CN110144558B - Magnetron sputtering coating equipment - Google Patents

Magnetron sputtering coating equipment Download PDF

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Publication number
CN110144558B
CN110144558B CN201910352464.1A CN201910352464A CN110144558B CN 110144558 B CN110144558 B CN 110144558B CN 201910352464 A CN201910352464 A CN 201910352464A CN 110144558 B CN110144558 B CN 110144558B
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Prior art keywords
movable
block
rods
clamping block
magnetron sputtering
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CN201910352464.1A
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Chinese (zh)
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CN110144558A (en
Inventor
王伟涛
王永超
杨玉杰
李建勋
付宪坡
张军营
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Henan Oriental Materials Co ltd
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Henan Oriental Materials Co ltd
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    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/3407Cathode assembly for sputtering apparatus, e.g. Target
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34Sputtering
    • C23C14/35Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50Substrate holders

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  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

The invention discloses a magnetron sputtering coating device, which comprises a vacuum chamber, wherein a substrate table is arranged at the lower end inside the vacuum chamber, a target seat is arranged at the upper end of the substrate table, a fixing device is arranged at the upper end of the target seat, a rotating device is arranged at the upper end inside the vacuum chamber, a connecting piece is arranged at the lower end of the rotating device, and a magnetron target is arranged at one end of the connecting piece, wherein the rotating device comprises a fixed frame, the upper end of the fixed frame is connected with the upper end inside the vacuum chamber, two groups of fixed rods are arranged between the upper ends of the fixed frame, a sliding plate is sleeved on the fixed rods, two groups of movable rods are inserted on two sides of the top of the sliding plate, one ends of the two groups of movable rods are fixedly connected with one side of the connecting piece, movable blocks are arranged at the ends of the two groups of, one side of the lower end of the movable disc is connected with the fixed frame, and a screw rod matched with the sliding block is inserted in the sliding block.

