CN106978588B - A kind of vapor deposition cover, evaporation source, evaporation coating device and evaporation coating method - Google Patents
A kind of vapor deposition cover, evaporation source, evaporation coating device and evaporation coating method Download PDFInfo
- Publication number
- CN106978588B CN106978588B CN201710212406.XA CN201710212406A CN106978588B CN 106978588 B CN106978588 B CN 106978588B CN 201710212406 A CN201710212406 A CN 201710212406A CN 106978588 B CN106978588 B CN 106978588B
- Authority
- CN
- China
- Prior art keywords
- cover
- strut
- evaporation
- vapor deposition
- main shaft
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The embodiment of the present invention provides a kind of vapor deposition cover, evaporation source, evaporation coating device and evaporation coating method, it is related to vacuum vapor plating field, is able to solve existing evaporation source during vapor deposition to the non-uniform problem of vapor deposition thicknesses of layers being deposited at the different location of region on substrate to be deposited.It include: support shaft.Cover is adjusted, cover side is adjusted and is arranged in support shaft, adjusting includes hollowed out area on cover, and the evaporation material of evaporating state can pass through hollowed out area, and the evaporation material transmitance adjusted on cover is gradually increased from center to edge.Wherein, support shaft is rotatable, to drive adjusting cover is mobile to be covered in evaporation source outlet.Pass through rotation support shaft, make the adjusting cover shift position being fixed in support shaft by side, so that evaporation source outlet can be covered in by adjusting cover, to be adjusted to from evaporation rate of the evaporation material of evaporation source outlet evaporation on substrate to be deposited at each position.
Description
Technical field
The present invention relates to vacuum vapor plating field more particularly to a kind of vapor deposition cover, evaporation source, evaporation coating device and vapor deposition sides
Method.
Background technique
Vacuum vapor plating refers in vacuum environment, after substance heating evaporation to be filmed or distillation, makes it in low temperature
Workpiece or substrate surface condensation or deposition, with the technique for forming coating.Substance to be filmed vapor deposition crucible inside heating evaporation or
After distillation, rises and issued by the evaporation apertures above vapor deposition crucible, substrate to be deposited at the uniform velocity passes through the position in evaporation apertures exit
It sets, the substance to be filmed evaporated gradually cools down after leaving the heating after crucible is deposited, and the speed for evaporating movement is gradually lowered,
Finally deposit to form film layer on the surface of substrate to be deposited.
The evaporation source of evaporation coating device is divided according to the setting quantity of evaporation apertures and arrangement mode, can be divided into a vapor deposition
Source, line evaporation source and face evaporation source.Point evaporation source is an only evaporation apertures above vapor deposition crucible, and film-forming region is with the steaming
A smaller range centered on hair engaging aperture, is usually applied to the evaporation film-forming to the lesser film layer of size.Line evaporation source refers to
Vapor deposition crucible above linearly arrange multiple evaporation apertures, in the case where substrate to be deposited is static, by line evaporation source to
The region that film layer is formed on vapor deposition substrate is also the shape of straight line.Face evaporation source refers to above vapor deposition crucible in whole face
It arranges multiple evaporation apertures, so that the region for forming film layer is whole face corresponding with entire evaporation apertures region.
For the small generation line of small-medium size organic display device, generallys use an evaporation source and be deposited, small-medium size
Substrate to be deposited at the uniform velocity rotates closer with range points evaporation source compared at distant positions with equilibrium distance point evaporation source during vapor deposition
The difference of evaporation rate at position improves the vapor deposition membrane uniformity on substrate to be deposited at variant position.But so only
The membrane uniformity on substrate to be deposited in same circumferential area everywhere can be balanced, for the vapor deposition between other different locations
The difference of rate can not balanced adjustment, there are still film thickness uniformity is poor between different circumferential areas on substrate to be deposited
Problem.
Summary of the invention
The embodiment of the present invention provides a kind of vapor deposition cover, evaporation source, evaporation coating device and evaporation coating method, is able to solve existing point
Evaporation source is during vapor deposition to the non-uniform problem of vapor deposition thicknesses of layers being deposited at the different location of region on substrate to be deposited.
In order to achieve the above objectives, the embodiment of the present invention adopts the following technical scheme that
The one side of the embodiment of the present invention provides a kind of vapor deposition cover, comprising: support shaft.Cover is adjusted, the setting of cover side is adjusted
In support shaft, adjusting includes hollowed out area on cover, and the evaporation material of evaporating state can pass through hollowed out area, is adjusted on cover
Evaporation material transmitance is gradually increased from center to edge.Wherein, support shaft is rotatable, to drive adjusting cover movement to be covered in steaming
The outlet of plating source.
Further, adjusting cover is the cover board for including multiple through-holes, on cover board shared by unit area inner via hole area
Ratio is gradually increased from center to edge.Wherein, multiple through-hole apertures are identical, and on cover board unit area inner via hole distribution it is close
Degree is gradually increased from center to edge；Alternatively, distribution density of multiple through-holes on the cover board in unit area is identical, and multiple logical
The aperture in hole is gradually increased from center to edge.
Further, the vapor deposition cover of the embodiment of the present invention further includes hood for protecting rider, and hood for protecting rider side is arranged in support shaft, branch
Supportting axis can be rotated, to drive hood for protecting rider is mobile to be covered in evaporation source outlet.
Preferably, support shaft includes main shaft and the first strut being connected in the vertical plane of main-shaft axis with main shaft
It is connected by the first strut with main shaft with the side of the second strut, hood for protecting rider, the side for adjusting cover passes through the second strut and master
Axis is connected.
Further, the first strut can circumferentially rotating around main shaft.
Further, the second strut can circumferentially rotating around main shaft.
Preferably, the first strut and the second strut are fixedly connected with main shaft, and main shaft can be rotatable around its axis, the first strut
Orthographic projection and the second strut orthographic projection between angle be 30 ° -120 °.
