CN110178221A - 一种基于二维材料的晶体管及其制备方法和晶体管阵列器件 - Google Patents
一种基于二维材料的晶体管及其制备方法和晶体管阵列器件 Download PDFInfo
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- CN110178221A CN110178221A CN201780083547.4A CN201780083547A CN110178221A CN 110178221 A CN110178221 A CN 110178221A CN 201780083547 A CN201780083547 A CN 201780083547A CN 110178221 A CN110178221 A CN 110178221A
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- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 169
- 229910052751 metal Inorganic materials 0.000 claims description 74
- 239000002184 metal Substances 0.000 claims description 74
- 229910052982 molybdenum disulfide Inorganic materials 0.000 claims description 60
- CWQXQMHSOZUFJS-UHFFFAOYSA-N molybdenum disulfide Chemical compound S=[Mo]=S CWQXQMHSOZUFJS-UHFFFAOYSA-N 0.000 claims description 45
- 229920002120 photoresistant polymer Polymers 0.000 claims description 45
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 43
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- 238000005229 chemical vapour deposition Methods 0.000 claims description 22
- 229910052759 nickel Inorganic materials 0.000 claims description 22
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 229910052802 copper Inorganic materials 0.000 claims description 21
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 20
- 229910052737 gold Inorganic materials 0.000 claims description 20
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- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 12
- 229910052719 titanium Inorganic materials 0.000 claims description 12
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- -1 at least one of SOI Chemical compound 0.000 claims description 10
- 238000004070 electrodeposition Methods 0.000 claims description 10
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- 238000010276 construction Methods 0.000 claims description 8
- 150000001247 metal acetylides Chemical class 0.000 claims description 8
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- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910045601 alloy Inorganic materials 0.000 claims description 6
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- WIHZLLGSGQNAGK-UHFFFAOYSA-N hafnium(4+);oxygen(2-) Chemical compound [O-2].[O-2].[Hf+4] WIHZLLGSGQNAGK-UHFFFAOYSA-N 0.000 claims description 5
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- 229910039444 MoC Inorganic materials 0.000 claims description 4
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 4
- GKOZUEZYRPOHIO-UHFFFAOYSA-N iridium atom Chemical compound [Ir] GKOZUEZYRPOHIO-UHFFFAOYSA-N 0.000 claims description 4
- NFFIWVVINABMKP-UHFFFAOYSA-N methylidynetantalum Chemical compound [Ta]#C NFFIWVVINABMKP-UHFFFAOYSA-N 0.000 claims description 4
- 239000001301 oxygen Substances 0.000 claims description 4
- 229910052760 oxygen Inorganic materials 0.000 claims description 4
- 229910052763 palladium Inorganic materials 0.000 claims description 4
- 229910003468 tantalcarbide Inorganic materials 0.000 claims description 4
- UONOETXJSWQNOL-UHFFFAOYSA-N tungsten carbide Chemical compound [W+]#[C-] UONOETXJSWQNOL-UHFFFAOYSA-N 0.000 claims description 4
- 229910000570 Cupronickel Inorganic materials 0.000 claims description 3
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 claims description 3
- 238000001039 wet etching Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 422
- 229910052961 molybdenite Inorganic materials 0.000 description 17
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 14
- 238000010894 electron beam technology Methods 0.000 description 13
