KR101714405B1 - Plasma Processing Apparatus - Google Patents

Plasma Processing Apparatus Download PDF

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Publication number
KR101714405B1
KR101714405B1 KR1020150107273A KR20150107273A KR101714405B1 KR 101714405 B1 KR101714405 B1 KR 101714405B1 KR 1020150107273 A KR1020150107273 A KR 1020150107273A KR 20150107273 A KR20150107273 A KR 20150107273A KR 101714405 B1 KR101714405 B1 KR 101714405B1
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South Korea
Prior art keywords
antenna
power
disposed
radius
power distribution
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KR1020150107273A
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Korean (ko)
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KR20170015608A (en
Inventor
서상훈
정성현
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주식회사 윈텔
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082Radio frequency generated discharge
    • H01J37/321Radio frequency generated discharge the radio frequency energy being inductively coupled to the plasma
    • H01J37/3211Antennas, e.g. particular shapes of coils
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02Details
    • H01J37/244Detectors; Associated components or circuits therefor
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192Microwave generated discharge
    • H01J37/32211Means for coupling power to the plasma
    • H01J37/3222Antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32Gas-filled discharge tubes
    • H01J37/32009Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32192Microwave generated discharge
    • H01J37/32266Means for controlling power transmitted to the plasma
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/245Detection characterised by the variable being measured
    • H01J2237/24564Measurements of electric or magnetic variables, e.g. voltage, current, frequency
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01JELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/248Components associated with the control of the tube
    • H01J2237/2485Electric or electronic means

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Plasma Technology (AREA)

Abstract

The present invention provides an inductively coupled plasma processing apparatus. The apparatus includes an inner antenna disposed on a dielectric top plate of a vacuum container and having a constant radius; A plurality of outer antennas electrically connected in parallel and disposed on the dielectric top plate of the vacuum container and disposed on an outer periphery of the inner antenna; A power distributor for distributing power to the inner antenna and the outer antenna, respectively; And an RF power source for providing power to the inner antenna and the outer antenna through the power divider. The outer antennas are disposed at regular intervals on a circumference having a constant radius on the central axis of the inner antenna. The outer antenna includes an inner curved portion having a first radius of curvature and an outer curved portion having a second radius of curvature larger than the first radius of curvature. The outer antennas do not overlap each other and form a closed loop.

Description

[0001] Plasma Processing Apparatus [0002]

The present invention relates to an inductively coupled plasma processing apparatus, and more particularly, to a large area plasma source having an inner antenna and an outer antenna.

Korean Patent Laid-Open No. 10-2013-0043795 discloses a plasma processing apparatus having an inner antenna and an outer antenna. The outer antenna of this patent is a multi-layer structure, and it is difficult to control the plasma density at a local location.

Korean Patent Laid-Open Publication No. 10-2012-0040335 discloses a plasma processing apparatus having an inner antenna and an outer antenna. The outer antenna of this patent is composed of half-turn antennas superimposed on each other, and it is difficult to control the plasma density at a local position.

In order to increase the uniformity of the rotating direction (direction of the azimuth angle of the cylindrical coordinate system), the large area inductively coupled plasma uses a plurality of turns in a multi-layered structure. Nonetheless, such an inductively coupled plasma produces a locally non-uniform plasma due to the gas supply direction or the gas pumping direction of the exhaust. Therefore, an antenna structure for improving local plasma nonuniformity is required.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an antenna structure for controlling local plasma nonuniformity in a large area plasma processing apparatus.

An inductively coupled plasma processing apparatus according to an embodiment of the present invention includes an inner antenna disposed on a dielectric top plate of a vacuum container and having a constant radius; A plurality of outer antennas electrically connected in parallel and disposed on the dielectric top plate of the vacuum container and disposed on an outer periphery of the inner antenna; A power distributor for distributing power to the inner antenna and the outer antenna, respectively; And an RF power source for providing power to the inner antenna and the outer antenna through the power divider. The outer antennas are disposed at regular intervals on a circumference having a constant radius on the central axis of the inner antenna. The outer antenna includes an inner curved portion having a first radius of curvature and an outer curved portion having a second radius of curvature larger than the first radius of curvature. The outer antennas do not overlap each other and form a closed loop.

