CN107142456A - A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column - Google Patents
A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column Download PDFInfo
- Publication number
- CN107142456A CN107142456A CN201710247265.5A CN201710247265A CN107142456A CN 107142456 A CN107142456 A CN 107142456A CN 201710247265 A CN201710247265 A CN 201710247265A CN 107142456 A CN107142456 A CN 107142456A
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- China
- Prior art keywords
- annulus
- target rifle
- rotary shaft
- rifle
- controlled sputtering
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Links
- 230000009977 dual effect Effects 0.000 title claims abstract description 12
- 238000005477 sputtering target Methods 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims description 25
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 13
- 238000009434 installation Methods 0.000 claims description 3
- 239000000203 mixture Substances 0.000 claims description 2
- 238000002360 preparation method Methods 0.000 abstract description 17
- 239000010409 thin film Substances 0.000 abstract description 2
- 239000010408 film Substances 0.000 description 33
- 238000004544 sputter deposition Methods 0.000 description 11
- 239000007888 film coating Substances 0.000 description 7
- 238000009501 film coating Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 230000001276 controlling effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000001755 magnetron sputter deposition Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention relates to a kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column.The equipment lays the rotary shaft for clamping convex cylindrical mirror at circular vacuum chamber center, the rotation annulus for laying spill cylindrical mirror is installed in periphery, rotatable pneumatic baffle is laid before the line style magnetic controlled sputtering target rifle of placement vertical display between annulus and rotary shaft, target rifle is rotated.By changing the radial position of target rifle direction and adjustment target rifle in vacuum chamber, target rifle can be made to be respectively directed to rotate annulus and rotary shaft, and be coated with to the convex cylindrical mirror either installed installed in the spill cylindrical mirror rotated on annulus on the rotating shaft.By changing the switch of the pneumatic baffle before target rifle and rotating control of the slewing rate completion of annulus and rotary shaft to thin film preparation process.
Description
Technical field
The present invention relates to a kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column, belong to nanoscale
Optical thin film Preparation equipment field.
Background technology
With being continuously increased for the astronomical exploration demand of China, the development of nested type glancing incidence focusing X-ray astronomical telescope
Bring into schedule.The features such as eyeglass of nested type glancing incidence focusing X-ray astronomical telescope has large scale, column symmetry, and
Existing coating machine adds the planetary motion pattern of revolution using rotation mostly, and such motor pattern causes the eyeglass tool that it is prepared
There is the symmetrical characteristic of circle, it is impossible to meet us and looked in the distance now for the nested type glancing incidence focusing X-ray astronomy for preparing column symmetry
The requirement of the large scale cylindrical mirror eyeglass of mirror, simultaneously because the limitation of motor pattern so that the sample size that can disposably lay
Less, its production efficiency can not meet the structure of nested type for a large amount of preparation demands of eyeglass.Therefore, it is possible to stablize life in batches
Production, and with column symmetry property large-scale magnetron sputtering coater be designed in order to develop nested type glancing incidence focus on X penetrate
The premise of line astronomical telescope.Simultaneously during prepared by telescope disk, due to right in the technique that heat-bending glass is molded
In the film preparation demand of convex cylindrical mirror, enabling while meeting the film preparation need for cylinder substrate concave and convex surface
Ask, also become the design requirement of this magnetic control film coating equipment.Under so specific lens structure and specific production requirement,
A kind of symmetrical large scale high uniformity coating machine of dual function column of use line style magnetic controlled sputtering target rifle arises at the historic moment.