The another aspect of the embodiment of the present invention provides a kind of evaporation source, the vapor deposition cover including any of the above-described, further includes steaming
Crucible is plated, is deposited on crucible and is provided with evaporation source outlet, vapor deposition cover can be rotated and make hood for protecting rider and/or adjust to cover to be placed on steaming
The outlet of plating source.
The embodiment of the present invention in another aspect, provide a kind of evaporation coating device, further include control including above-mentioned evaporation source
Device, controller and support axis connection, control the rotation of support shaft.
The another aspect of the embodiment of the present invention, provides a kind of evaporation coating method, applied to above-mentioned evaporation coating device, including, add
Hot evaporation crucible makes the evaporation material being deposited in crucible by thermal evaporation；Support shaft rotation is controlled, so that hood for protecting rider and/or tune
It saves movement under the drive for covering on support shaft and is covered in evaporation source outlet.Wherein, support shaft includes main shaft and in main-shaft axis
The side of the first strut and the second strut being connected in vertical plane with main shaft, hood for protecting rider is connected by the first strut with main shaft
It connects, the side for adjusting cover is connected by the second strut with main shaft, and control support shaft rotation includes: the first strut of control around main shaft
Circumferentially rotate, alternatively, controlling the first strut and the second strut circumferentially rotating around main shaft respectively.When the first strut and second
Bar is fixedly connected with main shaft, and main shaft is rotatable, and angle is 30 ° -120 ° between the first strut and the orthographic projection of the second strut,
Control support shaft rotation includes: that control main shaft is rotatable around its axis.
The embodiment of the present invention provides a kind of vapor deposition cover, evaporation source, evaporation coating device and evaporation coating method, comprising: support shaft.It adjusts
Cover adjusts cover side and is arranged in support shaft, and adjusting includes hollowed out area on cover, and the evaporation material of evaporating state, which can pass through, to be engraved
Empty region, the evaporation material transmitance adjusted on cover are gradually increased from center to edge.Wherein, support shaft is rotatable, to drive
The mobile evaporation source that is covered in of cover is adjusted to export.By rotation support shaft, move the adjusting cover being fixed in support shaft by side
Dynamic position so that evaporation source outlet can be covered in by adjusting cover, with to from the evaporation material of evaporation source outlet evaporation to
Evaporation rate on vapor deposition substrate at each position is adjusted.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
It obtains other drawings based on these drawings.
Fig. 1 is a kind of structural schematic diagram of vapor deposition cover provided in an embodiment of the present invention；
Fig. 2 is the top view (not including substrate and deposition mask version to be deposited) of Fig. 1；
Fig. 3 is the structural schematic diagram that a kind of vapor deposition cover provided in an embodiment of the present invention further includes hood for protecting rider；
Fig. 4 is the top view that cover is adjusted in a kind of vapor deposition cover provided in an embodiment of the present invention；
Fig. 5 is to be additionally provided with the first strut during a kind of vapor deposition provided in an embodiment of the present invention covers and the structure of the second strut is shown
It is intended to；
Fig. 6 is that first strut can be around the structural representation that main shaft circumferentially rotates in a kind of vapor deposition cover provided in an embodiment of the present invention
Figure；
Fig. 7 is that first strut and the second strut can be rotating around main shaft weeks in a kind of vapor deposition cover provided in an embodiment of the present invention
To the structural schematic diagram of rotation；
Fig. 8 is the structural schematic diagram that main shaft can be rotatable around its axis in a kind of vapor deposition cover provided in an embodiment of the present invention；
Fig. 9 a is one of the top view of Fig. 8；
Fig. 9 b is the two of the top view of Fig. 8；
Figure 10 is a kind of structural schematic diagram of evaporation source provided in an embodiment of the present invention；
Figure 11 is a kind of one of flow chart of evaporation coating method provided in an embodiment of the present invention；
Figure 12 is the two of a kind of flow chart of evaporation coating method provided in an embodiment of the present invention；
Figure 13 is the three of a kind of flow chart of evaporation coating method provided in an embodiment of the present invention；
Figure 14 is the four of a kind of flow chart of evaporation coating method provided in an embodiment of the present invention.
Appended drawing reference:
00- vapor deposition cover；01- controller；10- support shaft；11- main shaft；The first strut of 12-；The second strut of 13-；20- is adjusted
Cover；21- cover board；Crucible is deposited in 30-；40- substrate to be deposited；50- deposition mask version；60- hood for protecting rider；A- unit area；A1,
A2, A3- enumerate the first, second, third unit area；The hollowed out area X-；The outlet of a- evaporation source；B- through-hole；C- main-shaft axis；α-
Angle between first strut orthographic projection and the second strut orthographic projection；I, II, III-evaporation material is to substrate different location to be deposited
Locate the path arrows of deposition.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
The embodiment of the present invention provides a kind of vapor deposition cover, as shown in Figure 1, comprising: support shaft 10.Cover 20 is adjusted, cover 20 is adjusted
Side is arranged in support shaft 10, and adjusting includes hollowed out area X on cover 20, and the evaporation material of evaporating state can pass through vacancy section
Domain X, the evaporation material transmitance adjusted on cover 20 are gradually increased from center to edge.Wherein, support shaft 10 can be rotated, to drive
It adjusts the mobile evaporation source that is covered in of cover 20 and exports a.
It should be noted that first, as shown in Figure 1, adjusting on cover 20 at least includes a hollowed out area X, vacancy section
Domain X is located at the corresponding top of the evaporation source outlet a of vapor deposition crucible 30, and corresponding top described herein refers to hollowed out area X's
Evaporation source outlet a is included by orthographic projection, by evaporation source export after the evaporation material that evaporates of a evaporates upwards can respectively by
Corresponding position evaporates further up after penetrating on the X of hollowed out area.The evaporation material of evaporating state is as shown by the arrows in Figure 1, from
After the evaporation source outlet a of vapor deposition crucible 30 evaporates upwards, by adjusting the hollowed out area X on cover 20, it can finally pass through vapor deposition
Mask 50 forms the vapor deposition film layer with specific vapor deposition pattern on substrate 40 to be deposited.
