield according to claim 6, wherein the cleaning part is connectable to the peelable film, the peelable film comprises a positioning part, the cleaning part comprises a connecting part that is fitted to the positioning part, and the cleaning part is connectable to the peelable film via the connecting part.

8. The evaporation shield of claim 6, wherein said peelable film comprises a first film and a high temperature resistant coating disposed on said first film, said high temperature resistant coating being disposed adjacent to said evaporation source.

9. The evaporation shield according to claim 8, wherein said first film has a connection structure on a surface thereof adjacent to said refractory coating, said refractory coating being embedded in said connection structure and connected to said first film.

10. The evaporation shield according to any of claims 1 to 5, comprising a support having a central axis;

the shielding piece is arranged on the support and can rotate at least around the central axis.

11. The evaporation shield according to claim 10, wherein the shielding member comprises a first baffle plate, the first baffle plate is disposed on the support, the first baffle plate is provided with a plurality of evaporation holes along a thickness direction thereof, evaporation materials in an evaporation state can penetrate through the evaporation holes, and a projection of the first baffle plate covers the evaporation source along an extension direction of the central axis in the evaporation state; and/or the like and/or,

the shielding piece comprises a second baffle plate, the second baffle plate is continuously arranged along the extension direction of the second baffle plate, and in an evaporation state, the projection of the second baffle plate is arranged on the periphery side of the evaporation source along the extension direction of the central axis.

12. An evaporation apparatus, comprising: the vapor deposition shield according to any one of claims 1 to 11.