CN113493902A - Magnetron sputtering coating device and working method thereof - Google Patents

Magnetron sputtering coating device and working method thereof Download PDF

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Publication number
CN113493902A
CN113493902A CN202010196863.6A CN202010196863A CN113493902A CN 113493902 A CN113493902 A CN 113493902A CN 202010196863 A CN202010196863 A CN 202010196863A CN 113493902 A CN113493902 A CN 113493902A
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China
Prior art keywords
magnetron sputtering
workpiece
coated
sputtering source
distance
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CN202010196863.6A
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Chinese (zh)
Inventor
杜志游
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Advanced Micro Fabrication Equipment Inc Shanghai
Advanced Micro Fabrication Equipment Inc
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Advanced Micro Fabrication Equipment Inc Shanghai
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Priority to CN202010196863.6A priority Critical patent/CN113493902A/en
Priority to TW110102041A priority patent/TWI827905B/en
Publication of CN113493902A publication Critical patent/CN113493902A/en
Pending legal-status Critical Current

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/54—Controlling or regulating the coating process

Abstract

A magnetron sputtering coating device and a working method thereof are provided, wherein the magnetron sputtering coating device comprises: a vacuum coating chamber; the rotatable workpiece frame can rotate in the vacuum coating chamber along the central axis of the rotatable workpiece frame and is provided with a plurality of side walls, and the side walls are used for bearing workpieces to be coated; at least one magnetron sputtering source which is arranged in the vacuum coating chamber, has a gap with the workpiece to be coated and is used for sputtering coating material particles on the surface of the workpiece to be coated; and the position adjusting device is used for adjusting the position of the magnetron sputtering source, and when the position of the workpiece to be coated, which is opposite to the magnetron sputtering source, rotates from the center to the edge, the position adjusting device adjusts the position of the magnetron sputtering source, so that the distance from the magnetron sputtering source to the central shaft is gradually increased. The coating film prepared by the magnetron sputtering coating device has good uniformity.

Description

Magnetron sputtering coating device and working method thereof
Technical Field
The invention relates to the field of vacuum sputtering, in particular to a magnetron sputtering coating device and a working method thereof.
Background
In recent years, magnetron sputtering coating devices are increasingly widely applied to industrial coating production, and particularly, as the market of terminal products related to touch screens is continuously increased in temperature, the magnetron sputtering coating devices are used for preparing coatings with excellent performance, which are required by the touch screens, become one of trends.
The conventional magnetron sputtering coating device generally comprises a vacuum coating chamber, a rotatable workpiece holder and a magnetron sputtering source, wherein the rotatable workpiece holder can rotate in the vacuum coating chamber along a central axis thereof, in order to better bear a plurality of flat-plate workpieces to be coated, the rotatable workpiece holder is arranged in a polyhedral structure, an outer side wall of the polyhedral structure is used for bearing the workpieces to be coated, and the magnetron sputtering source is used for sputtering coating materials to the surfaces of the workpieces to be coated.
However, during the rotation of the rotatable workpiece holder, the rotation radius of each point on the workpiece to be coated is different, so that the distances from the magnetron sputtering source to different areas of the workpiece to be coated are different, which results in inconsistent thickness of the coating formed on the surface of the workpiece to be coated, and this brings inconsistency of color and optical performance to the end product.
Disclosure of Invention
The invention provides a magnetron sputtering coating device and a working method thereof, which aim to improve the uniformity of the thickness of a prepared coating.
The invention discloses a magnetron sputtering coating device, which comprises: a vacuum coating chamber; the rotatable workpiece frame can rotate in the vacuum coating chamber along the central axis of the rotatable workpiece frame and is provided with a plurality of side walls, and the side walls are used for bearing workpieces to be coated; at least one magnetron sputtering source which is arranged in the vacuum coating chamber, has a gap with the workpiece to be coated and is used for sputtering coating material particles on the surface of the workpiece to be coated; and the position adjusting device is used for adjusting the position of the magnetron sputtering source, and when the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjusting device adjusts the position of the magnetron sputtering source so that the distance from the magnetron sputtering source to the central shaft is gradually increased.
Optionally, when the relative position between the workpiece to be coated and the magnetron sputtering source rotates from the edge to the center, the position adjusting device adjusts the distance from the magnetron sputtering source to the central shaft to gradually decrease.
Optionally, a distance from the central shaft to the center of the workpiece to be coated is a first distance, a distance from the central shaft to the edge of the workpiece to be coated is a second distance, and in a process that the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjusting device makes a moving distance of the magnetron sputtering source smaller than 2 times a difference between the second distance and the first distance.
Optionally, in the process that the relative position between the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjusting device makes the distance that the magnetron sputtering source moves be less than or equal to the difference between the second distance and the first distance.
Optionally, in the process that the relative position between the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjusting device makes the magnetron sputtering source move by a distance greater than or equal to eighty percent of the difference between the second distance and the first distance and less than or equal to 1.2 times of the difference between the second distance and the first distance.
Optionally, in the process that the rotatable workpiece holder rotates along the central axis thereof, the position adjusting device continuously adjusts the position of the magnetron sputtering source, so that when the magnetron sputtering source is opposite to different areas of the workpiece to be coated, the magnetron sputtering source has an equal distance to the workpiece to be coated.
Optionally, the workpiece to be coated is arranged on the outer side wall of the rotatable workpiece frame, and the magnetron sputtering source is arranged outside the rotatable workpiece frame.
Optionally, the workpiece to be coated is disposed on an inner sidewall of the rotatable workpiece holder, and the magnetron sputtering source is disposed in the rotatable workpiece holder.
Optionally, the number of the magnetron sputtering sources is greater than or equal to 2, and the position of each magnetron sputtering source can be independently controlled.
Optionally, the position adjusting device is configured to move the magnetron sputtering source towards the central axis or away from the central axis.
Optionally, the position adjustment device comprises a bellows.
Optionally, the position adjusting device is configured to swing the magnetron sputtering source, and a swinging direction of the magnetron sputtering source is the same as or opposite to a rotation direction of the rotatable workpiece holder.
Optionally, the swinging angle of the magnetron sputtering source is less than or equal to 30 degrees.
Optionally, the method further includes: and the controller is used for determining the position relation between the magnetron sputtering source and the workpiece to be coated according to the rotating angle of the rotatable workpiece frame so as to start the position adjusting device.
Optionally, each of the side walls is used for carrying one or more workpieces to be coated.
Optionally, the rotatable workpiece holder is a polyhedral structure, and the polyhedral structure comprises a plurality of side walls; the side wall is a plane, and the workpiece to be coated is a flat-plate workpiece.
Optionally, in the height direction of the rotatable workpiece holder, the size of the magnetron sputtering source is greater than or equal to the size of the workpiece to be coated.
Optionally, in the height direction of the rotatable workpiece holder, the size of the magnetron sputtering source is smaller than the size of the workpiece to be coated, and the magnetron sputtering coating apparatus further includes: and the height adjusting device is used for enabling the magnetron sputtering source to move along the height direction of the rotatable workpiece rack.
Optionally, in the height direction of the rotatable workpiece holder, the dimension of the magnetron sputtering source is smaller than the dimension of the workpiece to be coated, and the method further includes: and the swinging device is used for swinging the workpiece to be coated back and forth.
Correspondingly, the invention also provides a working method of the magnetron sputtering coating device, which comprises the following steps: providing the magnetron sputtering coating device; when the position of the workpiece to be coated, which is opposite to the magnetron sputtering source, rotates from the center to the edge, the position of the magnetron sputtering source is adjusted by using a position adjusting device, so that the distance from the magnetron sputtering source to the central shaft is gradually increased.
Compared with the prior art, the technical scheme of the invention has the following beneficial effects:
in the magnetron sputtering coating device provided by the invention, when the position of the workpiece to be coated, which is arranged opposite to the magnetron sputtering source, rotates from the center to the edge, the position of the magnetron sputtering source is adjusted by the position adjusting device, so that the distance from the magnetron sputtering source to the central shaft is gradually increased, and the difference of the distance from the magnetron sputtering source to the surface of the workpiece to be coated is smaller, thereby being beneficial to improving the uniformity of the coating thickness formed on the surface of the workpiece to be coated.
Drawings
FIG. 1 is a schematic top view of a magnetron sputtering coating apparatus according to the present invention;
FIG. 2 is a diagram showing the relationship between the area of the magnetron sputtering coating device in FIG. 1 where the workpiece to be coated is opposite to the magnetron sputtering source and the distance from the workpiece to be coated to the central axis;
FIG. 3 is a schematic side view of the magnetron sputtering coating apparatus of FIG. 1;
FIG. 4 is another schematic side view of the magnetron sputter coating apparatus of FIG. 1;
FIG. 5 is a schematic top view of another magnetron sputtering coating device of the present invention, which is disposed opposite to the magnetron sputtering source in the edge area of the coated workpiece;
FIG. 6 is a schematic top view of a magnetron sputtering coating device according to another embodiment of the present invention, which is disposed opposite to a magnetron sputtering source in the edge region of a workpiece to be coated;
FIG. 7 is a flow chart of the working method of the magnetron sputtering coating device of the invention.
Detailed Description
The invention provides a magnetron sputtering coating device, comprising: a vacuum coating chamber; the rotatable workpiece frame can rotate in the vacuum coating chamber along the central axis of the rotatable workpiece frame and is provided with a plurality of side walls, and the side walls are used for bearing workpieces to be coated; at least one magnetron sputtering source which is arranged in the vacuum coating chamber, has a gap with the workpiece to be coated and is used for sputtering coating material particles on the surface of the workpiece to be coated; and the position adjusting device is used for adjusting the position of the magnetron sputtering source, and when the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjusting device adjusts the position of the magnetron sputtering source so that the distance from the magnetron sputtering source to the central shaft is gradually increased. The magnetron sputtering coating device can continuously adjust the distance between the magnetron sputtering source and the workpiece to be coated, so that the distance difference between the magnetron sputtering source and different areas of the workpiece to be coated is small, and the uniformity of the prepared coating is good.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
FIG. 1 is a schematic top view of a magnetron sputtering coating apparatus according to the present invention.
Referring to fig. 1, a vacuum coating chamber 10; the rotatable workpiece frame 6 can rotate in the vacuum coating chamber 10 along the central axis O thereof and is provided with a plurality of side walls for bearing a workpiece S to be coated; at least one magnetron sputtering source 70, disposed in the vacuum coating chamber 10, having a gap with the workpiece S to be coated, for sputtering coating material particles onto the surface of the workpiece S to be coated; and the position adjusting device 71 is configured to adjust the position of the magnetron sputtering source 70, and when the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the center B to the edge C1, the position adjusting device 71 adjusts the position of the magnetron sputtering source 70 so that the distance from the magnetron sputtering source 70 to the central axis O gradually increases.
The vacuum coating chamber 10 is in a vacuum environment, the surface of the workpiece S to be coated is subjected to a coating process in the vacuum coating chamber 10, and a coating film is formed on the surface of the workpiece S to be coated.
In this embodiment, the workpiece S to be coated is disposed on the outer sidewall 61 of the rotatable workpiece holder 6, the magnetron sputtering source 70 is disposed outside the rotatable workpiece holder 6, and the magnetron sputtering source 70 is configured to sputter particles of a coating material onto the surface of the workpiece S to be coated, so as to form a coating on the surface of the workpiece S to be coated.
The distance from the central axis O to the center B of the workpiece S to be coated is a first distance H1, the distance from the central axis O to the edge C1 of the workpiece S to be coated is a second distance H2, and the geometric knowledge shows that: the greater the number of faces of the polyhedral structure, the smaller the difference between the first distance H1 and the second distance H2, and conversely, the smaller the number of faces of the polyhedral structure, the greater the difference between the first distance H1 and the second distance H2. The difference between the first distance H1 and the second distance H2 determines the difference between the thickness of the film coated on the center and the edge of the workpiece S to be coated, and the smaller the difference between the first distance H1 and the second distance H2, the better the thickness uniformity of the film coated on the surface of the workpiece S to be coated.
In this embodiment, taking the rotatable workpiece holder 6 as a hexahedron as an example for explanation, correspondingly, the rotatable workpiece holder 6 has 6 outer side walls 61, and 6 outer side walls 61 are planes, and the workpiece S to be coated is a flat plate-shaped workpiece. In other embodiments, the rotatable workpiece holder is other polyhedral structures.
During the rotation of the rotatable workpiece holder 6 along the central axis O thereof, the position adjusting device 71 can continuously adjust the position of the magnetron sputtering source 70, in fig. 1, an abscissa x is established parallel to the outer sidewall 61, an ordinate y is established perpendicular to the outer sidewall 61, the ordinate y passes through the central axis O, an intersection point of the ordinate y and the abscissa x is a center B of the workpiece S to be coated, and the abscissa on both sides of the center B of the workpiece S to be coated has the edges C1 and C2, which is described in detail below with reference to fig. 2:
fig. 2 is a graph showing the relationship between the region of the magnetron sputtering coating apparatus in fig. 1 where the workpiece S to be coated is opposed to the magnetron sputtering source 70 and the distance from the workpiece to be coated to the central axis O.
Referring to fig. 2, an abscissa x represents a relative area of the workpiece S to be coated and the magnetron sputtering source 70, and an ordinate y represents a distance from the magnetron sputtering source 70 to the central axis O.
Wherein, the workpiece S to be coated is opposite to the magnetron sputtering source 70: the center of the magnetron sputtering source 70 is defined as N, and when a certain point ON the workpiece S to be coated is located ON the ON connection line, the point of the workpiece S to be coated is considered to be opposite to the magnetron sputtering source 70.
Referring to fig. 1 and fig. 2, when the relative position between the workpiece S to be coated and the magnetron sputtering source 70 rotates from the center B to the edge C1, the position adjusting device 71 is used to adjust the position of the magnetron sputtering source 70, so that the distance from the magnetron sputtering source 70 to the central axis O gradually increases (see the curve 1' in fig. 2), and then the distance difference between different areas of the workpiece S to be coated and the magnetron sputtering source 70 is smaller, so that the amount difference between the magnetron sputtering source 70 and the particles of the coating material sputtered on the surface of the workpiece S to be coated is smaller, and the uniformity of the thickness of the coating formed on the surface of the workpiece S to be coated is better.
Specifically, in the process that the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the center B to the edge C1, when the position adjusting device 71 moves the magnetron sputtering source 70 by a distance less than the difference between the second distance H2 and the first distance H1, the distance between the magnetron sputtering source 70 and the center B of the workpiece S to be coated is slightly greater than the distance between the magnetron sputtering source 70 and the edge C1, so that the thickness of the center coating of the workpiece S to be coated is slightly smaller than the thickness of the edge coating, but at this time, the difference between the thicknesses of the edge C1 and the center B is within an acceptable range, that is, the uniformity of the thickness of the coating on the surface of the workpiece S to be coated is better.
In the process that the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the center B to the edge C1, the position adjusting device 71 is continuously utilized to increase the moving distance of the magnetron sputtering source 70, and when the moving distance of the magnetron sputtering source 70 is equal to the difference between the second distance H2 and the first distance H1, the distances from the center B and the edge C1 of the workpiece S to be coated to the magnetron sputtering source 70 are equal, so that the consistency of the coating thickness of different areas on the surface of the workpiece S to be coated is better.
In the process that the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the center B to the edge C1, the position adjusting device 71 is used to further increase the moving distance of the magnetron sputtering source 70, and when the moving distance of the magnetron sputtering source 70 is greater than the difference between the second distance H2 and the first distance H1 and is less than 2 times the difference between the second distance H2 and the first distance H1, the distance from the center B of the workpiece S to be coated to the magnetron sputtering source 70 is slightly smaller than the distance from the edge C1 to the magnetron sputtering source 70, so that the thickness of the coating film at the center of the workpiece S to be coated is slightly thicker than the thickness of the coating film at the edge, but at this time, the difference between the thickness of the edge C1 and the thickness of the center B is within an acceptable range, that is, the consistency of the thickness of the coating film on the surface of the workpiece S to be coated is better.
In the process that the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the center B to the edge C1, when the position adjusting device 71 moves the magnetron sputtering source 70 by a distance greater than or equal to eighty percent of the difference between the second distance H2 and the first distance H1 and less than or equal to 1.2 times of the difference between the second distance H2 and the first distance H1, the distance difference between the center B and the edge C1 of the workpiece S to be coated and the magnetron sputtering source 70 is smaller, which is beneficial to further consistency of coating thickness of different areas on the surface of the workpiece S to be coated.
Referring to fig. 1 and fig. 2, when the position of the workpiece S to be coated, which is opposite to the magnetron sputtering source 70, rotates from the edge C2 to the center B, the position adjusting device 71 adjusts the distance from the magnetron sputtering source 70 to the central axis O to gradually decrease (see curve 1 in fig. 2), so that the distance difference between different areas of the workpiece S to be coated and the magnetron sputtering source 70 is small, so that the amount difference between the particles of the coating material sputtered by the magnetron sputtering source 70 onto the surface of the workpiece S to be coated is small, and the uniformity of the coating thickness formed on the surface of the workpiece S to be coated is good.
The same process as the process that the relative position of the workpiece S to be coated and the magnetron sputtering source 70 moves from the center B to the edge C1, when the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the edge C2 to the center B, the position adjusting device 71 makes the distance adjusted by the magnetron sputtering source 70 smaller than 2 times of the difference between the second distance H2 and the first distance H1, so that the difference between the edge C2 and the center B of the workpiece S to be coated is smaller, which is beneficial to improving the consistency of the coating thickness formed by the edge C2 and the center B of the workpiece to be coated.
In summary, the position adjusting device 71 can continuously adjust the distance from the magnetron sputtering source 70 to the surface of the workpiece S to be coated, so that the distance difference between the magnetron sputtering source 70 and the surface of the workpiece S to be coated is small, and the uniformity of the coating thickness of the surface of the workpiece S to be coated is improved.
In this embodiment, in the process that the rotatable workpiece holder 6 rotates along the central axis O thereof, the position adjusting device 71 continuously adjusts the position of the magnetron sputtering source 70, so that when the magnetron sputtering source 70 is opposite to different positions of the workpiece S to be coated, the magnetron sputtering source 70 has an equal distance to the workpiece S to be coated, so that the distance from the magnetron sputtering source 70 to the workpiece S to be coated is the same, and the thicknesses of the coatings formed on the surfaces of the workpiece S to be coated are the same.
In this embodiment, the position adjusting device 71 is used to make the magnetron sputtering source 70 movable toward the central axis O or away from the central axis O. Specifically, the position adjusting device 71 includes a bellows, which not only can move the position of the magnetron sputtering source 70, but also can ensure that the vacuum environment in the vacuum coating chamber 10 is not damaged during the movement of the magnetron sputtering source 70.
In this embodiment, the number of the magnetron sputtering sources 70 is 3, and the 3 magnetron sputtering sources 70 are uniformly distributed along the inner sidewall of the vacuum coating chamber 10. In other embodiments, the number of the magnetron sputtering sources may also be other values, and when the number of the magnetron sputtering sources is multiple, the magnetron sputtering sources are distributed along the inner side wall of the vacuum coating chamber, and the distance between two adjacent magnetron sputtering sources is different.
In the present embodiment, the significance of providing a plurality of magnetron sputtering sources 70 is that: the rotatable workpiece support 6 rotates along the central axis O, so that the workpiece S to be coated sequentially passes through the plurality of magnetron sputtering sources 70, and each magnetron sputtering source 70 is used for coating the surface of the workpiece S to be coated, thereby being beneficial to improving the coating efficiency of the workpiece S to be coated.
In this embodiment, the number of the magnetron sputtering sources 70 is greater than or equal to 2, and the position of each magnetron sputtering source can be independently controlled, so that the adjustment of the distance from different magnetron sputtering sources 70 to the surface of the workpiece S to be coated is not affected, and the uniformity of the coating thickness on the surface of the workpiece S to be coated is improved more accurately.
In one embodiment, a magnetron sputtering source 70 is positionally adjusted by a position adjustment device 71.
In another embodiment, one magnetron sputtering source 70 is position adjusted by a plurality of position adjustments 71.
In this embodiment, each of the outer sidewalls 61 is used to support a workpiece S to be coated. In other embodiments, each of the outer side walls carries a plurality of workpieces to be coated.
In this embodiment, the method further includes: the plasma source 9 is used for generating plasma, plasma is needed in the sputtering process, an electric field is used for accelerating ions in the plasma to bombard the magnetron sputtering source, and particles on the magnetron sputtering source rapidly fly to the surface of a workpiece to be coated after being bombarded to form a coating. .
In other embodiments, only a magnetron sputtering source is included, not the plasma source 9. In this embodiment, the number of the plasma sources 9 is 1, but in other embodiments, the number of the plasma sources 9 may be plural.
In this embodiment, the method further includes: and a plasma source position adjusting device for adjusting the position of the plasma source 9.
FIG. 3 is a schematic side view of the magnetron sputtering coating apparatus of FIG. 1.
In this embodiment, the number of the workpieces S to be coated is two along the height H of the rotatable workpiece holder 6.
In other embodiments, the number of the workpieces to be coated is 1, or the number of the workpieces to be coated is more than two along the height direction of the rotatable workpiece holder.
In this embodiment, the workpiece S to be coated is circular. In other embodiments, the shape of the workpiece to be coated can be other shapes.
In this embodiment, along the height H direction of the rotatable workpiece rack 6, the dimension of the magnetron sputtering source 70 is equal to the dimension of the two workpieces S to be coated, so that the magnetron sputtering source 70 can perform one-time overall coating on the workpieces S to be coated along the height direction of the rotatable workpiece rack 6.
In other embodiments, the magnetron sputtering source has a size larger than that of the workpiece to be coated along the height direction of the rotatable workpiece rack, and the magnetron sputtering source can perform one-time overall coating on the workpiece to be coated along the height direction of the rotatable workpiece rack.
FIG. 4 is another schematic side view of the magnetron sputter coating apparatus of FIG. 1.
In one embodiment, the magnetron sputtering source 70 has a dimension smaller than the workpiece S to be coated in the height H direction of the rotatable workpiece support 6, so that the magnetron sputtering source 70 can coat only a partial region of the workpiece S to be coated in the height direction of the rotatable workpiece support 6. The magnetron sputtering coating device also comprises: and a height adjusting device for moving the magnetron sputtering source 70 along the height direction of the rotatable workpiece holder 6. When the magnetron sputtering source 70 is used to meet the thickness requirement of the workpiece S to be coated, the height adjusting device is used to adjust the magnetron sputtering source 70 along the height direction of the rotatable workpiece holder 6, so that the magnetron sputtering source 70 corresponds to the non-sputtered area of the workpiece S to be coated, and the magnetron sputtering coating device is used again to sputter the non-sputtered area of the workpiece S to be coated until all areas of the workpiece S to be coated are coated.
In another embodiment, the magnetron sputtering source 7 has a smaller size than the workpiece S to be coated along the height H of the rotatable workpiece holder 7. Further comprising: and the swinging device is used for enabling the workpiece S to be coated to be close to or far away from the magnetron sputtering source 70, and is favorable for improving the coating thickness uniformity of the workpiece S to be coated along the height direction of the rotatable workpiece rack 7.
In this embodiment, the workpiece S to be coated has a square shape. In other embodiments, the workpiece to be coated may have other shapes.
FIG. 5 is a schematic top view of another magnetron sputtering coating apparatus according to the present invention.
In this embodiment, the workpiece S to be coated is located on the inner sidewall 62 of the rotatable workpiece holder 6, and the magnetron sputtering source 70 is disposed in the rotatable workpiece holder 6.
When the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the center B to the edge C1, the position adjusting device 71 adjusts the distance of the magnetron sputtering source 70 to be less than 2 times the difference between the second distance H2 and the first distance H1, so that the difference between the edge C1 and the center B of the workpiece S to be coated is small, which is beneficial to improving the consistency of the coating thickness formed by the edge C1 and the center B of the workpiece S to be coated. Similarly, when the relative position of the workpiece S to be coated and the magnetron sputtering source 70 rotates from the edge C2 to the center B, the position adjusting device 71 makes the distance adjusted by the magnetron sputtering source 70 less than 2 times the difference between the second distance H2 and the first distance H1, so that the difference between the edge C2 and the center B of the workpiece S to be coated is small, which is beneficial to improving the consistency of the coating thickness formed by the edge C2 and the center B of the workpiece S to be coated.
FIG. 6 is a schematic top view of a magnetron sputtering coating apparatus according to still another embodiment of the present invention.
In this embodiment, the position adjusting device 71 swings in the direction a to drive the magnetron sputtering source 70 to swing in the direction a, so that the difference between the distance from the edge of the workpiece S to be coated to the magnetron sputtering source 70 and the distance from the center of the workpiece S to be coated to the magnetron sputtering source 70 is smaller, which is beneficial to improving the thickness consistency of the coating formed on the surface of the workpiece S to be coated.
In this embodiment, the swinging angle of the magnetron sputtering source 70 is smaller than 30 degrees, which is beneficial to reducing the swinging difficulty of the magnetron sputtering source 70 on one hand, and on the other hand, the distance difference between different areas of the workpiece S to be coated and the magnetron sputtering source 70 is smaller, which is beneficial to improving the thickness uniformity of the coating formed on the surface of the workpiece S to be coated.
Correspondingly, the invention also provides a working method of the magnetron sputtering coating device, which is explained in detail as follows:
FIG. 7 is a flow chart of the working method of the magnetron sputtering coating device of the invention.
Referring to fig. 7, step S1: providing the magnetron sputtering coating device; step S2: when the position of the workpiece to be coated, which is opposite to the magnetron sputtering source, rotates from the center to the edge, the position of the magnetron sputtering source is adjusted by using a position adjusting device, so that the distance from the magnetron sputtering source to the central shaft is gradually increased.
When the position of the workpiece to be coated, which is opposite to the magnetron sputtering source, rotates from the center to the edge, the position of the magnetron sputtering source is adjusted by using the position adjusting device, so that the distance from the magnetron sputtering source to the central shaft is gradually increased, the difference of the distance from the magnetron sputtering source to the surface of the workpiece to be coated is smaller, and therefore, the uniformity of the coating thickness formed on the surface of the workpiece to be coated is favorably improved.
While the present invention has been described in detail with reference to the preferred embodiments, it should be understood that the above description should not be taken as limiting the invention. Various modifications and alterations to this invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be determined from the following claims.

Claims (21)

1. A magnetron sputtering coating device is characterized by comprising:
a vacuum coating chamber;
the rotatable workpiece frame can rotate in the vacuum coating chamber along the central axis of the rotatable workpiece frame and is provided with a plurality of side walls, and the side walls are used for bearing workpieces to be coated;
at least one magnetron sputtering source which is arranged in the vacuum coating chamber, has a gap with the workpiece to be coated and is used for sputtering coating material particles on the surface of the workpiece to be coated;
and the position adjusting device is used for adjusting the position of the magnetron sputtering source, and when the relative position of the workpiece to be coated and the magnetron sputtering source rotates from the center to the edge, the position adjusting device adjusts the position of the magnetron sputtering source so that the distance from the magnetron sputtering source to the central shaft is gradually increased.
2. The magnetron sputtering coating apparatus according to claim 1, wherein the position adjusting means adjusts the magnetron sputtering source to gradually decrease the distance from the central axis as the relative position of the workpiece to be coated and the magnetron sputtering source is rotated from the edge toward the center.
3. The magnetron sputtering coating apparatus of claim 1 wherein the distance from the central axis to the center of the workpiece to be coated is a first distance, the distance from the central axis to the edge of the workpiece to be coated is a second distance, and the position adjustment apparatus moves the magnetron sputtering source less than 2 times the difference between the second distance and the first distance during rotation of the workpiece to be coated from the center to the edge.
4. The magnetron sputtering coating apparatus of claim 3, wherein the position adjusting means moves the magnetron sputtering source by a distance less than or equal to a difference between the second distance and the first distance during rotation of the relative position of the workpiece to be coated and the magnetron sputtering source from the center to the edge.
5. The magnetron sputtering coating apparatus of claim 3 wherein the position adjustment device moves the magnetron sputtering source a distance greater than or equal to eighty percent of the difference between the second distance and the first distance and less than or equal to 1.2 times the difference between the second distance and the first distance during rotation of the relative position of the workpiece to be coated and the magnetron sputtering source from the center to the edge.
6. The magnetron sputtering coating apparatus according to claim 1 wherein the position adjustment means continuously adjusts the position of the magnetron sputtering source during rotation of the rotatable workpiece holder about its central axis such that the magnetron sputtering source is equidistant from the workpiece to be coated when the magnetron sputtering source is opposed to different areas of the workpiece to be coated.
7. The magnetron sputtering coating device according to claim 1, wherein the workpiece to be coated is disposed on an outer side wall of the rotatable workpiece holder, and the magnetron sputtering source is disposed outside the rotatable workpiece holder.
8. The magnetron sputtering coating device according to claim 1, wherein the workpiece to be coated is provided on an inner side wall of the rotatable workpiece holder, and the magnetron sputtering source is provided in the rotatable workpiece holder.
9. The magnetron sputtering coating device according to claim 1, wherein the number of the magnetron sputtering sources is 2 or more, and the position of each magnetron sputtering source can be independently controlled.
10. The magnetron sputter coating apparatus according to claim 1, wherein said position adjustment means is adapted to move said magnetron sputtering source towards or away from the central axis.
11. The magnetron sputter coating apparatus according to claim 10, wherein said position adjusting means comprises a bellows.
12. The magnetron sputtering coating apparatus according to claim 1 wherein the position adjustment means is adapted to oscillate the magnetron sputtering source in a direction that is the same as or opposite to the direction of rotation of the rotatable workpiece holder.
13. The magnetron sputtering coating apparatus according to claim 12 wherein the magnetron sputtering source is oscillated at an angle of 30 degrees or less.
14. The magnetron sputtering coating device according to claim 1, further comprising: and the controller is used for determining the position relation between the magnetron sputtering source and the workpiece to be coated according to the rotating angle of the rotatable workpiece frame so as to start the position adjusting device.
15. The magnetron sputter coating apparatus according to claim 1, wherein each of said side walls is adapted to carry one or more workpieces to be coated.
16. The magnetron sputter coating apparatus according to claim 1, wherein said rotatable workpiece holder has a polyhedral structure including a plurality of side walls; the side wall is a plane, and the workpiece to be coated is a flat-plate workpiece.
17. The magnetron sputtering coating apparatus according to claim 1 wherein the magnetron sputtering source has a dimension in the height direction of the rotatable work rest which is greater than or equal to the dimension of the work to be coated.
18. The magnetron sputter coating apparatus according to claim 1, wherein the magnetron sputtering source has a size smaller than that of the workpiece to be coated in a height direction of the rotatable workpiece holder, and further comprising: and the height adjusting device is used for enabling the magnetron sputtering source to move along the height direction of the rotatable workpiece rack.
19. The magnetron sputter coating apparatus according to claim 1, wherein the magnetron sputtering source has a size smaller than that of the workpiece to be coated in a height direction of the rotatable workpiece holder, further comprising: and the swinging device is used for enabling the workpiece to be coated to be close to or far away from the magnetron sputtering source.
20. The magnetron sputter coating apparatus of claim 1 further comprising at least one plasma source, the position of said plasma source being adjustable.
21. The working method of the magnetron sputtering coating device is characterized by comprising the following steps:
providing a magnetron sputter coating device according to any one of the claims 1 to 20;
when the position of the workpiece to be coated, which is opposite to the magnetron sputtering source, rotates from the center to the edge, the position of the magnetron sputtering source is adjusted by using a position adjusting device, so that the distance from the magnetron sputtering source to the central shaft is gradually increased.
CN202010196863.6A 2020-03-19 2020-03-19 Magnetron sputtering coating device and working method thereof Pending CN113493902A (en)

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