CN106978588A - One kind evaporation cover, vapor deposition source, evaporation coating device and evaporation coating method - Google Patents
One kind evaporation cover, vapor deposition source, evaporation coating device and evaporation coating method Download PDFInfo
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- CN106978588A CN106978588A CN201710212406.XA CN201710212406A CN106978588A CN 106978588 A CN106978588 A CN 106978588A CN 201710212406 A CN201710212406 A CN 201710212406A CN 106978588 A CN106978588 A CN 106978588A
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- Prior art keywords
- evaporation
- pole
- cover
- vapor deposition
- main shaft
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Abstract
The embodiment of the present invention provides a kind of evaporation cover, vapor deposition source, evaporation coating device and evaporation coating method, be related to vacuum vapor plating field, can solve the problem that existing vapor deposition source during evaporation on substrate to be deposited be deposited region diverse location at evaporation thicknesses of layers it is uneven the problem of.Including：Support shaft.Regulation cover, regulation cover side is arranged in support shaft, and void region is included on regulation cover, and the deposition material transmitance that the deposition material of evaporating state can pass through on void region, regulation cover gradually increases from center to edge.Wherein, support shaft is rotatable, to drive regulation cover is mobile to be covered in vapor deposition source outlet.Pass through rotation support shaft, make the regulation cover shift position being fixed on by side in support shaft, so that regulation cover can be covered in vapor deposition source outlet, so that the deposition material that evaporation is exported from vapor deposition source to be adjusted to the evaporation rate at each position on substrate to be deposited.
Description
Technical field
The present invention relates to vacuum vapor plating field, more particularly to a kind of evaporation cover, vapor deposition source, evaporation coating device and evaporation side
Method.
Background technology
Vacuum vapor plating refers in vacuum environment, after material heating evaporation to be filmed or distillation, makes it in low temperature
Workpiece or substrate surface condense or deposited, with the technique for forming coating.Material to be filmed evaporation crucible inside heating evaporation or
After distillation, rise and sent by the way that the evaporation apertures above crucible are deposited, substrate to be deposited at the uniform velocity passes through the position in evaporation apertures exit
Put, the material to be filmed evaporated gradually cools after leaving the heating after evaporation crucible, the speed of evaporation motion is gradually lowered,
Finally deposit to form film layer on the surface of substrate to be deposited.
The vapor deposition source of evaporation coating device, is divided according to the setting quantity and arrangement mode of evaporation apertures, can be divided into an evaporation
Source, line vapor deposition source and face vapor deposition source.Point vapor deposition source is an only evaporation apertures above evaporation crucible, and film-forming region is with the steaming
A smaller range centered on hair engaging aperture, is commonly used to the evaporation film-forming to the less film layer of size.Line vapor deposition source is referred to
Multiple evaporation apertures are linearly arranged above evaporation crucible, in the case where substrate to be deposited is static, are being treated by line vapor deposition source
The region that formation film layer on substrate is deposited also is the shape of straight line.Face vapor deposition source refers to being in whole face above evaporation crucible
Arrange multiple evaporation apertures, using the region that to form film layer as the whole face region corresponding with the evaporation apertures in whole face.
For the small generation line of small-medium size organic display device, generally it is deposited using point vapor deposition source, small-medium size
Substrate to be deposited is at the uniform velocity rotated during evaporation with nearer with range points vapor deposition source at equilibrium distance point vapor deposition source farther out position
The difference of evaporation rate at position, improves the evaporation membrane uniformity at variant position on substrate to be deposited.But so only
The membrane uniformity in same circumferential area everywhere on substrate to be deposited can be balanced, for the evaporation between other diverse locations
The difference of speed can not balanced adjustment, there are still film thickness uniformity is poor between different circumferential areas on substrate to be deposited
Problem.
The content of the invention
The embodiment of the present invention provides a kind of evaporation cover, vapor deposition source, evaporation coating device and evaporation coating method, can solve the problem that existing point
Vapor deposition source during evaporation on substrate to be deposited be deposited region diverse location at evaporation thicknesses of layers it is uneven the problem of.
To reach above-mentioned purpose, embodiments of the invention are adopted the following technical scheme that：
The one side of the embodiment of the present invention is covered there is provided one kind evaporation, including：Support shaft.Regulation cover, regulation cover side is set
In support shaft, void region is included on regulation cover, the deposition material of evaporating state can pass through on void region, regulation cover
Deposition material transmitance gradually increases from center to edge.Wherein, support shaft is rotatable, to drive regulation cover movement to be covered in steaming
Plating source is exported.
Further, regulation covers to include on the cover plate of multiple through holes, cover plate shared by unit area inner via hole area
Ratio gradually increases from center to edge.Wherein, multiple through-hole apertures are identical, and on cover plate unit area inner via hole distribution it is close
Du You centers gradually increase to edge；Or, distribution density of multiple through holes on the cover board in unit area is identical, and multiple logical
The aperture in hole gradually increases from center to edge.
Further, the evaporation cover of the embodiment of the present invention also includes hood for protecting rider, and hood for protecting rider side is arranged in support shaft, props up
Axle is supportted rotatable, to drive hood for protecting rider movement to be covered in vapor deposition source outlet.
It is preferred that, support shaft includes main shaft and the first pole being connected in the vertical plane of main-shaft axis with main shaft
With the second pole, the side of hood for protecting rider is connected by the first pole with main shaft, and the side of regulation cover passes through the second pole and master
Axle is connected.