The content of the invention
In order to meet the preparation to convex and spill cylinder eyeglass and the demand stably produced, mesh of the invention simultaneously
Be provide a kind of dual function column symmetrical large scale high uniformity line style magnetic control target filming equipment, the device not only can be to post
The x-ray film that the concave surface of face mirror carries out high uniformity is coated with, and is penetrated while high uniformity X can also be carried out to the convex surface of cylindrical mirror
Line film is coated with, and meets the demand of mass made with high precision.Present apparatus primary structure includes：Three can rotate
Pneumatic baffle is installed before changing the vertical placement line style magnetic controlled sputtering target rifle of sputter direction, target rifle；One can control rotation
In the rotary shaft for being used to install convex cylinder substrate of speed, rotary shaft the work of clamping plated film substrate can be installed as desired
Dress；One can control the rotation annulus for being used to install spill cylinder substrate of velocity of rotation, rotate annulus and be provided with sample panel,
The blessing to plated film substrate is completed using sample panel.Target rifle is arranged between rotating shaft and change, by adjusting target rifle sputter direction,
Completion the sample on different sample stages is coated with, using rotary shaft and rotation annulus rotating manner and with target rifle phase
To the difference of position, the film preparation to cylindrical mirror concave and convex surface is completed.
The technical solution adopted by the present invention is：
A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column, by vacuum cavity, rotates annulus, sample
Frame, magnetic controlled sputtering target rifle, pneumatic baffle and target rifle pedestal composition, wherein：Rotation annulus branch is provided with the vacuum cavity of column
Dagger, the rotation annulus support column is made up of outer layer column sleeve and internal layer moving block, and outer layer column sleeve is fixed on vacuum cavity bottom,
The rotation annulus of adjustable rotational speed is provided with the top of internal layer moving block, the bottom connection stepper motor of internal layer moving block rotates annulus
On lay specimen holder, for installing sample；The rotary shaft is fixed on vacuum cavity bottom, and rotary shaft, which is passed through, rotates annulus,
And rotary shaft, rotation annulus and vacuum cavity are coaxially arranged；Sample is installed in rotary shaft；The rotary shaft passes through Magnetofluid shaft
It is connected with motor, can control rotational velocity；Vacuum cavity inner bottom part is provided with target rifle pedestal provided with three guide rails, guide rail, two-by-two
90 degree of interval, that is, be respectively arranged in 3 o'clock, 6 o'clock and 9 o'clock direction of vacuum cavity；Magnetic controlled sputtering target rifle position is in target rifle base
On seat, three magnetic controlled sputtering target rifles pass through diverse location on the hollow parts for rotating annulus, guide rail to be provided with screw hole, when three
When individual target rifle pedestal is arranged at different screw hole sites, magnetic controlled sputtering target rifle can be adjusted with rotating the phase of annulus or rotary shaft
To position, pneumatic baffle connector is fixed on target rifle pedestal, and pneumatic baffle connects pneumatic shutter by pneumatic baffle connector,
The switch control of pneumatic baffle is completed, pneumatic baffle is located at the inner side of magnetic controlled sputtering target rifle, by converting the switch of pneumatic baffle,
Control whether survey radion of magnetic controlled sputtering target rifle is deposited in substrate.
In the present invention, the magnetic controlled sputtering target rifle be line style magnetic controlled sputtering target rifle, the target rifle sputter face be 38mm ×
508mm, can 180 ° of reversely installations, plating of the realization to sample on sample in the rotary shaft at vacuum cavity center and peripherally pivoted annulus
System.Magnetic controlled sputtering target rifle is arranged on guide assembly by target rifle pedestal simultaneously, can be slided along the radial direction of vacuum cavity
It is dynamic, to adjust the diverse location in different mode needed for magnetic controlled sputtering target rifle；When magnetic controlled sputtering target rifle direction rotates annulus
When, specimen holder is 60mm ~ 160mm with target surface distance；When magnetic controlled sputtering target rifle is towards rotary shaft, sample size is Ф 60mm,
Sample surfaces are 65mm ~ 160mm with target surface distance.
In the present invention, the rotating speed adjustable extent for rotating annulus is 0.01 ~ 1 rev/min, and rotating speed control accuracy is 0.01
Rev/min.
In the present invention, the size for rotating annulus loading product frame is：High 600mm, wide 245mm, specimen holder are 12, the sample
Product frame can install spill cylindrical mirror substrate, and the size of the spill cylindrical mirror substrate is：Curvature diameter is 100mm ~ 260mm, female
Line length is that within 230mm, arc angle is 0 ° ~ 90 °.