Description

Magnetron sputtering coating equipment
Technical Field
The invention relates to the technical field of magnetron sputtering, in particular to magnetron sputtering coating equipment.
Background
At present, the magnetron sputtering technology is a surface modification technology for experiments and production which has been widely used in the fields of physical science and material science. The magnetron sputtering coating is a technology for bombarding the surface of a target by using energetic particles in vacuum to deposit the bombarded particles on a substrate, a magnetic field is added in a sputtering environment, the electron motion on the surface of the cathode target is restrained by using the Lorentz force of the magnetic field, so that the increase of high-energy ions bombarding a target material and the reduction of high-energy electrons bombarding the substrate are caused, and the coating process has the characteristics of low temperature, high speed and the like.
An effective solution to the problems in the related art has not been proposed yet.
Disclosure of Invention
The invention aims to provide a magnetron sputtering coating device to solve the problems in the background technology.
In order to achieve the purpose, the invention provides the following technical scheme: a magnetron sputtering coating device comprises a vacuum chamber, a substrate table is arranged at the lower end in the vacuum chamber, a target seat is arranged at the upper end of the substrate table, a fixing device is arranged at the upper end of the target seat, a rotating device is arranged at the upper end in the vacuum chamber, a connecting piece is arranged at the lower end of the rotating device, sputtering coating equipment is arranged at one end of the connecting piece, wherein the rotating device comprises a fixing frame, the upper end of the fixing frame is connected with the upper end in the vacuum chamber, two groups of fixing rods are arranged between the upper ends of the fixing frame, sliding plates are sleeved on the fixing rods, two groups of movable rods are inserted into two sides of the top of each sliding plate, one ends of the two groups of movable rods are fixedly connected with one side of the connecting piece, movable blocks are arranged at the ends of the two groups of movable rods far away from, the slider is located the inboard of spout, the slider with the spout is mutually supported, and, the spout is located the upper end of activity dish, lower extreme one side of activity dish with the mount is connected, wear to insert in the slider be equipped with slider matched with lead screw, and, the lead screw is located the inboard of spout, the one end of lead screw just is located the outside of spout is equipped with the motor.
Furthermore, the sliding plate is of a double-layer structure, two groups of fixing rods penetrate through the lower end of the sliding plate, two groups of movable rods penetrate through the upper end of the sliding plate, and the fixing rods and the movable rods are perpendicular to each other.
Furthermore, the connecting parts of the screw rod, the sliding block and the sliding groove are provided with internal threads matched with the screw rod.
Furthermore, the lower end of the movable disc is fixedly connected with the fixed frame through a supporting frame, a movable shaft is arranged at the bottom of the lower end of the movable disc, and a driving motor is connected to the lower end of the movable shaft.
Furthermore, the fixing device comprises a base, the base is located at the lower end of the inside of the vacuum chamber, a limiting groove is formed in the inner side of the base, a first clamping block and a second clamping block are respectively arranged on the inner side of the limiting groove, and a connecting rod is arranged at the lower end of the second clamping block.
Furthermore, the lower end of the connecting rod penetrates through the lower end of the base, a spring is sleeved between the second clamping block and the base on the connecting rod, a through hole matched with the connecting rod is formed in the lower end of the inner portion of the base, and the lower end of the connecting rod is connected with an output shaft of the air cylinder.
Furthermore, a convex block is arranged on one side of the lower end of the first clamping block, a clamping groove matched with the convex block is arranged on one side of the lower end of the second clamping block, and grooves are formed in one sides of the upper ends of the first clamping block and the second clamping block.
Compared with the prior art, the invention has the following beneficial effects:
(1) the structure of the invention is ideal and simple, and the film-coated workpiece is fixed by the fixing device in the test process by improving the substrate table, so that the film-coated workpiece is more stable in the processing process;
(2) the improved magnetron sputtering coating equipment enables a group of substrates to carry out sputtering coating at different angles, thereby effectively expanding the utilization efficiency of the sample table, better meeting the requirements of tests on the number of samples and the uniformity and consistency of multiple films, simultaneously improving the test efficiency and greatly reducing the investment cost on the basis of ensuring the sputtering film-forming quality.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a magnetron sputtering coating apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of a rotating device in a magnetron sputtering coating apparatus according to an embodiment of the invention;
FIG. 3 is a schematic structural diagram of a fixing device in a magnetron sputtering coating apparatus according to an embodiment of the invention.
Reference numerals:
1. a vacuum chamber; 2. a substrate stage; 3. a target holder; 4. a fixing device; 5. a rotating device; 6. a connecting member; 7. magnetically controlling a target; 8. a fixed mount; 9. fixing the rod; 10. a slide plate; 11. a movable rod; 12. a movable block; 13. a slider; 14. a chute; 15. a movable tray; 16. a screw rod; 17. a motor; 18. a support frame; 19. a movable shaft; 20. a base; 21. a limiting groove; 22. a first clamping block; 23. a second clamping block; 24. a connecting rod; 25. a spring; 26. a through hole; 27. a cylinder; 28. a bump; 29. a card slot; 30. and (4) a groove.
Detailed Description
The invention is further described with reference to the following drawings and detailed description:
in the first embodiment, as shown in fig. 1-3, a magnetron sputtering coating apparatus according to an embodiment of the present invention includes a vacuum chamber 1, a substrate table 2 is disposed at a lower end inside the vacuum chamber 1, a target holder 3 is disposed at an upper end of the substrate table 2, a fixing device 4 is disposed at an upper end of the target holder 3, a rotating device 5 is disposed at an upper end inside the vacuum chamber 1, a connecting member 6 is disposed at a lower end of the rotating device 5, and a magnetron target 7 is disposed at one end of the connecting member 6, wherein the rotating device 5 includes a fixing frame 8, an upper end of the fixing frame 8 is connected to an upper end inside the vacuum chamber 1, two groups of fixing rods 9 are disposed between upper ends of the fixing frame 8, a sliding plate 10 is sleeved on the fixing rods 9, two groups of movable rods 11 are inserted into two sides of a top of the sliding plate 10, and one ends of the two groups of movable rods 11 are, two sets of movable rod 11 is kept away from the one end of connecting piece 6 is equipped with movable block 12, the lower extreme of movable block 12 is equipped with slider 13, slider 13 is located the inboard of spout 14, slider 13 with spout 14 mutually supports, and, spout 14 is located the upper end of activity dish 15, lower extreme one side of activity dish 15 with mount 8 is connected, alternate in slider 13 be equipped with slider 13 matched with lead screw 16, and, lead screw 16 is located the inboard of spout 14, the one end of lead screw 16 just is located the outside of spout 14 is equipped with motor 17.
In the second embodiment, as shown in fig. 2, the sliding plate 10 has a double-layer structure, two sets of the fixing rods 9 penetrate through the lower end of the sliding plate 10, two sets of the movable rods 11 penetrate through the upper end of the sliding plate 10, and the fixing rods 9 and the movable rods 11 are perpendicular to each other.
In a third embodiment, as shown in fig. 2, internal threads matched with the screw rod 16 are disposed at the joints of the screw rod 16, the slider 13 and the chute 14, the lower end of the movable disk 15 is fixedly connected with the fixed frame 8 through a supporting frame 18, a movable shaft 19 is disposed at the bottom of the lower end of the movable disk 15, and a driving motor is connected to the lower end of the movable shaft 19.
In a fourth embodiment, as shown in fig. 3, the fixing device 4 includes a base 20, and, the base 20 is located at the inner lower end of the vacuum chamber 1, the inner side of the base 20 is provided with a limit groove 21, the inner side of the limit groove 21 is respectively provided with a first clamping block 22 and a second clamping block 23, the lower end of the second clamping block 23 is provided with a connecting rod 24, the lower end of the connecting rod 24 penetrates through the lower end of the base 20, moreover, a spring 25 is sleeved on the connecting rod 24 and positioned between the second clamping block 23 and the base 20, the lower end of the inner part of the base 20 is provided with a through hole 26 matched with the connecting rod 24, the lower end of the connecting rod 24 is connected with an output shaft of a cylinder 27, a convex block 28 is arranged on one side of the lower end of the first clamping block 22, a clamping groove 29 matched with the convex block 28 is arranged on one side of the lower end of the second clamping block 23, and, the clamping blocks 22 and 23 are provided with grooves 30 on one side of the upper ends thereof.
The working principle is as follows: firstly, a workpiece to be coated is arranged on a fixing device 4, the lower end of the workpiece is clamped on two groups of grooves 30, at the moment, a control switch is used for enabling an air cylinder 27 to work and further driving a connecting rod 24 to move, the connecting rod 24 drives a first clamping block 22 and a second clamping block 23 to move downwards to extrude a spring 25, a lug 28 at the lower end of the first clamping block 22 moves towards a clamping groove 29, the first clamping block 22 and the second clamping block 23 contract, and further the two groups of grooves 30 fix the workpiece, at the moment, an external control switch is used for enabling a driving motor to work and further driving a movable shaft 19 to rotate, so that the movable shaft 19 drives a movable disc 15 to move, the movable disc 15 drives a sliding groove 14 and a sliding block 13 to do rotary motion, the sliding block 13 drives a movable block 12 to do circular motion, further a movable rod 11 and a fixed rod 9 move back and forth on a sliding plate 10, so that the other end of the movable rod 11, so that the magnetron targets 7 move around the workpiece.
In conclusion, by means of the technical scheme, the structure is ideal and simple, the substrate table 2 is improved, and the film-coated workpiece is fixed by the fixing device 4 in the test process, so that the film-coated workpiece is more stable in the processing process; the improved magnetron target 7 enables a group of substrates to carry out sputtering coating at different angles, thereby effectively expanding the utilization efficiency of the sample stage, better meeting the requirements of the test on the sample quantity and the uniformity and consistency of a multi-element film, simultaneously improving the test efficiency and greatly reducing the investment cost on the basis of ensuring the sputtering film-forming quality.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims (6)

