CN110178221A - 一种基于二维材料的晶体管及其制备方法和晶体管阵列器件 - Google Patents

一种基于二维材料的晶体管及其制备方法和晶体管阵列器件 Download PDF

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CN110178221A
CN110178221A CN201780083547.4A CN201780083547A CN110178221A CN 110178221 A CN110178221 A CN 110178221A CN 201780083547 A CN201780083547 A CN 201780083547A CN 110178221 A CN110178221 A CN 110178221A
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CN110178221B (zh
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赵冲
徐慧龙
张臣雄
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Huawei Technologies Co Ltd
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Huawei Technologies Co Ltd
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
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Abstract

一种基于二维材料的晶体管,包括绝缘衬底(10),设在衬底(10)两端的源极(11)和漏极(12),源极(11)和漏极(12)之间为沟道(13),沟道(13)中部设有第一二维材料层(131);设在第一二维材料层(131)一侧并与源极(11)相连的沟道区域中的第二二维材料层(132),设在第一二维材料层(131)另一侧并与漏极(12)相连的沟道区域中的第三二维材料层(133),三层二维材料层为一相同材质的整体膜层;设在第一二维材料层(131)上的栅介质层(14)和栅极(15);第二二维材料层(132)、第三二维材料层(133)的厚度均大于第一二维材料层(131)的厚度。晶体管结构中,与源漏极接触处的第二、第三二维材料层较厚,可减小接触电阻,而沟道中部的第一二维材料层比接触处的薄,因而同时保证了高的迁移率和栅对沟道的调制。还提供了基于二维材料的晶体管的制备方法和应用。

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PCT国内申请,说明书已公开。

Claims (20)

  1. PCT国内申请,权利要求书已公开。
CN201780083547.4A 2017-04-25 2017-04-25 一种基于二维材料的晶体管及其制备方法和晶体管阵列器件 Active CN110178221B (zh)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111969058A (zh) * 2020-07-30 2020-11-20 电子科技大学中山学院 一种二硫化钼场效应晶体管及其制备方法和应用

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US11636324B2 (en) 2019-09-11 2023-04-25 The Penn State Research Foundation Gaussian synapses for probabilistic neural networks

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101710588A (zh) * 2009-12-08 2010-05-19 北京大学 一种碳基场效应晶体管的顶栅介质及其制备方法
CN103346088A (zh) * 2013-06-08 2013-10-09 中国科学院微电子研究所 一种减小石墨烯顶栅fet器件寄生电阻的方法
CN203674269U (zh) * 2014-01-10 2014-06-25 北京京东方光电科技有限公司 薄膜晶体管、阵列基板及有机发光显示面板

Family Cites Families (3)

* Cited by examiner, † Cited by third party
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KR102232755B1 (ko) * 2015-04-07 2021-03-26 삼성전자주식회사 2차원 물질을 이용한 전자소자 및 그 제조 방법
WO2016200971A1 (en) * 2015-06-08 2016-12-15 Synopsys, Inc. Substrates and transistors with 2d material channels on 3d geometries
CN106206683A (zh) * 2016-08-31 2016-12-07 湖南航天新材料技术研究院有限公司 一种石墨烯基场效应晶体管及其制备方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101710588A (zh) * 2009-12-08 2010-05-19 北京大学 一种碳基场效应晶体管的顶栅介质及其制备方法
CN103346088A (zh) * 2013-06-08 2013-10-09 中国科学院微电子研究所 一种减小石墨烯顶栅fet器件寄生电阻的方法
CN203674269U (zh) * 2014-01-10 2014-06-25 北京京东方光电科技有限公司 薄膜晶体管、阵列基板及有机发光显示面板

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN111969058A (zh) * 2020-07-30 2020-11-20 电子科技大学中山学院 一种二硫化钼场效应晶体管及其制备方法和应用

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WO2018195761A1 (zh) 2018-11-01

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