In the present invention, the rotating speed adjustable extent of the rotary shaft is 0.1 ~ 100 rev/min, and rotary shaft places convex cylinder
Mirror substrate, the convex cylindrical mirror basal diameter is 60mm ~ 220mm, long 50mm ~ 45mm.
The present invention rotates the sputter direction of target rifle in annulus by changing, and towards rotating on the inside of change, forms cylindrical inner wall
Symmetrical sputtering mode, the slewing rate of the inswept target rifle sputtering zone of sample in change is rotated by changing, and regulates and controls film thickness, complete
The concave surface of paired cylindrical mirror carries out film preparation；In the rotary shaft of the adjustable rotational velocity of center placement of vacuum cavity, and
Film substrate is laid in rotary shaft, changes the sputter direction of magnetic controlled sputtering target rifle, towards rotary shaft, cylindrical outer wall is formed symmetrical
Sputtering mode, by regulating and controlling the switch time of magnetic controlled sputtering target rifle anterior shutter baffle plate, regulates and controls the film thickness being coated with, complete paired column
The film preparation on face mirror convex surface.The main magnetic control that can convert direction between rotation annulus and rotary shaft by switching splashes
Shoot at the target the sputter direction of rifle, complete to rotary shaft or rotate the function of base coated film on annulus and switch, utilize column symmetry form
Difference, completes the conversion of different film coating modes.The present apparatus is due to rotating annulus and turning association's axle different positions in rotation process simultaneously
The substrate put has a column symmetry characteristic, thus on annulus and rotary shaft is rotated diverse location mounting substrate can be provided with it is identical
Film preparation ability, thus can stablize batch prepare film eyeglass, greatly improve production efficiency.
The beneficial effects of the present invention are：
The present invention realizes dual-use, changes the symmetrical plated film mode of traditional circle, realizes convex to the post of column symmetry sample
Face and the thin-film-coating of post concave surface, and the application of filming equipment is greatly improved, and rotated being coated with annulus
By pneumatic baffle and the cooperation completion of annulus can be rotated to sample on diverse location specimen holder on rotation annulus during sample
Independent control, improves preparation efficiency.
Brief description of the drawings
Fig. 1 is vacuum chamber top view and Machine entity photo.
Fig. 1 outwardly, points to the film coating mode schematic diagram for rotating annulus for target rifle.Now target rifle is formed towards change inner side
The symmetrical sputtering mode of cylindrical inner wall, by changing the slewing rate of the inswept target rifle sputtering zone of substrate in change, regulation and control film is thick
Degree, completes to carry out film preparation to the concave surface of cylindrical mirror.
Fig. 2 inwardly, points to the film coating mode schematic diagram of rotary shaft for target rifle.Now target rifle forms cylinder towards rotary shaft
The symmetrical sputtering mode of outer wall, by regulating and controlling the switch time of target rifle anterior shutter baffle plate, regulates and controls the film thickness being coated with, completion pair
The film preparation on cylindrical mirror convex surface.
Fig. 3 is coating machine internal structure pictorial diagram 1.
Fig. 4 is coating machine internal structure pictorial diagram 2.
Fig. 5 is the structural diagrams of the rotary shaft of the present invention.
Label in figure：1 is vacuum cavity, and 2 is rotate annulus, and 3 be specimen holder, and 4 be rotary shaft, and 5 be pneumatic baffle, and 6 are
Magnetic controlled sputtering target rifle, 7 be target rifle pedestal, and 8 be pneumatic plate washer connector, and 9 be pneumatic shutter, and 10 be rotation annulus support column, 11
It is motor, 13 Magnetofluid shafts for stepper motor, 12.
Embodiment
The present invention is further illustrated below by embodiment combination accompanying drawing.
