TWI827905B - Magnetron sputtering coating device and working method - Google Patents

Abstract

A magnetron sputtering coating device and its working method, wherein the magnetron sputtering coating device includes: a vacuum coating chamber; a rotatable workpiece frame that can rotate in the vacuum coating chamber along its central axis and has a plurality of side walls; a plurality of side walls Used to carry the workpiece to be coated; at least one magnetron sputtering source is installed in the vacuum coating chamber with a gap between the workpiece to be coated and used to sputter coating material particles onto the surface of the workpiece to be coated; a position adjustment device for Adjust the position of the magnetron sputtering source. When the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjustment device adjusts the position of the magnetron sputtering source so that the magnetron sputtering source reaches the central axis. The distance gradually becomes larger. The coating produced by the magnetron sputtering coating device of the present invention has good uniformity.

Description

Magnetron sputtering coating device and its working method

The invention relates to the field of vacuum sputtering, and in particular to a magnetron sputtering coating device and a working method thereof.

In recent years, magnetron sputtering coating equipment has been increasingly used in industrial coating production. In particular, as the market for end products related to touch screens continues to heat up, magnetron sputtering coating equipment is used to prepare touch screens with excellent performance. Required coating has become one of the trends.

Existing magnetron sputtering coating devices usually include a vacuum coating chamber, a rotatable workpiece holder and a magnetron sputtering source. The rotatable workpiece holder can rotate along its central axis in the vacuum coating chamber in order to better carry multiple flat plates. Type of workpiece to be coated, the rotatable workpiece holder is set into a polyhedral structure, and the outer wall of the polyhedral structure is used to carry the workpiece to be coated, and the magnetron sputtering source is used to sputter the coating material onto the surface of the workpiece to be coated.

However, during the rotation of the rotatable workpiece holder, the rotation radii of each point on the workpiece to be coated are different, resulting in different distances from the magnetron sputtering source to different areas of the workpiece to be coated, resulting in a coating film formed on the surface of the workpiece to be coated. The thickness is inconsistent, which will bring inconsistency in color and optical performance to the end product.

The invention provides a magnetron sputtering coating device and a working method thereof to improve the uniformity of the thickness of the prepared coating.

The invention discloses a magnetron sputtering coating device, which includes: a vacuum coating chamber; a rotatable workpiece frame that can rotate along its central axis in the vacuum coating chamber, and has a plurality of side walls, and the plurality of side walls are used to carry the workpiece to be coated; at least one The magnetron sputtering source is installed in the vacuum coating chamber with a gap between the workpiece to be coated and is used to sputter coating material particles onto the surface of the workpiece to be coated; the position adjustment device is used to adjust the position of the magnetron sputtering source. When the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjustment device adjusts the position of the magnetron sputtering source so that the distance from the magnetron sputtering source to the central axis gradually becomes larger.

Preferably, when the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the edge to the center, the position adjustment device adjusts the distance between the magnetron sputtering source and the central axis to gradually decrease.

Preferably, the distance from the central axis to the center of the workpiece to be coated is the first distance, the distance from the central axis to the edge of the workpiece to be coated is the second distance, and the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge. During the process, the position adjustment device moves the magnetron sputtering source less than twice the difference between the second distance and the first distance.

Preferably, when the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjustment device moves the magnetron sputtering source by a distance less than or equal to the difference between the second distance and the first distance.

Preferably, when the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjustment device moves the magnetron sputtering source by a distance greater than or equal to the difference between the second distance and the first distance. Eighty percent and less than or equal to 1.2 times the difference between the second distance and the first distance.

Preferably, during the rotation of the rotatable workpiece frame along its central axis, the position adjustment device continuously adjusts the position of the magnetron sputtering source, so that when the magnetron sputtering source faces different areas of the workpiece to be coated, the magnetron sputtering There is an equal distance between the source and the workpiece to be coated.

Preferably, the workpiece to be coated is arranged on the outer wall of the rotatable workpiece frame, and the magnetron sputtering source is arranged outside the rotatable workpiece frame.

Preferably, the workpiece to be coated is arranged on the inner wall of the rotatable workpiece frame, and the magnetron sputtering source is arranged in the rotatable workpiece frame.

Preferably, the number of magnetron sputtering sources is greater than or equal to 2, and the position of each magnetron sputtering source can be controlled independently.

