CN107142456B - A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column - Google Patents
A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column Download PDFInfo
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- CN107142456B CN107142456B CN201710247265.5A CN201710247265A CN107142456B CN 107142456 B CN107142456 B CN 107142456B CN 201710247265 A CN201710247265 A CN 201710247265A CN 107142456 B CN107142456 B CN 107142456B
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- 230000009977 dual effect Effects 0.000 title claims abstract description 12
- 238000005477 sputtering target Methods 0.000 claims abstract description 32
- 239000000758 substrate Substances 0.000 claims description 25
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 15
- 238000004544 sputter deposition Methods 0.000 claims description 12
- 238000009434 installation Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 2
- 239000002245 particle Substances 0.000 claims 1
- 238000002360 preparation method Methods 0.000 abstract description 17
- 239000010409 thin film Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 32
- 239000007888 film coating Substances 0.000 description 7
- 238000009501 film coating Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 230000001276 controlling effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to a kind of symmetrical large scale high uniformity line style magnetic control target filming equipments of dual function column.The equipment places the rotation axis for clamping convex cylindrical mirror at circular vacuum chamber center, the rotation annulus for placing spill cylindrical mirror is installed in periphery, the line style magnetic controlled sputtering target rifle of vertical display is placed between rotation annulus and rotation axis, lays rotatable pneumatic baffle before target rifle.By changing target rifle direction and adjusting radial position of the target rifle in vacuum chamber, target rifle can be made to be respectively directed to rotation annulus and rotation axis, and be coated with to the spill cylindrical mirror being mounted on rotation annulus or the convex cylindrical mirror being mounted in rotation axis.The control to thin film preparation process is completed by the switch and rotation annulus of the pneumatic baffle before change target rifle and the slewing rate of rotation axis.
Description
Technical field
The present invention relates to a kind of symmetrical large scale high uniformity line style magnetic control target filming equipments of dual function column, belong to nanoscale
Optical thin film Preparation equipment field.
Background technique
As China's astronomy explores being continuously increased for demand, the development of nested type glancing incidence focusing X-ray astronomical telescope
It has brought into schedule.The eyeglass of nested type glancing incidence focusing X-ray astronomical telescope has the characteristics that large scale, column symmetry, and
Existing coating machine mostly uses greatly rotation to add the planetary motion mode of revolution, the eyeglass tool that such motor pattern prepares it
There is the symmetrical characteristic of circle, is not able to satisfy us and looks in the distance now for the nested type glancing incidence focusing X-ray astronomy for preparing column symmetry
The requirement of the large scale cylindrical mirror eyeglass of mirror, simultaneously because the limitation of motor pattern, so that the sample size that can disposably place
Less, the structure that production efficiency is not able to satisfy nested type largely prepares demand for eyeglass.It therefore, being capable of stable life in batches
Produce, and with column symmetry property large-scale magnetron sputtering coater be designed in order to develop nested type glancing incidence focus X penetrate
The premise of line astronomical telescope.Simultaneously during telescope disk preparation, due to right in the molding technique of heat-bending glass
In the film preparation demand of convex cylindrical mirror, make it possible to meet simultaneously the film preparation need for cylinder substrate concave and convex surface
It asks, also becomes the design requirement of this magnetic control film coating equipment.Under lens structure specific in this way and specific production requirement,
A kind of symmetrical large scale high uniformity coating machine of dual function column using line style magnetic controlled sputtering target rifle comes into being.
Summary of the invention
For the demand for meeting the preparation to convex and spill cylinder eyeglass simultaneously and stably producing, mesh of the invention
Be a kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column is provided, which not only can be to column
The x-ray film that the concave surface of face mirror carries out high uniformity is coated with, while can also be carried out high uniformity X to the convex surface of cylindrical mirror and be penetrated
Line film is coated with, and meets the demand of mass high precision.Present apparatus primary structure, which includes: three, to be rotated
Change the vertical placement line style magnetic controlled sputtering target rifle of sputter direction, pneumatic baffle is installed before target rifle；One can control rotation
Speed for installing the rotation axis of convex cylinder substrate, the work of clamping plated film substrate can be installed as desired in rotation axis
Dress；One can control the rotation annulus for being used to install spill cylinder substrate of velocity of rotation, and rotation annulus is equipped with sample panel,
The aid to plated film substrate is completed using sample panel.Target rifle is mounted between shaft and change, by adjusting target rifle sputter direction,
Completion the sample on different sample stages is coated with, using rotation axis and rotate annulus rotating manner and with target rifle phase
To the difference of position, the film preparation to cylindrical mirror concave and convex surface is completed.
