CN109652780B - Control method for improving coating uniformity of special-shaped part - Google Patents
Control method for improving coating uniformity of special-shaped part Download PDFInfo
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- CN109652780B CN109652780B CN201811518316.4A CN201811518316A CN109652780B CN 109652780 B CN109652780 B CN 109652780B CN 201811518316 A CN201811518316 A CN 201811518316A CN 109652780 B CN109652780 B CN 109652780B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/54—Controlling or regulating the coating process
- C23C14/542—Controlling the film thickness or evaporation rate
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/50—Substrate holders
- C23C14/505—Substrate holders for rotation of the substrates
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Abstract
The patent provides a control method for improving the coating uniformity of a special-shaped part, and innovatively provides that a light ray simulation technology is adopted to simulate the multi-degree-of-freedom movement of the special-shaped part, so that the plated special-shaped part can perform high-precision multi-degree-of-freedom movement, the movement parameters such as the swing angle, the rotation rate, the revolution period and the like of the special-shaped part are adjusted in real time, the relative sputtering deposition time of the special-shaped part is adjusted, the uniformity of the special-shaped part is improved, and. Finally, the film thickness of the product is ensured to be less than 80nm, and the film uniformity is ensured to be less than 3%. The problem that the uniformity of the coating film of the special-shaped part is difficult to control is solved.
Description
Technical Field
The invention relates to a control method for improving the coating uniformity of a special-shaped part, which is particularly used for preparing a high-uniformity film layer on the surface of the special-shaped part (quartz harmonic oscillator, hemispherical optical part, hyper-hemispherical optical part, cylindrical surface optical part, structural shielding part and the like), and has reference significance for the high-uniformity coating of other various special-shaped parts.
Background
In a conventional magnetron sputtering coating system, the substrate 10 generally moves singly, as shown in fig. 1, in such an environment, a better uniformity can be achieved for a planar coated workpiece, but the uniformity requirement is difficult to meet for a special-shaped structural part. Meanwhile, the traditional method can not form films on the surfaces of the special-shaped parts once, and the parts need to be coated for many times, so that the uniformity of the film layers can not be ensured. And the accurate monitoring of the film thickness can not be realized, so that the film coating uniformity of the special-shaped part is poor by adopting a common traditional mode, the qualification rate is difficult to control, and the efficiency is low.
The middle battery 26 researches a process technology of the metallization coating of the hemispherical gyroscope harmonic oscillator. The two-element composite film with gold doped is plated by magnetron sputtering method, so that adsorption center is effectively formed on the surface of the substrate, the adhesion of gold film is improved, and the film performance is quite stable. The uniformity of the film layer is ensured by designing a special fixture and a special process, and the thickness of a coating layer of tens of nanometers is sputtered
Aiming at the problem of insufficient uniformity of ITO conductive films plated on spherical glass substrates by an electron beam evaporation mode, the Chinese building material science research institute improves a common planet tool clamp in planar substrate coating. On the basis of a common planetary clamp, a steering shaft device is utilized to stagger a rotating shaft of a spherical substrate and a rotating shaft of an original rotating disc by a certain angle, so that the time of a spherical top center facing an evaporation source in a film coating process is reduced, and an included angle between a film deposition point tangent plane on a spherical surface at the edge of a hemisphere and incident evaporation atom beam is increased. Along with the increase of the staggering angle of the two rotation axes, the uniformity of the film thickness of the surface of the spherical substrate is obviously improved.
The Suzhou university carries out the research on the homogenization control of the magnetron sputtering coating on the surface of the complex workpiece. Aiming at the problems of uneven consumption of target materials, concave erosion rings and uneven thickness of films in the process of coating a complex workpiece, a rotary columnar magnetron sputtering target is adopted, a plurality of magnetron sputtering targets are adopted in a coating chamber, an auxiliary magnetic field is arranged to form a closed magnetic field, a cross-linking effect is formed between the targets, the density of plasma and the bias current of the workpiece are provided, and the purpose of uniformly coating the surface with a complex shape and an inner cavity structure is achieved. After the modification, the prepared film has good appearance and no crack, the thickness of the film layer is between 1 and 5 mu m, and the uniformity of the film layer is less than +/-5 percent.
