CN217149299U

CN217149299U - Fixing device of many sputtering electrodes

Info

Publication number: CN217149299U
Application number: CN202220367932.XU
Authority: CN
Inventors: 肖一鸣; 郑鹏; 白王峰; 傅唐雨; 叶文博; 朱成浩
Original assignee: Hangzhou Dianzi University
Current assignee: Hangzhou Dianzi University
Priority date: 2022-02-23
Filing date: 2022-02-23
Publication date: 2022-08-09
Anticipated expiration: 2032-02-23

Abstract

The utility model discloses a fixing device of a multi-sputtering electrode, which comprises a mask plate, plated holes, a support rod and magnets, wherein the mask plate is provided with a plurality of plated holes which are communicated up and down; the mask plate is made of magnetic materials or metal materials, the magnet is made of magnetic materials, and when the mask plate is used, an object to be plated is located between the magnet and the mask plate and is fixed through magnetic attraction between the magnet and the mask plate. The utility model is used for fixed when a plurality of ultra-thin samples sputter electrode pattern can alleviate the fragile phenomenon of ultra-thin sample that mechanical fixation leads to, guarantees the in close contact with between sample and the mask plate simultaneously, ensures the uniformity of electrode area.

Description

Fixing device of many sputtering electrodes

Technical Field

The utility model belongs to sputter mask field, in particular to fixing device of many sputtering electrodes.

Background

The sputtering coating is a method for preparing a film, which is called sputtering coating, by bombarding a target material by using charged particles in a vacuum chamber, so that atoms or atom groups on the surface of the target material are released, and the released atoms form a film with the same component as the target material on the surface of a workpiece. The sputtering coating method is the best novel electric polarization process method at present with low energy consumption, high repeatability and accurate control, and the initial kinetic energy of the sputtering particles is large, so that the film is compact and is firmly combined with the ceramic matrix.

The sputtering method is widely applied to the preparation of electrodes on the surfaces of ceramic electronic components at present. However, there are difficulties in sputtering metal electrodes on multiple samples, especially multiple ultra-thin samples with different thicknesses, mainly due to the lack of effective mask fixing clamp. Generally, for a conventional mechanical fixing device, when a plurality of samples are fixed simultaneously, a gap is generated between the sample and the fixture due to the fact that the thicknesses of the samples may be inconsistent, so that the edge of the electrode is enlarged in the sputtering process, and the area of the electrode is further affected. And for ultra-thin samples, the conventional mechanical fixing clamp also easily breaks the sample. Therefore, it is necessary to design a mask jig which can be applied to a plurality of ultra-thin sample sputtering electrodes.

SUMMERY OF THE UTILITY MODEL

In view of the above problem, the technical solution of the present invention is as follows: a fixing device for multiple sputtering electrodes comprises a mask plate, a plating hole, a support rod and a magnet, wherein,

the mask plate is provided with a plurality of vertically-through plated holes, the magnets are arranged below the mask plate and correspond to the plated holes in use, and the support rods are detachably assembled at four corners below the mask plate;

the mask plate is made of magnetic materials or metal materials, the magnet is made of magnetic materials, and when the mask plate is used, an object to be plated is located between the magnet and the mask plate and is fixed through magnetic attraction between the magnet and the mask plate.

Preferably, the plated hole is circular.

Preferably, the plated hole is triangular.

Preferably, the plated hole is square.

Preferably, the plated holes are arranged in a square matrix.

Preferably, the plated holes are staggered in multiple rows.

The beneficial effects of the utility model include at least:

1. the device has simple design and convenient use, and can be adapted to various sputtering electrodes;

2. each plated hole is independently provided with a magnet, and then can be set into a latticed magnetic plate to be matched with mask plates of different plated holes;

3. the device is suitable for the objects to be plated with various thicknesses, and the objects to be plated are fixed only through magnetic adsorption without excessive external force, so that the problem that the objects to be plated are broken by a mechanical clamp is avoided.

Drawings

Fig. 1 is a schematic structural view of a fixing device for multiple sputtering electrodes according to a first embodiment of the present invention;

fig. 2 is a schematic structural view of a fixing device for multiple sputtering electrodes according to a second embodiment of the present invention;

fig. 3 is a schematic structural view of a fixing device for multiple sputtering electrodes according to a third embodiment of the present invention;

fig. 4 is a schematic structural view of a fixing device for multiple sputtering electrodes according to a fourth embodiment of the present invention;

fig. 5 is a schematic side view of a fixing device for multiple sputtering electrodes according to an embodiment of the present invention.