Second, adjust evaporation rate of the cover 20 for the evaporation material evaporated of the evaporation source outlet a to vapor deposition crucible 30
It is adjusted, therefore, the evaporation material transmitance adjusted in the hollowed out area X on cover 20 everywhere is not identical.For example, such as Fig. 1 institute
Show, substrate 40 to be deposited and deposition mask version 50 are located above evaporation source outlet a, in substrate 40 to be deposited and deposition mask version 50
In the case where fixed, in unit evaporation time as shown by the arrows in Figure 1, evaporation source outlet is corresponded on substrate 40 to be deposited
Vapor deposition film layer at I position of arrow at the center a is most thick, secondly, at II position of arrow due to apart from evaporation source outlet the center a compared with
Closely, vapor deposition film layer is thicker, and since apart from evaporation source outlet a centre distance, farther out, vapor deposition film layer is relatively thin at III position of arrow, this
Sample results in the vapor deposition thicknesses of layers on substrate 40 to be deposited uneven.For being made on substrate 40 to be deposited by an evaporation source
Make for vapor deposition film layer, substrate 40 usually to be deposited and the deposition mask version 50 that face side is deposited for being covered on substrate 40 to be deposited
It is at the uniform velocity rotated during vapor deposition by driving device drive, to improve the vapor deposition film layer week made on substrate 40 to be deposited
The film thickness uniformity on side makes substrate 40 to be deposited and deposition mask version 50 with the center (point as shown in figure 1 of substrate 40 to be deposited
Shown in scribing line) it is rotation center uniform rotation, in a rotation period of substrate 40 to be deposited, in substrate 40 to be deposited
Heart position remains the evaporation rate of II position of arrow, to form thicker vapor deposition film layer, and the edge of substrate to be deposited 40
The same circumferential area of position successively passes through II position of III position of arrow and arrow in a rotation period, is capable of forming
Film layer it is relatively thin, accordingly, it is difficult to avoid, the vapor deposition film layer that evaporation material is formed in the central area of substrate 40 to be deposited is still
Than the evaporation film thickness formed in the neighboring area of substrate 40 to be deposited, substrate 40 to be deposited and deposition mask version 50 are at the uniform velocity revolved for meeting
Turn also reduce above-mentioned film thickness difference.Therefore, setting adjust cover 20 evaporation material transmitance from center to edge gradually
Increase, by the evaporation source evaporation material that evaporates of outlet a of vapor deposition crucible 30 when by adjusting the hollowed out area X on cover 20,
By adjusting the adjustment effect of 20 pairs of evaporation material transmitances of cover, reduce evaporation material in 40 central area of substrate to be deposited and
The deposition rate difference of neighboring area, so as to improve the thickness uniformity of the vapor deposition film layer on substrate 40 to be deposited.
Third, in the vapor deposition cover of the embodiment of the present invention, for adjusting cover 20 and adjusting the shape of the hollowed out area X on cover 20
Shape is not specifically limited, if can satisfy adjusting cover 20 be mounted in support shaft 10 after, vapor deposition crucible can be completely covered
Above 30 evaporation source outlet a.For example, as shown in Fig. 2, the hollowed out area X for adjusting cover 20 and adjusting on cover 20 is
Circle, the circular one side edge for adjusting cover 20 is fixed in support shaft 10, so that hollowed out area X, which is located at, is completely covered vapor deposition
Position above evaporation source outlet a (in Fig. 2 shown in circle of dotted line) of crucible 30.
4th, support shaft 10 can be rotated, and adjusting cover 20 can be with support shaft 10 under the drive that support shaft 10 rotates
The heart rotates in same level, so that when need to use, will adjust vapor deposition of 20 rotation of cover to covering vapor deposition crucible 30
Source exports at the top position a, and can rotate adjusting cover 20 when not in use far from the evaporation sources of vapor deposition crucibles 30 and export a
Top position.
The embodiment of the present invention provides a kind of vapor deposition cover, comprising: support shaft.Cover is adjusted, cover side is adjusted and is arranged in support shaft
On, adjusting includes hollowed out area on cover, and the evaporation material of evaporating state can pass through hollowed out area, adjusts the evaporation material on cover
Transmitance is gradually increased from center to edge.Wherein, support shaft is rotatable, is gone out with driving adjusting cover movement to be covered in evaporation source
Mouthful.By rotation support shaft, make the adjusting cover shift position being fixed in support shaft by side, so that adjusting cover can
It is covered in evaporation source outlet, to the evaporation from the evaporation material of evaporation source outlet evaporation on substrate to be deposited at each position
Rate is adjusted.
Further, as shown in figure 3, the vapor deposition cover of the embodiment of the present invention further includes hood for protecting rider 60,60 side of hood for protecting rider is set
It sets in support shaft 10, support shaft 10 can be rotated, to drive hood for protecting rider 60 is mobile to be covered in evaporation source outlet a.
Before film layer is deposited to substrate 40 to be deposited, or after the vapor deposition of substrate 40 to be deposited is completed, rotational support
Axis 10, as shown in figure 3, on the mobile evaporation source outlet a for being covered in vapor deposition crucible 30 of hood for protecting rider 60, to stop that crucible 30 is deposited
Interior evaporation material evaporates outward, so, when replacing substrate 40 to be deposited during vapor deposition, only needs rotation support shaft
10, on the mobile evaporation source outlet a for being covered in vapor deposition crucible 30 of hood for protecting rider 60, closing evaporation source exports a, stops vapor deposition material
Material evaporation outward, when substrate 40 to be deposited replacement completion starts vapor deposition, the mobile covering of cover 20 will be adjusted by being rotated further by support shaft 10
On the evaporation source outlet a of vapor deposition crucible 30, substrate 40 to be deposited is deposited on to the evaporation source outlet a evaporation material evaporated
On evaporation rate everywhere be adjusted.