It can be seen from the inquired reference that, in the current coating method for the special-shaped part, uniformity control mainly remains in the traditional single motion mode, and accurate control of the thickness of the film layer and good uniformity of the film layer cannot be realized, so a new processing method is to be developed to solve the problem.
Disclosure of Invention
In view of the above, the main objective of the present invention is to develop a control method for improving the coating uniformity of a special-shaped part.
The technical scheme of the invention is to provide a control method for improving the coating uniformity of the special-shaped part, wherein a coated workpiece performs compound motion of revolution, rotation and swing in the coating process;
the plated workpiece is arranged on a multi-degree-of-freedom working platform, the multi-degree-of-freedom working platform is perpendicular to the axis of the target material and performs circular motion to drive the plated workpiece to perform revolution motion, the clamping diameter of the multi-degree-of-freedom working platform is 600mm, and the revolution speed is 10r/min-15 r/min;
the plated workpiece carries out self-transmission motion relative to the multi-degree-of-freedom working platform, and the self-rotation speed is 15r/min-20 r/min;
the workpiece to be plated is clamped by the multi-degree-of-freedom working platform clamping tool and performs swinging motion simultaneously in revolution motion and rotation motion, the workpiece performs revolution motion around a revolution shaft in a horizontal plane, performs rotation motion around a central shaft of the workpiece simultaneously, and performs swinging motion in a plane vertical to the revolution shaft to form revolution, rotation and swinging combined motion. Keeping for a period of time at every interval swinging degree to continue to rotate freely for coating;
the formula of the film thickness distribution of the hemisphere is as follows:
H(θ)＝λ1H1(θ)+λ2H2(θ)+…+λnHn(θ)
the film thickness distribution of each ring belt obtained when each swinging corner rotates and plates independently is H1 (theta), H2 (theta).. Hn (theta);
scale factor lambda1、λ2…λnThe self-rotation film coating time of the hemispheres at different swing angles is adjusted.
Preferably, the selection mode of the scale factor is as follows:
digging three clamping grooves on the workpiece to be plated, sticking a silicon wafer into the clamping grooves, taking down the silicon wafer after the composite motion film plating, measuring the thickness of a film on the surface of the silicon wafer by using a step instrument, enabling the thickness of the film on the plane of the silicon wafer to be equivalent to the thickness of the film on the curved surface of a hemisphere, measuring the uniformity of the film thickness on the hemisphere, placing a crystal oscillator probe at the central position of a workpiece plate, and adjusting the autorotation film plating time of the hemisphere at different pivot angles H (theta) and different pivot angles
λnAnd (5) carrying out repeated experiments, and recording the thickness of the coating formed by different process parameters.
The method is particularly used for preparing the high-uniformity film on the surface of the special-shaped part (quartz harmonic oscillator, hemispherical optical part, hyper-hemispherical optical part, cylindrical surface optical part, structural shielding and the like), and has reference significance for high-uniformity film coating of other various special-shaped parts.
Drawings
FIG. 1 is a schematic diagram of a conventional magnetron sputtering coating system;
FIG. 2 is a schematic view of a multiple degree of freedom kinematic mechanism;
FIG. 3 is a schematic view of the relative position of the sputter target and the hemispherical member;
FIG. 4 is a graph showing the film thickness distribution of each zone and the hemispherical film thickness distribution at a swing angle interval of 15 °;
FIG. 5 is a graph of the post optimization hemispherical film thickness uniformity distribution;
FIG. 6 is a schematic view showing the inspection of the film thickness.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
Examples
The present invention will be further described with reference to the following examples. The present invention includes, but is not limited to, the following.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
1. Plated workpiece motion synthesis control method
The multi-degree-of-freedom motion mechanism 20 allows a workpiece to be plated (hemispherical component) 30 to perform a combined motion of revolution, rotation, and oscillation during the plating process, as shown in fig. 2. The workpiece moves in a composite motion mode in the film coating process, so that the one-time film coating of the whole surface of the special-shaped part can be realized, and the film layer can be ensured to achieve higher uniformity. The kinetic parameters were therefore studied.