Further, the first pole can circumferentially rotating around main shaft.
Further, the second pole can circumferentially rotating around main shaft.
It is preferred that, the first pole and the second pole are fixedly connected with main shaft, and main shaft can be rotatable around its axis, the first pole
Orthographic projection and the second pole orthographic projection between angle be 30 ° -120 °.
The another aspect of the embodiment of the present invention is there is provided the evaporation cover of a kind of vapor deposition source, including any of the above-described, in addition to steams
Plate and vapor deposition source outlet is provided with crucible, evaporation crucible, evaporation cover is rotatable and causes hood for protecting rider and/or regulation cover to be placed on steaming
Plating source is exported.
There is provided a kind of evaporation coating device, including above-mentioned vapor deposition source, in addition to control for the another further aspect of the embodiment of the present invention
Device, controller is connected with support shaft, controls the rotation of support shaft.
The another aspect of the embodiment of the present invention is there is provided a kind of evaporation coating method, applied to above-mentioned evaporation coating device, including, plus
Hot evaporation crucible, makes the deposition material in evaporation crucible by thermal evaporation；Support shaft is controlled to rotate, to cause hood for protecting rider and/or tune
Save movement under the drive for covering on support shaft and be covered in vapor deposition source outlet.Wherein, support shaft includes main shaft and in main-shaft axis
The first pole and the second pole being connected in vertical plane with main shaft, the side of hood for protecting rider is connected by the first pole with main shaft
Connect, the side of regulation cover is connected by the second pole with main shaft, control support shaft, which is rotated, to be included：The first pole is controlled around main shaft
Circumferentially rotate, or, the first pole and the second pole circumferentially rotating around main shaft are controlled respectively.When the first pole and second
Bar is fixedly connected with main shaft, and main shaft is rotatable, and angle is 30 ° -120 ° between the orthographic projection of the first pole and the second pole,
Control support shaft, which is rotated, to be included：Control main shaft rotatable around its axis.
The embodiment of the present invention provides a kind of evaporation cover, vapor deposition source, evaporation coating device and evaporation coating method, including：Support shaft.Regulation
Cover, regulation cover side is arranged in support shaft, and void region is included on regulation cover, and the deposition material of evaporating state, which can pass through, to be engraved
Deposition material transmitance on dummy section, regulation cover gradually increases from center to edge.Wherein, support shaft is rotatable, to drive
Regulation cover is mobile to be covered in vapor deposition source outlet.By rotation support shaft, move the regulation cover being fixed on by side in support shaft
Dynamic position, so that regulation cover can be covered in vapor deposition source outlet, with to exporting the deposition material of evaporation from vapor deposition source to treating
Evaporation rate on evaporation substrate at each position is adjusted.
Brief description of the drawings
In order to illustrate more clearly about the embodiment of the present invention or technical scheme of the prior art, below will be to embodiment or existing
There is the accompanying drawing used required in technology description to be briefly described, it should be apparent that, drawings in the following description are only this
Some embodiments of invention, for those of ordinary skill in the art, on the premise of not paying creative work, can be with
Other accompanying drawings are obtained according to these accompanying drawings.
Fig. 1 is a kind of structural representation that cover is deposited provided in an embodiment of the present invention；
The top view that Fig. 2 is Fig. 1 (not including substrate to be deposited and deposition mask version)；
Fig. 3 also includes the structural representation of hood for protecting rider for a kind of evaporation cover provided in an embodiment of the present invention；
Fig. 4 adjusts the top view of cover in being covered for a kind of evaporation provided in an embodiment of the present invention；
Fig. 5 is additionally provided with the first pole in being covered for a kind of evaporation provided in an embodiment of the present invention and the structure of the second pole is shown
It is intended to；
The structural representation that Fig. 6 can circumferentially rotate for the first pole in a kind of evaporation cover provided in an embodiment of the present invention around main shaft
Figure；
Fig. 7 is that the first pole in a kind of evaporation cover provided in an embodiment of the present invention and the second pole can be rotating around main shaft weeks
To the structural representation of rotation；
The structural representation that main shaft can be rotatable around its axis during Fig. 8 covers for a kind of evaporation provided in an embodiment of the present invention；
Fig. 9 a are one of Fig. 8 top view；
Fig. 9 b are the two of Fig. 8 top view；
Figure 10 is a kind of structural representation of vapor deposition source provided in an embodiment of the present invention；
Figure 11 is a kind of one of flow chart of evaporation coating method provided in an embodiment of the present invention；
Figure 12 is the two of a kind of flow chart of evaporation coating method provided in an embodiment of the present invention；
Figure 13 is the three of a kind of flow chart of evaporation coating method provided in an embodiment of the present invention；
Figure 14 is the four of a kind of flow chart of evaporation coating method provided in an embodiment of the present invention.