It should be noted that hood for protecting rider 60 is usually the sheet metal (such as iron plate) of monolith, when sheet metal is covered on steaming
When plating on the evaporation source outlet a of crucible 30, evaporation material is completely enclosed, can not export a by evaporation source and evaporate outward, in addition,
It is additionally provided with latticed wire close to the side of vapor deposition crucible 30 in sheet metal, i.e., when sheet metal is covered on vapor deposition earthenware
When on the evaporation source outlet a of crucible 30, evaporates and the evaporation material for being blocked in sheet metal surface can adsorb receipts by wire
Collection reduces the evaporation material being blocked during hood for protecting rider 60 blocks evaporation source outlet a and falls and be deposited in crucible 30
Possibility.
Further, adjusting cover 20 is the cover board 21 for including the identical through-hole b in multiple apertures, unit area on cover board 21
Ratio shared by the area of A inner via hole b is gradually increased from center to edge.Wherein, as shown in figure 4, the aperture multiple through-hole b phase
Together, and on cover board 21 distribution density of unit area A inner via hole b is gradually increased from center to edge；Alternatively, multiple through-hole b exist
Distribution density on cover board 21 in unit area A is identical, and the aperture of multiple through-hole b is gradually increased from center to edge.
For example, as shown in figure 4, having the identical through-hole b in multiple apertures on the cover board 21 for adjusting cover 20, in unit area A
The density of through-hole b is the transmission rates for determining the evaporation material in unit area A, the density of unit area A inner via hole b
Bigger, the transmission rates of the evaporation material in unit area A are bigger, conversely, then transmission rates are smaller.For example, by covering
The center of plate 21 respectively includes 1,4 and 9 through-hole b into unit area A1, A2, A3 that edge arranges, so,
When adjusting on the evaporation source outlet a that cover 20 is covered in vapor deposition crucible 30, passed through by the evaporation material that evaporation source outlet a is evaporated
After adjusting cover 20, the ratio for the material that the material that central area evaporates gradually is evaporated to fringe region is 1:4:9, is passed through
Adjust cover board 21 on different location unit area A inner via hole b distribution density, it is adjustable by adjust cover 20 be deposited on to
The evaporation material being deposited on substrate 40 changes span by the evaporation rate of central area to neighboring area.
Further, it is also possible to which it is identical and multiple logical that distribution density of multiple through-hole b on cover board 21 in unit area A is arranged
The aperture of hole b is gradually increased from center to edge, so, smaller due to being located at the aperture of through-hole b of central part, is more leaned on
The aperture of the through-hole of proximal edge part is bigger, when adjusting on the evaporation source outlet a that cover 20 is covered in vapor deposition crucible 30, by being deposited
After the evaporation material that outlet a in source is evaporated is by adjusting cover 20, the material that central area evaporates is less, gradually to marginal zone
Domain, the material evaporated gradually increase, adjustable by adjusting the pore size of the through-hole b at different location on cover board 21
By adjust cover 20 be deposited on evaporation material on substrate 40 to be deposited by central area to neighboring area evaporation rate change
Change span.Or it can also be multiple by distribution density of the above-mentioned adjusting through-hole b on cover board 21 in unit area A and adjusting
Through-hole b pore size of different location on cover board 21 combines, jointly to evaporation material by central area to neighboring area
The variation span of evaporation rate is adjusted.
Preferably, identical for the aperture multiple through-hole b, and on cover board 21 unit area A inner via hole b distribution density in
The regulative mode that the heart is gradually increased to edge adjusts the distribution density of unit area A inner via hole b on cover 20 at the center of cover board 21
Position is 7:10-9:10 with the ratio range in marginal position.
So, can to evaporation source in the evaporation material on substrate 40 to be deposited, due to evaporation material to
In the central area of substrate 40 to be deposited caused by the central area that substrate 40 is deposited is different with the deposition distance of neighboring area
Compensation is adjusted than the defect of the deposition film thickness in 40 neighboring area of substrate to be deposited in depositional coating, to balance to be deposited
The thickness of central area and neighboring area depositional coating on substrate 40.If the distribution for adjusting unit area A inner via hole b on cover 20 is close
It spends the center in cover board 21 and is less than 7:10 with the ratio range in marginal position, may be compensated excessively due to adjusting, so that
The thickness that central area depositional coating is led to the problem of on substrate 40 to be deposited is less than neighboring area depositional coating thickness；If adjusting
Center of the distribution density of unit area A inner via hole b in cover board 21 is greater than with the ratio range in marginal position on cover 20
9:10, then may be weaker due to adjusting compensation ability, and after compensation is adjusted, there is also central areas on substrate 40 to be deposited
The thickness of depositional coating is greater than neighboring area depositional coating thickness.
Preferably, as shown in figure 5, support shaft 10 include main shaft 11 and in the vertical plane of 11 axis c of main shaft with master
The side of the first strut 12 and the second strut 13 that axis 11 is connected, hood for protecting rider 60 is connected by the first strut 12 with main shaft 11
It connects, the side for adjusting cover 20 is connected by the second strut 13 with main shaft 11.
So, hood for protecting rider 60 can be determined by the first strut 12 and the second strut 13 and adjust the position of cover 20,
So that hood for protecting rider 60 or adjusting cover 20 can completely be covered in vapor deposition crucible 30 when support shaft 10 turns to a certain position
Evaporation source outlet a on, avoid hood for protecting rider 60 or adjust cover 20 when being directly anchored in support shaft 10, hood for protecting rider 60 or adjust
The part that the side of cover 20 is connect with support shaft 10 is not used to the problem of covering evaporation source outlet a.
Further, as shown in fig. 6, the first strut 12 can circumferentially rotating around main shaft 11.