The technical solution adopted by the present invention is that:
A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column, by vacuum cavity, rotation annulus,
Specimen holder, magnetic controlled sputtering target rifle, pneumatic baffle and target rifle pedestal composition, in which: rotation circle is provided in columnar vacuum cavity
Ring support column, the rotation arch brace column are made of outer layer column sleeve and internal layer rotating block, and outer layer column sleeve is fixed on vacuum cavity
Bottom, internal layer rotating block top are equipped with the rotation annulus of adjustable rotational speed, and the bottom of internal layer rotating block connects stepper motor, rotation
Specimen holder is laid on annulus, for installing sample；The rotation axis is fixed on vacuum cavity bottom, and rotation axis passes through rotation circle
Ring, and rotation axis, rotation annulus and vacuum cavity are coaxially arranged；Sample is installed in rotation axis；The rotation axis passes through magnetic current
Body axis is connected to the motor, and can control rotational velocity；Bottom is set there are three guide rail in vacuum cavity, and guide rail is equipped with target rifle pedestal,
It is spaced 90 degree two-by-two, that is, is respectively arranged in 3 o'clock, 6 o'clock and 9 o'clock direction of vacuum cavity；Magnetic controlled sputtering target rifle position is in target
On rifle pedestal, three magnetic controlled sputtering target rifles pass through the hollow parts of rotation annulus, and different location is equipped with screw hole on guide rail,
When three target rifle pedestals are set to different screw hole sites, adjustable magnetic controlled sputtering target rifle and rotation annulus or rotation axis
Relative position, pneumatic baffle connector is fixed on target rifle pedestal, and pneumatic baffle is pneumatic by the connection of pneumatic baffle connector
Shutter completes the switch control of pneumatic baffle, and pneumatic baffle is located at the inside of magnetic controlled sputtering target rifle, passes through transformation pneumatic baffle
Whether survey radion of switch, control magnetic controlled sputtering target rifle deposits in substrate.
In the present invention, the magnetic controlled sputtering target rifle be line style magnetic controlled sputtering target rifle, the target rifle sputter face be 38mm ×
508mm, can 180 ° of reversed installations, realize the plating to sample on sample in the rotation axis at vacuum cavity center and peripherally pivoted annulus
System.Magnetic controlled sputtering target rifle is mounted on guide assembly by target rifle pedestal simultaneously, can be sliding along the radial direction of vacuum cavity
It is dynamic, to adjust the different location needed for magnetic controlled sputtering target rifle in different mode；When magnetic controlled sputtering target rifle direction rotation annulus
When, specimen holder and target surface distance are 60mm ~ 160mm；When magnetic controlled sputtering target rifle is towards rotation axis, sample having a size of Ф 60mm,
Sample surfaces and target surface distance are 65mm ~ 160mm.
In the present invention, the revolving speed adjustable extent of the rotation annulus is 0.01 ~ 1 rev/min, and it is 0.01 that revolving speed, which controls precision,
Rev/min.
In the present invention, the size of specimen holder on annulus is rotated are as follows: high 600mm, wide 245mm, specimen holder are 12, the sample
The mountable spill cylindrical mirror substrate of product frame, the size of the spill cylindrical mirror substrate are as follows: curvature diameter is 100mm ~ 260mm, female
Line length is within 230mm, and arc angle is 0 ° ~ 90 °.
In the present invention, the revolving speed adjustable extent of the rotation axis is 0.1 ~ 100 rev/min, and rotation axis places convex cylinder
Mirror substrate, the convex cylindrical mirror basal diameter are 60mm ~ 220mm, long 50mm ~ 45mm.
The present invention forms cylindrical inner wall towards on the inside of rotation change by changing the sputter direction of target rifle in rotation annulus
Symmetrical sputtering mode, by changing the slewing rate of sample inswept target rifle sputtering zone in rotation change, regulation film thickness is complete
The concave surface of pairs of cylindrical mirror carries out film preparation；The rotation axis of the adjustable rotational velocity of placement at the center of vacuum cavity, and
Film substrate is placed in rotation axis, changes the sputter direction of magnetic controlled sputtering target rifle, and towards rotation axis, it is symmetrical to form cylindrical outer wall
Sputtering mode regulates and controls the film thickness being coated with, complete paired column by regulating and controlling the switch time of magnetic controlled sputtering target rifle anterior shutter baffle
The film preparation on face mirror convex surface.Main be mounted between rotation annulus and rotation axis by switching can convert the magnetic control of direction and splash
It shoots at the target the sputter direction of rifle, completes to utilize column symmetry form to the function switch of base coated film in rotation axis or rotation annulus
Difference completes the conversion of different film coating modes.The present apparatus due to rotation annulus and turns association's axis different positions during rotation simultaneously
The substrate set has a column symmetry characteristic, thus on rotation annulus and rotation axis different location mounting substrate may have it is identical
Film preparation ability, thus can stablize batch prepares film eyeglass, greatly improves production efficiency.