Reference：
00- evaporation covers；01- controllers；10- support shafts；11- main shafts；The poles of 12- first；The poles of 13- second；20- is adjusted
Cover；21- cover plates；Crucible is deposited in 30-；40- substrates to be deposited；50- deposition masks version；60- hood for protecting rider；A- unit areas；A1、
A2, A3- enumerate first, second, third unit area；X- void regions；A- vapor deposition sources are exported；B- through holes；C- main-shaft axis；α-
Angle between first pole orthographic projection and the second pole orthographic projection；Ith, II, III-deposition material is to substrate diverse location to be deposited
Locate the path arrows of deposition.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only a part of embodiment of the invention, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
The embodiment of the present invention provides a kind of evaporation cover, as shown in figure 1, including：Support shaft 10.Regulation cover 20, regulation cover 20
Side is arranged in support shaft 10, and void region X is included on regulation cover 20, and the deposition material of evaporating state can pass through vacancy section
Deposition material transmitance on domain X, regulation cover 20 gradually increases from center to edge.Wherein, support shaft 10 is rotatable, to drive
The movement of regulation cover 20 is covered in vapor deposition source outlet a.
It should be noted that first, as shown in figure 1, at least including a void region X, vacancy section on regulation cover 20
Domain X is located at the vapor deposition source outlet a of evaporation crucible 30 correspondence top, and correspondence top described herein refers to void region X's
Vapor deposition source outlet a is included by orthographic projection, by vapor deposition source export the deposition materials that evaporate of a upwards after evaporation can respectively by
Correspondence position evaporates further up after passing through on the X of void region.The deposition material of evaporating state as shown by the arrows in Figure 1, from
It is deposited after the upward evaporations of the vapor deposition source of crucible 30 outlet a, by adjusting the void region X on cover 20, can finally passes through evaporation
Mask 50 forms the evaporation film layer with specific evaporation pattern on substrate 40 to be deposited.
Second, regulation cover 20 is used for the evaporation rate to the vapor deposition source outlet a that crucible 30 the is deposited deposition materials evaporated
It is adjusted, therefore, the deposition material transmitance in the void region X on regulation cover 20 everywhere is differed.For example, such as Fig. 1 institutes
Show, substrate 40 and deposition mask version 50 to be deposited is located above vapor deposition source outlet a, in substrate 40 to be deposited and deposition mask version 50
In the case of fixed, in unit evaporation time as shown by the arrows in Figure 1, correspondence vapor deposition source outlet on substrate 40 to be deposited
Evaporation film layer at the position of arrow I at a centers is most thick, secondly, at the position of arrow II due to apart from vapor deposition source outlet a centers compared with
Closely, evaporation film layer is thicker, and because apart from vapor deposition source outlet a centre distances, farther out, evaporation film layer is relatively thin at the position of arrow III, this
The evaporation thicknesses of layers that sample is resulted on substrate 40 to be deposited is uneven.For being made by a vapor deposition source on substrate 40 to be deposited
For making evaporation film layer, usual substrate 40 to be deposited and be covered in substrate 40 to be deposited evaporation face side deposition mask version 50
Driven and at the uniform velocity rotated by drive device during evaporation, to improve the evaporation film layer made on substrate 40 to be deposited week
The film thickness uniformity on side, makes substrate 40 to be deposited and deposition mask version 50 with center (such as Fig. 1 midpoints of substrate 40 to be deposited
Shown in line) it is pivot uniform rotation, in a rotation period of substrate 40 to be deposited, in substrate 40 to be deposited
Heart position remains the evaporation rate of the position of arrow II, to form thicker evaporation film layer, and the edge of substrate to be deposited 40
The same circumferential area of position, the position of arrow III and the position of arrow II are sequentially passed through in a rotation period, can be formed
Film layer it is relatively thin, accordingly, it is difficult to avoid, the evaporation film layer that deposition material is formed in the central area of substrate 40 to be deposited is still
Understand the evaporation film thickness than being formed in the neighboring area of substrate 40 to be deposited, substrate 40 and deposition mask version 50 to be deposited is at the uniform velocity revolved
Turn also reduce above-mentioned thickness difference.Therefore, set regulation cover 20 deposition material transmitance from center to edge gradually
Increase, by the vapor deposition source deposition materials that evaporate of outlet a of evaporation crucible 30 when by adjusting the void region X on cover 20,
By adjusting the adjustment effect of 20 pairs of deposition material transmitances of cover, reduce deposition material in the central area of substrate 40 to be deposited and
The deposition rate difference of neighboring area, so as to improve the thickness evenness of the evaporation film layer on substrate 40 to be deposited.
3rd, in the evaporation cover of the embodiment of the present invention, for the shape of the void region X on regulation cover 20 and regulation cover 20
Shape is not specifically limited, as long as after disclosure satisfy that regulation cover 20 is arranged in support shaft 10, evaporation crucible can be completely covered
Above 30 vapor deposition source outlet a.For example, as shown in Fig. 2 the void region X on regulation cover 20 and regulation cover 20 is
Circle a, lateral edges of circular regulation cover 20 are fixed in support shaft 10, to cause void region X is located at evaporation is completely covered
Position above the vapor deposition source outlet a (in Fig. 2 shown in broken circle) of crucible 30.
4th, support shaft 10 is rotatable, and regulation cover 20 can be under the drive that support shaft 10 is rotated, in being with support shaft 10
The heart rotates in same level, to cause when needing to use, and will adjust evaporation of the rotation of cover 20 to covering evaporation crucible 30
At source outlet a top positions, and vapor deposition source outlet a of the regulation cover 20 away from evaporation crucible 30 can be rotated when not in use
Top position.
