JPH0266170A - Sputtering device - Google Patents

Abstract

PURPOSE:To improve the uniformity and step coverage of a formed film by placing a semiconductor substrate and a target opposite to each other and sputtering the target while changing the relative positions of them. CONSTITUTION:A semiconductor substrate 1 fixed on a holder 2 and a target 4 are placed opposite to each other in a horizontal state and the target 4 is sputtered in a gaseous atmosphere at a prescribed vacuum pressure while relatively changing the horizontal position of the substrate 1 to the target 4 by horizontally rotating the substrate 1. The substrate 1 is rotated by rotating the holder 2 with a rotation unit 3. A film is uniformly formed on the substrate 1 and the step coverage of the film at the stepped part is improved.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a sputtering apparatus, and particularly to a sputtering apparatus capable of forming a uniform film.

[Conventional technology]

2. Description of the Related Art Conventionally, a sputtering apparatus used in the manufacturing process of a semiconductor device holds a semiconductor substrate on which a film is to be formed in a holder or the like around the semiconductor substrate, and a target of a film forming material is placed opposite to the semiconductor substrate. Then, by creating an electric field between the two in a required gas atmosphere, the target is sputtered, and the target material is deposited on the surface of the semiconductor substrate to form a film.

[Problem to be solved by the invention]

In the conventional sputtering apparatus described above, the semiconductor substrate and the target are each fixedly supported within the apparatus, so the relative positions of the two are also fixed. Therefore, the direction in which the target material sputters from the target and adheres to the surface of the semiconductor substrate.

There are problems in that the deposition area is uneven, the uniformity of film formation on the semiconductor substrate is poor, and the step coverage at the stepped portion is also poor.

An object of the present invention is to provide a sputtering apparatus that improves the uniformity of film formation and also improves step coverage.

[Means to solve the problem]

The sputtering apparatus of the present invention is equipped with a mechanism for changing the relative position of a semiconductor substrate on which a film is to be formed and a target serving as a film-forming material that is placed opposite to the semiconductor substrate.

[Effect]

In the above-described configuration, the direction of adhesion of the target material from the target to the semiconductor substrate is changed as the relative position between the target and the semiconductor substrate changes, and the target material is uniformly adhered to the semiconductor substrate to form a film.

(Example〕 Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a front view schematically showing a first embodiment of the present invention. In the figure, ▪ is a semiconductor substrate on which a sputtered film is formed, and this semiconductor substrate 1 is fixed to a holder 2 at its periphery with its surface facing downward. This holder 2 is provided with a rotation unit 3 on its upper part, and is horizontally rotated around its central axis.

On the other hand, a target 4 is fixedly supported in a substantially horizontal position below the holder 2, and a sputtering power source 5 is energized.

Note that these are actually installed in a vacuum chamber and maintained in a gas atmosphere at a predetermined vacuum pressure.

Therefore, according to this configuration, by driving the rotation unit 3 to rotate the holder 2, the semiconductor substrate Fi1 is rotated in the horizontal direction, and its position in the plane direction relative to the target 4 is changed. As a result, the direction in which the target material scattered by the sputtering of the target 4 is attached to the surface of the semiconductor substrate 1 is changed, and as a result, the target material is attached to various parts of the surface of the semiconductor substrate 1 from various directions. This results in uniform adhesion of the target material.

Therefore, a film with a uniform thickness is formed on the surface of the semiconductor substrate 1.

FIG. 2 is a front view schematically showing a second embodiment of the present invention, and the same parts as in the first embodiment are given the same reference numerals.

In this embodiment, the holder 2 and the rotation unit 3 are inclined at approximately 45 degrees with respect to the vertical axis, and a second rotation unit 6 oriented vertically is attached thereto. Therefore, in this embodiment, while the holder 2 is rotated around the axis of the rotation unit 3, it is also rotated around the vertical axis by the second rotation unit 6, and as a result, the dimension of the rotational movement of the semiconductor substrate 1 is changed. John is numbered 2.

This has the effect of three-dimensionally changing the relative position of the semiconductor substrate 1 with respect to the target 4, further improving the uniformity of film formation, and improving step coverage at the stepped portion.

Note that the semiconductor substrate may be fixed and the target may be relatively rotatable.

〔Effect of the invention〕

As explained above, since the present invention is equipped with a mechanism for changing the relative position between the semiconductor substrate and the target, as the relative position between the target and the semiconductor substrate changes, the target attached to the semiconductor substrate can be removed. The direction in which the material is attached is changed, which has the effect of making uniform in-plane variations in the film formed on the semiconductor substrate and improving step coverage at stepped portions.

[Brief explanation of the drawing]

FIG. 1 is a schematic front view of a first embodiment of the invention, and FIG. 2 is a schematic front view of a second embodiment of the invention. DESCRIPTION OF SYMBOLS 1... Semiconductor substrate, 2... Holder, 3... Rotation unit, 4... Target, 5... Sputter power supply, 6... Second rotation unit.

Claims (1)

[Claims] 1. A sputtering apparatus comprising a semiconductor substrate on which a film is to be formed and a target as a film-forming material placed opposite to the semiconductor substrate, the sputtering apparatus comprising a mechanism for changing the relative position of the semiconductor substrate and the target. Device.