In one embodiment of the present invention, the antenna further includes an external antenna variable capacitor connected between the at least one external antenna and the ground. The outer antenna variable capacitors can uniformly control non-uniform plasma locally.

In one embodiment of the present invention, the apparatus may further include a current measuring unit for sensing a current flowing through the outer antenna to which the outer antenna variable capacitor is connected.

In one embodiment of the present invention, the power input terminal and the output terminal of the outer antenna may be disposed in the outer curved portion.

In one embodiment of the present invention, one end includes a vertical support which vertically extends in a plane in which the outer antenna is disposed and the outer antenna is fixed; And a conductive fixing plate fixed and grounded at the other end of the vertical supporting portion. The conductive fixing plate includes a through hole at the center, and the power distributing portion is disposed to extend through the through hole, and can be radially branched.

In one embodiment of the present invention, the antenna may further include a permanent magnet disposed vertically spaced apart from the outer antenna. The permanent magnets may be respectively disposed corresponding to the outer antenna, and the permanent magnets may be disposed on the conductive fixing plate.

In one embodiment of the present invention, the power divider may include an inner power divider for distributing power to the inner antenna and an outer power divider for distributing power to the outer antenna. The inner power distribution portion may include a cylindrical inner power distribution body portion and an inner power distribution branch portion that radially branches from the inner power distribution body portion. The outer power distribution portion may include a cylindrical outer power distribution body portion and an outer power distribution branch portion that radially branches from the outer power distribution body portion. The outer power distribution body may be coaxial to enclose the inner power distribution body.

In one embodiment of the present invention, the power divider includes a power distribution variable capacitor connected in series with the inner antenna to control a current flowing to the inner antenna and the outer antenna; And a fixed inductor connected in series to the outer antenna connected in parallel.

In one embodiment of the present invention, the outer antennas may be disposed in quadrants, respectively.

In one embodiment of the invention, the inner antenna comprises an inner curved portion having a third radius of curvature and an outer curved portion having a fourth radius of curvature larger than the third radius of curvature to provide an outline of the annular section, Section. The inner antenna can form a closed loop without overlapping.

According to an embodiment of the present invention, a local plasma density distribution can be controlled by disposing the outer antennas so that they are not overlapped spatially and connecting a variable capacitor to at least one outer antenna. Thus, a spatially uniform plasma density distribution can be provided.

1 is a conceptual diagram illustrating an inductively coupled plasma apparatus according to an embodiment of the present invention.
2 is a circuit diagram showing an electrical connection of the inductively coupled plasma apparatus of FIG.
3 is a perspective view illustrating the inductively coupled plasma apparatus of FIG.
4 is a perspective view illustrating the inductively coupled plasma apparatus of FIG.
5 is a cross-sectional view taken along line AA 'of FIG.
6 is a cross-sectional view taken along the line B-B 'in FIG.
7 is a circuit diagram illustrating a plasma processing apparatus according to another embodiment of the present invention.
8 is a conceptual diagram illustrating a plasma processing apparatus according to another embodiment of the present invention.
9 is a conceptual diagram illustrating a plasma processing apparatus according to another embodiment of the present invention.
10 is a circuit diagram illustrating the plasma processing apparatus of FIG.

Conventional inductively coupled plasma is designed in a multi-layer structure in which a plurality of antennas connected in parallel are provided in order to provide plasma uniformity in azimuthal direction in a cylindrical coordinate system. However, the antenna of such a structure can not locally control the RF power, so that it is difficult to control the local plasma density.

The plasma apparatus according to an embodiment of the present invention may spatially separate a plurality of outer antennas from each other so as not to overlap with each other, and the RF power provided to one or a plurality of outer antennas of the outer antennas may be controlled. Thus, the plasma density distribution can be locally controlled. Thus, local plasma non-uniformity or process non-uniformity due to the pumping direction or gas flow direction of the exhaust portion and the like can be improved.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. However, the present invention is not limited to the embodiments described herein but may be embodied in other forms. Rather, the embodiments disclosed herein are being provided so that this disclosure will be thorough and complete, and will fully convey the concept of the invention to those skilled in the art. In the drawings, the components have been exaggerated for clarity. Like numbers refer to like elements throughout the specification.

