CN110233093A - Mechanically control the substrate board treatment of plasma density - Google Patents
Mechanically control the substrate board treatment of plasma density Download PDFInfo
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- CN110233093A CN110233093A CN201910435957.1A CN201910435957A CN110233093A CN 110233093 A CN110233093 A CN 110233093A CN 201910435957 A CN201910435957 A CN 201910435957A CN 110233093 A CN110233093 A CN 110233093A
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- horizontal drive
- linkage part
- drive portion
- board treatment
- substrate board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
- H01J37/32082—Radio frequency generated discharge
- H01J37/321—Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
- H01J37/3211—Antennas, e.g. particular shapes of coils
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32623—Mechanical discharge control means
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- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Plasma Technology (AREA)
- Chemical Vapour Deposition (AREA)
Abstract
The present invention relates to a kind of substrate board treatments for mechanically controlling plasma density, which is characterized in that including cavity, in inside corona treatment substrate；Aerial coil radiates high frequency waves to the engineering gas for being supplied to the inside cavity to generate plasma；Linkage part connects the aerial coil, moves together with the aerial coil；Horizontal drive portion provides driving force so that the linkage part moves in the horizontal direction；And drive control part, control the driving in the horizontal drive portion, the drive control part is in a manner of the moving direction of the corresponding position that should be moved to from the current position of the aerial coil to the aerial coil and moving distance, the drive volume for adjusting the horizontal drive portion, the forming position of the plasma by the aerial coil is controlled with this.
Description
Technical field
The present invention relates to a kind of substrate board treatments for mechanically controlling plasma density, and in particular to Yi Zhongtong
The position of aerial coil is overregulated to control the substrate board treatment of plasma density.
Background technique
Substrate board treatment is the device for executing semiconducter engineering, specifically with plasma P processing substrate 10
Device.
At this point, substrate 10 can be chip or be equipped with the pallet of chip.
In addition, substrate board treatment can be with plasma P execute etching, vapor deposition and ashing in it is more than one
Device.
In substrate board treatment, aerial coil radiates high frequency waves to the engineering gas being supplied in 100 inside of cavity
(High-frequency wave) is to generate plasma P.
At this point, the processing speed of the Effects of Density substrate 10 of the plasma P generated.
For example, the density of plasma P is high, then the processing speed of substrate 10 becomes faster, and the density of plasma P is low, then base
The processing speed of plate 10 is slack-off.
It is commonly used for adjusting the control of the density of the plasma P of the processing speed of substrate 10 being by increasing or subtracting
It is few to be supplied to the high frequency power (High-frequency power) of aerial coil 200 from high frequency power portion 20 to be controlled.
For example, the processing speed such as substrate 10 is slow, then increase the high frequency power for being supplied to aerial coil 200, such as substrate 10
Processing speed it is fast, then reduce and be supplied to the high frequency power of aerial coil 200, thus adjust the processing speed of substrate.
Such method is to indirectly control high frequency power to control the high frequency waves of the radiation of aerial coil 200.
However, there are the following problems: during being supplied to aerial coil 200 from high frequency power portion 20, high frequency waves can be by
To many influences of environmental factor, it is thus impossible to the expected high frequency waves for effectively controlling the radiation of aerial coil 200 like that, as a result without
Method effectively controls plasma P density.
Additionally, there are following problems: in order to control high frequency power, increasing multiple electrical/electronics and constitutes, make management item
Mesh increases, and thus the replacement cycle can be made to become faster.
Such problems increases as 10 area of substrate handled by substrate board treatment becomes larger.
As shown in Figure 1, in the substrate board treatment of processing large-area substrates 10, due to the inside of substrate 10 and outside etc.
Plasma density is uneven, by inboard antennas coil 210 and outboard antenna coil 220 distinguish control base board inside and
Outer plasma density.
In general, the high frequency function of inboard antennas coil 210 is supplied to from the first high frequency power portion 21 by increase or reduction
Rate carries out the control of the inside plasma density of substrate 10, is supplied by increasing or reducing from the second high frequency power portion 22
The control of the outer plasma density of substrate 10 is carried out to the high frequency power of outboard antenna coil 220.
For example, increasing the high frequency power for being supplied to inboard antennas coil 210, base when the processing speed of 10 inside of substrate is slow
When the processing speed of 10 inside of plate is fast, the high frequency power for being supplied to inboard antennas coil 210 is reduced, thus 10 inside of control base board
Processing speed.
In addition, increasing the high frequency power for being supplied to outboard antenna coil 220, base when the processing speed in 10 outside of substrate is slow
When the processing speed in 10 outside of plate is fast, the high frequency power for being supplied to outboard antenna coil 220 is reduced, thus 10 outside of control base board
Processing speed.
There are problems that the problem identical as above-mentioned aerial coil 200 as described below: in expectability does not control effectively like that
The high frequency waves that side aerial coil 210 and outboard antenna coil 220 radiate, as a result can not effectively control plasma density.
Additionally, there are following problems: being supplied to inboard antennas coil 210 and outboard antenna coil to control respectively
220 high frequency power increases multiple electrical/electronic structures including the first high frequency power portion 21 and the second high frequency power portion 22
At the replacement cycle being made to become faster with this so that management project further increases.