Preferably, the position adjustment device is used to move the magnetron sputtering source toward or away from the central axis.

Preferably, the position adjustment device includes a bellows.

Preferably, the position adjustment device is used to swing the magnetron sputtering source, and the swing direction of the magnetron sputtering source is the same as or opposite to the rotation direction of the rotatable workpiece frame.

Preferably, the swing angle of the magnetron sputtering source is less than or equal to 30 degrees.

Preferably, the magnetron sputtering coating device of the present invention further includes: a controller for determining the positional relationship between the magnetron sputtering source and the workpiece to be coated according to the rotation angle of the rotatable workpiece frame to start the position adjustment device.

Preferably, each side wall is used to carry one or a plurality of workpieces to be coated.

Preferably, the rotatable workpiece holder has a polyhedral structure, the polyhedral structure includes a plurality of side walls; the plurality of side walls are flat surfaces, and the workpiece to be coated is a flat workpiece.

Preferably, along the height direction of the rotatable workpiece holder, the size of the magnetron sputtering source is greater than or equal to the size of the workpiece to be coated.

Preferably, along the height direction of the rotatable workpiece frame, the size of the magnetron sputtering source is smaller than the size of the workpiece to be coated, and the sputtering coating device further includes: a height adjustment device for adjusting the magnetron sputtering source along the height direction of the rotatable workpiece frame. The rotating workpiece holder moves in the height direction.

Correspondingly, the present invention further provides a working method of the above-mentioned magnetron sputtering coating device, which includes: providing the above-mentioned magnetron sputtering coating device; when the position where the workpiece to be coated and the magnetron sputtering source are arranged relative to each other rotates from the center to the edge. , use the position adjustment device to adjust the position of the magnetron sputtering source so that the distance from the magnetron sputtering source to the central axis gradually becomes larger.

Compared with the prior art, the technical solution of the present invention has the following beneficial effects: In the magnetron sputtering coating device provided by the present invention, when the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position is used to The adjusting device adjusts the position of the magnetron sputtering source so that the distance between the magnetron sputtering source and the central axis gradually becomes larger. Then, the difference in distance between the magnetron sputtering source and the surface of the workpiece to be coated is small. Therefore, it is beneficial to improve the coating efficiency. The uniformity of the thickness of the coating formed on the surface of the workpiece.

1,1’:curve

6: Rotatable workpiece holder

61: Lateral wall

62: Medial wall

70: Magnetron sputtering source

71:Position adjustment device

8:Heating device

9: Plasma source

10: Vacuum coating room

H: height

H1: first distance

H2: second distance

B,N: center

C1,C2: edge

O: central axis

S: Workpiece to be coated

a: direction

x: abscissa

y: vertical coordinate

S1, S2: steps

Fig. 1 is a schematic top view of a magnetron sputtering coating device of the present invention; Fig. 2 is the area between the workpiece to be coated and the magnetron sputtering source in the magnetron sputtering coating device in Fig. 1 and the distance from the workpiece to be coated to the central axis relationship diagram; Figure 3 is a schematic side view of the magnetron sputtering coating device in Figure 1; Figure 4 is another schematic side view of the magnetron sputtering coating device in Figure 1; Figure 5 is another schematic side view of the present invention A schematic top view of the magnetron sputtering coating device when the edge area of the coated workpiece is opposite to the magnetron sputtering source; Figure 6 is another magnetron sputtering coating device of the present invention when the edge area of the coated workpiece is opposite to the magnetron sputtering source. 7 is a flow chart of the working method of the magnetron sputtering coating device of the present invention.

The invention provides a magnetron sputtering coating device, which includes: a vacuum coating chamber; a rotatable workpiece frame that can rotate along its central axis in the vacuum coating chamber, and has a plurality of side walls, and the plurality of side walls are used to carry the workpiece to be coated; at least one The magnetron sputtering source is installed in the vacuum coating chamber with a gap between the workpiece to be coated and is used to sputter coating material particles onto the surface of the workpiece to be coated; the position adjustment device is used to adjust the position of the magnetron sputtering source. When the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjustment device adjusts the position of the magnetron sputtering source so that the distance from the magnetron sputtering source to the central axis gradually becomes larger. The magnetron sputtering coating device can continuously adjust the distance between the magnetron sputtering source and the workpiece to be coated, so that the distance difference between the magnetron sputtering source and different areas of the workpiece to be coated is small, and the uniformity of the prepared coating is Better.

In order to make the above objects, features and beneficial effects of the present invention more obvious and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings.

Figure 1 is a schematic top view of a magnetron sputtering coating device of the present invention.

Please refer to Figure 1. The magnetron sputtering coating device of the present invention includes: a vacuum coating chamber 10; a rotatable workpiece frame 6, which can rotate in the vacuum coating chamber 10 along its central axis O, and has a plurality of side walls, and a plurality of side walls. On carrying the workpiece S to be coated; at least one magnetron sputtering source 70 is disposed in the vacuum coating chamber 10 with a gap between the workpiece S to be coated and used to sputter coating material particles onto the surface of the workpiece S to be coated; position The adjusting device 71 is used to adjust the position of the magnetron sputtering source 70. When the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the center B to the edge C1, the position adjusting device 71 adjusts the magnetron sputtering source. 70, so that the distance between the magnetron sputtering source 70 and the central axis O gradually becomes larger.

The vacuum coating chamber 10 is in a vacuum environment. The surface of the workpiece S to be coated completes the coating process in the vacuum coating chamber 10 and a coating is formed on the surface of the workpiece S to be coated.

In this embodiment, the workpiece S to be coated is disposed on the outer side wall 61 of the rotatable workpiece frame 6, the magnetron sputtering source 70 is disposed outside the rotatable workpiece frame 6, and the magnetron sputtering source 70 is used to spray the workpiece to be coated. Coating material particles are sputtered on the surface of S to form a coating on the surface of the workpiece S to be coated.

The distance from the central axis O to the center B of the workpiece S to be coated is the first distance H1, and the distance from the central axis O to the edge C1 of the workpiece S to be coated is the second distance H2. It can be known from geometric knowledge: the more faces the polyhedral structure has, the The smaller the difference between the first distance H1 and the second distance H2. On the contrary, the smaller the number of faces of the polyhedral structure, the larger the difference between the first distance H1 and the second distance H2. The difference between the first distance H1 and the second distance H2 will determine the difference in thickness of the film coated at the center and edge of the workpiece S to be coated. When the difference between the first distance H1 and the second distance H2 is smaller, the surface of the workpiece S to be coated will be smaller. The better the thickness consistency of the deposited film.

In this embodiment, the rotatable workpiece frame 6 is a hexahedron as an example. Correspondingly, the rotatable workpiece frame 6 has six outer walls 61, and the six outer walls 61 are planes. The workpiece S to be coated is Flat workpiece. In other embodiments, the rotatable workpiece holder is other polyhedral structure.

During the rotation of the rotatable workpiece frame 6 along its central axis O, the position adjustment device 71 can continuously adjust the position of the magnetron sputtering source 70. In Figure 1, the abscissa x is established parallel to the outer wall 61 and perpendicular to the outer wall 61. The outer wall 61 establishes an ordinate y, and the ordinate y passes through the central axis O. The intersection of the ordinate y and the abscissa x is the center B of the workpiece S to be coated. The abscissas on both sides of the center B of the workpiece S to be coated have edges C1, C2 is described in detail below with reference to Figure 2: Figure 2 is a relationship diagram between the area between the workpiece S to be coated and the magnetron sputtering source 70 in the magnetron sputtering coating device in Figure 1 and the distance from the workpiece to be coated to the central axis O. .

Please refer to Figure 2. The abscissa x represents the relative area between the workpiece S to be coated and the magnetron sputtering source 70, and the ordinate y represents the distance from the magnetron sputtering source 70 to the central axis O.

Among them, the relative position between the workpiece S to be coated and the magnetron sputtering source 70 means that the center of the magnetron sputtering source 70 is defined as N. When a certain point on the workpiece S to be coated is located on the ON line, the workpiece S to be coated is considered to be This point is opposite the magnetron sputtering source 70 .

Please combine Figure 1 and Figure 2. When the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the center B to the edge C1, use the position adjustment device 71 to adjust the position of the magnetron sputtering source 70, so that the magnetron sputtering source 70 rotates from the center B to the edge C1. As the distance between the sputtering source 70 and the central axis O gradually becomes larger (see curve 1' in Figure 2), the workpiece S to be coated will be different. The distance difference between the area and the magnetron sputtering source 70 is small, so that the difference in the amount of coating material particles sputtered by the magnetron sputtering source 70 onto the surface of the workpiece S to be coated is small, and then the particles formed on the surface of the workpiece S to be coated are The coating thickness consistency is better.

Specifically, when the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the center B to the edge C1, when the position adjustment device 71 moves the magnetron sputtering source 70 less than the second distance H2 and the first distance H1, the distance between the magnetron sputtering source 70 and the center B of the workpiece S to be coated is slightly greater than the distance from the magnetron sputtering source 70 to the edge C1, so that the thickness of the coating at the center of the workpiece S to be coated is slightly thinner than The thickness of the edge coating, but at this time, the difference in coating thickness between edge C1 and center B is within the acceptable range, that is, the consistency of the coating thickness on the surface of the workpiece S to be coated is good.

In the process of the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotating from the center B to the edge C1, continue to use the position adjustment device 71 to increase the moving distance of the magnetron sputtering source 70. When the magnetron sputtering When the distance moved by the source 70 is equal to the difference between the second distance H2 and the first distance H1, the distance from the center B and edge C1 of the workpiece S to be coated to the magnetron sputtering source 70 is equal, then the coating thickness of different areas on the surface of the workpiece S to be coated is The consistency is better.

In the process of the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotating from the center B to the edge C1, the position adjustment device 71 is used to further increase the moving distance of the magnetron sputtering source 70. When the magnetron sputtering The distance that the source 70 moves is greater than the difference between the second distance H2 and the first distance H1 and less than 2 times the difference between the second distance H2 and the first distance H1, so that the distance from the center B of the workpiece S to be coated to the magnetron sputtering source 70 is slightly is less than the distance from the edge C1 to the magnetron sputtering source 70, so that the thickness of the coating in the center of the workpiece S to be coated is slightly thicker than the thickness of the edge coating, but at this time, the difference in the thickness of the coating between the edge C1 and the center B is within the acceptable range, that is, The coating thickness on the surface of the workpiece S to be coated has good consistency.

In the process of the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotating from the center B to the edge C1, when the position adjustment device 71 moves the magnetron sputtering source 70 by a distance greater than or equal to the second distance H2 and the first distance H2. Eighty percent of the difference between the distance H1 and less than or equal to the difference between the second distance H2 and the first distance H1 1.2 times the difference makes the distance difference between the center B and edge C1 of the workpiece S to be coated and the magnetron sputtering source 70 smaller, which is conducive to the consistency of the coating thickness in different areas of the surface of the workpiece S to be coated.

Please combine Figure 1 and Figure 2. When the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the edge C2 to the center B, the position adjustment device 71 adjusts the distance between the magnetron sputtering source 70 and the central axis O. gradually decreases (see curve 1 in Figure 2), then the distance difference between different areas of the workpiece S to be coated and the magnetron sputtering source 70 is small, so that the magnetron sputtering source 70 sputters towards the surface of the workpiece S to be coated. If the difference in the amount of coating material particles is small, the thickness of the coating formed on the surface of the workpiece S to be coated will be more consistent.

The process of the relative position of the workpiece S to be coated and the magnetron sputtering source 70 moving from the center B to the edge C1 is the same as the process of the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotating from the edge C2 to the center B. , the position adjustment device 71 makes the distance adjusted by the magnetron sputtering source 70 less than twice the difference between the second distance H2 and the first distance H1, so that the difference between the edge C2 of the workpiece S to be coated and the center B is small, which is beneficial to improving The consistency of the coating thickness formed by the edge C2 of the workpiece to be coated and the center B.

In summary, the position adjustment device 71 can be used to continuously adjust the distance between the magnetron sputtering source 70 and the surface of the workpiece S to be coated, so that the distance difference between the magnetron sputtering source 70 and the surface of the workpiece S to be coated is small, which is beneficial to improving the The consistency of the coating thickness on the surface of the workpiece S to be coated.

In this embodiment, during the rotation of the rotatable workpiece frame 6 along its central axis O, the position adjustment device 71 continuously adjusts the position of the magnetron sputtering source 70 so that the magnetron sputtering source 70 is in contact with the workpiece S to be coated. When different positions are opposite, the distance between the magnetron sputtering source 70 and the workpiece S to be coated is the same, so that the distance between the magnetron sputtering source 70 and the workpiece S to be coated is the same, then the thickness of the coating formed on the surface of the workpiece S to be coated is same.

In this embodiment, the position adjustment device 71 is used to make the magnetron sputtering source 70 move toward the central axis O or away from the central axis O. Specifically, the position adjustment device 71 includes a bellows. The bellows can not only move the position of the magnetron sputtering source 70 , but also further ensure the vacuum in the vacuum coating chamber 10 during the movement of the magnetron sputtering source 70 . The environment is not destroyed.

In this embodiment, the number of magnetron sputtering sources 70 is three, and the three magnetron sputtering sources 70 are evenly distributed along the inner wall of the vacuum coating chamber 10 . In other embodiments, the number of magnetron sputtering sources can also be other values. When the number of magnetron sputtering sources is a plurality, the plurality of magnetron sputtering sources are distributed along the side wall of the vacuum coating chamber, and are relatively The distance between two adjacent magnetron sputtering sources is unequal.

In this embodiment, the significance of arranging a plurality of magnetron sputtering sources 70 is that since the rotatable workpiece frame 6 rotates along the central axis O, the workpiece S to be coated sequentially passes through a plurality of magnetron sputtering sources 70. The controlled sputtering sources 70 are all used to coat the surface of the workpiece S to be coated. Therefore, it is beneficial to improve the coating efficiency of the workpiece S to be coated.

In this embodiment, the number of magnetron sputtering sources 70 is greater than or equal to 2, and the position of each magnetron sputtering source can be independently controlled, so that the distances between different magnetron sputtering sources 70 and the surface of the workpiece S to be coated are adjusted mutually. are not affected, which is conducive to more accurately improving the uniformity of the coating thickness on the surface of the workpiece S to be coated.

In one embodiment, the position of a magnetron sputtering source 70 is adjusted through a position adjustment device 71 .

In another embodiment, the position of a magnetron sputtering source 70 is adjusted through a plurality of position adjustment devices 71 .

In this embodiment, each outer side wall 61 carries a workpiece S to be coated as an example for description. In other embodiments, each outer side wall carries a plurality of workpieces to be coated.

In this embodiment, it further includes: plasma source 9. The plasma source 9 is used to generate plasma. The sputtering process requires plasma. The electric field is used to accelerate the ions in the plasma to bombard the magnetron sputtering source. The magnetron sputtering After being bombarded, the particles on the source quickly fly toward the surface of the workpiece to be coated to form a coating. .

In other embodiments, only a magnetron sputtering source is included and no plasma source is included. In this embodiment, the number of plasma sources 9 is assumed to be one. In other embodiments, the number of plasma sources 9 may be further plural.

In this embodiment, it further includes: a plasma source position adjusting device for adjusting the position of the plasma source 9 .

In this embodiment, it further includes: a heating device 8 located in the rotatable workpiece frame 6 for heating the workpiece S to be coated during the sputtering process.

FIG. 3 is a schematic side view of the magnetron sputtering coating device in FIG. 1 .

In this embodiment, along the height H direction of the rotatable workpiece rack 6, the number of workpieces S to be coated is two.

In other embodiments, along the height direction of the rotatable workpiece rack, the number of workpieces to be coated is one, or the number of workpieces to be coated is greater than two.

In this embodiment, the workpiece S to be coated is circular. In other embodiments, the shape of the workpiece to be coated may further be other shapes.

In this embodiment, along the height H direction of the rotatable workpiece frame 6, the size of the magnetron sputtering source 70 is equal to the size of the two workpieces S to be coated, so that the magnetron sputtering source 70 moves along the direction of the rotatable workpiece S to be coated. The height direction of rack 6 can be fully coated at one time.

In other embodiments, along the height direction of the rotatable workpiece frame, the size of the magnetron sputtering source is larger than the size of the workpiece to be coated, and the magnetron sputtering source can perform one operation on the workpiece to be coated along the height direction of the rotatable workpiece frame. Fully coated.

FIG. 4 is another schematic side view of the magnetron sputtering coating device in FIG. 1 .

In one embodiment, along the height H direction of the rotatable workpiece frame 6, the size of the magnetron sputtering source 70 is smaller than the size of the workpiece S to be coated, so that the magnetron sputtering source 70 can only move the workpiece S to be coated along the rotatable workpiece frame. 6 Partial areas in the height direction are coated. The magnetron sputtering coating device further includes: a height adjustment device for moving the magnetron sputtering source 70 along the height direction of the rotatable workpiece frame 6 . When the thickness of the coating on the workpiece S to be coated reaches the thickness requirement using the magnetron sputtering source 70, the magnetron sputtering source 70 can be adjusted along the height direction of the rotatable workpiece frame 6 through the height adjustment device, so that the magnetron sputtering source 70 corresponding to be plated The area of the film workpiece S that has not been sputtered is again sputtered by the magnetron sputtering coating device until all areas of the workpiece S to be coated are coated.

In this embodiment, the shape of the workpiece S to be coated is square. In other embodiments, the workpiece to be coated may further have other shapes.

Figure 5 is a schematic top view of another magnetron sputtering coating device of the present invention.

In this embodiment, the workpiece S to be coated is located on the inner wall 62 of the rotatable workpiece frame 6 , the magnetron sputtering source 70 is located inside the rotatable workpiece frame 6 , and the heating device 8 is located outside the rotatable workpiece frame 6 .

When the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the center B to the edge C1, the position adjustment device 71 causes the magnetron sputtering source 70 to adjust a distance smaller than the second distance H2 and the first distance H1 2 times the difference makes the difference between the edge C1 of the workpiece S to be coated and the center B smaller, which is beneficial to improving the consistency of the thickness of the coating formed between the edge C1 and the center B of the workpiece S to be coated. Similarly, when the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the edge C2 to the center B, the position adjustment device 71 makes the distance adjusted by the magnetron sputtering source 70 smaller than the second distance H2 and the third distance. A distance H1 that is twice the difference makes the difference between the edge C2 of the workpiece S to be coated and the center B smaller, which is beneficial to improving the consistency of the thickness of the coating formed between the edge C2 of the workpiece to be coated and the center B.

Figure 6 is a schematic top view of yet another magnetron sputtering coating device of the present invention.

In this embodiment, the position adjustment device 71 swings in the direction a, driving the magnetron sputtering source 70 to swing in the direction a, so that the distance from the edge of the workpiece S to be coated to the magnetron sputtering source 70 is equal to the distance from the center of the workpiece S to be coated to the magnetron sputtering source 70 . Controlling the distance difference between the sputtering sources 70 is small, which is beneficial to improving the thickness consistency of the coating formed on the surface of the workpiece S to be coated.

In this embodiment, the swing angle of the magnetron sputtering source 70 is less than 30 degrees. On the one hand, it is helpful to reduce the difficulty of swinging the magnetron sputtering source 70. On the other hand, it makes different areas of the workpiece S to be coated and the magnetron sputtering The difference in distance between the radiation sources 70 when facing each other is small, which is beneficial to improving the thickness uniformity of the coating formed on the surface of the workpiece S to be coated.

Correspondingly, the present invention further provides a working method of the above-mentioned magnetron sputtering coating device, which will be described in detail below: FIG. 7 is a flow chart of the working method of the magnetron sputtering coating device of the present invention.

Please refer to Figure 7, Step S1: Provide the above-mentioned magnetron sputtering coating device; Step S2: When the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, use the position adjustment device to adjust the magnetron sputtering The position of the source makes the distance between the magnetron sputtering source and the central axis gradually become larger.

When the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, use the position adjustment device to adjust the position of the magnetron sputtering source so that the distance from the magnetron sputtering source to the central axis gradually becomes larger. The difference in distance between the magnetron sputtering source and the surface of the workpiece to be coated is small. Therefore, it is beneficial to improve the uniformity of the thickness of the coating formed on the surface of the workpiece to be coated.

Although the content of the present invention has been described in detail through the above preferred embodiments, it should be understood that the above description should not be considered as limiting the present invention. Various modifications and alternatives to the present invention will be apparent to those of ordinary skill in the art upon reading the above. Therefore, the protection scope of the present invention should be limited by the appended patent application scope.

S1, S2: steps

Claims (19)

A magnetron sputtering coating device, which includes: a vacuum coating chamber; a rotatable workpiece frame that can rotate along a central axis in the vacuum coating chamber and has a plurality of side walls, and the plurality of side walls are used to carry a film to be coated Workpiece; at least one magnetron sputtering source, installed in the vacuum coating chamber, with a gap between the workpiece to be coated, for sputtering coating material particles onto the surface of the workpiece to be coated; a position adjustment device for adjusting The position of the magnetron sputtering source. When the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjustment device adjusts the position of the magnetron sputtering source so that the magnetron sputtering source rotates from the center to the edge. The distance between the radiation source and the central axis gradually becomes larger; when the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the edge to the center, the position adjustment device adjusts the magnetron sputtering source to the central axis. The distance gradually decreases. The magnetron sputtering coating device of claim 1, wherein the distance from the central axis to the center of the workpiece to be coated is a first distance, and the distance from the central axis to the edge of the workpiece to be coated is a second distance, and the When the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjustment device causes the magnetron sputtering source to move a distance less than 2 times the difference between the second distance and the first distance. times. The magnetron sputtering coating device according to claim 2, wherein the position adjustment device moves the magnetron sputtering source when the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge. The distance is less than or equal to the difference between the second distance and the first distance. The magnetron sputtering coating device as described in claim 2, wherein the workpiece to be coated and When the relative position of the magnetron sputtering source rotates from the center to the edge, the position adjustment device moves the magnetron sputtering source by a distance greater than or equal to a percentage of the difference between the second distance and the first distance. Eighty and less than or equal to 1.2 times the difference between the second distance and the first distance. The magnetron sputtering coating device as described in claim 1, wherein during the rotation of the rotatable workpiece frame along the central axis, the position adjustment device continuously adjusts the position of the magnetron sputtering source, so that the magnetron sputtering When the source is opposite to different areas of the workpiece to be coated, the magnetron sputtering source is at an equal distance from the workpiece to be coated. The magnetron sputtering coating device according to claim 1, wherein the workpiece to be coated is arranged on the outer wall of the rotatable workpiece frame, and the magnetron sputtering source is arranged outside the rotatable workpiece frame. The magnetron sputtering coating device according to claim 1, wherein the workpiece to be coated is arranged on the inner wall of the rotatable workpiece frame, and the magnetron sputtering source is arranged in the rotatable workpiece frame. The magnetron sputtering coating device as claimed in claim 1, wherein the number of the magnetron sputtering sources is greater than or equal to 2, and the position of each magnetron sputtering source can be controlled independently. The magnetron sputtering coating device as claimed in claim 1, wherein the position adjustment device is used to move the magnetron sputtering source toward the central axis or away from the central axis. The magnetron sputtering coating device according to claim 9, wherein the position adjustment device includes a bellows. The magnetron sputtering coating device according to claim 1, wherein the position adjustment device is used to swing the magnetron sputtering source, and the swing direction of the magnetron sputtering source is the same as the rotation direction of the rotatable workpiece frame. Or vice versa. The magnetron sputtering coating device according to claim 11, wherein the swing angle of the magnetron sputtering source is less than or equal to 30 degrees. The magnetron sputtering coating device according to claim 1, further comprising: a controller for determining the positional relationship between the magnetron sputtering source and the workpiece to be coated according to the rotation angle of the rotatable workpiece frame, so as to Activate the position adjustment device. The magnetron sputtering coating device as claimed in claim 1, wherein each side wall is used to carry one or a plurality of the workpieces to be coated. The magnetron sputtering coating device of claim 1, wherein the rotatable workpiece holder is a polyhedral structure, the polyhedral structure includes the plurality of side walls; the plurality of side walls are planes, and the workpiece to be coated is a flat workpiece. The magnetron sputtering coating device as claimed in claim 1, wherein along the height direction of the rotatable workpiece frame, the size of the magnetron sputtering source is greater than or equal to the size of the workpiece to be coated. The magnetron sputtering coating device according to claim 1, wherein along the height direction of the rotatable workpiece frame, the size of the magnetron sputtering source is smaller than the size of the workpiece to be coated, and the magnetron sputtering coating device further It includes: a height adjustment device for moving the magnetron sputtering source along the height direction of the rotatable workpiece frame. The magnetron sputtering coating device according to claim 1, wherein the magnetron sputtering coating device further includes at least one plasma source, and the position of the plasma source is adjustable. A working method of a magnetron sputtering coating device, which includes: providing a magnetron sputtering coating device as described in any one of claims 1 to 18; When the relative position of the workpiece to be coated and the magnetron sputtering source is rotated from the center to the edge, the position adjustment device is used to adjust the position of the magnetron sputtering source so that the magnetron sputtering source reaches the position of the central axis. The distance gradually increases.

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