The beneficial effects of the present invention are:
The present invention realizes dual-use, changes the symmetrical plated film mode of traditional circle, realizes to column symmetry sample
The thin-film-coating on column convex surface and column concave surface, and the application range of filming equipment is greatly improved, and be coated with rotation annulus
On sample when can by pneumatic baffle and rotation annulus cooperation complete to rotation annulus on different location specimen holder loading
The independent control of product, improves preparation efficiency.
Detailed description of the invention
Fig. 1 is vacuum chamber top view and Machine entity photo.
Fig. 1 outwardly, is directed toward the film coating mode schematic diagram of rotation annulus for target rifle.Target rifle is formed towards change inside at this time
The symmetrical sputtering mode of cylindrical inner wall, by changing the slewing rate of substrate inswept target rifle sputtering zone in change, regulation film is thick
Degree is completed to carry out film preparation to the concave surface of cylindrical mirror.
Fig. 2 inwardly, is directed toward the film coating mode schematic diagram of rotation axis for target rifle.Target rifle forms cylinder towards rotation axis at this time
The symmetrical sputtering mode of outer wall regulates and controls the film thickness being coated with, completion pair by regulating and controlling the switch time of target rifle anterior shutter baffle
The film preparation on cylindrical mirror convex surface.
Fig. 3 is coating machine internal structure pictorial diagram 1.
Fig. 4 is coating machine internal structure pictorial diagram 2.
Fig. 5 is the structural diagrams of rotation axis of the invention.
Figure label: 1 is vacuum cavity, and 2 be rotation annulus, and 3 be specimen holder, and 4 be rotation axis, and 5 be pneumatic baffle, and 6 are
Magnetic controlled sputtering target rifle, 7 be target rifle pedestal, and 8 be pneumatic plate washer connector, and 9 be pneumatic shutter, and 10 be to rotate arch brace column, 11
It is motor, 13 Magnetofluid shafts for stepper motor, 12.
Specific embodiment
The present invention is further illustrated below by embodiment combination attached drawing.
Embodiment 1:
Rotation axis 4 is laid at the center of vacuum cavity 1, rotation axis 4 is connected with Magnetofluid shaft 13, and Magnetofluid shaft 13 is worn
It crosses 1 bottom of vacuum cavity to be connected with motor 12, completes the transmission process that motor 12 drives rotation axis 4.In rotation axis 4 along vacuum chamber
90 degree of 1 radial direction interval of body is mounted with 3 magnetic controlled sputtering target rifles 6 respectively, and magnetic controlled sputtering target rifle 6 is by target rifle pedestal 7 and very
1 bottom of cavity body is connected, and using the different location of adjustment target rifle pedestal 7, adjustable magnetic controlled sputtering target rifle 6 is in vacuum cavity 1
It is interior along the location of radial direction.Rotary pneumatic baffle connector 8, pneumatic baffle are cased in 7 side wall of target rifle pedestal
Connector 8 is connect in vacuum cavity 1 with pneumatic baffle 5, is passed through 1 bottom of vacuum cavity and is connect with pneumatic shutter 9, is completed pneumatic
Control of the shutter 9 to pneumatic baffle 5.It is cased with rotation annulus 2 in the outermost of vacuum cavity 1, rotates and lays sample on annulus 2
Frame 3, rotation annulus 2 are supported by three equally distributed rotary rotation arch brace columns 10, rotate arch brace column
10 pass through 1 bottom of vacuum cavity is connected with stepper motor 11, completes the rotation control of 11 pairs of stepper motor rotation annulus 2.
When preparing convex cylindrical mirror, target rifle sputter direction turns to rotation axis, installs convex cylinder substrate, root on the rotating shaft
It sets to obtain suitable range according to size of foundation base adjustment target rifle position.After plated film starts, rotation axis is with given pace rotation.Plated film starting
Stage, target rifle front apron are in close state, and plated film starts the pneumatic baffle alternation switch before rear target rifle, when using control plated film
Between complete to coating film thickness control, be finally completed and spill cylindrical mirror be coated with.