The item that above-mentioned background technique illustrates is not considered as just for the sake of promoting the understanding to background of the present invention
To the conventional art known to technical field those who have general knowledge.
Existing technical literature
Patent document
Patent document 1: South Korea KR10-1007822B1 (2011.01.06)
Patent document 2: South Korea KR10-1114283B1 (2012.02.02)
Patent document 3: South Korea KR10-1196649B1 (2012.10.26)
Patent document 4: South Korea KR10-0737989B1 (2007.07.04)
Patent document 5: South Korea KR10-2016-0053247A (2016.05.13)
Patent document 6: South Korea KR10-1312505B1 (2013.09.23)
Patent document 7: South Korea KR10-1762230B1 (2017.07.21)
Patent document 8: South Korea KR10-1853365B1 (2018.04.24)
Patent document 9: South Korea KR10-1714405B1 (2017.03.03)
Summary of the invention
Problem of the present invention is that solving the problems, such as above description.
The purpose of the present invention is to provide a kind of substrate board treatments for mechanically controlling plasma density.
The substrate board treatment according to the present invention for mechanically controlling plasma density includes: cavity, in inside
With corona treatment substrate；Aerial coil radiates high frequency waves to the engineering gas for being supplied to the inside cavity to generate
Gas ions；Linkage part is connected with the aerial coil, and moves together with the aerial coil；Horizontal drive portion, provides driving
Power is so that the linkage part moves in the horizontal direction；And drive control part, the driving in the horizontal drive portion is controlled, it is described
Drive control part is with the mobile side of the corresponding position that should be moved to from the current position of the aerial coil to the aerial coil
To the mode with moving distance, the drive volume in the horizontal drive portion is adjusted, is carried out to control according to the aerial coil with this
Plasma forming position.
The horizontal drive portion includes first level driving portion, provides driving force so that the linkage part is to horizontal direction
It is moved left and right；And the second horizontal drive portion, it is interlocked and moved left and right by the first level driving portion, driving force is provided
So that the linkage part is to being moved before and after horizontal direction, the first level driving portion and/or described second horizontal drive
Dynamic portion is actuated to be moved on at least side in left-right and front-back in the horizontal direction, so that the center of the aerial coil
Point is separated from original position.
The first level driving portion is the motor of rotation, and second horizontal drive portion is connected with nut shell and is controlled
Mobile, be set forth in nut shell ball screw of rotation by interlocked by the first level driving portion and is moved.
The first level driving portion is flexible cylinder, and second horizontal drive portion is connected with nut shell and is controlled
Mobile, nut shell cylinder rod flexible and being interlocked by the first level driving portion is moved.
In the substrate board treatment according to the present invention for mechanically controlling plasma density, the linkage part includes
Interconnecting piece, in conjunction with the aerial coil；And integration portion, in conjunction with multiple interconnecting pieces, so that multiple interconnecting pieces
The driving force in the horizontal drive portion is received together.
The interconnecting piece includes the definite part (a part) at the position contacted with the aerial coil by non-conductive
Material composition, to minimize the interference of the aerial coil.
The substrate board treatment according to the present invention for mechanically controlling plasma density includes vertical drive unit, is hung down
Straight driving portion provides driving force so that the horizontal drive portion vertically moves, the horizontal drive portion and the linkage part interlock with
Vertically move the linkage part.
The substrate board treatment according to the present invention for mechanically controlling plasma density includes vertical drive unit, is hung down
Straight driving part provides driving force so that the linkage part vertically moves between the horizontal drive portion and the linkage part,
The horizontal drive portion and the vertical drive unit are interlocked to move horizontally the vertical drive unit.
In the substrate board treatment according to the present invention for mechanically controlling plasma density, the aerial coil packet
Include: inboard antennas coil controls the plasma density on the inside of the substrate；And outboard antenna coil, control the substrate
The plasma density in outside, the linkage part include that inside linkage part and the inboard antennas coil described in the linkage part of inside connect
It moves to move horizontally the inboard antennas coil, the substrate board treatment includes inside horizontal drive portion, inside horizontal drive
Portion provides driving force so that the inside linkage part moves horizontally.
Inside horizontal drive portion includes: inside first level driving portion, moves left and right the linkage part；And it is interior
Side the second horizontal drive portion, is moved forward and backward the linkage part.
Inside the second horizontal drive portion is interlocked and moved left and right, the gearing by the inside first level driving portion
Portion is interlocked and be moved forward and backward by inside the second horizontal drive portion.
The substrate board treatment according to the present invention for mechanically controlling plasma density includes inner vertical driving
Portion, inner vertical driving portion provide driving force so that inside horizontal drive portion vertically moves, inside horizontal drive portion
It interlocks with the linkage part to vertically move the linkage part.
The substrate board treatment according to the present invention for mechanically controlling plasma density includes: outside linkage part,
It interlocks with the outboard antenna coil to move horizontally the outboard antenna coil；And outside horizontal drive portion, driving is provided
Power is so that the outside linkage part moves horizontally.
In the substrate board treatment according to the present invention for mechanically controlling plasma density, the outside level is driven
Dynamic portion includes: outside first level driving portion, moves left and right the linkage part；And outside the second horizontal drive portion, front and back are moved
Move the linkage part.