(1) Revolution parameter
Taking a harmonic oscillator part as an example, in the revolution motion, the harmonic oscillator part makes a circular motion around an axis perpendicular to a target, which aims to keep particles received by the part stable in the coating process. Tests prove that the clamping diameter of the moving mechanism is 600mm, and the revolution speed can be selected from 10r/min to 15 r/min.
(2) Autorotation parameter
The film coating machine has the advantages that the parts rotate in the film coating process, the probability that film material molecules are deposited on the equivalent plane of the parts can be kept consistent, the film layer thickness of the center and the edge of the equivalent plane of the special-shaped parts can be kept consistent due to forward-shaped rotation in the film coating process, and the uniformity of the film layer is improved. Tests prove that the harmonic oscillator has the outer diameter of 25mm and the autorotation speed of 15r/min-20 r/min. The rotation speed of the special-shaped part is determined to be related to the size of the part, the larger outer diameter of the part can be selected from the larger rotation speed, and the smaller size can be selected to properly reduce the rotation speed.
(3) Parameters of oscillation
The swing parameter setting is a key parameter for ensuring the coating uniformity of the special-shaped part. In the coating process, the workpiece can properly and controllably swing while revolving and rotating, so that the whole surface of the special-shaped part can be coated at one time, and the requirement of high uniformity of a surface film layer of the special-shaped part can be met by matching with revolving and rotating parameters. It is therefore important to determine the appropriate swing speed. In the process of coating, as shown in fig. 3, the harmonic oscillator performs a combined motion of free rotation in the plane XOY and swinging forward or backward within 90 degrees in the plane XOZ, and the projection of the central Q point of the target surface on the outer surface of the hemisphere is a spiral line from the top point of the hemisphere to the bottom edge. When the hemisphere rotates continuously and freely, the film is coated in a free rotation mode for a period of time when the hemisphere swings to an angle at each interval degree, the projection of the target surface center Q on the outer surface of the hemisphere is a plurality of circular rings which are uniformly distributed from the top of the hemisphere to the edge according to the latitude, and the latitude difference between every two adjacent circular rings is the swing interval degree. When the degree of the interval during the swing is sufficiently small, the projection can approach the situation of the projection as a spiral line infinitely. Due to the symmetrical relation, the film thickness distribution of the self-rotation plating film of the hemisphere at different positions is in an annular distribution, namely the film thicknesses of all points on the same latitude of the outer surface of the hemisphere are equal.
Under a certain swing angle interval, the rotating film coating time of the hemispheres at each swing angle is equal, the film thickness distribution of each ring zone obtained when each swing angle is subjected to independent rotating film coating is H1 (theta), H2 (theta).. Hn (theta), and the film thickness distribution H (theta) of the outer surface of the hemispheres is the superposition of the film thickness distribution of each ring zone, namely the film thickness distribution H (theta) of each ring zone is superposed
H(θ)＝H1(θ)+H2(θ)+…+Hn(θ) (1)
Now, taking the film thickness distribution at different swing angles at a swing interval of 15 ° and the film thickness distribution of a hemisphere after being superimposed as an example, the different swing angles correspond to 0 °, 15 °, 30 °, 45 °, 60 °, and 75 °, respectively. By calculation, the film thickness distribution of the hemisphere at different swing angles can be obtained, and the rough curve thereof is shown in fig. 4.