As shown in fig. 6, the first strut 12 and the second strut 13 can be arranged in same vertical plane, wherein first
Strut 12 and the hood for protecting rider 60 connecting with the first strut 12 are located below, and the second strut 13 and are connect with the second strut 13
It adjusts cover 20 to be located above, when without vapor deposition operation, on the evaporation source outlet a of the covering vapor deposition crucible 30 of hood for protecting rider 60, adjust
Section cover 20 is located at the vertical direction of hood for protecting rider 60, and due to the effect of blocking of hood for protecting rider 60, evaporation material can not export a from evaporation source
Evaporation outward.When needing to carry out substrate 40 to be deposited vapor deposition operation, the first circumferentially rotating around main shaft of strut 12, so that hiding
Block cover 60 exports a far from the evaporation source of vapor deposition crucible 30, and so, it is outside that evaporation material can export a by evaporation source
Evaporation, and after the evaporation rate adjusting by exporting the adjusting cover 2- above a positioned at the evaporation source of vapor deposition crucible, it is uniform to deposit
Vapor deposition film layer is formed on substrate 40 to be deposited.After the completion of film layer vapor deposition, then by making the first strut 12 around the circumferential direction of main shaft
Hood for protecting rider 60 is moved on the evaporation source outlet a of covering vapor deposition crucible 30 by rotation, adjusts cover 20 without mobile, i.e.,
The closing and opening to evaporation source outlet a can be achieved, and when opening evaporation source outlet a by adjusting 20 pairs of cover by evaporation source
Export the adjusting of evaporation rate of the evaporation material of a evaporation on substrate 40 to be deposited at each position.
Further, as shown in fig. 7, the second strut 13 can circumferentially rotating around main shaft 11.
As shown in fig. 7, the first strut 12 and the second strut 13 can circumferentially rotating rotating around main shaft 11, so,
Hood for protecting rider 60 and adjusting cover 20 are more flexible by the setting position of the first strut 12 and the second strut 13 on main shaft 11 respectively,
It can be set to the top of evaporation source outlet a simultaneously, the top for being away from evaporation source outlet a can also be all disposed within, needed
The tops that hood for protecting rider 60 or adjusting cover 20 are moved to evaporation source outlet a by corresponding strut are rotated when use.
Preferably, as shown in figure 8, the first strut 12 and the second strut 13 are fixedly connected with main shaft 11, main shaft 11 can be around
Its axis c rotation.As illustrated in fig. 9, wherein the first strut 12 and the second strut 13 be not in same vertical plane.
So, as illustrated in fig. 9, the first strut 12 and the second strut 13 are fixedly connected between main shaft 11, and the
One strut 12 and the second strut 13 be not in same vertical plane, so that the projection of hood for protecting rider 60 and adjusting cover 20 is not also overlapped.
Main shaft 11 can be rotated around its axis c, by rotating main shaft 11, hood for protecting rider 60 or adjusting cover 20 can be turned to covering vapor deposition earthenware
The top of the evaporation source outlet a of crucible 30 carries out blocking or rate adaptation to the evaporation material evaporated by evaporation source outlet a.
Preferably, angle α is 30 ° -120 ° between the orthographic projection of the first strut 12 and the orthographic projection of the second strut 13.
As illustrated in fig. 9, angle α is about 120 ° between the orthographic projection of the first strut 12 and the orthographic projection of the second strut 13.If
Angle α can then to be fixed on the first strut less than 30 ° between the orthographic projection of first strut 12 and the orthographic projection of the second strut 13
Projection is Chong Die and influence the rate that adjusting covers 20 between hood for protecting rider 60 on 12 and the adjusting cover 20 being fixed on the second strut 13
Regulating effect is not overlapped, it is necessary to extend the first strut 12 and the second strut to project between hood for protecting rider 60 and adjusting cover 20
On the other hand 13 length also improves the power consumption that main shaft 11 rotates on the one hand increase the volume of vapor deposition cover；If the first strut
Angle α is greater than 120 ° between 12 orthographic projection and the orthographic projection of the second strut 13, then increases hood for protecting rider 60 and adjust replacing for cover 20
It changes the time, and leads to the waste of evaporation material in replacement process.
Preferably, as shown in figure 9b, angle α is between the orthographic projection of the first strut 12 and the orthographic projection of the second strut 13
90°.So, on the one hand, under the premise of the length without extending the first strut 12 and the second strut 13, can guarantee to hide
Orthographic projection is not overlapped between block cover 60 and adjusting cover 20, avoids the evaporation rate regulating effect for influencing to adjust cover 20；On the other hand,
Distance is not far between hood for protecting rider 60 and adjusting cover 20, and hood for protecting rider 60 can be rapidly completed during vapor deposition and adjust between cover 20
Exchange.
The another aspect of the embodiment of the present invention provides a kind of evaporation source, as shown in Figure 10, the vapor deposition including any of the above-described
Cover 00 further includes vapor deposition crucible 30, is deposited on crucible 30 and is provided with evaporation source outlet a, and vapor deposition cover 00 can be rotated and to block
Cover 60 and/or adjusting cover 20 are covered in evaporation source outlet a.
As shown in Figure 10, evaporation material is heated to evaporation or sublimation condition in vapor deposition crucible 30, is deposited on crucible 30 and sets
It is equipped with evaporation source outlet a, the evaporation material of evaporation exports a by evaporation source and evaporates outward, and vapor deposition cover 00 can be rotated and will block
Cover 60 and/or adjusting cover 20 are covered at the position of evaporation source outlet a, are exported on a when hood for protecting rider 60 is covered in evaporation source, or
When hood for protecting rider 60 and adjusting cover 20 are located at the evaporation source outlet top a simultaneously, evaporation material is blocked and cannot export a from evaporation source
Evaporation outward；When adjusting cover 20 above evaporation source outlet a, evaporated outward in vapor deposition crucible 30 by evaporation source outlet a
Evaporation material by adjust cover 20 rate adaptation, can more uniformly on substrate 40 to be deposited formed vapor deposition film layer.
The embodiment of the present invention in another aspect, provide a kind of evaporation coating device, as shown in Figure 10, including above-mentioned evaporation source,
It further include controller 01, controller 01 is connect with support shaft 10, controls the rotation of support shaft 10.