1 is a conceptual diagram illustrating an inductively coupled plasma apparatus according to an embodiment of the present invention.

2 is a circuit diagram showing an electrical connection of the inductively coupled plasma apparatus of FIG.

3 is a perspective view illustrating the inductively coupled plasma apparatus of FIG.

4 is a perspective view illustrating the inductively coupled plasma apparatus of FIG.

5 is a cross-sectional view taken along line A-A 'in FIG.

6 is a cross-sectional view taken along the line B-B 'in FIG.

1 to 6, an inductively coupled plasma processing apparatus 100 includes an inner antenna 110 disposed on a dielectric top plate 102 of a vacuum container 101 and having a constant radius; A plurality of outer antennas (120) electrically connected in parallel and disposed on the dielectric top plate (102) of the vacuum container (101) and disposed on the outer periphery of the inner antenna (110); A power divider 140 for distributing power to the inner antenna 110 and the outer antenna 120, respectively; And an RF power supply 184 for supplying power to the inner antenna and the outer antenna through the power distributor 140. [ The outer antenna 120 is disposed at regular intervals on a circumference having a predetermined radius on the center axis of the inner antenna 110. The outer antenna 120 includes an inner curved portion 124 having a first radius of curvature and an outer curved portion 124 having a second radius of curvature greater than the first radius of curvature. The outer antenna 120 does not overlap with each other and forms a closed loop.

The vacuum chamber 101 may be a cylindrical chamber made of a metal. The dielectric top plate 102 may be a cover of the vacuum vessel 101. The vacuum chamber 101 may be subjected to a plasma etching process, a plasma deposition process, or a plasma surface treatment process. The dielectric top plate 102 may be a disk-shaped quartz, alumina, or ceramic.

The substrate holder 103 may be disposed inside the vacuum container 101. The substrate 104 may be disposed on the substrate holder 103. The substrate 104 may be a semiconductor substrate. The substrate holder 103 can fix the substrate 104 through an electrostatic chuck or a mechanical chuck. The substrate holder 103 may be connected to a separate RF power source (not shown) to apply an RF bias to the substrate 104. The substrate holder 103 may include a temperature controller (not shown) to control the temperature.

The pumping port 108 may be arranged to exhaust the interior of the vacuum container 101. The pumping port may be connected to a vacuum pump. The pumping port 108 may be disposed on the lower surface of the vacuum container 101 or on the side surface of the vacuum container 101. Depending on the arrangement of the pumping port 101, a flow of fluid may be generated and localized plasma non-uniformity may occur in the region where the inductively coupled plasma is generated. Local plasma non-uniformity can be attributed to various causes such as local temperature differences, direction of gas flow, and the like.

The gas supply unit 109 is disposed at the center of the dielectric top plate 102 and can inject the process gas symmetrically. For example, in the case of an etching process, the process gas may be a chlorine-containing gas, a fluorine-containing gas, or an oxygen-containing gas.

The RF power supply 184 may generate RF power with a frequency of several hundred kHz to several hundred MHz. The RF power supply 184 may be provided to the impedance matching unit 182 through a coaxial cable. The impedance matching unit 182 may typically perform impedance matching using two variable active elements. The output of the impedance matching unit 182 may be transmitted to the power distributor 140. If the impedance matching unit is not used, the RF power source 184 may change the driving frequency to perform impedance matching, and the RF power may be directly provided to the power distributor 140.

The power divider 140 may distribute the provided RF power to the inner antenna 110 and the outer antenna 120. [ For this purpose, the power divider 140 may include a power divider variable capacitor 141 that can change the impedance of the inner antenna or the impedance of the outer antenna.

Specifically, the input terminal of the power distributor 140 may be branched into two branches, and one branch may be connected to the inner antenna 110 through the power distribution variable capacitor 141. The other branch may be connected to the outer antenna 120 via an inductor 142.