The citing of convex cylindrical mirror film preparation case study on implementation: the convex cylinder curvature radius being coated with is 170mm, length
For 210mm, plating made membrane is nanoscale Pt/Cr duplicature.It the use of range is 100mm, base vacuum is being better than 3 × 10-4Pa, to
Sputter gas Ar gas, charge 3mTorr are filled in vacuum cavity, sputter material is Pt and Cr, and target rifle sputtering power selects respectively
It is taken as WPt=400W, WCr=400W, shaft autorotation speed are 30 revs/min.Pass through the alternating of pneumatic baffle before control Pt and Cr target
Switch completes Pt/Cr bilayer film preparation certain thickness to convex cylindrical mirror.
When preparing spill cylindrical mirror, target rifle sputter direction turns to rotation annulus, installs on the specimen holder of rotation annulus recessed
Shape cylinder substrate.Plated film initial phase, target rifle front apron are in close state, and rotation annulus drives concave column face substrate rotation,
When the substrate for needing to be coated with inswept target rifle sputtering zone, the fast door guard plate of target rifle is opened, in substrate inswept target rifle sputtering zone
Thin-film-coating is carried out to substrate in the process, the regulation to coating film thickness is completed by the control to rotation annulus slewing rate, most
It completes to be coated with convex cylindrical mirror eventually.Using the switch of shutter and the change of gradient of change slewing rate, can independently regulate and control
Substrate is independently coated on different location specimen holder in change, so that equipment can be simultaneously to different location in change
The substrate of installation carries out the preparation of same or different structural membrane, produces in batches to eyeglass.
The citing of spill cylindrical mirror film preparation case study on implementation: the spill cylinder curvature radius being coated with is 167mm, length
For 150mm, plating made membrane is nanoscale W/Si multilayer film.It the use of range is 100mm, base vacuum is being better than 3 × 10-4Pa, to
Sputter gas Ar gas, charge 3mTorr are filled in vacuum cavity, sputter material is W and Si, and target rifle sputtering power selects respectively
It is taken as WW=200W, WSi=400W, when sample goes to working target rifle sputter area, pneumatic baffle is opened, rotation annulus rotation speed
Rate, which is changed into, presets rate, controls thin-film-coating thickness；After sample produces working region, pneumatic baffle is closed, rotation circle
Ring rate rises to 1 rev/min, until sample enters next working target rifle sputtering zone, repeats pneumatic baffle and opens rotation annulus
Speed-change process completes being coated with for W/Si multilayer film.
Claims (5)
1. a kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column, by vacuum cavity, rotation annulus, sample
Product frame, magnetic controlled sputtering target rifle, pneumatic baffle and target rifle pedestal composition, it is characterised in that: be provided with and turn in columnar vacuum cavity
Dynamic arch brace column, the rotation arch brace column are made of outer layer column sleeve and internal layer rotating block, and outer layer column sleeve is fixed on vacuum
Cavity bottom, internal layer rotating block top are equipped with the rotation annulus of adjustable rotational speed, and the bottom of internal layer rotating block connects stepper motor,
Specimen holder is laid on rotation annulus, for installing sample；Rotation axis is fixed on vacuum cavity bottom, and rotation axis passes through rotation circle
Ring, and rotation axis, rotation annulus and vacuum cavity are coaxially arranged；Sample is installed in rotation axis；The rotation axis passes through magnetic current
Body axis is connected to the motor, and can control rotational velocity；Bottom is set there are three guide rail in vacuum cavity, and guide rail is equipped with target rifle pedestal,
Each target rifle pedestal is respectively arranged in 3 o'clock, 6 o'clock and 9 o'clock direction of vacuum cavity；Magnetic controlled sputtering target rifle position is in target rifle base
On seat, three magnetic controlled sputtering target rifles pass through the hollow parts of rotation annulus, and different location is equipped with screw hole on guide rail, when three
When a target rifle pedestal is set to different screw hole sites, the phase of adjustable magnetic controlled sputtering target rifle and rotation annulus or rotation axis
To position, pneumatic baffle connector is fixed on target rifle pedestal, and pneumatic baffle connects pneumatic shutter by pneumatic baffle connector,
The switch control of pneumatic baffle is completed, pneumatic baffle is located at the inside of magnetic controlled sputtering target rifle, by converting the switch of pneumatic baffle,
Whether the sputtering particle of control magnetic controlled sputtering target rifle deposits in substrate.