The rotation of support shaft 10 is controlled by controller 01, when the rotation of main shaft 11 of support shaft 10, the first strut
12 and second when being fixedly connected between strut 13 and main shaft 11, and controller 01 is connect with main shaft 11, when controlling the rotation of main shaft 11
Between and rotation direction, when the main shaft 11 of support shaft 10 is fixed, the first strut 12 along main shaft 11 circumferentially rotate or the first strut 12
With the second strut 13 respectively along main shaft 11 when circumferentially rotating, controller 01 and the first strut 12 or respectively with the first strut 12
It is connected with the second strut 13, control the first strut 12 or controls the first strut 12 and the second strut 13 respectively along the week of main shaft 11
Time and direction to rotation.
When film layer is deposited on substrate 40 to be deposited using the evaporation coating device of the embodiment of the present invention, by substrate 40 to be deposited with
And the setting of deposition mask version 50 on substrate 40 to be deposited is covered on above evaporation source outlet a, a evaporation is exported by evaporation source
Evaporation material out is evaporated upwards and is deposited in deposition mask version 50, and in deposition mask version 50 at the position of hollow out, material is deposited
Material is deposited on substrate 40 to be deposited by deposition mask version 50, after the completion of to be deposited, after removing deposition mask version 50, wait steam
The vapor deposition film layer to match with the pattern in deposition mask version 50 is formd on plated substrate 40.It is set above evaporation source outlet a
It is equipped with vapor deposition and covers 00, adjusting cover 20 is provided on vapor deposition cover 00, when adjusting cover 20 is covered on evaporation source outlet a, material is deposited
Material can be evaporated further up by adjusting hollowed out area X on cover 20, meanwhile, it is penetrated by the evaporation material of hollowed out area X
Rate is gradually increased from center to edge, so, can to directly by evaporation source export a on substrate 40 to be deposited everywhere
The rate of deposition film forming is adjusted compensation, so that the uniformity of the vapor deposition film layer formed on substrate 40 to be deposited is mentioned
It rises, to improve the display effect of the display panel of production.
In the above-mentioned description explanation to vapor deposition cover and evaporation source, for including above-mentioned vapor deposition cover and evaporation source
Structure and working principle, the working condition of evaporation coating device are described in detail, and details are not described herein again.
The another aspect of the embodiment of the present invention, provides a kind of evaporation coating method, applied to above-mentioned evaporation coating device, such as Figure 11 institute
Show, including, S101, heating vapor deposition crucible 30 make the evaporation material being deposited in crucible 30 by thermal evaporation.S102, control support shaft
10 rotations, so that hood for protecting rider 60 and/or adjusting cover 20 are mobile under the drive of support shaft 10 to be covered in evaporation source outlet a.
It should be noted that the evaporation coating method of the embodiment of the present invention, for the sequencing of step S101 and step S102
Without limitation, step S102 is carried out again after can first carrying out step S101, can also first be carried out step S102, then be walked again
Rapid S101, moreover, step S102 can be one or many according to process requirement progress.In addition, when the structure of evaporation coating device is only
Connect hood for protecting rider 60 the first strut 12 can circumferentially rotating along main shaft 11, when original state be deposited, hood for protecting rider 60 and adjusting
The corresponding top that cover is respectively positioned on evaporation source outlet a carries out step when starting to carry out film layer vapor deposition to substrate 40 to be deposited
S102 makes hood for protecting rider 60 export a, the adjusting cover of the second strut 13 connection far from evaporation source by rotating the first strut 12
20 are always positioned at the corresponding top of evaporation source outlet a, without carrying out moving operation to it.
For example, in the ban carry out step S101 when, first heating vapor deposition crucible 30, make be deposited crucible 30 in evaporation material by
Thermal evaporation, the evaporation material of gasification evaporates upwards and exports a by evaporation source and evaporates outward, if hood for protecting rider 60 is covered in steaming at this time
Plating source exports a, then evaporation material is blocked in vapor deposition crucible 30, by substrate 40 to be deposited and is being covered on substrate to be deposited
Deposition mask version 50 on 40 is arranged at scheduled vapor deposition position, carries out step S102, and control support shaft 10 rotates, and makes original
The hood for protecting rider 60 for being covered in evaporation source outlet a is separate, and turns to adjusting cover 20 above evaporation source outlet a, passes through steaming at this time
It deposits after plating adjustment effect of the material by adjusting cover 20 on substrate 40 to be deposited to form vapor deposition film layer.When to base to be deposited
After the completion of film layer vapor deposition on plate 40, step 102 is carried out again, and control support shaft 10 rotates, and makes to adjust cover 20 far from evaporation source
A is exported, and hood for protecting rider 60 is made to be covered in evaporation source outlet a, to stop the vapor deposition to substrate 40 to be deposited.
Further, support shaft 10 includes main shaft 11 and is connected in the vertical plane of 11 axis c of main shaft with main shaft 11
The side of the first strut 12 and the second strut 13 connect, hood for protecting rider 60 is connected by the first strut 12 with main shaft 11, and cover is adjusted
20 side is connected by the second strut 13 with main shaft 11, and as shown in figure 12, the control rotation of support shaft 11 includes: S201, control
Make the first circumferentially rotating around main shaft 11 of strut 12.Alternatively, as shown in figure 13, the control rotation of support shaft 11 includes: S201 ', divides
The first strut 12 and the second circumferentially rotating around main shaft 11 of strut 13 are not controlled.
When in evaporation coating device the first strut 12 can be around the circumferentially rotating of main shaft 11 in the case where, as shown in figure 12, control branch
The rotation of axis 11 is supportted to be S201, control the first circumferentially rotating around main shaft 11 of strut 12.So, can make through the second strut
The adjusting cover 20 of 13 connections is always positioned above evaporation source outlet a, then passes through the first circumferentially rotating around main shaft 11 of strut 12,
Control hood for protecting rider 60 blocks or exports a far from evaporation source.When hood for protecting rider 60 blocks evaporation source outlet a, evaporation material is blocked
Evaporation outward, when hood for protecting rider 60 exports a far from evaporation source, the adjusting cover 20 above evaporation source outlet a adjusts vapor deposition material
Expect the rate evaporated everywhere on substrate 40 to be deposited.