The power divider 140 may include an inner power divider 143 for distributing power to the inner antenna 110 and an outer power divider 144 for distributing power to the outer antenna 120 . The inner power distributor 143 may include a cylindrical inner power distribution body 143b and an inner power distribution branch 143a that branches radially from the inner power distribution body 143b. The outer power distributor 144 may include a cylindrical outer power distribution body 144b and an outer power distribution branch 144a that diverges radially from the outer power distribution body. The outer power distribution body 144b may be coaxial to enclose the inner power distribution body 143b. The outer power distribution branch 144a may branch radially from the outer power distribution body 144b and supply RF power to each of the outer antennas. In addition, the inner power distribution branch 143a branches radially from the inner power distribution body 143b, and supplies RF power to each inner antenna 110. [

When the inner antenna 110 is a multi-layer structure in which two antennas are superimposed, there may be two points where power is supplied. In this case, the inner power divider 143a may be branched by 180 degrees. When there are four external antennas 120, the external power distribution branch 144a may be branched in a cross shape with a difference of 90 degrees.

The power distributor 140 is connected to the power distribution variable capacitor 141 connected in series with the inner antenna 110 and the outer antenna connected in parallel to control the current flowing in the inner antenna 110 and the outer antenna 120 And may include a series connected inductor 142. The inductor 142 may be used for stable impedance matching. As the inner antenna 110 and the power-sharing variable capacitor 141 constitute a series resonance circuit, the impedance in the direction of the inner antenna can be changed. Thus, the power in the inner antenna direction and the power in the outer antenna direction can be controlled to be distributed.

The inner antenna 110 may be disposed between the power distribution variable capacitor 141 and the ground. The inner antenna 110 may have a multi-layer structure in which two antennas are overlapped. The inner antenna 110 may include a first inner antenna 110a and a second inner antenna 110b. The first inner antenna 110a and the second inner antenna 110b may have the same structure and are arranged symmetrically with respect to each other by 180 degrees and may be connected in parallel. The inner antenna 110 includes an inner power supply plug 116, a first 45 degree upper branch 111, a first plug 112, a 180 degree lower branch 113, a second plug 114, The upper branch 115, and the inner ground post 117. The inner antenna 110 may be arranged to extend counterclockwise or clockwise. The inner antenna 110 may be in the shape of a band rather than a pipe shape in which refrigerant flows.

The inner power supply plug 116 may extend vertically from the inner power distribution branch 143a and may be connected to one end of the inner antenna 110. [ The first 45 degrees upper branch 111 may be disposed on the upper surface of the antenna with a 45 degree arc. The first plug 112 can be lowered by lowering the placement plane at the upper surface. The 180 degree lower branch 113 may extend from the lower surface with a 180 degree arc. The second plug 114 can change the placement plane from the lower face to the upper face. The second 45 degree branch 115 may be disposed on the upper surface and may have a 45 degree arc. The inner ground column 117 may extend vertically and be connected to the conductive fixing plate 130 or the grounding member. The connecting portions of the branches may be bent in a direction in which the radius increases or a direction in which the radius decreases so that the antennas do not overlap with each other.

The outer antenna 120 may be disposed outside the inner antenna 110, and may be disposed in a quadrant. The outer antenna 120 includes an inner curved portion 124 having a first radius of curvature and an outer curved portion 122 having a second radius of curvature greater than the first radius of curvature to provide an outline of an annular section. ). The power supply portion and the ground portion of the outer antenna 120 may be disposed on the outer curved portion 122 having a large radius. By disposing the power supply portion in the outer curved portion 122, plasma nonuniformity due to capacitive coupling can be disposed at the outermost periphery. Also, as the radius of the substrate 104 is set to be smaller than the radius of curvature of the curved outer curved portion 122, the curved outer curved portion 122 may be disposed at the outer periphery of the substrate. For example, when the radius of the substrate is 150 mm, the radius of curvature of the outer curved portion may be set to 150 mm or more, and the radius of curvature of the inner curved portion 124 may be set to be less than 150 mm. The power supply portion and the ground portion of the outer antenna 120 may be symmetrically disposed at the center of the columnar section. The outer antenna 120 may be in the shape of a band rather than a pipe shape in which refrigerant flows.

The outer antennas 120 have the same structure and can be disposed in quadrants, respectively. The outer power distribution branch 144a may be connected to the outer antenna 120 via a power supply plug 125 that branches in a cross and extends vertically. The outer antenna 120 may be connected to the conductive fixing plate 130 or the grounding member via an outer grounding column 126 extending vertically.