The embodiment of the present invention provides a kind of evaporation cover, including：Support shaft.Regulation cover, regulation cover side is arranged on support shaft
On, void region is included on regulation cover, the deposition material of evaporating state can pass through the deposition material on void region, regulation cover
Transmitance gradually increases from center to edge.Wherein, support shaft is rotatable, is gone out with driving regulation cover movement to be covered in vapor deposition source
Mouthful.By rotation support shaft, make the regulation cover shift position being fixed on by side in support shaft, so that regulation cover can
Vapor deposition source outlet is covered in, with to exporting the deposition material evaporated to the evaporation at each position on substrate to be deposited from vapor deposition source
Speed is adjusted.
Further, as shown in figure 3, the evaporation cover of the embodiment of the present invention also includes hood for protecting rider 60, the side of hood for protecting rider 60 is set
Put in support shaft 10, support shaft 10 is rotatable, to drive the movement of hood for protecting rider 60 to be covered in vapor deposition source outlet a.
Before substrate 40 to be deposited evaporation film layer, or after the evaporation of substrate 40 to be deposited is completed, rotational support
Axle 10, is covered on the vapor deposition source outlet a of evaporation crucible 30 as shown in figure 3, hood for protecting rider 60 is moved, to stop evaporation crucible 30
Interior deposition material outwards evaporates, so, when changing substrate 40 to be deposited during evaporation, only needs rotation support shaft
10, hood for protecting rider 60 is moved and is covered on the vapor deposition source outlet a of evaporation crucible 30, closing vapor deposition source outlet a stops evaporation material
Material outwards evaporation, when substrate 40 to be deposited replacing completion starts evaporation, the movement covering of cover 20 will be adjusted by being rotated further by support shaft 10
On the vapor deposition source outlet a of evaporation crucible 30, substrate 40 to be deposited is deposited on to the vapor deposition source outlet a deposition materials evaporated
On evaporation rate everywhere be adjusted.
It should be noted that hood for protecting rider 60 is usually the sheet metal (such as iron plate) of monoblock, when sheet metal is covered in steaming
When plating on the vapor deposition source outlet a of crucible 30, deposition material is completely enclosed, it is impossible to is exported a by vapor deposition source and is outwards evaporated, in addition,
Latticed wire is additionally provided with close to the side of evaporation crucible 30 in sheet metal, i.e., when sheet metal is covered in evaporation earthenware
When on the vapor deposition source outlet a of crucible 30, the deposition material for evaporating and being blocked in sheet metal surface can adsorb receipts by wire
Collection, reduction hood for protecting rider 60 exports the deposition material being blocked during a is blocked to vapor deposition source and dropped with being deposited in crucible 30
Possibility.
Further, regulation cover 20 is unit area on the cover plate 21 for including multiple aperture identical through hole b, cover plate 21
Ratio shared by A inner via holes b area gradually increases from center to edge.Wherein, as shown in figure 4, multiple through hole b apertures phases
Together, and unit area A inner via holes b distribution density gradually increases from center to edge on cover plate 21；Or, multiple through hole b exist
Distribution density on cover plate 21 in unit area A is identical, and multiple through hole b aperture gradually increases from center to edge.
For example, as shown in figure 4, having on the cover plate 21 of regulation cover 20 in multiple aperture identical through hole b, unit area A
Through hole b density is the transmission rates for determining the deposition material in unit area A, unit area A inner via holes b density
Bigger, the transmission rates of the deposition material in unit area A are bigger, conversely, then transmission rates are smaller.For example, by covering
In unit area A1, A2, A3 that the center of plate 21 is arranged to edge, respectively including 1,4 and 9 through hole b, so,
When regulation cover 20 is covered on the vapor deposition source outlet a of evaporation crucible 30, passed through by the vapor deposition source outlet a deposition materials evaporated
After regulation cover 20, the ratio for the material that the material that central area is evaporated gradually is evaporated to fringe region is 1:4:9, pass through
The distribution density of the unit area A inner via holes b of diverse location on cover plate 21 is adjusted, can adjust to be deposited on by regulation cover 20 and treat
The deposition material being deposited on substrate 40 changes span by the evaporation rate of central area to neighboring area.
Further, it is also possible to set distribution densities of multiple through hole b on cover plate 21 in unit area A identical, and it is multiple logical
Hole b aperture gradually increases from center to edge, so, because the aperture of the through hole b positioned at core is smaller, more leans on
The aperture of the through hole of proximal edge part is bigger, when regulation cover 20 is covered on the vapor deposition source outlet a of evaporation crucible 30, by being deposited
The deposition material that outlet a in source is evaporated is by adjusting after cover 20, and the material that central area is evaporated is less, gradually to marginal zone
Domain, the material evaporated gradually increases, and by adjusting the pore size of the through hole b on cover plate 21 at diverse location, can adjust
By the change for adjusting the evaporation rate for covering 20 deposition materials being deposited on substrate 40 to be deposited by central area to neighboring area
Change span.Or, can also be multiple with adjusting by distribution densities of the above-mentioned regulation through hole b on cover plate 21 in unit area A
Through hole b pore sizes of diverse location on cover plate 21 are combined, jointly to deposition material by central area to neighboring area
The change span of evaporation rate is adjusted.
It is preferred that, it is identical for multiple through hole b apertures, and on cover plate 21 unit area A inner via holes b distribution density in
Unit area A inner via holes b distribution density is at the center of cover plate 21 on the regulative mode that the heart gradually increases to edge, regulation cover 20
Position is with being 7 in the ratio range of marginal position:10-9:10.