1. The magnetron sputtering coating equipment is characterized by comprising a vacuum chamber (1), wherein a substrate table (2) is arranged at the lower end in the vacuum chamber (1), a target seat (3) is arranged at the upper end of the substrate table (2), a fixing device (4) is arranged at the upper end of the target seat (3), a rotating device (5) is arranged at the upper end in the vacuum chamber (1), a connecting piece (6) is arranged at the lower end of the rotating device (5), a magnetron target (7) is arranged at one end of the connecting piece (6), the rotating device (5) comprises a fixing frame (8), the upper end of the fixing frame (8) is connected with the upper end in the vacuum chamber (1), two groups of fixing rods (9) are arranged between the upper ends of the fixing frame (8), a sliding plate (10) is sleeved on the fixing rods (9), two movable rods (11) are arranged on two sides of the top of the sliding plate (10) in an inserting manner, one end of each of the two groups of movable rods (11) is fixedly connected with one side of the connecting piece (6), one end of each of the two groups of movable rods (11) far away from the connecting piece (6) is provided with a movable block (12), the lower end of the movable block (12) is provided with a slide block (13), the slide block (13) is positioned at the inner side of the sliding groove (14), the slide block (13) is matched with the sliding groove (14), moreover, the sliding groove (14) is positioned at the upper end of the movable disc (15), one side of the lower end of the movable disc (15) is connected with the fixed frame (8), a screw rod (16) matched with the sliding block (13) is inserted in the sliding block (13), the screw rod (16) is positioned on the inner side of the sliding groove (14), and a motor (17) is arranged at one end of the screw rod (16) and positioned on the outer side of the sliding groove (14); the sliding plate (10) is of a double-layer structure, the fixed rods (9) penetrate through the lower end of the sliding plate (10), the movable rods (11) penetrate through the upper end of the sliding plate (10), and the fixed rods (9) and the movable rods (11) are perpendicular to each other.
2. The magnetron sputtering coating equipment according to claim 1, wherein the connection part of the screw rod (16) and the sliding block (13) and the sliding groove (14) is provided with an internal thread matched with the screw rod (16).
3. The magnetron sputtering coating equipment according to claim 1, wherein the lower end of the movable disk (15) is fixedly connected with the fixed frame (8) through a support frame (18), a movable shaft (19) is arranged at the bottom of the lower end of the movable disk (15), and a driving motor is connected to the lower end of the movable shaft (19).
4. The magnetron sputtering coating equipment according to claim 1, wherein the fixing device (4) comprises a base (20), the base (20) is located at the lower end of the inside of the vacuum chamber (1), a limiting groove (21) is formed in the inner side of the base (20), a first clamping block (22) and a second clamping block (23) are respectively arranged in the limiting groove (21), and a connecting rod (24) is arranged at the lower end of the second clamping block (23).
5. The magnetron sputtering coating equipment according to claim 4, wherein the lower end of the connecting rod (24) penetrates through the lower end of the base (20), a spring (25) is sleeved on the connecting rod (24) and positioned between the second clamping block (23) and the base (20), a through hole (26) matched with the connecting rod (24) is formed in the lower end of the inner part of the base (20), and the lower end of the connecting rod (24) is connected with an output shaft of a cylinder (27).
6. The magnetron sputtering coating equipment according to claim 4, wherein one side of the lower end of the first clamping block (22) is provided with a convex block (28), one side of the lower end of the second clamping block (23) is provided with a clamping groove (29) matched with the convex block (28), and one sides of the upper ends of the first clamping block (22) and the second clamping block (23) are provided with grooves (30).
CN201910352464.1A 2019-04-29 2019-04-29 Magnetron sputtering coating equipment Active CN110144558B (en)