2. the symmetrical large scale high uniformity line style magnetic control target filming equipment of a kind of dual function column according to claim 1,
Be characterized in that the magnetic controlled sputtering target rifle is line style magnetic controlled sputtering target rifle, which is 38mm × 508mm, can 180 ° it is anti-
To installation, realizes and sample on sample in the rotation axis at vacuum cavity center and peripherally pivoted annulus is coated with, while magnetic control splashes
Rifle of shooting at the target is mounted on guide assembly by target rifle pedestal, can be slided along the radial direction of vacuum cavity, to adjust
Different location needed for magnetic controlled sputtering target rifle in different mode；When magnetic controlled sputtering target rifle direction rotation annulus, specimen holder and target
Identity distance is from for 60mm ~ 160mm；When magnetic controlled sputtering target rifle is towards rotation axis, sample is having a size of Ф 60mm, sample surfaces and target surface
Distance is 65mm ~ 160mm.
3. the symmetrical large scale high uniformity line style magnetic control target filming equipment of a kind of dual function column according to claim 1,
The revolving speed adjustable extent for being characterized in that the rotation annulus is 0.01 ~ 1 rev/min, and it is 0.01 rev/min that revolving speed, which controls precision,.
4. the symmetrical large scale high uniformity line style magnetic control target filming equipment of a kind of dual function column according to claim 1,
It is characterized in that the size of specimen holder on rotation annulus are as follows: high 600mm, wide 245mm, specimen holder are 12, the specimen holder installation
Spill cylindrical mirror substrate, the size of the spill cylindrical mirror substrate are as follows: curvature diameter is 100mm ~ 260mm, and bus length is
Within 230mm, arc angle is 0 ° ~ 90 °.
5. the symmetrical large scale high uniformity line style magnetic control target filming equipment of a kind of dual function column according to claim 1,
The revolving speed adjustable extent for being characterized in that the rotation axis is 0.1 ~ 100 rev/min, and rotation axis places convex cylindrical mirror substrate, institute
Stating convex cylindrical mirror basal diameter is 60mm ~ 220mm, long 50mm ~ 45mm.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710247265.5A CN107142456B (en) | 2017-04-17 | 2017-04-17 | A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710247265.5A CN107142456B (en) | 2017-04-17 | 2017-04-17 | A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column |
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| Publication Number | Publication Date |
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| CN107142456A CN107142456A (en) | 2017-09-08 |
| CN107142456B true CN107142456B (en) | 2019-03-29 |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108203808A (en) * | 2017-10-25 | 2018-06-26 | 同济大学 | Improve the method and device of X ray reflection mirror uniformity of film and production efficiency |
| CN107871802B (en) * | 2017-10-31 | 2019-10-29 | 京东方科技集团股份有限公司 | The preparation method and magnetic control sputtering device of carrier blocking layers |
| CN109881170A (en) * | 2019-03-07 | 2019-06-14 | 厦门阿匹斯智能制造系统有限公司 | A kind of magnetic-controlled sputtering coating equipment and its film plating process |
Citations (3)
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|---|---|---|---|---|
| CN101638774A (en) * | 2009-08-21 | 2010-02-03 | 上海工程技术大学 | Rotatable sample position of magnetron sputtering device |
| CN104846345A (en) * | 2015-06-05 | 2015-08-19 | 深圳市正和忠信股份有限公司 | Magnetron sputtering depositing deep space grey film equipment and using method thereof |
| CN204714891U (en) * | 2015-06-13 | 2015-10-21 | 深圳市正和忠信股份有限公司 | Ionic fluid fast deposition diamond like carbon film equipment |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3689465B2 (en) * | 1995-11-30 | 2005-08-31 | 日本ピストンリング株式会社 | Method and apparatus for forming physical vapor deposition film of vane for rotary compressor |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101638774A (en) * | 2009-08-21 | 2010-02-03 | 上海工程技术大学 | Rotatable sample position of magnetron sputtering device |
| CN104846345A (en) * | 2015-06-05 | 2015-08-19 | 深圳市正和忠信股份有限公司 | Magnetron sputtering depositing deep space grey film equipment and using method thereof |
| CN204714891U (en) * | 2015-06-13 | 2015-10-21 | 深圳市正和忠信股份有限公司 | Ionic fluid fast deposition diamond like carbon film equipment |
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Effective date of registration: 20231227 Address after: 313100 Unit B, Building 2, National University Science Park, No. 669 High speed Railway, the Taihu Lake Street, Changxing County, Huzhou City, Zhejiang Province Patentee after: Zhejiang Tongyue Optical Technology Co.,Ltd. Address before: 200092 Siping Road 1239, Shanghai, Yangpu District Patentee before: TONGJI University |