JPH113653A - Coat thickness adjusting device for coating sputtering device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To restrict the lowering of rate of operation and form an optical thin film of high quality by providing a means, which can be rotated from outside, in two trim bases, and having at least two trim space patterns, in which a pair of film thickness controlling trim shields are arranged along the major axis direction opposite to each other with an appropriate space. SOLUTION: Trim bases 23, 24, which can be rotated from outside, are formed, and while a first and a second trim shields 21a, 21b are fitted to the trim base 23, and similarly, a first and a second trim shields 22a, 22b are fitted to the other trim base 24. Each shield piece as a structural member of each trim shield is arranged so as to form a different space between the first and the second trim shields 21a, 21b and between the first and the second trim shields 22a, 22b. Each trim shield is rotated from outside so that a chamber is not opened in the atmosphere, and a desirable distribution of film thickness is secured.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a sputtering apparatus suitable for use in a step of forming an optical thin film such as an antireflection film by coating a front glass of a cathode ray tube with a multilayer film, and more particularly to a sputtering apparatus. And a coating film thickness adjusting device.

[0002]

2. Description of the Related Art Conventionally, a sputtering apparatus has been used in a process of forming an optical thin film such as an antireflection film on a cathode ray tube surface by a sputtering method. This sputtering apparatus is provided with a trim shield (shielding plate) to which a cathode shield or the like is attached in order to control the film thickness distribution of the optical thin film formed on the surface of the cathode ray tube. In this case, the trim shield is made of a material that is not easily deformed, and the gap (distance) between the pair of trim shields is stably maintained. On the other hand, sputtering target (sputtering cathode)
In the case where is a cylindrical type and involves rotation, the trim shield is fixed to a shield base (support structure) such as a square bar.

[0003] This shield base is arranged in the vicinity of the target at a distance of about 50 to 200 mm from the target in order to improve the controllability of sputter particles from the target (sputtering cathode). The shield base is fixed at both ends by a block at a target end or a bracket supported by a vacuum vessel. as a result,
The shield base is deformed by thermal expansion due to radiant heat of the plasma generated on the target, so that the distance between the trim shield gaps cannot be kept constant, and a stable film thickness cannot be obtained. Here, a conventional sputtering apparatus will be described with reference to the drawings.

FIG. 3 is a view showing an example of a peripheral structure of a trim shield of a sputtering apparatus used in a conventional coating method. (1) is a left side view, (2) is a front view, and (3) Is a top view. 1, reference numeral 1 denotes a trim shield (shielding plate), 2 denotes a bracket, 3 denotes a shield base, and 4 denotes a target.

[0005] As shown in FIG. 3, the sputtering apparatus is provided with a pair of trim shields 1, both ends of which are supported by a pair of shield stands 3.
The amount of sputtered particles that fly out of the target (sputtering cathode) 4 is arranged near the target 4 and is controlled by the distance between the pair of trim shields 1 facing each other to adjust the film thickness. The precision in this case can vary the thickness of the trim shield 1 by about 0.5 to 2% when the distance of the opposing gap is 1 mm. Thus, the gap between the pair of trim shields 1 must be adjusted very severely. In addition, since the pair of trim shields 1 is intended to control the film thickness, there is a restriction that the trim shields 1 must be disposed near the target 4 in order to perform their functions. As one conventional method for avoiding such restrictions and obtaining an arbitrary film thickness distribution on a work (for example, a cathode ray tube surface), a sputtering apparatus configured to be able to adjust a gap between a pair of trim shields 1. Is known.

FIG. 4 shows a conventional sputtering apparatus in which the gap between a pair of trim shields can be adjusted.
1 is a diagram showing an example of the structure of the main part, (1) is a top view, and (2) is a side view. In the reference numerals in the figure, reference numerals 11 and 12 denote trim shields (shielding plates), 13 denotes a target, 14 denotes a work (workpiece), and 15 denotes a trim base.

FIGS. 4A and 4B show only the structure around the trim shield in the sputtering apparatus, that is, only the main structure of the coat film thickness adjusting apparatus. The pair of trim shields 11 and 12 shown in FIGS.
The difference between the trim shield 1 and the pair of trim shields 1 shown in FIGS. 3A to 3C is that in the case of FIGS. FIG. 4 shows that the respective shield pieces constituting the trim shield 1 are arranged so as to face each other at the same interval in the long axis direction.
(1) is that the shield pieces constituting the pair of trim shields 11 and 12 are arranged at different facing intervals in the major axis direction (hereinafter referred to as trim intervals).

Since the trim interval between the pair of trim shields 11 and 12 determines the film thickness to be coated on the work 14, as shown in FIG. By arranging them, the thickness of the coating film formed on the work 14 can be made uniform or a desired distribution of film thickness can be obtained. Therefore, usually, by adjusting the trim interval before using the target 13, a desired film thickness distribution is obtained. However, even if the trim interval is adjusted in the early stage of using the target 13,
Since the set film thickness distribution changes, it is necessary to readjust the trim interval. In order to adjust the trim interval, the chamber must be opened to the atmosphere.
The chamber is vented each time the trim interval is readjusted.