The outer antenna variable capacitor 170 may be connected between at least one of the outer antennas 120 and ground. The power flowing through the outer antenna variable capacitor 170 and the outer antenna 120d connected to the outer antenna variable capacitor 170 is different from the power flowing through the outer antenna variable capacitor 170 and the outer antennas 120a to 120c not connected thereto . Therefore, the outer antenna variable capacitor 170 can uniformly control the non-uniform plasma locally.

In order to control the external antenna variable capacitor 170, the current measuring unit 149 may sense a current flowing in the external antenna 120 to which the external antenna variable capacitor 170 is connected. Also, the current measuring unit 149 can sense the current flowing through the external antenna to which the external antenna variable capacitor 170 is not connected. Accordingly, the power between the outer antennas can be controlled by adjusting the capacitance of the outer antenna variable capacitor 170. On the other hand, since the outer antennas are not arranged so as to overlap with each other spatially, the local induced electromotive force can be controlled.

One end of the vertical support portion 162 may extend vertically in a plane in which the outer antenna 120 is fixed and the outer antenna 120 is disposed. The vertical support part 120 may fix the outer curved part 122 and the inner curved part 124 together. The vertical support portions 162 may be disposed at two positions spaced from each other with respect to the respective outer antennas. The vertical support portion 162 includes a groove to which the outer antenna is disposed, and the outer antenna inserted in the groove can be fixed through the cover. The vertical support portion 162 may spatially separate the outer antenna 120 from the dielectric top plate 102 and fix the outer antenna 120 at a specific position. The vertical support portion 162 may be formed of an insulator, and the material thereof may be ceramic. The vertical support portion 162 may be fixed to the conductive fixing plate 130 by the support pillars 162a.

The conductive fixing plate 130 may be grounded while fixing the other end of the vertical support portion 162. The conductive fixing plate 130 includes a through hole at the center thereof, and the power distributor 140 is disposed to extend through the through hole and may be radially branched. The conductive fixing plates 130 may be spaced apart from each other at a predetermined interval in the dielectric top plate of the vacuum chamber 101 and arranged side by side. The conductive fixing plate 130 may have a disc shape and may be made of a conductive material.

The shield case 105 may be disposed to surround the inner antenna 110, the outer antenna 120, and the power distributor 140 and may have a cylindrical shape. The shield case 105 may be mounted on the vacuum container 101 and formed of a conductive material.

The conductive fixing plate 130 may be disposed inside the shield case 105. The distance between the conductive fixing plate 130 and the upper surface 106 of the shielding case 105 may be adjusted to adjust the distance between the antenna and the dielectric top plate.

The permanent magnet fixing plate 132 may be disposed on the conductive fixing plate 130. A permanent magnet 133 may be disposed inside the permanent magnet fixing plate 132. The shapes of the permanent magnets 132 are similar to those of the antennas and can be arranged to correspond to each other. The permanent magnets 133 and 134 are magnetized in a vertical direction, and the permanent magnet may provide a magnetic field in a region where inductively coupled plasma is generated. The permanent magnets 133 corresponding to the outer antenna may be shaped to provide an outline of an annular section. The permanent magnet corresponding to the inner antenna 134 may be ring-shaped.

According to a modified embodiment of the present invention, the number of the outer antennas may be changed to three, five, six, or the like.

7 is a circuit diagram illustrating a plasma processing apparatus according to another embodiment of the present invention.

Referring to FIG. 7, the inductively coupled plasma processing apparatus 100a includes an inner antenna 110 disposed on a dielectric top plate 102 of a vacuum container 101 and having a constant radius; A plurality of outer antennas (120) electrically connected in parallel and disposed on the dielectric top plate (102) of the vacuum container (101) and disposed on the outer periphery of the inner antenna (110); A power divider 140 for distributing power to the inner antenna 110 and the outer antenna 120, respectively; And an RF power supply 184 for supplying power to the inner antenna and the outer antenna through the power distributor 140. [ The outer antenna 120 is disposed at regular intervals on a circumference having a predetermined radius on the center axis of the inner antenna 110. The outer antenna 120 includes an inner curved portion 124 having a first radius of curvature and an outer curved portion 124 having a second radius of curvature greater than the first radius of curvature. The outer antenna 120 does not overlap with each other and forms a closed loop.

The outer antenna variable capacitor 170 may be mounted to each of the outer antennas 120a, 120b, 120c, and 102d. The external antenna 120 to which the external antenna variable capacitor is connected may be provided with a current meter 149 for measuring a current flowing therethrough. The current meter 149 can be used to measure the flowing current to remove the capacitance of the outer antenna variable capacitor 170.

8 is a conceptual diagram illustrating a plasma processing apparatus according to another embodiment of the present invention.

Referring to FIG. 8, an inductively coupled plasma processing apparatus 200 includes an inner antenna 110 disposed on a dielectric top plate 102 of a vacuum container 101 and having a constant radius; A plurality of outer antennas (120) electrically connected in parallel and disposed on the dielectric top plate (102) of the vacuum container (101) and disposed on the outer periphery of the inner antenna (110); A power divider 140 for distributing power to the inner antenna 110 and the outer antenna 120, respectively; And an RF power supply 184 for supplying power to the inner antenna and the outer antenna through the power distributor 140. [ The outer antenna 120 is disposed at regular intervals on a circumference having a predetermined radius on the center axis of the inner antenna 110. The outer antenna 120 includes an inner curved portion 124 having a first radius of curvature and an outer curved portion 124 having a second radius of curvature greater than the first radius of curvature. The outer antenna 120 does not overlap with each other and forms a closed loop.

The directions of the magnetic moments by the outer antenna may be opposite to each other with respect to the adjacent outer antenna. Specifically, the current direction of the first outside antenna 120a disposed in the first quadrant may be opposite to the current direction of the second outside antenna 120b disposed in the second quadrant. In addition, the current direction of the second outside antenna 120b may be opposite to the current direction of the third antenna 120c disposed in the third quadrant. In addition, the current direction of the third outside antenna 120c may be opposite to the current direction of the fourth antenna 120d arranged in the fourth quadrant.

9 is a conceptual diagram illustrating a plasma processing apparatus according to another embodiment of the present invention.

10 is a circuit diagram illustrating the plasma processing apparatus of FIG.

9 and 10, an inductively coupled plasma processing apparatus 300 includes an inner antenna 310 disposed on a dielectric top plate 102 of a vacuum container 101 and having a constant radius; A plurality of outer antennas (120) electrically connected in parallel and disposed on the dielectric top plate (102) of the vacuum container (101) and disposed on the outer side of the inner antenna (310); A power divider 340 for distributing power to the inner antenna 310 and the outer antenna 120, respectively; And an RF power supply 184 for providing power to the inner antenna and the outer antenna through the power distributor 340. [ The outer antenna 120 is disposed at regular intervals on a circumference having a predetermined radius on the central axis of the inner antenna 310. The outer antenna 120 includes an inner curved portion 124 having a first radius of curvature and an outer curved portion 124 having a second radius of curvature greater than the first radius of curvature. The outer antenna 120 does not overlap with each other and forms a closed loop.

The inner antenna 310 includes an inner curved portion 314 having a third radius of curvature and an outer curved portion 312 having a fourth radius of curvature greater than the third radius of curvature to provide an outline of the annular section ). The inner antenna 310 can form a closed loop without overlapping each other.

The inner antennas 310 are four and may be disposed in quadrants, respectively. At least one of the inner antennas may be grounded via an inner antenna variable capacitor 171. The electric power flowing to the inner antenna connected to the inner antenna variable capacitor 171 may be changed as compared to the inner antenna not connected to the inner antenna variable capacitor by changing the capacitance of the inner antenna variable capacitor 171. Thus, the plasma uniformity at the localized position can be changed.

The inner antenna 310 may have a shape having a reduced radius of curvature as compared with the outer antenna 120 and may be arranged to be rotated by 45 degrees relative to the outer antenna 120.

The power divider 340 may distribute the provided RF power to the inner antenna 310 and the outer antenna 120. For this, the power divider 340 may include a power divider variable capacitor 141 that can change the impedance of the inner antenna or the impedance of the outer antenna.

Specifically, the input terminal of the power divider 340 may be branched into two branches, and one branch may be connected to the inner antenna 310 via the power distribution variable capacitor 141. The other branch may be connected to the outer antenna 120 via an inductor 142.

The power divider 340 may include an inner power divider 343 for distributing power to the inner antenna 310 and an outer power divider 344 for distributing power to the outer antenna 120 . The inner power distributor 343 may include a cylindrical inner power distribution body 343b and an inner power distribution branch 343a that diverges radially from the inner power distribution body 343a. The outer power distributor 344 may include a cylindrical outer power distribution body 344b and an outer power distribution branch 344a that diverges radially from the outer power distribution body. The outer power distribution body 344b may be coaxial to wrap the inner power distribution body 343b. The outer power distribution branch 344a may radially branch out from the outer power distribution body 344b and supply RF power to each of the outer antennas. In addition, the inner power distribution branch 343a can radially branch the inner power distribution body 343b and supply RF power to each inner antenna 310. [

The inner antennas 310 have the same structure and can be disposed in quadrants, respectively. The inner power division branch 343a may be connected to the inner antenna 310 via an inner power supply plug 315 branched in a cross shape and extending vertically. The inner antenna 310 may be connected to the conductive fixing plate 130 or the grounding member through a vertically extending inner grounding pole 316.

While the present invention has been particularly shown and described with reference to exemplary embodiments thereof, it is to be understood that the invention is not limited to the disclosed exemplary embodiments, And all of the various forms of embodiments that can be practiced without departing from the technical spirit.

110: inner antenna
120: outer antenna
140: Power distributor
184: Power supply

Claims (10)

An inner antenna disposed on the dielectric top plate of the vacuum container and having a constant radius;
A plurality of outer antennas electrically connected in parallel and disposed on the dielectric top plate of the vacuum container and disposed on an outer periphery of the inner antenna;
A power distributor for distributing power to the inner antenna and the outer antenna, respectively;
And an RF power source for providing power to the inner antenna and the outer antenna through the power distributor,
Wherein each of the outer antennas is disposed at a constant interval on a circumference having a predetermined radius on the central axis of the inner antenna,
Each of the outer antennas includes an inner curved portion having a first radius of curvature and an outer curved portion having a second radius of curvature larger than the first radius of curvature,
Each of the outer antennas forms a closed loop without being overlapped with each other,
Further comprising an outer antenna variable capacitor connected between at least one of the outer antenna and ground,
The outer antenna variable capacitor uniformly controls a locally non-uniform plasma,
Further comprising a current measuring unit for sensing a current flowing through the outer antenna connected to the outer antenna variable capacitor,
A vertical support having one end fixed to the outer antenna and extending vertically in a plane in which the outer antenna is disposed; And
And a conductive fixing plate fixed to the other end of the vertical supporting portion and grounded,
Wherein the conductive fixing plate includes a through hole at the center thereof,
Wherein the power distributing portion is disposed to extend through the through hole, is radially branched,
Wherein the power divider includes an inner power divider for distributing power to the inner antenna and an outer power divider for distributing power to the outer antenna,
Wherein the inner power distribution portion includes a cylindrical inner power distribution body portion and an inner power distribution branch portion that radially branches from the inner power distribution body portion,
Wherein the outer power distribution portion includes a cylindrical outer power distribution body portion and an outer power distribution branch portion that radially branches from the outer power distribution body portion,
The outer power distribution body is coaxial to wrap the inner power distribution body,
A power input end and an output end of the outer antenna are disposed in the outer curved portion,
And the outer antennas are disposed in quadrants, respectively.
delete delete delete delete The method according to claim 1,
Further comprising a permanent magnet disposed vertically spaced apart from the outer antenna,
The permanent magnets are respectively disposed corresponding to the outer antenna,
And the permanent magnet is disposed on the conductive fixing plate.
delete The method according to claim 1,
Wherein the power distributor comprises:
A power distribution variable capacitor connected in series with the inner antenna to control a current flowing through the inner antenna and the outer antenna; And
Further comprising a fixed inductor connected in series to the outer antenna connected in parallel.
delete The method according to claim 1,
The inner antenna comprising an inner curved portion having a third radius of curvature and an outer curved portion having a fourth radius of curvature larger than the third radius of curvature to provide an outline of an annular section,
Wherein said inner antenna forms a closed loop without overlapping. ≪ RTI ID = 0.0 > 31. < / RTI >
KR1020150107273A 2015-07-29 2015-07-29 Plasma Processing Apparatus KR101714405B1 (en)

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