Embodiment 1：
Rotary shaft 4 is laid in the center of vacuum cavity 1, rotary shaft 4 is connected with Magnetofluid shaft 13, Magnetofluid shaft 13 is through very
The bottom of cavity body 1 is connected with motor 12, completes the transmission process that motor 12 drives rotary shaft 4.In rotary shaft 4 along vacuum cavity 1
90 degree of radial direction interval is mounted with 3 magnetic controlled sputtering target rifles 6 respectively, and magnetic controlled sputtering target rifle 6 passes through target rifle pedestal 7 and vacuum chamber
The bottom of body 1 is connected, and using the diverse location for adjusting target rifle pedestal 7, can adjust the edge in vacuum cavity 1 of magnetic controlled sputtering target rifle 6
The location of radial direction.There are rotary pneumatic baffle connector 8, pneumatic baffle connection in the sidewall sheath of target rifle pedestal 7
Part 8 is connected in vacuum cavity 1 with pneumatic baffle 5, is connected through the bottom of vacuum cavity 1 with pneumatic shutter 9, completes pneumatic shutter
The control of 9 pairs of pneumatic baffles 5.It is cased with rotating annulus 2 in the outermost of vacuum cavity 1, rotates and lay specimen holder 3 on annulus 2,
Rotate annulus 2 to support by three equally distributed rotary rotation annulus support columns 10, rotate annulus support column 10 and wear
Cross the bottom of vacuum cavity 1 with stepper motor 11 to be connected, complete the rotation control of 11 pairs of rotation annulus 2 of stepper motor.
When preparing convex cylindrical mirror, target rifle sputter direction turns to rotary shaft, and convex cylinder substrate, root are installed on the rotating shaft
Put according to size of foundation base adjustment target rifle position and obtain suitable range.After plated film starts, rotary shaft is with given pace rotation.Plated film is originated
Stage, target rifle front apron is closed, and plated film starts the pneumatic baffle alternation switch before rear target rifle, during using controlling plated film
Between complete, to coating film thickness control, to be finally completed and be coated with spill cylindrical mirror.
Convex cylindrical mirror film preparation case study on implementation is illustrated：The convex cylinder curvature radius being coated with is 170mm, length
For 210mm, plating made membrane is nanoscale Pt/Cr duplicatures.The use of range is 100mm, base vacuum is better than 3 × 10-4Pa, to
Sputter gas Ar gas is filled with vacuum cavity, charge is 3mTorr, and sputter material is Pt and Cr, and target rifle sputtering power is selected respectively
It is taken as WPt=400W, WCr=400W, rotating shaft autorotation speed is 30 revs/min.By the alternating for controlling pneumatic baffle before Pt and Cr targets
Switch completes the double-deck film preparations of Pt/Cr certain thickness to convex cylindrical mirror.
When preparing spill cylindrical mirror, target rifle sputter direction, which is turned to, rotates annulus, installs recessed on the specimen holder for rotating annulus
Shape cylinder substrate.Plated film initial period, target rifle front apron is closed, and is rotated ring belt and is moved spill cylinder substrate rotation,
When the substrate for needing to be coated with inswept target rifle sputtering zone, the fast door guard plate of target rifle is opened, in the inswept target rifle sputtering zone of substrate
During thin-film-coating is carried out to substrate, by completing regulation and control to coating film thickness to the control for rotating annulus slewing rate, most
Complete to be coated with convex cylindrical mirror eventually.Using the switch and the graded of change slewing rate of shutter, can independently it regulate and control
Substrate is independently coated with diverse location specimen holder in change, so that equipment can be simultaneously to diverse location in change
The substrate of installation, carries out identical or different structure film preparation, eyeglass is produced in batches.
Spill cylindrical mirror film preparation case study on implementation is illustrated：The spill cylinder curvature radius being coated with is 167mm, length
For 150mm, plating made membrane is nanoscale W/Si multilayer films.The use of range is 100mm, base vacuum is better than 3 × 10-4Pa, to
Sputter gas Ar gas is filled with vacuum cavity, charge is 3mTorr, and sputter material is W and Si, and target rifle sputtering power is selected respectively
It is taken as WW=200W, WSi=400W, when sample goes to working target rifle sputter area, pneumatic baffle is opened, and is rotated annulus and is rotated speed
Rate, which is changed into, presets speed, controls thin-film-coating thickness；Sample is produced behind working region, and pneumatic baffle is closed, slewing circle
Ring speed rises to 1 rev/min, until sample enters next working target rifle sputtering zone, repeats pneumatic baffle and opens rotation annulus
Speed-change process, completes being coated with for W/Si multilayer films.