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Application Number Priority Date Filing Date Title
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CN110144558B true CN110144558B (en) 2021-06-11

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Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992001081A1 (en) * 1990-07-06 1992-01-23 The Boc Group, Inc. Method and apparatus for co-sputtering and cross-sputtering homogeneous films
CN101634011A (en) * 2008-07-21 2010-01-27 中国科学院宁波材料技术与工程研究所 Magnetic control sputtering device and method for uniformly coating film on outer surface of workpiece
CN101878321A (en) * 2007-11-30 2010-11-03 应用材料股份有限公司 The control of the arbitrary scan path of rotating magnetron
CN102400107A (en) * 2010-09-13 2012-04-04 北京北方微电子基地设备工艺研究中心有限责任公司 Magnetron sputtering source and magnetron sputtering device
CN208136324U (en) * 2018-05-04 2018-11-23 深圳市锆安材料科技有限公司 A kind of vacuum coater
CN109652780A (en) * 2018-12-12 2019-04-19 上海航天控制技术研究所 A kind of control method improving special-shaped part plating film uniformity

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1992001081A1 (en) * 1990-07-06 1992-01-23 The Boc Group, Inc. Method and apparatus for co-sputtering and cross-sputtering homogeneous films
CN101878321A (en) * 2007-11-30 2010-11-03 应用材料股份有限公司 The control of the arbitrary scan path of rotating magnetron
CN101634011A (en) * 2008-07-21 2010-01-27 中国科学院宁波材料技术与工程研究所 Magnetic control sputtering device and method for uniformly coating film on outer surface of workpiece
CN102400107A (en) * 2010-09-13 2012-04-04 北京北方微电子基地设备工艺研究中心有限责任公司 Magnetron sputtering source and magnetron sputtering device
CN208136324U (en) * 2018-05-04 2018-11-23 深圳市锆安材料科技有限公司 A kind of vacuum coater
CN109652780A (en) * 2018-12-12 2019-04-19 上海航天控制技术研究所 A kind of control method improving special-shaped part plating film uniformity

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