[0009]

As described in the prior art, in a sputtering apparatus, the facing distance (trim gap) between a pair of trim shields has a great influence on the film thickness distribution to be formed. Therefore, it is necessary to appropriately readjust the trim interval according to the change accompanying the use of the target. When the trim interval is readjusted, the chamber must be opened to the atmosphere, so that there is a problem that the operation rate is reduced and the loss is caused, particularly in production with an in-line type coater or the like. In the present invention, by configuring the coat film thickness adjusting device so that the trim interval can be adjusted without the necessity of opening the chamber to the atmosphere,
To reduce the number of adjustments of the trim interval when the chamber is opened to the atmosphere, suppress the decrease in the operation rate, and always maintain a desired film thickness distribution to enable the formation of high quality optical thin films. As an issue.

[0010]

According to a first aspect of the present invention, there is provided a coating film thickness adjusting device which is disposed between a target and a front glass of a cathode ray tube on which the target and an optical thin film are formed, and is attached to two trim tables respectively. In a sputtering apparatus provided with a pair of trim shields for controlling the film thickness, a means capable of being rotated from the outside is provided on two trim bases, and the pair of trim shields for controlling the film thickness is optional along the longitudinal direction. At least 2 arranged at opposing intervals of
It has two trim spacing patterns.

According to a second aspect of the present invention, there is provided a coating film thickness adjusting apparatus, comprising: a trim base on which trim shields having different trim intervals are fixed along the longitudinal direction of the target; Attach a trim shield with.

[0012]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, an embodiment of a coating film thickness adjusting apparatus in a coating sputtering apparatus according to the present invention will be described in detail with reference to the drawings. The present invention focuses on the fact that a change in the film thickness distribution of a coating that occurs with the use of a target can be empirically predicted in a sputtering apparatus. For each shield piece that composes the trim shield, prepare a pattern (a plurality of trim interval patterns) with different trim intervals of the trim shield in the long axis direction. The feature is that the trim interval can be readjusted by the operation from.

FIG. 1 is a view showing an example of an embodiment of a main part configuration of a coat thickness adjusting apparatus of a sputtering apparatus according to the present invention, wherein (1) is a top view and (2) is a side view. . The reference numerals in the figure are the same as those in FIG. 4, 21a is one first trim shield, 21b is one second trim shield, 22a is the other first trim shield,
21b is the other second trim shield, 23 and 24 are rotatable trim stands, and arrows indicate the direction of rotation of the trim shield.

The coating film thickness adjusting device shown in FIGS. 1 (1) and 1 (2) has a pair of trim shields, one of which is mounted on one of the rotatable trim bases 23 and one of the first trim shields 21a. The second trim shield 21b and the other first trim shield 22a and the second trim shield 21 attached to the other rotatable trim stand 24.
b. In the case of FIG. 1A, the coating film thickness is controlled by a trim interval determined by one first trim shield 21a and the other first trim shield 22a. The state in this case is as shown in a side view in FIG. In this state, both rotatable trim bases 23 and 24 are set at 180 °.
By rotating, the trim interval pattern formed by one second trim shield 21b and the other second trim shield 21b is changed, and the distribution of the coating film thickness is changed corresponding to this pattern.

As described above, the trim bases 23 and 24 are configured to be rotatable from the outside, and one of the trim bases 23 is
First and second trim shields 21a and 21b are respectively attached, and similarly, first and second trim shields 22a and 22b are respectively attached to the other trim base 24. At this time, the first trim base 23
Each of the trim shields 21a, 21b, 21b, 21b, 21b, 21a, 21b, and the other trim base 24 has a different spacing between the first and second trim shields 22a, 22b. Each shield piece constituting the 22a and 22b is arranged. That is, if the trim bases 23 and 24 are installed from the outside of the chamber by setting them in different trim interval patterns, trim intervals of different patterns can be obtained without opening to the atmosphere as in the related art. In this case, of the two trim bases 23 and 24,
Even if only one trim table is rotated, a different trim interval pattern can be obtained. Therefore, if only one of the two trim bases 23 and 24 is rotated, and if there is a trim interval pattern at which an optimum film thickness distribution can be obtained, a maximum of four sets are provided. It becomes possible to select a pattern.

Here, the pattern of the trim intervals will be described. For example, in a planar type target 13 of a magnetron drive type widely used in a sputtering process, a race track ( groove)
Is formed, the distribution of the film thickness coated on the work 11 changes. Therefore, a large number of measurements are actually performed on the state of the change in the film thickness distribution, and the obtained data is recorded. Then, the trim shield is provided with a pattern of the trim interval corresponding to the change of the film thickness distribution, and if the trim base is rotated in advance during the process, it is not necessary to open the chamber to the atmosphere, and the desired film thickness distribution can be obtained. This makes it possible to reduce the loss in production. Further, as another embodiment, by changing the shape of the trim base, three patterns of trim intervals,
It is also possible to have a pattern with a trim interval longer than that.