So, can be to a vapor deposition source when to deposition material on substrate 40 to be deposited, because deposition material is to treating
In the central area of substrate 40 to be deposited caused by the central area of evaporation substrate 40 is different with the deposition distance of neighboring area
Compensation is adjusted than the defect of the deposition film thickness in the neighboring area of substrate 40 to be deposited in depositional coating, so as to balance to be deposited
The thickness of central area and neighboring area depositional coating on substrate 40.If unit area A inner via holes b distribution is close on regulation cover 20
Spend in the center of cover plate 21 with the ratio range in marginal position less than 7:10, may be excessive due to regulation compensation so that
The problem of thickness that central area depositional coating is produced on substrate 40 to be deposited is less than neighboring area depositional coating thickness；If regulation
Unit area A inner via holes b distribution density is more than in the center of cover plate 21 with the ratio range in marginal position on cover 20
9:10, then may be weaker due to regulation compensation ability, after compensation is adjusted, also there is central area on substrate 40 to be deposited
The thickness of depositional coating is more than neighboring area depositional coating thickness.
It is preferred that, as shown in figure 5, support shaft 10 include main shaft 11 and in the axis c of main shaft 11 vertical plane with master
The first pole 12 and the second pole 13 that axle 11 is connected, the side of hood for protecting rider 60 is connected by the first pole 12 with main shaft 11
Connect, the side of regulation cover 20 is connected by the second pole 13 with main shaft 11.
So, the position of hood for protecting rider 60 and regulation cover 20 can be determined by the first pole 12 and the second pole 13,
To cause when support shaft 10 turns to a certain position, hood for protecting rider 60 or regulation cover 20 can completely be covered in evaporation crucible 30
Vapor deposition source outlet a on, it is to avoid hood for protecting rider 60 or regulation cover 20 are when being directly anchored in support shaft 10, hood for protecting rider 60 or regulation
The problem of side of cover 20 is not used to covering vapor deposition source outlet a with the part that support shaft 10 is connected.
Further, as shown in fig. 6, the first pole 12 can circumferentially rotating around main shaft 11.
As shown in fig. 6, the first pole 12 and the second pole 13 can be arranged in same vertical plane, wherein, first
Pole 12 and the hood for protecting rider 60 that is connected with the first pole 12 be located at lower section, the second pole 13 and is connected with the second pole 13
Regulation cover 20 is above, when being operated without evaporation, on the vapor deposition source outlet a of the covering evaporation crucible 30 of hood for protecting rider 60, adjusts
Section cover 20 is located at the vertical direction of hood for protecting rider 60, due to the effect of blocking of hood for protecting rider 60, and deposition material can not export a from vapor deposition source
Outwards evaporation.When needing to carry out substrate 40 to be deposited evaporation operation, the first circumferentially rotating around main shaft of pole 12, to hide
Vapor deposition source outlet a of the block cover 60 away from evaporation crucible 30, so, it is outside that deposition material just can export a by vapor deposition source
Evaporation, and by after the evaporation rate regulation for the regulation cover 2- being deposited above the vapor deposition source outlet a of crucible, uniformly depositing
Evaporation film layer is formed on substrate 40 to be deposited.After the completion of film layer evaporation, then by making the first pole 12 around the circumference of main shaft
Rotate on the vapor deposition source outlet a for being moved to hood for protecting rider 60 and covering evaporation crucible 30, cover 20 without mobile regulation, i.e.,
The closing to vapor deposition source outlet a and opening can be achieved, and when opening vapor deposition source outlet a by adjusting 20 pairs of cover by vapor deposition source
The deposition material of a evaporations is exported to the regulation of the evaporation rate on substrate 40 to be deposited at each position.
Further, as shown in fig. 7, the second pole 13 can circumferentially rotating around main shaft 11.
As shown in fig. 7, the first pole 12 and the second pole 13 can circumferentially rotating rotating around main shaft 11, so,
Hood for protecting rider 60 and regulation 20 set location respectively by the first pole 12 and the second pole 13 on main shaft 11 of cover are more flexible,
The top that vapor deposition source exports a can be arranged at simultaneously, can also be all disposed within and be away from the top that vapor deposition source exports a, needed
Corresponding pole is rotated when use hood for protecting rider 60 or regulation cover 20 are moved to the top that vapor deposition source exports a.
It is preferred that, as shown in figure 8, the first pole 12 and the second pole 13 are fixedly connected with main shaft 11, main shaft 11 can be around
Its axis c is rotated.As illustrated in fig. 9, wherein, the first pole 12 and the second pole 13 be not in same vertical plane.
So, as illustrated in fig. 9, the first pole 12 and the second pole 13 are fixedly connected between main shaft 11, and the
One pole 12 and the second pole 13 be not in same vertical plane, so that the projection of hood for protecting rider 60 and regulation cover 20 is not also overlapping.
Main shaft 11 can be rotated around its axis c, by rotating spindle 11, hood for protecting rider 60 or regulation cover 20 can be turned into covering evaporation earthenware
The vapor deposition source of crucible 30 exports a top, to being stopped or rate adaptation by the vapor deposition source outlet a deposition materials evaporated.
It is preferred that, angle α is 30 ° -120 ° between the orthographic projection of the first pole 12 and the orthographic projection of the second pole 13.