Detailed Description

The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

Example 1

Referring to fig. 1, a schematic structural diagram of a fixing device for a multi-sputtering electrode includes a mask plate 10, plated holes 11, support rods 12 and magnets 20, wherein the mask plate 10 is provided with a plurality of plated holes 11 which are through up and down, the magnets 20 are arranged below the mask plate 10 and correspond to the plated holes 11 in position when in use, and the support rods 12 are detachably assembled at four corners below the mask plate 10; the mask plate 10 is a thin plate made of a magnetic material or a metal material, the magnet 20 is a magnetic material, when the mask plate is used, the object 30 to be plated is arranged between the magnet 20 and the mask plate 10, and the object 30 to be plated is fixed by the magnetic attraction between the magnet 20 and the mask plate 10.

In example 1, the plated holes 11 are circular and arranged in a square matrix. Referring to fig. 5, the object 30 is placed under the plating hole 11, a magnet 20 is attached under the object 30, the object 30 sandwiched therebetween is fixed by a magnetic force or a magnetic force between the metal mask 10 and the magnet 20, and the remaining objects 30 are fixed according to this operation, and then sputtering of a circular electrode pattern is started.

Example 2

On the basis of the embodiment 1, referring to fig. 2, the plated holes 11 are arranged in a triangular shape, and may be arranged in a matrix or arranged according to the actual situation. Similarly, referring to fig. 5, the object 30 to be plated is placed under the plating hole 11, a magnet 20 is attached under the object 30 to be plated, the object 30 to be plated sandwiched between the magnet and the mask plate 10 is fixed by magnetism or magnetic force between the magnet 20, and the triangular electrode pattern is sputtered after the other objects 30 to be plated are fixed according to the operation.

Example 3

On the basis of the embodiment 1, referring to fig. 3, the plated holes 11 are arranged in a square shape, and may be arranged in a matrix or arranged according to the actual situation. Similarly, referring to fig. 5, the object 30 to be plated is placed under the plating hole 11, a magnet 20 is attached under the object 30 to be plated, the object 30 to be plated sandwiched between the magnets or the magnetic force between the metal mask 10 and the magnet 20 is fixed, and the other objects 30 to be plated are fixed according to this operation, and then sputtering of a square electrode pattern is started.

Example 4

On the basis of example 1, referring to fig. 4, the plated holes 11 are arranged in a circular shape and staggered in multiple rows. Similarly, referring to fig. 5, the object 30 to be plated is placed under the plating hole 11, a magnet 20 is attached under the object 30 to be plated, the object 30 to be plated sandwiched between the magnets or the magnetic force between the metal mask 10 and the magnet 20 is fixed, and the other objects 30 to be plated are fixed according to this operation, and then sputtering of the circular electrode pattern is started.

The utility model discloses solved effectively when a plurality of objects 30 that wait to plate of sputtering because the fixed difficult problem that the object 30 thickness difference leads to of waiting to plate, alleviateed mechanical fastening and made ultra-thin object 30 fragile phenomenon of waiting to plate, it is even to be favorable to the control electrode area simultaneously, improves the coating film precision, also can correspondingly carry out the coating film of multiple combination through changing 11 shapes in plated hole and arrangement.

Finally, it is noted that the above-mentioned preferred embodiments illustrate rather than limit the invention, and that, although the invention has been described in detail with reference to the above-mentioned preferred embodiments, it will be understood by those skilled in the art that various changes in form and details may be made therein without departing from the scope of the invention as defined by the appended claims.

Claims

1. A fixing device of a multi-sputtering electrode is characterized by comprising a mask plate, a plating hole, a support rod and a magnet, wherein,

2. The fixture for a multi-sputtering electrode according to claim 1, wherein the plating hole is circular.

3. The fixture for a multi-sputtering electrode according to claim 1, wherein the plating hole has a triangular shape.

4. The fixture for a multi-sputtering electrode according to claim 1, wherein the plating hole is square.

5. The apparatus of claim 1, wherein the plating holes are arranged in a square matrix.

6. The fixture for a multi-sputtering electrode according to claim 1, wherein the plating holes are staggered in a plurality of rows.