Claims (6)
1. a kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column, by vacuum cavity, rotates annulus, sample
Product frame, magnetic controlled sputtering target rifle, pneumatic baffle and target rifle pedestal composition, it is characterised in that：It is provided with and turns in the vacuum cavity of column
Dynamic arch brace post, the rotation annulus support column is made up of outer layer column sleeve and internal layer moving block, and outer layer column sleeve is fixed on vacuum
The rotation annulus of adjustable rotational speed is provided with the top of cavity bottom, internal layer moving block, the bottom of internal layer moving block connects stepper motor,
Rotate and lay specimen holder on annulus, for installing sample；The rotary shaft is fixed on vacuum cavity bottom, and rotary shaft, which is passed through, to be turned
Dynamic annulus, and rotary shaft, rotation annulus and vacuum cavity are coaxially arranged；Sample is installed in rotary shaft；The rotary shaft passes through
Magnetofluid shaft is connected with motor, can control rotational velocity；Vacuum cavity inner bottom part is provided with target rifle base provided with three guide rails, guide rail
Seat, is spaced 90 degree, that is, is respectively arranged in 3 o'clock, 6 o'clock and 9 o'clock direction of vacuum cavity two-by-two；Magnetic controlled sputtering target rifle position in
On target rifle pedestal, three magnetic controlled sputtering target rifles pass through diverse location on the hollow parts for rotating annulus, guide rail to be provided with screw
Hole, when three target rifle pedestals are arranged at different screw hole sites, can adjust magnetic controlled sputtering target rifle with rotating annulus or turning
The relative position of moving axis, pneumatic baffle connector is fixed on target rifle pedestal, and pneumatic baffle is connected by pneumatic baffle connector
Pneumatic shutter, completes the switch control of pneumatic baffle, pneumatic baffle is located at the inner side of magnetic controlled sputtering target rifle, by converting pneumatic gear
The switch of plate, controls whether survey radion of magnetic controlled sputtering target rifle is deposited in substrate.
2. the symmetrical large scale high uniformity line style magnetic control target filming equipment of a kind of dual function column according to claim 1, its
It is line style magnetic controlled sputtering target rifle to be characterised by the magnetic controlled sputtering target rifle, and the target rifle sputter face is 38mm × 508mm, can 180 ° it is anti-
To installation, realize and sample on sample in the rotary shaft at vacuum cavity center and peripherally pivoted annulus is coated with.
3. simultaneously magnetic controlled sputtering target rifle by target rifle pedestal be arranged on guide assembly on, can along vacuum cavity radial direction
Slide, to adjust the diverse location in different mode needed for magnetic controlled sputtering target rifle；When magnetic controlled sputtering target rifle is towards slewing circle
During ring, specimen holder is 60mm ~ 160mm with target surface distance；When magnetic controlled sputtering target rifle is towards rotary shaft, sample size is Ф
60mm, sample surfaces are 65mm ~ 160mm with target surface distance.
4. the symmetrical large scale high uniformity line style magnetic control target filming equipment of a kind of dual function column according to claim 1, its
The rotating speed adjustable extent for being characterised by the rotation annulus is 0.01 ~ 1 rev/min, and rotating speed control accuracy is 0.01 rev/min.
5. the symmetrical large scale high uniformity line style magnetic control target filming equipment of a kind of dual function column according to claim 1, its
It is characterised by that the size for rotating annulus loading product frame is：High 600mm, wide 245mm, specimen holder are 12, and the specimen holder can pacify
Spill cylindrical mirror substrate is filled, the size of the spill cylindrical mirror substrate is：Curvature diameter is 100mm ~ 260mm, and bus length is
Within 230mm, arc angle is 0 ° ~ 90 °.