FIG. 2 is a side view showing an example of another embodiment of a trimming table of a sputtering apparatus used in the coating method according to the present invention. FIG. (2) shows a case where four patterns of trim intervals are provided. In the reference numerals in the figure,
31a to 31c are first to third trim shields, 32
Denotes a rotatable trim base having a triangular cross section, 41a to 41
d indicates the first to fourth trim shields, and 42 indicates a rotatable trim base having a rectangular cross section.

FIG. 2 shows the relationship between the cross-sectional shape of one rotatable trim base and the trim shield attached to each side. Although the other rotatable trim base is not shown, as described with reference to FIG. 1, the two trim bases have the same cross-sectional shape, and are attached to both rotatable trim bases. It goes without saying that the trim interval provided by the trim shield determines the film thickness distribution. For example, as shown in FIG. 2A, the cross-sectional shape of the rotatable trim base 32 is triangular, and the first to third trim shields 31a are provided on each side.
31c can basically be provided with three patterns of trim intervals, and considering the combination thereof, nine patterns of trim intervals can be provided. Also, as shown in FIG. 2 (2), if the cross-sectional shape of the rotatable trim base 42 is made rectangular and the first to fourth trim shields 41a to 41d are respectively attached to each side, basically four patterns are formed. It is possible to provide trim intervals, and as a combination, trim intervals of 16 patterns can be obtained.

As shown in FIGS. 2A and 2B, the cross-sectional shape of the rotatable trim bases 32 and 42 is changed to an arbitrary polygon, and trim shields having different trim intervals are attached to each side. This makes it possible to provide three or four patterns of trim intervals, or a pattern of trim intervals longer than that. Note that, as described above, these trim interval patterns correspond to the target 13.
It is possible to apply not only to the change in the shape of the work 11 but also to the change in the shape of the work 11. As described above, in the present invention, for each shield piece constituting a pair of trim shields, a pattern in which the trim intervals of the trim shield in the longitudinal direction are different is set in advance, and the change of the target 13 and the shape of the workpiece 11 are set. The trim bases 23, 24, 32, 42 and the like can be rotated by an external operation so that an optimum trim interval can be obtained in response to the change in the distance. Therefore, even when the trim interval needs to be changed due to a change in the target or the like, the trim interval can be readjusted without having to open the chamber to the atmosphere each time as in the related art. Therefore, the number of times of adjustment by opening the chamber to the atmosphere is reduced, and a decrease in the operation rate is suppressed.

[0020]

According to a first aspect of the present invention, there is provided a coat film thickness adjusting device which is disposed between a target and a front glass of a cathode ray tube on which the target and an optical thin film are formed, and is attached to two trim bases respectively. In a sputtering apparatus equipped with a pair of film thickness control trim shields, two trim bases are provided with rotatable means from the outside, and a pair of film thickness control trim shields are disposed at any intervals along the long axis direction. Have at least two trim spacing patterns arranged in a matrix. Therefore, by rotating the trim table from outside during the process in advance, it is possible to maintain a desired film thickness distribution without having to open the chamber to the atmosphere, and it is possible to reduce production loss.

According to a second aspect of the present invention, there is provided the coat thickness adjusting apparatus according to the first aspect, wherein a trim base on which trim shields having different trim intervals are fixed along the longitudinal direction of the target is provided. A trim shield having a polygonal shape and having a different trim interval pattern on each side is attached. Therefore, in addition to the effect of the coat film thickness adjusting device of the first aspect, more types of trim interval patterns can be provided.

[Brief description of the drawings]

FIG. 1 is a diagram showing an example of an embodiment of a main part configuration of a coat film thickness adjusting device of a sputtering device according to the present invention.

FIG. 2 is a side view showing one example of another embodiment of a trim base of a sputtering apparatus used in the coating method of the present invention.

FIG. 3 is a diagram illustrating an example of a peripheral structure of a trim shield of a sputtering apparatus used in a conventional coating method.

FIG. 4 is a diagram showing an example of a main part structure of a conventional sputtering apparatus configured to be able to adjust a gap between a pair of trim shields.

[Explanation of symbols]

13 ... target, 14 ... work, 21a ... one first trim shield, 21b ... one second trim shield, 22a ... the other first trim shield,
21b ... the other second trim shield, 23 and 24 ...
... Rotable trim base

Claims (2)

[Claims] 1. A sputtering apparatus used in a step of forming an optical thin film by coating a front glass of a cathode ray tube with a multilayer film, wherein the sputtering apparatus includes a target (sputtering cathode), and the target and the optical thin film are formed. In a sputtering apparatus provided between a front glass of a cathode ray tube and a pair of trim shields for controlling a film thickness respectively attached to two trim bases, the two trim bases have means rotatable from outside. A pair of the film thickness control trim shields, at least two of which are arranged at any opposing intervals along the long axis direction.
A coating film thickness adjusting device having three trim interval patterns. 2. A trim base to which trim shields with different trim intervals are fixed along the longitudinal direction of the target has a side surface shape of a polygon, and a trim shield having a different trim interval pattern is attached to each side. The coating film thickness adjusting device according to claim 1, wherein: