CN212375363U - Magnetron sputtering coating device - Google Patents
Magnetron sputtering coating device Download PDFInfo
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- CN212375363U CN212375363U CN202020352887.1U CN202020352887U CN212375363U CN 212375363 U CN212375363 U CN 212375363U CN 202020352887 U CN202020352887 U CN 202020352887U CN 212375363 U CN212375363 U CN 212375363U
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Abstract
A magnetron sputtering coating device, wherein the magnetron sputtering coating device comprises: a vacuum coating chamber; the rotatable workpiece frame can rotate in the vacuum coating chamber along the central axis and is provided with a plurality of side walls, the side walls are used for bearing a workpiece to be coated, the workpiece to be coated is provided with a surface to be coated, and the surface to be coated protrudes in the direction far away from the central axis; and the magnetron sputtering source is arranged in the vacuum coating chamber and is used for sputtering coating material particles on the surface of the workpiece to be coated, and a gap is formed between the magnetron sputtering source and the surface to be coated. The coating film prepared by the magnetron sputtering coating device has good uniformity.
Description
Technical Field
The utility model relates to a vacuum sputtering field especially relates to a magnetron sputtering coating device.
Background
In recent years, magnetron sputtering coating devices are increasingly widely applied to industrial coating production, and particularly, as the market of terminal products related to touch screens is continuously increased in temperature, the magnetron sputtering coating devices are used for preparing coatings with excellent performance, which are required by the touch screens, become one of trends.
The conventional magnetron sputtering coating device generally comprises a vacuum coating chamber, a rotatable workpiece holder and a magnetron sputtering source, wherein the rotatable workpiece holder can rotate in the vacuum coating chamber along a central axis thereof, in order to better bear a plurality of flat-plate workpieces to be coated, the rotatable workpiece holder is arranged in a polyhedral structure, an outer side wall of the polyhedral structure is used for bearing the workpieces to be coated, and the magnetron sputtering source is used for sputtering coating materials to the surfaces of the workpieces to be coated.
However, during the rotation of the rotatable workpiece holder, the rotation radius of each point on the workpiece to be coated is different, so that the distances from the magnetron sputtering source to different areas of the workpiece to be coated are different, which results in inconsistent thickness of the coating formed on the surface of the workpiece to be coated, and this brings inconsistency of color and optical performance to the end product.
Disclosure of Invention
The utility model provides a magnetron sputtering coating device to improve the uniformity of the prepared coating film.
The utility model discloses a magnetron sputtering coating device, include: a vacuum coating chamber; the rotatable workpiece frame can rotate in the vacuum coating chamber along the central axis and is provided with a plurality of side walls, the side walls are used for bearing a workpiece to be coated, the workpiece to be coated is provided with a surface to be coated, and the surface to be coated protrudes in the direction far away from the central axis; and the magnetron sputtering source is arranged in the vacuum coating chamber and is used for sputtering coating material particles on the surface of the workpiece to be coated, and a gap is formed between the magnetron sputtering source and the surface to be coated.
Optionally, the workpiece to be coated is located on the outer side wall of the rotatable workpiece holder, and the magnetron sputtering source is located outside the rotatable workpiece holder.
Optionally, the workpiece to be coated is located on the inner side wall of the rotatable workpiece holder, and the magnetron sputtering source is located in the rotatable workpiece holder.
Optionally, the side wall projects away from the central axis.
Optionally, the side wall is a plane; further comprising: and the supporting platform is positioned on the side wall and is provided with a supporting surface protruding towards the direction away from the central shaft, and the supporting surface is used for supporting the workpiece to be coated.
Optionally, the workpiece to be coated is supported on the side wall or the supporting surface.
Optionally, the center of the sidewall has a first distance to the central axis, the edge of the sidewall has a second distance to the central axis, and the distance that the surface to be plated protrudes away from the central axis is less than or equal to 2 times the difference between the second distance and the first distance.
Optionally, the distance that the to-be-plated surface protrudes away from the central axis is less than or equal to the difference between the second distance and the first distance.
Optionally, the distance that the to-be-plated surface protrudes away from the central axis is greater than or equal to 80% of the difference between the second distance and the first distance and less than or equal to 1.2 times of the difference between the second distance and the first distance.
Optionally, in the process that the rotatable workpiece holder rotates along the central axis thereof, when the magnetron sputtering source faces different regions of the surface to be plated, the distances from the surface to be plated to the magnetron sputtering source are equal.
Optionally, the material of the workpiece to be coated includes an organic material or an inorganic material.
Optionally, when the material of the workpiece to be coated is silicon oxide, silicon or silicon carbide, the thickness of the workpiece to be coated is less than or equal to 0.7 mm.
Optionally, the workpiece to be coated is supported on the side wall through a fixing device.
Optionally, the number of the workpieces to be coated is 1 or more along the height direction of the rotatable workpiece rack.
Optionally, the shape of the workpiece to be coated is circular or polygonal.
Optionally, in the height direction of the rotatable workpiece holder, the size of the magnetron sputtering source is greater than or equal to the size of the workpiece to be coated.
Optionally, in the height direction of the rotatable workpiece holder, the dimension of the magnetron sputtering source is smaller than the dimension of the workpiece to be coated, and the method further includes: and the height adjusting device is used for enabling the magnetron sputtering source to move along the height direction of the rotatable workpiece rack.
Optionally, the method further includes: and the plasma source is positioned in the vacuum coating chamber.
Compared with the prior art, the utility model discloses technical scheme has following beneficial effect:
the utility model provides an among the magnetron sputtering coating device, rotatable work rest has a plurality of lateral wall, the lateral wall is used for bearing and treats the coating film work piece, treat that the coating film work piece has the face of remaining to plate, treat to plate towards the direction protrusion of keeping away from the center pin for treat that the different regions of face of plating are relative with the magnetron sputtering source, the magnetron sputtering source is less to the distance difference of treating the face of plating, then the magnetron sputtering source is less to the volume difference of treating the coating material granule of the different regional sputters of face of plating, consequently, is favorable to improving the homogeneity of treating the different regional coating film thickness that forms of coating film work piece.
Drawings
FIG. 1 is a schematic top view of a magnetron sputtering coating apparatus according to the present invention;
FIG. 2 is a schematic side view of the magnetron sputtering coating apparatus of FIG. 1;
FIG. 3 is another schematic side view of the magnetron sputter coating apparatus of FIG. 1;
FIG. 4 is a schematic top view of another magnetron sputtering coating apparatus according to the present invention;
FIG. 5 is a schematic top view of another magnetron sputtering coating apparatus according to the present invention.
Detailed Description
The utility model provides a magnetron sputtering coating device, include: a vacuum coating chamber; the rotatable workpiece frame can rotate in the vacuum coating chamber along the central axis and is provided with a plurality of side walls, the side walls are used for bearing a workpiece to be coated, the workpiece to be coated is provided with a surface to be coated, and the surface to be coated protrudes in the direction far away from the central axis; and the magnetron sputtering source is arranged in the vacuum coating chamber and is used for sputtering coating material particles on the surface of the workpiece to be coated, and a gap is formed between the magnetron sputtering source and the surface to be coated. The uniformity of the coating prepared by the magnetron sputtering coating device is better.
In order to make the above objects, features and advantages of the present invention more comprehensible, embodiments of the present invention are described in detail below with reference to the accompanying drawings.
FIG. 1 is a schematic top view of a magnetron sputtering coating apparatus according to the present invention.
Referring to fig. 1, a vacuum coating chamber 10; the rotatable workpiece frame 6 can rotate in the vacuum coating chamber 10 along the central axis O thereof, and is provided with a plurality of side walls for bearing a workpiece S to be coated, wherein the workpiece S to be coated is provided with a surface A to be coated, and the surface A to be coated protrudes in the direction far away from the central axis O; and the magnetron sputtering source 7 is arranged in the vacuum coating chamber 10 and is used for sputtering coating material particles on the surface of the workpiece S to be coated, and a gap is formed between the magnetron sputtering source 7 and the surface A to be coated.
The vacuum coating chamber 10 is in a vacuum environment, and the magnetron sputtering source 7 sputters coating material particles to the surface a to be coated of the workpiece S to be coated so as to form a coating on the surface a to be coated.
In this embodiment, the workpiece S to be coated is located on the outer side wall 61 of the rotatable workpiece holder 6, and the magnetron sputtering source 7 is located outside the rotatable workpiece holder 6.
In this embodiment, the outer sidewall 61 is a plane, and further includes: and the support table 20 is positioned on the outer side wall 61 and is provided with a support surface B protruding in the direction away from the central axis O, and the support surface B is used for supporting the workpiece S to be coated.
The workpiece S to be coated is supported on the supporting table 20 through a fixing device, and the fixing device includes: and the edge of the workpiece S to be coated is fixed with the support table 20 through the clamping groove.
Whether the workpiece S to be coated can be bent and does not break is related to the material of the base material of the workpiece S to be coated, the material of the workpiece S to be coated comprises an organic material or an inorganic material, and when the material of the base material of the workpiece S to be coated is softer, the workpiece S to be coated is easier to bend and does not break. However, a thicker material tends to break more easily. With the development of the manufacturing process of the workpiece S to be coated, the thickness of the brittle workpiece S to be coated is thinner and thinner, and the brittle workpiece S to be coated is not easy to break when being bent.
In this embodiment, when the material of the workpiece to be coated is silicon oxide, silicon or silicon carbide, the thickness of the workpiece S to be coated is 0.7 mm or less. Because the surface A to be plated of the workpiece S to be plated protrudes in the direction far away from the central axis O, the difference between the distances from different areas of the workpiece S to be plated to the central axis O is small, namely: the difference of the rotating radius of each point on the workpiece S to be coated is small, the distance from the magnetron sputtering source 7 to the surface A to be coated is equal to the difference between the distance from the magnetron sputtering source 7 to the central axis O and the distance from the workpiece S to be coated to the central axis O, the distances from the magnetron sputtering source 7 to the central axis O are equal, so that the difference of the distances from the magnetron sputtering source 7 to different areas of the workpiece S to be coated is small, and then, the difference of the amount of coating material particles sputtered from the magnetron sputtering source 7 to different areas of the workpiece S to be coated is small, so that the difference of the coating thicknesses formed by different areas of the workpiece S to be coated is favorably improved.
Specifically, it is defined that a first distance R1 is provided from a center M1 of the outer sidewall 61 to the central axis O, a second distance R2 is provided from an edge M2 of the outer sidewall 61 to the central axis O, and if a distance d that each point on the surface a to be plated protrudes in a direction away from the central axis O is smaller than a difference between the second distance R2 and the first distance R1, a distance between the magnetron sputtering source 7 and the center of the workpiece S to be plated is slightly greater than a distance between the magnetron sputtering source 7 and the edge, so that the thickness of the center plated film of the workpiece S to be plated is slightly smaller than the thickness of the edge plated film, but at this time, the difference between the thicknesses of the edge and the center plated film is within an acceptable range, that is, the uniformity of the thickness of the surface.
If the distance d of the protrusion of the surface a to be coated in the direction away from the central axis O is equal to the difference between the second distance R2 and the first distance R1, the distances from the center and the edge of the workpiece S to be coated to the magnetron sputtering source 7 are equal, and the consistency of the coating thickness of different areas of the surface of the workpiece S to be coated is better.
If the distance d of the protrusion of the surface to be coated A in the direction away from the central axis O is greater than 2 times that of the difference between the second distance R2 and the first distance R1 and less than 2 times that of the difference between the second distance R2 and the first distance R1, the distance from the center of the workpiece to be coated S to the magnetron sputtering source 7 is slightly smaller than that from the edge to the magnetron sputtering source 7, so that the thickness of the coating film at the center of the workpiece to be coated is slightly thicker than that of the coating film at the edge, but at the moment, the difference between the thicknesses of the coating film at the edge and the center is within an acceptable range, namely, the consistency of the thickness of the coating film on.
The distance d of the projection of the surface A to be plated in the direction away from the central axis O is more than or equal to 80% of the difference between the second distance R2 and the first distance R1 and less than or equal to 1.2 times of the difference between the second distance R2 and the first distance R1, so that the distance difference between the center and the edge of the workpiece S to be plated and the magnetron sputtering source 7 is smaller, and the consistency of the plating thickness of different areas on the surface of the workpiece S to be plated is further facilitated.
In this embodiment, in the process that the rotatable workpiece holder 6 rotates along the central axis O thereof, when the magnetron sputtering source 7 faces different areas of the surface a to be plated, distances from the surface a to be plated to the magnetron sputtering source 7 are equal, so that amounts of particles of the coating material sputtered from the magnetron sputtering source 7 to the surface a to be plated are equal, and thicknesses of the coatings formed on the different areas of the surface a to be plated are equal. Wherein, the magnetron sputtering source 7 is opposite to different areas of the surface A to be plated, which means that: defining the center of the magnetron sputtering source 7 as N, and when a certain point ON the surface A to be coated is positioned ON the ON connecting line, the point of the surface A to be coated is considered to be opposite to the magnetron sputtering source 7.
In the present embodiment, the rotatable workpiece rack 6 is a hexahedron for illustration, and accordingly, the rotatable workpiece rack 6 has 6 outer side walls 61.
In other embodiments, the rotatable workpiece holder is other polyhedral structures.
In this embodiment, the number of the magnetron sputtering sources 7 is 3, and the 3 magnetron sputtering sources 7 are uniformly distributed along the inner side wall of the vacuum coating chamber 10.
In other embodiments, the number of magnetron sputtering sources can be other values.
The significance of the rotation of the rotatable workpiece holder 6 along the central axis O is: the workpiece S to be coated sequentially passes through different magnetron sputtering sources 7, and each magnetron sputtering source 7 is used for coating the surface of the workpiece S to be coated, so that the efficiency of coating the film on the surface A to be coated is improved.
In this embodiment, the method further includes: the plasma source 9 is positioned on the inner side wall of the vacuum coating chamber 10, the plasma source 9 is used for generating plasma, plasma is needed in the sputtering process, an electric field is used for accelerating ions in the plasma to bombard the magnetron sputtering source, and particles on the magnetron sputtering source rapidly fly to the surface of a workpiece to be coated after being bombarded to form a coating. In other embodiments, only the magnetron sputtering source is present, and the plasma source is absent.
In this embodiment, the method further includes: a heater 8, the heater 8 being for heating the rotatable work rest 6.
In this embodiment, the workpiece S to be coated is completely supported on the supporting surface B, that is: the back surface of the workpiece S to be coated is completely attached to the supporting surface B, so that the heat transferred to the workpiece S to be coated by the heater 8 is uniform, and the consistency of the coating thickness of the surface of the workpiece S to be coated is improved.
In other embodiments, the workpiece to be coated is partially supported on the support surface.
FIG. 2 is a schematic side view of the magnetron sputtering coating apparatus of FIG. 1.
In the present embodiment, 2 workpieces S to be coated are arranged in the height direction H of the rotatable workpiece holder 6.
In other embodiments, the number of workpieces to be coated is 1 or more than 2 in the direction of the height H of the rotatable workpiece holder 6.
In this embodiment, along the height H direction of the rotatable workpiece holder 6, the size of the magnetron sputtering source 7 is equal to the size of 2 workpieces S to be coated, so that the magnetron sputtering source 7 can simultaneously coat the 2 workpieces S to be coated, which is beneficial to improving the coating efficiency.
In other embodiments, the magnetron sputtering source has a dimension, along the height of the rotatable workpiece holder, greater than the dimension of 2 workpieces to be coated.
In this embodiment, the workpiece S to be coated has a circular shape.
In other embodiments, the workpiece to be coated is polygonal in shape.
FIG. 3 is another schematic side view of the magnetron sputter coating apparatus of FIG. 1.
In the present embodiment, 2 workpieces S to be coated are arranged in the height direction H of the rotatable workpiece holder 6.
In other embodiments, the number of workpieces to be coated is 1 or more than 2 in the height direction of the rotatable workpiece holder 6.
In one embodiment, the magnetron sputtering source 7 is smaller than the workpiece S to be coated in size along the height H of the rotatable workpiece holder 7, and the magnetron sputtering source 7 can only coat a portion of the workpiece S to be coated. The magnetron sputtering coating device also comprises: and the height adjusting device is used for enabling the magnetron sputtering source 7 to move along the height H direction of the rotatable workpiece frame 6, and enabling the magnetron sputtering source 7 to be opposite to the area of the workpiece S to be coated, which is not coated, so as to coat the workpiece S.
In this embodiment, the workpiece S to be coated has a square shape.
In other embodiments, the workpiece to be coated is circular or other shapes.
FIG. 4 is a schematic top view of another magnetron sputtering coating apparatus according to the present invention.
In this embodiment, the outer sidewall 61 of the rotatable workpiece holder 6 protrudes in a direction away from the central axis O, the workpiece S to be coated is located on the outer sidewall 61 of the rotatable workpiece holder 6, the magnetron sputtering source 7 is located outside the rotatable workpiece holder 6, and the magnetron sputtering source 7 is configured to sputter coating material particles onto the surface of the workpiece S to be coated, so as to form a coating on the surface a to be coated of the workpiece S to be coated.
Because the surface A to be plated of the workpiece S to be plated protrudes in the direction far away from the central axis O, the difference between the distances from different areas of the workpiece S to be plated to the central axis O is small, namely: the difference of the rotating radius of each point on the workpiece S to be coated is small, the distance from the magnetron sputtering source 7 to the surface A to be coated is equal to the difference between the distance from the magnetron sputtering source 7 to the central axis O and the distance from the workpiece S to be coated to the central axis O, the distances from the magnetron sputtering source 7 to the central axis O are equal, so that the difference of the distances from the magnetron sputtering source 7 to different areas of the workpiece S to be coated is small, and then, the difference of the amount of coating material particles sputtered from the magnetron sputtering source 7 to different areas of the workpiece S to be coated is small, so that the difference of the coating thicknesses formed by different areas of the workpiece S to be coated is favorably improved.
Defining the distance from the center M1 to the central axis O of the connecting line L of the edge of the workpiece S to be coated as a first distance R1, and the distance from the edge M2 of the connecting line L to the central axis O as a second distance R2. The distance d of the projection of the film A to be plated in the direction far away from the central axis O is less than 2 times of the difference between the second distance R2 and the first distance, so that the distance difference between different areas of the surface A to be plated and the magnetron sputtering source 7 is smaller, and the consistency of the thickness of the film on the surface A to be plated is favorably improved.
In this embodiment, the back surface of the workpiece S to be coated is completely attached to the outer sidewall 61.
In other embodiments, the back surface of the workpiece to be coated is attached to the outer sidewall.
The workpiece S to be coated is fixed on the outer side wall 61 through a fixing device.
In this embodiment, the workpiece S to be coated is fixed on the outer sidewall 61 through a clamping groove.
FIG. 5 is a schematic top view of another magnetron sputtering coating apparatus according to the present invention.
In this embodiment, the workpiece S to be coated is located on an inner sidewall 62 of the rotatable workpiece holder 6, the magnetron sputtering source 7 is located in the rotatable workpiece holder 6, and the inner sidewall 62 is a plane, and further includes: and the support table 20 is positioned on the inner side wall 62 and is provided with a support surface D protruding away from the central axis O, and the support surface D is used for supporting the workpiece S to be coated.
In other embodiments, no support table is provided and the inner sidewall of the rotatable workpiece holder projects away from the central axis.
Because the surface C to be plated of the workpiece S to be plated protrudes in the direction far away from the central axis O, the distance difference between different areas of the workpiece S to be plated and the central axis O is smaller, namely: the rotation radius difference of each point on the workpiece S to be coated is small, the distance from the magnetron sputtering source 7 to the surface C to be coated is equal to the difference between the distance from the workpiece S to be coated to the central axis O and the distance from the magnetron sputtering source 7 to the central axis O, the distances from the magnetron sputtering source 7 to the central axis O are equal, so that the distance difference between the magnetron sputtering source 7 and different areas of the workpiece S to be coated is small, and then, the difference between the magnetron sputtering source 7 and different areas of the workpiece S to be coated in the amount of the coating material particles is small, so that the difference of the coating thicknesses formed by the different areas of the workpiece S to be coated is favorably improved.
The center M1 of the inner side wall 62 is defined to have a first distance R1 from the central axis O, the edge M2 of the inner side wall 62 has a second distance R2 from the central axis O, and the distance d of the surface C to be plated protruding in the direction away from the central axis O is smaller than 2 times of the difference between the second distance R2 and the first distance, so that the distance difference between different areas of the surface C to be plated and the magnetron sputtering source 7 is smaller, and therefore, the consistency of the thickness of the plated film on the surface C to be plated is favorably improved.
The workpiece S to be coated is fixed on the inner side wall 62 by a fixing device.
In this embodiment, the fixing device is a slot, and the workpiece S to be coated is fixed on the inner sidewall 62 through the slot.
While the present invention has been described in detail with reference to the preferred embodiments thereof, it should be understood that the above description should not be taken as limiting the present invention. Numerous modifications and alterations to the present invention will become apparent to those skilled in the art upon reading the foregoing description. Accordingly, the scope of the invention should be limited only by the attached claims.
Claims (18)
1. A magnetron sputtering coating device is characterized by comprising:
a vacuum coating chamber;
the rotatable workpiece frame can rotate in the vacuum coating chamber along the central axis and is provided with a plurality of side walls, the side walls are used for bearing a workpiece to be coated, the workpiece to be coated is provided with a surface to be coated, and the surface to be coated protrudes in the direction far away from the central axis;
and the magnetron sputtering source is arranged in the vacuum coating chamber and is used for sputtering coating material particles on the surface of the workpiece to be coated, and a gap is formed between the magnetron sputtering source and the surface to be coated.
2. The magnetron sputtering coating device according to claim 1, wherein the workpiece to be coated is located on an outer side wall of the rotatable workpiece holder, and the magnetron sputtering source is located outside the rotatable workpiece holder.
3. The magnetron sputtering coating device according to claim 1, wherein the workpiece to be coated is located on an inner side wall of the rotatable workpiece holder, and the magnetron sputtering source is located in the rotatable workpiece holder.
4. The magnetron sputter coating apparatus according to claim 1, wherein said side wall is convex in a direction away from the central axis.
5. The magnetron sputter coating apparatus according to claim 1, wherein said side wall is planar; further comprising: and the supporting platform is positioned on the side wall and is provided with a supporting surface protruding towards the direction away from the central shaft, and the supporting surface is used for supporting the workpiece to be coated.
6. The magnetron sputtering coating apparatus according to claim 4 or 5, wherein the workpiece to be coated is supported entirely on the side wall or the support surface.
7. The magnetron sputter coating apparatus according to claim 1, wherein the center of said side wall has a first distance from the central axis, the edge of said side wall has a second distance from the central axis, and said surface to be coated protrudes away from the central axis by a distance equal to or less than 2 times the difference between the second distance and the first distance.
8. The magnetron sputtering coating apparatus according to claim 7, wherein a distance by which the surface to be coated protrudes away from the central axis is equal to or less than a difference between the second distance and the first distance.
9. The magnetron sputtering coating apparatus according to claim 7, wherein the distance by which the surface to be coated protrudes away from the central axis is 80% or more and 1.2 times or less of the difference between the second distance and the first distance.
10. The magnetron sputtering coating device according to claim 1, wherein during the rotation of the rotatable workpiece holder along the central axis thereof, the distance from the surface to be coated to the magnetron sputtering source is equal when the magnetron sputtering source is opposed to different areas of the surface to be coated.
11. The magnetron sputtering coating device according to claim 1, wherein the material of the workpiece to be coated comprises an organic material or an inorganic material.
12. The magnetron sputtering coating device according to claim 11, wherein when the material of the workpiece to be coated is silicon oxide, silicon or silicon carbide, the thickness of the workpiece to be coated is 0.7 mm or less.
13. The magnetron sputtering coating device according to claim 1, wherein the workpiece to be coated is carried on the side wall by a fixing device.
14. The magnetron sputtering coating apparatus according to claim 1, wherein the number of the workpieces to be coated is 1 or more in the height direction of the rotatable workpiece holder.
15. The magnetron sputtering coating device according to claim 1, wherein the workpiece to be coated has a circular or polygonal shape.
16. The magnetron sputtering coating apparatus according to claim 1 wherein the magnetron sputtering source has a dimension in the height direction of the rotatable work rest which is greater than or equal to the dimension of the work to be coated.
17. The magnetron sputter coating apparatus according to claim 1, wherein the magnetron sputtering source has a size smaller than that of the workpiece to be coated in a height direction of the rotatable workpiece holder, and further comprising: and the height adjusting device is used for enabling the magnetron sputtering source to move along the height direction of the rotatable workpiece rack.
18. The magnetron sputtering coating device according to claim 1, further comprising: and the plasma source is positioned in the vacuum coating chamber.
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| CN113493903A (en) * | 2020-03-19 | 2021-10-12 | 中微半导体设备(上海)股份有限公司 | Magnetron sputtering coating device and working method thereof |
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| CN113493903A (en) * | 2020-03-19 | 2021-10-12 | 中微半导体设备(上海)股份有限公司 | Magnetron sputtering coating device and working method thereof |
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