As illustrated in fig. 9, angle α is about 120 ° between the orthographic projection of the first pole 12 and the orthographic projection of the second pole 13.If
Angle α is less than 30 ° between the orthographic projection of first pole 12 and the orthographic projection of the second pole 13, then can be fixed on the first pole
Speed that is overlapping and influenceing regulation cover 20 is projected between hood for protecting rider 60 and the regulation cover 20 being fixed on the second pole 13 on 12
Regulating effect, it is not overlapping in order to be projected between hood for protecting rider 60 and regulation cover 20, it is necessary to extend the first pole 12 and the second pole
13 length, so that the on the one hand volume of increase evaporation cover, on the other hand also improves the power consumption that main shaft 11 is rotated；If the first pole
Angle α is more than 120 ° between 12 orthographic projection and the orthographic projection of the second pole 13, then increases hood for protecting rider 60 and adjust replacing for cover 20
Change the time, and cause in replacement process the waste of deposition material.
It is preferred that, as shown in figure 9b, angle α is between the orthographic projection of the first pole 12 and the orthographic projection of the second pole 13
90°.So, on the one hand, on the premise of it need not extend the length of the first pole 12 and the second pole 13, ensure that screening
Orthographic projection is not overlapping between block cover 60 and regulation cover 20, it is to avoid the evaporation rate regulating effect of influence regulation cover 20；On the other hand,
Distance is not far between hood for protecting rider 60 and regulation cover 20, can be rapidly completed during evaporation between hood for protecting rider 60 and regulation cover 20
Exchange.
The another aspect of the embodiment of the present invention as shown in Figure 10, includes the evaporation of any of the above-described there is provided a kind of vapor deposition source
Vapor deposition source outlet a is provided with cover 00, in addition to evaporation crucible 30, evaporation crucible 30, evaporation cover 00 is rotatable and to block
Cover 60 and/or regulation cover 20 are covered in vapor deposition source outlet a.
As shown in Figure 10, deposition material is heated to setting on evaporation or sublimation condition, evaporation crucible 30 in evaporation crucible 30
Vapor deposition source outlet a is equipped with, the deposition material of evaporation exports a by vapor deposition source and outwards evaporated, and evaporation cover 00 is rotatable and will block
Cover 60 and/or regulation cover 20 are covered at vapor deposition source outlet a position, are exported when hood for protecting rider 60 is covered in vapor deposition source on a, or
Hood for protecting rider 60 and regulation cover 20 are located above vapor deposition source outlet a simultaneously when, deposition material is blocked and can not export a from vapor deposition source
Outwards evaporation；A is exported when regulation cover 20 is located above vapor deposition source outlet a, in evaporation crucible 30 by vapor deposition source outwards to evaporate
Deposition material by adjusting the rate adaptation of cover 20, more uniform evaporation film layer can be formed on substrate 40 to be deposited.
The another further aspect of the embodiment of the present invention is there is provided a kind of evaporation coating device, as shown in Figure 10, including above-mentioned vapor deposition source,
Also include controller 01, controller 01 is connected with support shaft 10, control the rotation of support shaft 10.
The rotation of support shaft 10 is controlled by controller 01, when the main shaft 11 of support shaft 10 is rotated, the first pole
12 and second when being fixedly connected between pole 13 and main shaft 11, and controller 01 is connected with main shaft 11, when controlling the rotation of main shaft 11
Between and rotation direction, when the main shaft 11 of support shaft 10 is fixed, the first circumferentially rotating along main shaft 11 of pole 12, or the first pole 12
With the second pole 13 respectively along main shaft 11 when circumferentially rotating, the pole 12 of controller 01 and first or respectively with the first pole 12
Connected with the second pole 13, control the first pole 12 or control the week of the first pole 12 and the second pole 13 along main shaft 11 respectively
Time and direction to rotation.
Using the evaporation coating device of the embodiment of the present invention to when film layer is deposited on substrate 40 to be deposited, by substrate 40 to be deposited with
And the deposition mask version 50 being covered on substrate 40 to be deposited is arranged on above vapor deposition source outlet a, and a evaporations are exported by vapor deposition source
The deposition material gone out evaporates and is deposited in deposition mask version 50 upwards, and in deposition mask version 50 at the position of hollow out, material is deposited
Material 50 is deposited on substrate 40 to be deposited by deposition mask version, it is to be deposited after the completion of, remove after deposition mask edition 50, waiting to steam
The evaporation film layer matched with the pattern in deposition mask version 50 is formd on plated substrate 40.Set above vapor deposition source outlet a
It is equipped with evaporation cover 00, evaporation cover 00 and is provided with regulation cover 20, when regulation cover 20 is covered on vapor deposition source outlet a, material is deposited
Material can further up be evaporated by adjusting void region X on cover 20, meanwhile, passed through by void region X deposition material
Shuai You centers gradually increase to edge, so, can to directly by vapor deposition source export a on substrate 40 to be deposited everywhere
The speed of deposition film forming is adjusted compensation so that the uniformity of the evaporation film layer formed on substrate 40 to be deposited is carried
Rise, so as to improve the display effect of the display panel of making.
In the above-mentioned description explanation to evaporation cover and vapor deposition source, for including above-mentioned evaporation cover and vapor deposition source
Structure and operation principle, the working condition of evaporation coating device are described in detail, and here is omitted.
The another aspect of the embodiment of the present invention is there is provided a kind of evaporation coating method, applied to above-mentioned evaporation coating device, such as Figure 11 institutes
Show, including, S101, heating evaporation crucible 30 make the deposition material in evaporation crucible 30 by thermal evaporation.S102, control support shaft
10 rotate, to cause hood for protecting rider 60 and/or regulation cover 20 are mobile under the drive of support shaft 10 to be covered in vapor deposition source outlet a.
It should be noted that the evaporation coating method of the embodiment of the present invention, for step S101 and step S102 sequencing
Do not limit, can first carry out carrying out step S102 after step S101 again, can also first carry out step S102, then be walked again
Rapid S101, moreover, step S102 can need progress one or many according to technique.In addition, when the structure of evaporation coating device is only
Connect hood for protecting rider 60 the first pole 12 can circumferentially rotating along main shaft 11, be deposited original state when, hood for protecting rider 60 and regulation
Cover is respectively positioned on vapor deposition source outlet a correspondence top, when starting to carry out film layer evaporation to substrate 40 to be deposited, carries out step
S102, causes hood for protecting rider 60 to export a, the regulation cover of the second pole 13 connection away from vapor deposition source by rotating the first pole 12
20 are always positioned at vapor deposition source outlet a correspondence top, without moving operation to it.
For example, when carrying out step S101 in the ban, heating evaporation crucible 30 first, make deposition material in evaporation crucible 30 by
Thermal evaporation, the deposition material of gasification evaporates and exports a by vapor deposition source and outwards evaporates upwards, if now hood for protecting rider 60 is covered in steaming
Plating source exports a, then deposition material is blocked in evaporation crucible 30, by substrate 40 to be deposited and is being covered in substrate to be deposited
When deposition mask version 50 on 40 is arranged on predetermined evaporation position, step S102 is carried out, control support shaft 10 is rotated, and is made original
The hood for protecting rider 60 for being covered in vapor deposition source outlet a is remote, and regulation cover 20 is turned to above vapor deposition source outlet a, now by steaming
Plating material passes through after the adjustment effect for adjusting cover 20 to depositing to form evaporation film layer on substrate 40 to be deposited.When to base to be deposited
After the completion of film layer evaporation on plate 40, step 102 is carried out again, and control support shaft 10 is rotated, and makes regulation cover 20 away from vapor deposition source
A is exported, and hood for protecting rider 60 is covered in vapor deposition source outlet a, to stop the evaporation to substrate 40 to be deposited.
Further, support shaft 10 includes main shaft 11 and is connected in the axis c of main shaft 11 vertical plane with main shaft 11
The first pole 12 and the second pole 13 connect, the side of hood for protecting rider 60 is connected by the first pole 12 with main shaft 11, regulation cover
20 side is connected by the second pole 13 with main shaft 11, as shown in figure 12, and control support shaft 11, which is rotated, to be included：S201, control
Make the first circumferentially rotating around main shaft 11 of pole 12.Or, as shown in figure 13, control support shaft 11, which is rotated, to be included：S201 ＇, point
The first pole 12 and the second circumferentially rotating around main shaft 11 of pole 13 are not controlled.
When in evaporation coating device the first pole 12 can be around the circumferentially rotating of main shaft 11 in the case of, as shown in figure 12, control branch
Axle 11 is supportted to rotate as S201, the first circumferentially rotating around main shaft 11 of pole 12 of control.So, it can make by the second pole
The regulation cover 20 of 13 connections is always positioned above vapor deposition source outlet a, then by the first circumferentially rotating around main shaft 11 of pole 12,
Control hood for protecting rider 60 blocks or exports a away from vapor deposition source.When hood for protecting rider 60 blocks vapor deposition source outlet a, deposition material is blocked
Outwards evaporation, when hood for protecting rider 60 exports a away from vapor deposition source, the regulation evaporation material of regulation cover 20 above a is exported positioned at vapor deposition source
Expect the speed evaporated everywhere on substrate 40 to be deposited.
When in evaporation coating device the second pole 13 also can be around the circumferentially rotating of main shaft 11 in the case of, as shown in figure 13, control
Support shaft 11 rotates as S201 ＇, controls the first pole 12 and the second circumferentially rotating around main shaft 11 of pole 13 respectively.Such one
Come, the hood for protecting rider 60 connected by the first pole 12 and the regulation cover 20 connected by the second pole 13 can be made in original state
When outwards evaporate, it is necessary to block vapor deposition source outlet a or regulation and export a by vapor deposition source positioned at the circumferential optional position of main shaft 11
During the evaporation rate of deposition material, correspondence the first pole 12 of control or the second circumferentially rotating around main shaft 11 of pole 13 will hide
Block cover 60 or regulation cover 20 are moved to above vapor deposition source outlet a.
Further, the first pole 12 and the second pole 13 are fixedly connected with main shaft 11, and main shaft 11 is rotatable, and first
The pole 13 of pole 12 and second is not in same vertical plane, as shown in figure 14, and control support shaft 11, which is rotated, to be included：S301, control
Main shaft 11 processed is rotated around its axis c.
In the case that main shaft 11 rotates and drives the first pole 12 being fixedly connected on main shaft 11 and the second pole 13, such as
Shown in Figure 14, control support shaft 11 to rotate and rotated for S301, control main shaft 11 around its axis c.The orthographic projection of first pole 12 with
Angle between the orthographic projection of second pole 13 is arranged between 30 ° -120 °, so, it is necessary to block vapor deposition source outlet a or
When adjusting the evaporation rate by the vapor deposition source outlet a deposition materials outwards evaporated, control main shaft 11 is rotated around its axis c to be made just to hide
Block cover 60 or regulation cover 20 are moved to above vapor deposition source outlet a.