6. the symmetrical large scale high uniformity line style magnetic control target filming equipment of a kind of dual function column according to claim 1, its
The rotating speed adjustable extent for being characterised by the rotary shaft is 0.1 ~ 100 rev/min, and rotary shaft places convex cylindrical mirror substrate, institute
Convex cylindrical mirror basal diameter is stated for 60mm ~ 220mm, long 50mm ~ 45mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710247265.5A CN107142456B (en) | 2017-04-17 | 2017-04-17 | A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710247265.5A CN107142456B (en) | 2017-04-17 | 2017-04-17 | A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107142456A true CN107142456A (en) | 2017-09-08 |
| CN107142456B CN107142456B (en) | 2019-03-29 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710247265.5A Active CN107142456B (en) | 2017-04-17 | 2017-04-17 | A kind of symmetrical large scale high uniformity line style magnetic control target filming equipment of dual function column |
Country Status (1)
| Country | Link |
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| CN (1) | CN107142456B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107871802A (en) * | 2017-10-31 | 2018-04-03 | 京东方科技集团股份有限公司 | The preparation method and magnetic control sputtering device of carrier blocking layers |
| CN108203808A (en) * | 2017-10-25 | 2018-06-26 | 同济大学 | Improve the method and device of X ray reflection mirror uniformity of film and production efficiency |
| CN109881170A (en) * | 2019-03-07 | 2019-06-14 | 厦门阿匹斯智能制造系统有限公司 | A kind of magnetic-controlled sputtering coating equipment and its film plating process |
| CN116288209A (en) * | 2023-03-23 | 2023-06-23 | 浙江景昇薄膜科技有限公司 | Vacuum coating equipment and coating method |
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| JPH09157844A (en) * | 1995-11-30 | 1997-06-17 | Nippon Piston Ring Co Ltd | Formation of physical vapor deposition film on vane for rotary compressor and device therefor |
| CN101638774A (en) * | 2009-08-21 | 2010-02-03 | 上海工程技术大学 | Rotatable sample position of magnetron sputtering device |
| CN104846345A (en) * | 2015-06-05 | 2015-08-19 | 深圳市正和忠信股份有限公司 | Magnetron sputtering depositing deep space grey film equipment and using method thereof |
| CN204714891U (en) * | 2015-06-13 | 2015-10-21 | 深圳市正和忠信股份有限公司 | Ionic fluid fast deposition diamond like carbon film equipment |
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2017
- 2017-04-17 CN CN201710247265.5A patent/CN107142456B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH09157844A (en) * | 1995-11-30 | 1997-06-17 | Nippon Piston Ring Co Ltd | Formation of physical vapor deposition film on vane for rotary compressor and device therefor |
| CN101638774A (en) * | 2009-08-21 | 2010-02-03 | 上海工程技术大学 | Rotatable sample position of magnetron sputtering device |
| CN104846345A (en) * | 2015-06-05 | 2015-08-19 | 深圳市正和忠信股份有限公司 | Magnetron sputtering depositing deep space grey film equipment and using method thereof |
| CN204714891U (en) * | 2015-06-13 | 2015-10-21 | 深圳市正和忠信股份有限公司 | Ionic fluid fast deposition diamond like carbon film equipment |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108203808A (en) * | 2017-10-25 | 2018-06-26 | 同济大学 | Improve the method and device of X ray reflection mirror uniformity of film and production efficiency |
| CN107871802A (en) * | 2017-10-31 | 2018-04-03 | 京东方科技集团股份有限公司 | The preparation method and magnetic control sputtering device of carrier blocking layers |
| CN109881170A (en) * | 2019-03-07 | 2019-06-14 | 厦门阿匹斯智能制造系统有限公司 | A kind of magnetic-controlled sputtering coating equipment and its film plating process |
| CN116288209A (en) * | 2023-03-23 | 2023-06-23 | 浙江景昇薄膜科技有限公司 | Vacuum coating equipment and coating method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107142456B (en) | 2019-03-29 |
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Effective date of registration: 20231227 Address after: 313100 Unit B, Building 2, National University Science Park, No. 669 High speed Railway, the Taihu Lake Street, Changxing County, Huzhou City, Zhejiang Province Patentee after: Zhejiang Tongyue Optical Technology Co.,Ltd. Address before: 200092 Siping Road 1239, Shanghai, Yangpu District Patentee before: TONGJI University |