The curves 1, 2, 3, 4, 5 and 6 correspond to the film thickness distribution of the annuli when the swing angles are 0 degrees, 15 degrees, 30 degrees, 45 degrees, 60 degrees and 75 degrees, respectively, and the curve 7 is the hemisphere film thickness distribution after the curves 1 to 6 are overlapped, so that the figure shows that the uniformity of the annulus film thickness distribution formed by coating films at different swing angles and the hemisphere film thickness distribution after the overlapping of the annuli can not meet the requirement. For this case, we multiply the film thickness distribution of each zone on the right side of equation (1) by a scaling factor, and the film thickness distribution of the hemisphere becomes the following equation:
H(θ)＝λ1H1(θ)+λ2H2(θ)+…+λnHn(θ) (2)
adjusting the scale factor lambda in equation (2)1、λ2…λnThe uniformity of the film thickness distribution H (theta) on the hemisphere can be improved by adjusting the autorotation film coating time of the hemisphere at different swing angles.For different swing angle intervals, a set of optimal scale factors can be optimized by a computer to realize the optimal film thickness uniformity distribution of the hemisphere, which can be achieved under different swing angle intervals, and the hemisphere film thickness distribution obtained by optimizing the scale factors is shown as a curve 8 in fig. 5. As can be seen from FIG. 5, the uniformity of the film thickness on the hemisphere is greatly improved, and in order to continue to improve the uniformity, the swing angle interval and the scale factor can be adjusted according to the specific coating requirements, and if the thickness of the coated film is not too thin, the swing interval can be reduced, so that more coating zones are provided, and the optimized uniformity is higher. Therefore, when the revolution parameter of 10r/min-15r/min, the rotation rate of 15r/min-20r/min and the swing angle interval of 15 degrees are selected for harmonic oscillator special-shaped parts, the thickness of a film layer of a product is finally ensured to be less than 80nm, and the uniformity of the film layer is ensured to be less than 3%.
2. Film thickness uniformity detection control method
For the special-shaped parts, how to detect the thickness of the film in real time is also a problem to be solved. The crystal oscillator is placed inside the magnetron sputtering vacuum chamber to detect the film thickness at a certain position, but for the hemispherical part, the crystal oscillator cannot be used to test the film thickness at each position of the hemispherical surface, and in this case, an experimental method is required. Firstly, we propose a method to make the plated film thickness on the hemisphere uniform, and then check whether the film thickness on the hemisphere is uniform after plating, for the hemispherical part, it is difficult to directly measure the film thickness on the surface of the sphere, and in the experimental stage, we have designed the structure as shown in fig. 6. In order to measure the thickness of a film on the surface of a hemisphere, three clamping grooves are dug on the surface of the hemisphere, a silicon wafer is stuck into the clamping grooves, the thickness of the plated film is thick, the silicon wafer is taken down, the thickness of the film on the surface of the silicon wafer is measured by using a step profiler, and the thickness of the film on the surface of the silicon wafer can be equivalent to the thickness of the film on the curved surface of the hemisphere due to the fact that the silicon wafer is distributed on the hemisphere at different latitudes and is. And placing a probe of the crystal oscillator in the central position of the workpiece disc, determining the relation between the thickness of the film measured by the crystal oscillator and the actual thickness of the film on the hemisphere through repeated experiments, and if the thickness of the film measured by the crystal oscillator is 200nm, the thickness of the film on the hemisphere is 80nm, the film on the surface of the hemisphere is uniform, recording each process parameter of magnetron sputtering, and carrying out batch production.
Claims (2)
1. A control method for improving the coating uniformity of a special-shaped part is characterized in that a coated workpiece performs compound motion of revolution, autorotation and swing in the coating process;
the plated workpiece is arranged on a multi-degree-of-freedom working platform, the multi-degree-of-freedom working platform is perpendicular to the axis of the target material and performs circular motion to drive the plated workpiece to perform revolution motion, the clamping diameter of the multi-degree-of-freedom working platform is 600mm, and the revolution speed is 10r/min-15 r/min;
the plated workpiece carries out autorotation motion relative to the multi-degree-of-freedom working platform, and the autorotation speed is 15r/min-20 r/min;
the workpiece to be plated is clamped by the multi-degree-of-freedom working platform clamping tool and performs swinging motion simultaneously in revolution motion and rotation motion, the workpiece performs revolution motion around a revolution shaft in the horizontal plane, performs rotation motion around a central shaft of the workpiece simultaneously, and performs swinging motion in the plane vertical to the revolution shaft to form revolution, rotation and swinging combined motion; the coating film is continuously and freely rotated for a period of time according to the swing degrees of each interval;
the formula of the film thickness distribution of the hemisphere is as follows:
H(θ)＝λ1H1(θ)+λ2H2(θ)+…+λnHn(θ)
the film thickness distribution of each ring belt obtained when each swinging corner rotates and plates independently is H1 (theta), H2 (theta).. Hn (theta);
scale factor lambda1、λ2…λnThe self-rotation film coating time of the hemispheres at different swing angles is adjusted.
2. The control method for improving the coating uniformity of the special-shaped part according to claim 1, wherein the selection mode of the scale factor is as follows:
digging three clamping grooves on the workpiece to be plated, sticking a silicon wafer into the clamping grooves, taking down the silicon wafer after the composite motion coating, and measuring the surface of the silicon wafer by using a step profilerFilm thickness, equivalent to that of the semi-spherical curved surface, measuring the uniformity of the film thickness on the semi-sphere, placing a crystal oscillator probe at the center of the workpiece plate, and adjusting the self-rotation film-coating time lambda of the semi-sphere at different swing angles H (theta) and H (theta)nAnd (5) carrying out repeated experiments, and recording the thickness of the coating formed by different process parameters.
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| CN110144558B (en) * | 2019-04-29 | 2021-06-11 | 河南东微电子材料有限公司 | Magnetron sputtering coating equipment |
| CN110158037B (en) * | 2019-06-27 | 2022-01-18 | Oppo广东移动通信有限公司 | Integrated shell, manufacturing method thereof, electronic equipment and vacuum evaporation equipment |
| CN112323034B (en) * | 2019-08-05 | 2023-10-17 | 武汉光谷创元电子有限公司 | Vacuum processing apparatus |
| CN110607509A (en) * | 2019-09-19 | 2019-12-24 | 金陵科技学院 | Device and method for coating film on curved surface material |
| CN110512176B (en) * | 2019-09-24 | 2021-04-02 | 扬州大学 | Combined type vacuum coating device for elevator roller surface and using method thereof |
| CN110760808B (en) * | 2019-12-10 | 2023-10-31 | 湘潭宏大真空技术股份有限公司 | Curved surface screen magnetron sputtering assembly |
| CN113621929B (en) * | 2020-05-08 | 2023-04-11 | 武汉光谷创元电子有限公司 | Microwave device manufacturing apparatus and method |
| CN112281133B (en) * | 2020-10-28 | 2021-09-07 | 哈尔滨工业大学 | Harmonic oscillator film thickness distribution and uniformity correction method |
| CN112553589B (en) * | 2021-02-19 | 2021-06-11 | 上海米蜂激光科技有限公司 | High-stability film monitoring method and film coating device |
| CN115572954B (en) * | 2022-09-20 | 2024-07-09 | 华中光电技术研究所（中国船舶重工集团公司第七一七研究所） | High-uniformity coating device and method for hemispherical workpiece |
| CN117403190B (en) * | 2023-10-31 | 2024-06-28 | 四川图林科技有限责任公司 | Method for metallizing and coating surface of harmonic oscillator of hemispherical resonator gyroscope |
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| CN86205339U (en) * | 1986-07-08 | 1987-12-09 | 周时培 | Coating apparatus for highly homogeneous coat |
| EP0439361B1 (en) * | 1990-01-26 | 2003-06-11 | Varian Semiconductor Equipment Associates Inc. | Sputtering apparatus with a rotating magnet array having a geometry for specified target erosion profile |
| CN102732844B (en) * | 2012-07-12 | 2014-05-07 | 中国科学院光电技术研究所 | Design method of coating uniformity correction baffle plate of spherical optical element on planetary rotating fixture of vacuum coating machine |
| JP6209286B2 (en) * | 2015-03-20 | 2017-10-04 | 芝浦メカトロニクス株式会社 | Film forming apparatus and film forming work manufacturing method |
| CN204589295U (en) * | 2015-04-10 | 2015-08-26 | 俊尚科技股份有限公司 | The film coating apparatus of adjustable varied angle |
| TWM512589U (en) * | 2015-09-07 | 2015-11-21 | Modern Auto Products Corp | Multi-shaft planetary coating device |
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