The foregoing is only a specific embodiment of the invention, but protection scope of the present invention is not limited thereto, any
Those familiar with the art the invention discloses technical scope in, change or replacement can be readily occurred in, should all be contained
Cover within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. one kind evaporation cover, it is characterised in that including：
Support shaft；
Regulation cover, the regulation cover side is arranged in the support shaft, is included void region on the regulation cover, is evaporated shape
The deposition material transmitance that the deposition material of state can pass through on the void region, the regulation cover gradually increases from center to edge
Greatly；
Wherein, the support shaft is rotatable, to drive the regulation cover is mobile to be covered in vapor deposition source outlet.
2. evaporation cover according to claim 1, it is characterised in that the regulation cover is the cover plate for including multiple through holes,
Ratio on the cover plate shared by unit area inner via hole area gradually increases from center to edge；
Wherein, the multiple through-hole aperture is identical, and on the cover plate unit area inner via hole distribution density from center to side
Edge gradually increases；Or, distribution density of the multiple through hole on the cover plate in unit area is identical, and the multiple logical
The aperture in hole gradually increases from center to edge.
3. evaporation cover according to claim 1 or 2, it is characterised in that also including hood for protecting rider, the hood for protecting rider side is set
In the support shaft, the support shaft is rotatable, to drive the hood for protecting rider movement to be covered in vapor deposition source outlet.
4. evaporation cover according to claim 3, it is characterised in that the support shaft includes main shaft and in the spindle shaft
The first pole and the second pole being connected in the vertical plane of line with the main shaft, the side of the hood for protecting rider pass through described the
One pole is connected with the main shaft, and the side of the regulation cover is connected by second pole with the main shaft.
5. evaporation cover according to claim 4, it is characterised in that first pole can turn around the circumference of the main shaft
It is dynamic.
6. evaporation cover according to claim 5, it is characterised in that first pole and second pole can be around institutes
State circumferentially rotating for main shaft.
7. it is according to claim 4 evaporation cover, it is characterised in that first pole and second pole with it is described
Main shaft is fixedly connected, and the main shaft can be rotatable around its axis；
Angle is 30 ° -120 ° between the orthographic projection of first pole and second pole.
8. a kind of vapor deposition source, it is characterised in that including the evaporation cover as described in claim any one of 1-7, in addition to evaporation earthenware
Vapor deposition source outlet is provided with crucible, the evaporation crucible, the evaporation cover is rotatable and causes hood for protecting rider and/or regulation cover covering
In vapor deposition source outlet.
9. a kind of evaporation coating device, it is characterised in that including the vapor deposition source described in claim 8, in addition to controller, the control
Device is connected with the support shaft, controls the rotation of the support shaft,.
10. a kind of evaporation coating method, applied to the evaporation coating device described in claim 9, it is characterised in that including,
Heating evaporation crucible, makes the deposition material in the evaporation crucible by thermal evaporation；
Control support shaft to rotate, evaporation is covered in cause hood for protecting rider and/or adjust movement under the drive for covering on the support shaft
Source is exported；
Wherein, support shaft includes main shaft and first be connected in the vertical plane of the main-shaft axis with the main shaft
Bar and the second pole, the side of hood for protecting rider are connected by first pole with the main shaft, and the side of regulation cover passes through institute
State the second pole with the main shaft to be connected, the control support shaft, which is rotated, to be included：
The first pole circumferentially rotating around the main shaft is controlled, or, first pole and described second are controlled respectively
Pole circumferentially rotates around the main shaft；
First pole and second pole are fixedly connected with the main shaft, and the main shaft is rotatable, and described first
Angle is 30 ° -120 ° between the orthographic projection of pole and second pole, and the control support shaft, which is rotated, to be included：
Control the main shaft rotatable around its axis.
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| CN201710212406.XA CN106978588B (en) | 2017-03-31 | 2017-03-31 | A kind of vapor deposition cover, evaporation source, evaporation coating device and evaporation coating method |
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| CN201710212406.XA CN106978588B (en) | 2017-03-31 | 2017-03-31 | A kind of vapor deposition cover, evaporation source, evaporation coating device and evaporation coating method |
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| CN107190236A (en) * | 2017-07-27 | 2017-09-22 | 京东方科技集团股份有限公司 | Crucible, evaporation coating device and evaporation coating method |
| CN107686969A (en) * | 2017-08-22 | 2018-02-13 | 武汉华星光电半导体显示技术有限公司 | A kind of evaporation source |
| CN109023260A (en) * | 2018-10-09 | 2018-12-18 | 京东方科技集团股份有限公司 | Evaporation source, evaporation coating device |
| CN109920931A (en) * | 2019-03-04 | 2019-06-21 | 华为技术有限公司 | Display terminal, mask assembly, deposition system and its control method |
| CN110257777A (en) * | 2019-07-30 | 2019-09-20 | 云谷（固安）科技有限公司 | Vapor deposition cover and evaporated device |
| CN110551981A (en) * | 2018-06-01 | 2019-12-10 | 潍坊华光光电子有限公司 | Correction device and correction method for evaporation |
| CN112981314A (en) * | 2021-02-03 | 2021-06-18 | 武汉华星光电半导体显示技术有限公司 | Evaporation plating equipment |
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