When in evaporation coating device the second strut 13 can also be around the circumferentially rotating of main shaft 11 in the case where, as shown in figure 13, control
The rotation of support shaft 11 is S201 ', controls the first strut 12 and the second circumferentially rotating around main shaft 11 of strut 13 respectively.Such one
Come, the hood for protecting rider 60 connected by the first strut 12 and the adjusting cover 20 connected by the second strut 13 can be made in original state
When positioned at the circumferential any position of main shaft 11, need to block what evaporation source outlet a or adjust was evaporated outward by evaporation source outlet a
When the evaporation rate of evaporation material, the first strut 12 of corresponding control or the second circumferentially rotating around main shaft 11 of strut 13 will be hidden
Block cover 60 or adjusting cover 20 are moved to above evaporation source outlet a.
Further, the first strut 12 and the second strut 13 are fixedly connected with main shaft 11, and main shaft 11 can be rotated, and first
Strut 12 and the second strut 13 be not in same vertical plane, and as shown in figure 14, the control rotation of support shaft 11 includes: S301, control
Main shaft 11 processed is rotated around its axis c.
In the case that the rotation of main shaft 11 drives the first strut 12 and the second strut 13 being fixedly connected on main shaft 11, such as
Shown in Figure 14, the control rotation of support shaft 11 is S301, control main shaft 11 is rotated around its axis c.The orthographic projection of first strut 12 with
Angle between the orthographic projection of second strut 13 is arranged between 30 ° -120 °, so, need to block evaporation source outlet a or
When adjusting the evaporation rate by the evaporation source outlet a evaporation material evaporated outward, control main shaft 11 makes just to hide around its axis c rotation
Block cover 60 or adjusting cover 20 are moved to above evaporation source outlet a.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can easily think of the change or the replacement, and should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (9)
1. a kind of vapor deposition cover characterized by comprising
Support shaft；
Cover is adjusted, adjusting cover side is arranged in the support shaft, includes hollowed out area on the adjusting cover, evaporates shape
The evaporation material of state can pass through the hollowed out area, and the evaporation material transmitance adjusted on cover gradually increases from center to edge
Greatly；
Wherein, the support shaft can be rotated, to drive the adjusting cover is mobile to be covered in evaporation source outlet；
It is described to adjust cover as the cover board that includes multiple through-holes, on the cover board ratio shared by unit area inner via hole area by
Center is gradually increased to edge；
Wherein, the multiple through-hole aperture is identical, and on the cover board unit area inner via hole distribution density from center to side
Edge is gradually increased；Alternatively, distribution density of the multiple through-hole on the cover board in unit area is identical, and the multiple logical
The aperture in hole is gradually increased from center to edge.
2. vapor deposition cover according to claim 1, which is characterized in that further include hood for protecting rider, the hood for protecting rider side setting exists
In the support shaft, the support shaft be can be rotated, to drive the hood for protecting rider is mobile to be covered in evaporation source outlet.
3. vapor deposition according to claim 2 cover, which is characterized in that the support shaft includes main shaft and in the spindle shaft
The first strut and the second strut being connected in the vertical plane of line with the main shaft, the side of the hood for protecting rider pass through described the
One strut is connected with the main shaft, and the side for adjusting cover is connected by second strut with the main shaft.
4. vapor deposition cover according to claim 3, which is characterized in that first strut can turn around the circumferential direction of the main shaft
It is dynamic.
5. vapor deposition cover according to claim 4, which is characterized in that first strut and second strut can be around institutes
State circumferentially rotating for main shaft.
6. vapor deposition according to claim 3 cover, which is characterized in that first strut and second strut with it is described
Main shaft is fixedly connected, and the main shaft can be rotatable around its axis；
Angle is 30 ° -120 ° between first strut and the orthographic projection of second strut.
7. a kind of evaporation source, which is characterized in that covered including vapor deposition as claimed in any one of claims 1 to 6, further include vapor deposition earthenware
Crucible, is provided with evaporation source outlet on the vapor deposition crucible, and the vapor deposition cover can be rotated and make hood for protecting rider and/or adjust cover to cover
It is exported in the evaporation source.
8. a kind of evaporation coating device, which is characterized in that it further include controller including evaporation source as claimed in claim 7, the control
Device and the support axis connection, control the rotation of the support shaft.