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- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical group C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 12
- 238000011161 development Methods 0.000 description 11
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 7
- 229910052786 argon Inorganic materials 0.000 description 7
- 229910052750 molybdenum Inorganic materials 0.000 description 7
- 239000011733 molybdenum Substances 0.000 description 7
- 238000000231 atomic layer deposition Methods 0.000 description 6
- 238000005566 electron beam evaporation Methods 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
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- 238000002474 experimental method Methods 0.000 description 3
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 3
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- CMPGARWFYBADJI-UHFFFAOYSA-L tungstic acid Chemical compound O[W](O)(=O)=O CMPGARWFYBADJI-UHFFFAOYSA-L 0.000 description 3
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
Abstract
一种基于二维材料的晶体管,包括绝缘衬底(10),设在衬底(10)两端的源极(11)和漏极(12),源极(11)和漏极(12)之间为沟道(13),沟道(13)中部设有第一二维材料层(131);设在第一二维材料层(131)一侧并与源极(11)相连的沟道区域中的第二二维材料层(132),设在第一二维材料层(131)另一侧并与漏极(12)相连的沟道区域中的第三二维材料层(133),三层二维材料层为一相同材质的整体膜层;设在第一二维材料层(131)上的栅介质层(14)和栅极(15);第二二维材料层(132)、第三二维材料层(133)的厚度均大于第一二维材料层(131)的厚度。晶体管结构中,与源漏极接触处的第二、第三二维材料层较厚,可减小接触电阻,而沟道中部的第一二维材料层比接触处的薄,因而同时保证了高的迁移率和栅对沟道的调制。还提供了基于二维材料的晶体管的制备方法和应用。
Description
PCT国内申请,说明书已公开。
Claims (20)
- PCT国内申请,权利要求书已公开。
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PCT/CN2017/081821 WO2018195761A1 (zh) | 2017-04-25 | 2017-04-25 | 一种基于二维材料的晶体管及其制备方法和晶体管阵列器件 |
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CN110178221A true CN110178221A (zh) | 2019-08-27 |
CN110178221B CN110178221B (zh) | 2021-07-09 |
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Cited By (1)
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CN111969058A (zh) * | 2020-07-30 | 2020-11-20 | 电子科技大学中山学院 | 一种二硫化钼场效应晶体管及其制备方法和应用 |
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US11636324B2 (en) | 2019-09-11 | 2023-04-25 | The Penn State Research Foundation | Gaussian synapses for probabilistic neural networks |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101710588A (zh) * | 2009-12-08 | 2010-05-19 | 北京大学 | 一种碳基场效应晶体管的顶栅介质及其制备方法 |
CN103346088A (zh) * | 2013-06-08 | 2013-10-09 | 中国科学院微电子研究所 | 一种减小石墨烯顶栅fet器件寄生电阻的方法 |
CN203674269U (zh) * | 2014-01-10 | 2014-06-25 | 北京京东方光电科技有限公司 | 薄膜晶体管、阵列基板及有机发光显示面板 |
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KR102232755B1 (ko) * | 2015-04-07 | 2021-03-26 | 삼성전자주식회사 | 2차원 물질을 이용한 전자소자 및 그 제조 방법 |
WO2016200971A1 (en) * | 2015-06-08 | 2016-12-15 | Synopsys, Inc. | Substrates and transistors with 2d material channels on 3d geometries |
CN106206683A (zh) * | 2016-08-31 | 2016-12-07 | 湖南航天新材料技术研究院有限公司 | 一种石墨烯基场效应晶体管及其制备方法 |
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2017
- 2017-04-25 CN CN201780083547.4A patent/CN110178221B/zh active Active
- 2017-04-25 WO PCT/CN2017/081821 patent/WO2018195761A1/zh active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101710588A (zh) * | 2009-12-08 | 2010-05-19 | 北京大学 | 一种碳基场效应晶体管的顶栅介质及其制备方法 |
CN103346088A (zh) * | 2013-06-08 | 2013-10-09 | 中国科学院微电子研究所 | 一种减小石墨烯顶栅fet器件寄生电阻的方法 |
CN203674269U (zh) * | 2014-01-10 | 2014-06-25 | 北京京东方光电科技有限公司 | 薄膜晶体管、阵列基板及有机发光显示面板 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111969058A (zh) * | 2020-07-30 | 2020-11-20 | 电子科技大学中山学院 | 一种二硫化钼场效应晶体管及其制备方法和应用 |
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WO2018195761A1 (zh) | 2018-11-01 |
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