In the substrate board treatment according to the present invention for mechanically controlling plasma density, second water of outside
Flat driving portion is interlocked and moved left and right by the outside first level driving portion, and the linkage part is by the horizontal drive in the outside second
Dynamic portion interlocks and is moved forward and backward.
The substrate board treatment according to the present invention for mechanically controlling plasma density includes outside vertical driving
Portion, outside vertical driving portion provide driving force so that outside horizontal drive portion vertically moves, outside horizontal drive portion
It interlocks with the linkage part to vertically move the linkage part.
Invention effect
If adjusting the position of aerial coil, the high frequency waves of aerial coil radiation can be directly controlled, therefore, having can be effective
The advantages of controlling plasma density distribution.
Have the advantages that the electrical/electronic without the need for control high frequency power is constituted.
Has the advantages that vertical and or horizontal movement aerial coil to control plasma density distribution.
More than any one in vertical and or horizontal movement inboard antennas coil and outboard antenna coil, with
It controls to plasma density distribution more than any one on the inside of substrate and outside.
For substrate board treatment, the advantages of having in addition to CCP, could be applicable to various substrate board treatments.
Control unit 600 adjusts the position of aerial coil 200, it is therefore not necessary to the opening of cavity 100 and adjustable antenna coil
200 position, and then there is the process hold-up time for minimizing substrate board treatment, the advantages of to improve productivity.
Mechanically adjusting position, therefore, after directly adjusting position with tool decomposition aerial coil 200 with user
The case where re-assemblying is compared, have can accurately adjusting position, so as to accurate adjusting position with minimized undesirable
Advantage.
Detailed description of the invention
Fig. 1 is the attached drawing for illustrating conventional art.
Fig. 2 is the attached drawing for illustrating the case where vertical drive unit is cylinder.
Fig. 3 is in the case where vertical drive unit is cylinder for illustrating the attached drawing of the rising of aerial coil.
Fig. 4 is in the case where vertical drive unit is cylinder for illustrating the attached drawing of the decline of aerial coil.
Fig. 5 is the attached drawing for illustrating the case where vertical drive unit is motor.
Fig. 6 is in the case where vertical drive unit is motor for illustrating the attached drawing of the rising of aerial coil.
Fig. 7 is in the case where vertical drive unit is motor for illustrating the attached drawing of the decline of aerial coil.
Fig. 8 to Figure 14 is the attached drawing vertically moved for illustrating aerial coil.
Figure 15 to Figure 21 is the attached drawing moved horizontally for illustrating aerial coil.
Figure 22 to Figure 29 is the attached drawing for illustrating the vertical of aerial coil and moving horizontally.
Description of symbols
10 substrate of P plasma
100 cavity, 110 chuck
200 aerial coil, 210 inboard antennas coil
220 outboard antenna coil, 300 linkage part
301 interconnecting piece, 302 integration portion
303 support portion, 310 inside linkage part
311 inside interconnecting piece, 312 inside integration portion
400 vertical drive unit, 410 inner vertical driving portion
420 outside vertical driving portion, 500 horizontal drive portion
501 first level driving portion, 502 second horizontal drive portion
510 inside horizontal drive portion, 511 inside first level driving portion
512 insides 520 outside horizontal drive portion, the second horizontal drive portion
BS ball screw SB cylinder rod
600 control unit of NH nut shell
Specific embodiment
As shown in Fig. 2 to Figure 29, the substrate board treatment for mechanically controlling plasma density of the invention includes
Cavity 100, chuck 110 and aerial coil 200.
Corona treatment substrate 10 is used inside cavity 100.
At this point, substrate 10 can be chip or be equipped with the pallet of chip.
In addition, substrate board treatment can be with plasma execute etching, vapor deposition and ashing in it is more than one
Device.
It is mounted with substrate 10 on chuck 110, and is set to inside cavity 100.
Chuck 110 can be according to top or lower part of the structure setting of cavity 100 inside cavity 100.
Aerial coil 200 is set to position corresponding with chuck 110 outside cavity 100, across substrate 10.
Aerial coil 200 radiates high frequency waves (High-frequency to the engineering gas being supplied to inside cavity 100
Wave) to generate plasma.
Aerial coil 200 is mobile with upper type with any one in vertical and level, and it is close to control plasma with this
Degree distribution.
When aerial coil 200 vertically moves, aerial coil 200 rises and the spacing between chuck 110 becomes larger, then can subtract
Small plasma density, aerial coil 200 declines and the spacing between chuck 110 becomes smaller, then will increase plasma density.
For example, aerial coil 200 rises and makes the processing speed of substrate 10 slack-off when the processing speed of substrate 10 is fast,
When the processing speed of substrate 10 is slow, aerial coil 200 declines and the processing speed of substrate 10 is become faster.
Plasma is generated centered on aerial coil 200, and therefore, plasma density is centered on aerial coil 200
Distribution.
When aerial coil 200 moves horizontally, plasma is distributed centered on the position of aerial coil 200 moved horizontally
Density.
That is, plasma density distribution with aerial coil 200 move horizontally move in the horizontal direction with control etc. from
Daughter forming position.
For example, substrate 10 is handled not on the basis of the center of substrate 10, but on the left of being inclined to when processing, it can be by antenna line
Circle 200 moves to the right, then plasma density distribution moves to the right, can be adjusted to again using the center of substrate 10 as base
Quasi- processing substrate 10.
As described above, adjusting the position of aerial coil 200, then the high frequency waves of the radiation of aerial coil 200 can be directly controlled, from
And have the advantages that plasma density distribution can be effectively controlled.
In addition, having the advantages that the electrical/electronic without the need for control high frequency power is constituted.
In the following, the various embodiments with reference to Detailed description of the invention about the move mode of aerial coil 200.
<embodiment vertically moved about aerial coil 200>
As shown in Figures 2 to 7, the substrate board treatment of plasma density that mechanically controls of the invention includes chamber
Body 100, aerial coil 200, linkage part 300 and vertical drive unit 400.
Linkage part 300 and aerial coil 200 are interlocked to vertically move aerial coil 200.
Vertical drive unit 400 provides driving force so that linkage part 300 vertically moves.
At this point, vertical drive unit 400 can be cylinder or motor.
In addition, cylinder can refer to the cylinder flexible with pressure or electric power.
As shown in Figures 2 to 4, when vertical drive unit 400 is flexible cylinder, linkage part 300 can be with nut shell NH phase
It even vertically moves, the nut shell NH with cylinder rod SB flexible and the gearing of vertical drive unit 400 by being moved.
As shown in Figures 5 to 7, when vertical drive unit 400 is the motor of rotation, linkage part 300 can be with nut shell NH phase
It even vertically moves, the nut shell NH with the ball screw BS of rotation and the gearing of vertical drive unit 400 by being moved
It is dynamic.
Linkage part 300 may include interconnecting piece 301, be combined with aerial coil 200；And integration portion 302, and it is multiple
Interconnecting piece 301 combines, so that multiple interconnecting pieces 301 receive the driving force of vertical drive unit 400 together.
Interconnecting piece 301 is in order to minimize by the interference of aerial coil 200, including the position that contacts with aerial coil 200
Definite part can be made of non-conducting material, preferably by set of dielectrics at.
The position that interconnecting piece 301 is contacted with aerial coil 200 can be the shape all around 200 periphery of aerial coil,
The shape for being also possible to partially surround is so that the lower part of aerial coil 200 is placed (installation).
Interconnecting piece 301 can extend or be attached to integration portion 302 and be formed, and (can conclude hand by fastener means such as screws
Section) fixed become round and smooth to separate.
Aerial coil 200 rises and the spacing between chuck 110 when becoming larger, and plasma density reduces, and makes base
10 processing speed of plate is slack-off, and when becoming smaller, plasma density is improved for the decline of aerial coil 200 and the spacing between chuck 110,
And 10 processing speed of substrate is become faster.
As described above, having the advantages that vertically move aerial coil 200 to control plasma density.
As shown in Fig. 8 to Figure 14, the substrate board treatment for mechanically controlling plasma density of the invention includes
Cavity 100, chuck 110, inboard antennas coil 210, outboard antenna coil 220, inside linkage part 310, outside linkage part 320,
Inner vertical driving portion 410 and outside vertical driving portion 420.
Aerial coil 200 as described above may include on the basis of substrate 10, and the plasma of 10 inside of control base board is close
The inboard antennas coil 210 of degree；And the outboard antenna coil 220 of the plasma density in 10 outside of control base board.
For vertically moving the composition of inboard antennas coil 210, including inside linkage part 310 and inner vertical driving portion
410。
Inside linkage part 310 and inboard antennas coil 210 are interlocked to vertically move inboard antennas coil 210.
Inner vertical driving portion 410 provides driving force so that inside linkage part 310 vertically moves.
As shown in figure 9, rising inboard antennas coil 210 when the processing speed of 10 inside of substrate to be slowed down.
As shown in Figure 10, when the processing speed of 10 inside of substrate to be improved, decline inboard antennas coil 210.
For vertically moving the composition of outboard antenna coil 220, including outside linkage part 320 and outside vertical driving portion
420。
Outside linkage part 320 and outboard antenna coil 220 are interlocked to vertically move outboard antenna coil 220.
Outside vertical driving portion 420 provides driving force so that outside linkage part 320 vertically moves.
As shown in figure 11, when the processing speed in 10 outside of substrate to be slowed down, rise outboard antenna coil 220.
As shown in figure 12, when the processing speed in 10 outside of substrate to be improved, decline outboard antenna coil 220.
Any one in inboard antennas coil 210 and outboard antenna coil 220 vertically moves, adjustable substrate 10
The processing speed of any one in inside and outside.
In addition, aerial coil 200 and outboard antenna coil 220 are vertically movable, can adjust simultaneously in substrate 10
The processing speed of side and outside.
For example, inboard antennas coil 210 rises and makes the processing speed of 10 inside of substrate slack-off, outboard antenna coil
220 decline and the processing speed in 10 outside of substrate are become faster.
Inboard antennas coil 210 and outboard antenna coil 220 may be configured as vertically moving.
In addition, any one that may be configured as in only inboard antennas coil 210 and outboard antenna coil 220 is hung down
Translation is dynamic.
It is vertically moved for example, being configured to inboard antennas coil 210, is configured to outboard antenna coil 220 and is fixed, so that with
On the basis of the processing speed in 10 outside of substrate, inboard antennas coil 210 is vertically moved to adjust the processing speed of 10 inside of substrate.
At this point, can fixed supply to outboard antenna coil 220 high frequency power and the outside of fixed substrate 10 processing speed,
Alternatively, the high frequency power for being supplied to outboard antenna coil 220 is adjusted and adjusts the processing speed on the outside of substrate 10.
In addition, may be configured as fixed inboard antennas coil 210, and it is configured to outboard antenna coil 220 and is vertically moved,
So that vertically moving outboard antenna coil 220 on the basis of the processing speed of 10 inside of substrate to adjust the place in 10 outside of substrate
Manage speed.
At this point, can fixed supply to inboard antennas coil 210 high frequency power and the inside of fixed substrate 10 processing speed,
Alternatively, the high frequency power for being supplied to inboard antennas coil 210 is adjusted and adjusts the processing speed on the inside of substrate 10.
As shown in Fig. 8 to Figure 12, inner vertical driving portion 410 and outside vertical driving portion 420 can be flexible gas
Cylinder.
In addition, inner vertical driving portion 410 and outside vertical driving portion 420 can be the motor of rotation.
In addition, inner vertical driving portion 410 can be flexible cylinder, outside vertical driving as shown in Figure 13 and 14
Portion 420 can be the motor of rotation.
In addition, inner vertical driving portion 410 can be the motor of rotation, outside vertical driving portion 420 can be flexible
Cylinder.
Inside linkage part 310 may include inside interconnecting piece 311, be combined with inboard antennas coil 210；And inside system
Conjunction portion 312 is combined with multiple inside interconnecting pieces 311, so that multiple inside interconnecting pieces 311 receive inner vertical driving portion together
410 driving force.
Inside interconnecting piece 311 in order to minimize by the interference of inboard antennas coil 210, including with inboard antennas coil 210
The definite part at the position of contact can be made of non-conducting material, preferably can by set of dielectrics at.
Inside interconnecting piece 311 can extend or be attached to inside integration portion 312 and be formed, alternatively, can be tight by screw etc.
Gu means are fixed to become round and smooth to separate.
Outside linkage part 320 may include outside interconnecting piece 321, be combined with outboard antenna coil 220；And outside system
Conjunction portion 322 is combined with multiple outside interconnecting pieces 321, so that multiple outside interconnecting pieces 321 receive outside horizontal drive portion together
Driving force.
Outside interconnecting piece 321 in order to minimize by the interference of outboard antenna coil 220, including with outboard antenna coil 220
The definite part at the position of contact can be made of non-conducting material, preferably can by set of dielectrics at.
Outside interconnecting piece 321 can extend or be attached to outside integration portion 322 and be formed, alternatively, can be tight by screw etc.
Gu means are fixed to become round and smooth to separate.
As described above, have vertically move in inboard antennas coil 210 and outboard antenna coil 220 any one with
On, with advantage more than any one in 10 inside of control base board and outer plasma density.
<embodiment moved horizontally about aerial coil 200>
As shown in Figure 15 to Figure 21, the substrate board treatment for mechanically controlling plasma density of the invention includes
Cavity 100, aerial coil 200, linkage part 300 and horizontal drive portion 500.
Linkage part 300 and aerial coil 200 are interlocked to move horizontally aerial coil 200.
Horizontal drive portion 500 provides driving force so that linkage part 300 moves horizontally.
Horizontal drive portion 500 can include: first level driving portion 501 moves left and right linkage part 300；And second water
Flat driving portion 502 is moved forward and backward linkage part 300.
As shown in figure 16, when first level driving portion 501 is the motor of rotation, the second horizontal drive portion 502 can be by spiral shell
Female shell NH is interlocked and is moved left and right, the ball spiral shell which is rotated and being interlocked by first level driving portion 501
Bar BS is moved.
In addition, the second horizontal drive portion 502 can be by nut shell when first level driving portion 501 is flexible cylinder
NH is interlocked and is moved left and right, the cylinder rod SB nut shell NH flexible and being interlocked by first level driving portion 501 come into
Row movement.
As shown in figure 17, when the second horizontal drive portion 502 is the motor of rotation, linkage part 300 can be by nut shell NH
Interlock and is moved forward and backward, the nut shell NH by by the second horizontal drive portion 502 interlock and rotation ball screw BS come into
Row movement.
In addition, when the second horizontal drive portion 502 is flexible cylinder, linkage part 300 can be interlocked by nut shell NH and
It is moved forward and backward, the cylinder rod SB nut shell NH flexible and being interlocked by the second horizontal drive portion 502 is moved.
Contrary to the above, first level driving portion 501 can be interlocked by the second horizontal drive portion 502 and is moved forward and backward.
In addition, linkage part 300 can be interlocked by first level driving portion 501 and be moved left and right.
It can move left and right and be moved forward and backward by the way that combination is above-mentioned, as shown in figure 18, aerial coil 200 is moved horizontally
To required position.
As shown in figure 19, the ball screw BS in the second horizontal drive portion 502 is integrated to the nut of first level driving portion 501
Shell NH, first level driving portion 501 move left and right the ball screw BS in the second horizontal drive portion 502 and make the second horizontal drive
Dynamic portion 502 moves left and right, and linkage part 300 can be interlocked by the second horizontal drive portion 502 and be moved left and right.
As shown in figure 20, the second horizontal drive portion 502 is integrated to the nut shell NH of first level driving portion 501, and first
Horizontal drive portion 501 moves left and right the nut shell NH of first level driving portion 501 and makes the second horizontal drive portion 502 or so
Mobile, linkage part 300 can be interlocked by the second horizontal drive portion 502 and be moved left and right.
As shown in figure 21, the second horizontal drive portion 502 is integrated to support portion 303, and first level driving portion 501 moves left and right
Support portion 303 and the second horizontal drive portion 502 is moved left and right, linkage part 300 can be interlocked by the second horizontal drive portion 502
And it moves left and right.
When the processing of substrate 10 is amesiality and processed, aerial coil 200 can be moved horizontally to the position with deviation
Opposite position completes the processing of substrate 10 in center with this.
As described above, having the advantages that move horizontally aerial coil 200 to control plasma formation location.
As shown in Figure 15 to Figure 21, aerial coil 200 includes inboard antennas coil 210 and outboard antenna coil 220.
With above-mentioned as the linkage part 300 for the composition for moving horizontally aerial coil 200, horizontal drive portion 500, the first water
In the same manner, inboard antennas coil 210 can be by connecting including inside for the composition in flat driving portion 501 and the second horizontal drive portion 502
Move the structure in portion 310, inside horizontal drive portion 510, inside first level driving portion 511 and inside the second horizontal drive portion 512
At being horizontally moved.
Outboard antenna coil 220 can fix position, alternatively, can be by as water identical with inboard antennas coil 210
Translation is dynamic, and constitute includes outside linkage part 320, outside horizontal drive portion 520, outside first level driving portion 501 and outside
The composition in side the second horizontal drive portion 502 is horizontally moved.
As described above, have can move horizontally it is any one in inboard antennas coil 210 and outboard antenna coil 220
Advantage more than any one a above in 10 inside of control base board and outer plasma density.
<about the vertical of aerial coil 200 and the embodiment moved horizontally>
The substrate board treatment according to the present invention for mechanically controlling plasma density, with above-mentioned aerial coil
200 vertically move and move horizontally in the same manner, can implement vertically moving and moving horizontally for aerial coil 200 respectively,
Alternatively, vertically moving and moving horizontally for aerial coil 200 can be implemented simultaneously as shown in Figure 22 to Figure 26.
As shown in Figure 22 to Figure 24, the substrate board treatment for mechanically controlling plasma density of the invention includes
Cavity 100, aerial coil 200, linkage part 300, vertical drive unit 400 and horizontal drive portion 500.
Identical as above content about the composition for vertically moving and moving horizontally, therefore, main explanation is about in conjunction with structure
At distinctive points.
Linkage part 300 and aerial coil 200 are interlocked with vertical and move horizontally aerial coil 200.
Horizontal drive portion 500 provides driving force so that linkage part 300 moves horizontally.
Vertical drive unit 400 provides driving force so that horizontal drive portion 500 vertically moves.
That is, horizontal drive portion 500 moves horizontally linkage part 300, vertical drive unit 400 vertically moves horizontal drive portion 500
And linkage part 300 is vertically moved together with horizontal drive portion 500, so that aerial coil 200 vertically moves and water
Translation is dynamic.
Contrary to the above, as shown in figure 25, vertical drive unit 400 vertically moves linkage part 300,500 water of horizontal drive portion
It translates dynamic vertical drive unit 400 and linkage part 300 is moved horizontally together with vertical drive unit 400, so that antenna line
Circle 200 can be vertically moved and be moved horizontally.
As shown in Figure 22 and Figure 24, by can composition that is vertical and moving horizontally inboard antennas coil 210, with this
The processing speed of adjustable 10 inside of substrate.
In addition, by can composition that is vertical and moving horizontally outboard antenna coil 220, be adjusted outside substrate 10 with this
The processing speed of side.
In addition, by being capable of structure that is vertical and moving horizontally inboard antennas coil 210 and outboard antenna coil 220
At the inside processing speed and outside processing speed of substrate 10 are adjusted with this.
As shown in Figure 22 and Figure 25, vertical drive unit 400 can be cylinder, and horizontal drive portion 500 can be motor.
In addition, vertical drive unit 400 can be motor, horizontal drive portion 500 can be cylinder.
As shown in figure 26, vertical drive unit 400 and horizontal drive portion 500 can be motor.
In addition, vertical drive unit 400 and horizontal drive portion 500 can be cylinder.
It can be vertical and be moved horizontally in inboard antennas coil 210 and outboard antenna coil 220 as described above, having
More than any one, the advantages of processing speed to adjust any one in the inside of substrate 10 and outside or more.
<embodiment of structure is generated about plasma>
CCP (capacitiveiy coupled plasma, the capacitive of plasma are generated in substrate board treatment using electric field
Coupled plasma) in the case where, aerial coil 200 is formed in the top of cavity 100, as shown in Fig. 2 to Figure 26, according to this
In the substrate board treatment for mechanically controlling plasma density of invention, the moving range of aerial coil 200 is formed in
The top of cavity 100.
If aerial coil 200 is formed in the lower part of cavity 100, the moving range of aerial coil 200 is formed in cavity
100 lower part.
That is, being formed by the position of cavity 100 according to aerial coil 200, the moving range of aerial coil 200 is formed.
In substrate board treatment, ICP (inductively coupled plasma, the inductive of plasma are generated using magnetic field
Coupled plasma) in the case where, aerial coil 200 may be formed at the periphery of cavity 100, as shown in Figure 27 to Figure 29, root
According in the substrate board treatment for mechanically controlling plasma density of the invention, the moving range of aerial coil 200 can
It is formed in the periphery of cavity 100.
It could be applicable to the excellent of various substrate board treatments other than CCP as described above, having in substrate board treatment
Point.
<embodiment of the mobile composition about control aerial coil 200>
The substrate board treatment according to the present invention for mechanically controlling plasma density, as shown in Figures 2 to 4,
It may include control unit 600, to providing driving force so that vertical drive unit 400 that aerial coil 200 moves in the vertical direction
Drive volume is controlled, alternatively, as shown in FIG. 15 to 18, it may include control unit 600, to offer driving force so that antenna line
The drive volume in the horizontal drive portion 500 that circle 200 moves in the horizontal direction is controlled.
At this point, control unit 600 can control vertical drive unit 400 and horizontal drive portion 500.
Control unit 600 controls the moving distance of aerial coil 200 by control drive volume, to control according to aerial coil
The forming position of 200 plasma Ps carried out.
Based on this, the concrete operations of control unit constitute as follows.
Firstly, the substrate 10 of processed plasma P is detected, to confirm the field of the deviation generation of processing speed.
Confirm at this point, deviation field is approved really by directly detecting substrate, alternatively, the density of plasma can be passed through
Equal indirect acknowledgments.
Then, the information in the deviation field about substrate 10 is inputted in control unit 600.
Then, control unit 600 is based on the information of input, calculate aerial coil 200 moving direction and it is mobile away from
From the position control value of calculating aerial coil 200.
At this point, the information input in the deviation field about substrate 10 can be replaced, antenna line can be directly inputted to control unit 600
The position control value of circle 200.
Then, control unit 600 adjusts the driving of vertical drive unit 400 based on the position control value of aerial coil 200
Amount, to adjust the upright position of aerial coil 200, alternatively, the drive volume in horizontal drive portion 500 is adjusted, to adjust aerial coil
200 horizontal position controls plasma density distribution with this.
As described above, control unit 600 adjusts the position of aerial coil 200, there is no need to the openings of cavity 100, and day is adjusted
The position of line coil 200, to have the advantages that the process hold-up time for minimizing substrate board treatment to improve productivity.
In addition, mechanically therefore adjusting position directly decomposes aerial coil 200 with tool with user and adjusts
The case where re-assemblying behind position is compared, can accurately adjusting position, thus have can accurate adjusting position and it is minimized
Bad advantage.
Claims (16)
1. a kind of substrate board treatment for mechanically controlling plasma density, wherein include:
Cavity, in inside corona treatment substrate；
Aerial coil radiates high frequency waves to the engineering gas for being supplied to the inside cavity to generate plasma；
Linkage part is connected with the aerial coil, moves together with the aerial coil；
Horizontal drive portion provides driving force so that the linkage part moves in the horizontal direction；And
Drive control part controls the driving in the horizontal drive portion,
The drive control part is with corresponding from the position that the current position of the aerial coil should be moved to the aerial coil
Moving direction and moving distance mode, adjust the drive volume in the horizontal drive portion, thus control through the antenna
The forming position of the plasma of coil.
2. mechanically controlling the substrate board treatment of plasma density as described in claim 1, wherein
The horizontal drive portion includes:
First level driving portion provides driving force so that the linkage part is moved to the left and right of horizontal direction；And
Second horizontal drive portion is interlocked and moved left and right by the first level driving portion, provides driving force so that the gearing
Portion to being moved before and after horizontal direction,
The first level driving portion and/or second horizontal drive portion are driven, in left-right and front-back in the horizontal direction
At least side on moved so that the central point of the aerial coil is separated from original position.
3. mechanically controlling the substrate board treatment of plasma density as claimed in claim 2, wherein
The first level driving portion is the motor of rotation,
Second horizontal drive portion is connected with nut shell and is moved left and right, and the nut shell passes through by the first level
The ball screw that driving portion is interlocked and rotated is moved.
4. mechanically controlling the substrate board treatment of plasma density as claimed in claim 2, wherein
The first level driving portion is flexible cylinder,
Second horizontal drive portion is connected with nut shell and is moved left and right, and the nut shell passes through by the first level
Driving portion interlocks and flexible cylinder rod is moved.
5. mechanically controlling the substrate board treatment of plasma density as claimed in claim 2, wherein
The linkage part includes:
Interconnecting piece, in conjunction with the aerial coil；And
Integration portion, in conjunction with multiple interconnecting pieces, so that multiple interconnecting pieces receive the drive in the horizontal drive portion together
Power.
6. mechanically controlling the substrate board treatment of plasma density as claimed in claim 5, wherein
The interconnecting piece includes that the definite part at the position contacted with the aerial coil is made of non-conducting material, with most
The interference of the smallization aerial coil.
7. mechanically controlling the substrate board treatment of plasma density as described in claim 1, wherein
The substrate board treatment includes vertical drive unit, and the vertical drive unit provides driving force so that the horizontal drive portion
It vertically moves,
The horizontal drive portion and the linkage part are interlocked to vertically move the linkage part.
8. mechanically controlling the substrate board treatment of plasma density as described in claim 1, wherein
The substrate board treatment includes vertical drive unit, and the vertical drive unit is located at the horizontal drive portion and the gearing
Between portion, driving force is provided so that the linkage part vertically moves,
The horizontal drive portion and the vertical drive unit are interlocked to move horizontally the vertical drive unit.
9. mechanically controlling the substrate board treatment of plasma density as described in claim 1, wherein
The aerial coil includes:
Inboard antennas coil controls the plasma density on the inside of the substrate；And
Outboard antenna coil controls the plasma density on the outside of the substrate,
The linkage part includes inside linkage part, and the inside linkage part and the inboard antennas coil interlock, to move horizontally
The inboard antennas coil,
The substrate board treatment includes inside horizontal drive portion, and inside horizontal drive portion provides driving force so that in described
Side linkage part moves horizontally.
10. mechanically controlling the substrate board treatment of plasma density as claimed in claim 9, wherein
Inside horizontal drive portion includes:
Inside first level driving portion, moves left and right the linkage part；And
Inside the second horizontal drive portion, is moved forward and backward the linkage part.
11. mechanically controlling the substrate board treatment of plasma density as claimed in claim 10, wherein
Inside the second horizontal drive portion is interlocked and moved left and right by the inside first level driving portion,
The linkage part is interlocked and be moved forward and backward by inside the second horizontal drive portion.
12. mechanically controlling the substrate board treatment of plasma density as claimed in claim 11, wherein
The substrate board treatment includes inner vertical driving portion, and the inner vertical driving portion provides driving force so that in described
Side horizontal drive portion vertically moves,
Inside horizontal drive portion and the linkage part interlock, to vertically move the linkage part.
13. mechanically controlling the substrate board treatment of plasma density as claimed in claim 9, wherein
The substrate board treatment includes:
Outside linkage part is interlocked with the outboard antenna coil, to move horizontally the outboard antenna coil；And
Outside horizontal drive portion provides driving force so that the outside linkage part moves horizontally.
14. mechanically controlling the substrate board treatment of plasma density as claimed in claim 13, wherein
Outside horizontal drive portion includes:
Outside first level driving portion, moves left and right the linkage part；And
Outside the second horizontal drive portion, is moved forward and backward the linkage part.
15. mechanically controlling the substrate board treatment of plasma density as claimed in claim 14, wherein
Outside the second horizontal drive portion is interlocked and moved left and right by the outside first level driving portion,
The linkage part is interlocked and be moved forward and backward by outside the second horizontal drive portion.
16. mechanically controlling the substrate board treatment of plasma density as claimed in claim 15, wherein
The substrate board treatment includes outside vertical driving portion, and the outside vertical driving portion provides driving force so that described outer
Side horizontal drive portion vertically moves,
Outside horizontal drive portion and the linkage part interlock, to vertically move the linkage part.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1020180076490A KR102190794B1 (en) | 2018-07-02 | 2018-07-02 | A substrate processing apparatus for mechanically controlling plasma density |
| KR10-2018-0076490 | 2018-07-02 |
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| Publication Number | Publication Date |
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| CN110233093A true CN110233093A (en) | 2019-09-13 |
| CN110233093B CN110233093B (en) | 2021-08-24 |
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| CN201910435957.1A Active CN110233093B (en) | 2018-07-02 | 2019-05-23 | Substrate processing apparatus for mechanically controlling plasma density |
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|---|---|
| KR (1) | KR102190794B1 (en) |
| CN (1) | CN110233093B (en) |
| TW (1) | TWI697030B (en) |
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| CN114599142A (en) * | 2022-03-07 | 2022-06-07 | 盛吉盛(宁波)半导体科技有限公司 | Plasma conditioning device, plasma conditioning method, plasma generating device, and semiconductor processing device |
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| KR20220106820A (en) | 2019-12-02 | 2022-07-29 | 램 리써치 코포레이션 | Impedance conversion in RF (RADIO-FREQUENCY) assisted plasma generation |
| US11994542B2 (en) | 2020-03-27 | 2024-05-28 | Lam Research Corporation | RF signal parameter measurement in an integrated circuit fabrication chamber |
| KR102147873B1 (en) * | 2020-04-01 | 2020-08-25 | 주식회사 기가레인 | Plasma antena module |
| CN113496863B (en) * | 2020-04-01 | 2022-04-12 | 吉佳蓝科技股份有限公司 | Plasma antenna module |
| CN115485808A (en) * | 2020-05-04 | 2022-12-16 | 朗姆研究公司 | Improving plasma uniformity in a receptacle |
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Also Published As
| Publication number | Publication date |
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| TWI697030B (en) | 2020-06-21 |
| KR20200003561A (en) | 2020-01-10 |
| TW202006787A (en) | 2020-02-01 |
| KR102190794B1 (en) | 2020-12-15 |
| CN110233093B (en) | 2021-08-24 |
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