9. a kind of evaporation coating method is applied to evaporation coating device according to any one of claims 8, which is characterized in that including,
Heating vapor deposition crucible makes the evaporation material in the vapor deposition crucible by thermal evaporation；
Support shaft rotation is controlled, so that hood for protecting rider and/or adjusting, which cover on movement under the drive of the support shaft, is covered in vapor deposition
Source outlet；
Wherein, support shaft includes main shaft and be connected in the vertical plane of the main-shaft axis with the main shaft first
The side of bar and the second strut, hood for protecting rider is connected by first strut with the main shaft, and the side for adjusting cover passes through institute
It states the second strut to be connected with the main shaft, the control support shaft rotation includes:
The first strut circumferentially rotating around the main shaft is controlled, alternatively, controlling first strut and described second respectively
Strut is circumferentially rotated around the main shaft；
First strut and second strut are fixedly connected with the main shaft, and the main shaft can be rotated, and described first
Angle is 30 ° -120 ° between strut and the orthographic projection of second strut, and the control support shaft rotation includes:
It is rotatable around its axis to control the main shaft.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710212406.XA CN106978588B (en) | 2017-03-31 | 2017-03-31 | A kind of vapor deposition cover, evaporation source, evaporation coating device and evaporation coating method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710212406.XA CN106978588B (en) | 2017-03-31 | 2017-03-31 | A kind of vapor deposition cover, evaporation source, evaporation coating device and evaporation coating method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN106978588A CN106978588A (en) | 2017-07-25 |
| CN106978588B true CN106978588B (en) | 2019-09-20 |
Family
ID=59343633
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710212406.XA Active CN106978588B (en) | 2017-03-31 | 2017-03-31 | A kind of vapor deposition cover, evaporation source, evaporation coating device and evaporation coating method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106978588B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107190236B (en) * | 2017-07-27 | 2019-06-25 | 京东方科技集团股份有限公司 | Crucible, evaporation coating device and evaporation coating method |
| CN107686969A (en) * | 2017-08-22 | 2018-02-13 | 武汉华星光电半导体显示技术有限公司 | A kind of evaporation source |
| CN110551981B (en) * | 2018-06-01 | 2021-10-01 | 潍坊华光光电子有限公司 | Correction device and correction method for evaporation |
| CN109023260A (en) * | 2018-10-09 | 2018-12-18 | 京东方科技集团股份有限公司 | Evaporation source, evaporation coating device |
| CN109920931B (en) * | 2019-03-04 | 2022-08-26 | 荣耀终端有限公司 | Display terminal, mask assembly, evaporation system and control method thereof |
| CN110257777B (en) * | 2019-07-30 | 2021-11-02 | 云谷（固安）科技有限公司 | Evaporation cover and evaporation equipment |
| CN112981314B (en) * | 2021-02-03 | 2022-07-12 | 武汉华星光电半导体显示技术有限公司 | Evaporation plating equipment |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1138205A (en) * | 1997-07-17 | 1999-02-12 | Matsushita Electron Corp | Apparatus for production of light quantity correction filter and production of color image receiving tube using light quantity correction filter produced by the apparatus |
| WO2003093529A2 (en) * | 2002-05-03 | 2003-11-13 | Ecole Polytechnique Federale De Lausanne (Epfl) | Large area deposition in high vacuum with high thickness uniformity |
| JP2007200735A (en) * | 2006-01-27 | 2007-08-09 | Canon Inc | Evaporate method and device of organic compound |
| CN101445910A (en) * | 2008-12-17 | 2009-06-03 | 中国科学院上海光学精密机械研究所 | Vacuum coating machine baffle plate with adjustable deposition rate |
| CN102002680A (en) * | 2009-08-31 | 2011-04-06 | 鸿富锦精密工业（深圳）有限公司 | Bearing plate and ejection fixture with bearing plate |
| CN205576264U (en) * | 2016-05-13 | 2016-09-14 | 合肥鑫晟光电科技有限公司 | Evaporation material homogeneity adjusting device and vacuum deposition device |
-
2017
- 2017-03-31 CN CN201710212406.XA patent/CN106978588B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1138205A (en) * | 1997-07-17 | 1999-02-12 | Matsushita Electron Corp | Apparatus for production of light quantity correction filter and production of color image receiving tube using light quantity correction filter produced by the apparatus |
| WO2003093529A2 (en) * | 2002-05-03 | 2003-11-13 | Ecole Polytechnique Federale De Lausanne (Epfl) | Large area deposition in high vacuum with high thickness uniformity |
| JP2007200735A (en) * | 2006-01-27 | 2007-08-09 | Canon Inc | Evaporate method and device of organic compound |
| CN101445910A (en) * | 2008-12-17 | 2009-06-03 | 中国科学院上海光学精密机械研究所 | Vacuum coating machine baffle plate with adjustable deposition rate |
| CN102002680A (en) * | 2009-08-31 | 2011-04-06 | 鸿富锦精密工业（深圳）有限公司 | Bearing plate and ejection fixture with bearing plate |
| CN205576264U (en) * | 2016-05-13 | 2016-09-14 | 合肥鑫晟光电科技有限公司 | Evaporation material homogeneity adjusting device and vacuum deposition device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN106978588A (en) | 2017-07-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106978588B (en) | A kind of vapor deposition cover, evaporation source, evaporation coating device and evaporation coating method | |
| US7311939B2 (en) | Vacuum coating unit and a method for the differentiated coating of spectacle lenses | |
| US5906857A (en) | Apparatus, system and method for controlling emission parameters attending vaporized in a HV environment | |
| CN205329148U (en) | Vacuum evaporation source device and vacuum evaporation equipment | |
| WO2015062311A1 (en) | Vacuum deposition apparatus | |
| KR101536257B1 (en) | Lateral-flow deposition apparatus and method of depositing film by using the apparatus | |
| CN105887020B (en) | Multi-vaporizing-source coating apparatus and its film plating process | |
| WO2005111259A1 (en) | Organic material evaporation source and organic vapor deposition device | |
| JP4535908B2 (en) | Vapor deposition equipment | |
| CN100478488C (en) | Transitional optical thin-film coating device and its smelting tool ring | |
| CN110257777A (en) | Vapor deposition cover and evaporated device | |
| JP5028584B2 (en) | Vacuum deposition apparatus for liquid crystal alignment film and film forming method thereof | |
| CN206467283U (en) | One kind is evaporated in vacuo source device and vacuum evaporation equipment | |
| CN107142456B (en) | A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column | |
| US6082296A (en) | Thin film deposition chamber | |
| JPS60181264A (en) | Method and device for forming film | |
| CN111394698A (en) | Method for uniformly coating film | |
| CN108165934B (en) | Evaporation plating equipment | |
| TWI391507B (en) | Apparatus for vacuum deposition | |
| JP2008056952A (en) | Apparatus and method for oblique vapor deposition, and manufacturing method of liquid crystal apparatus | |
| CN216404520U (en) | Vacuum evaporation coating equipment | |
| JPH03264667A (en) | Carrousel-type sputtering device | |
| KR20060126265A (en) | Chemical vapor deposition apparatus for multiple substrates | |
| KR20050094305A (en) | Oled evaporation system using shutter rotation for continuous deposition process | |
| CN202865319U (en) | Film coating device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |