CN1101754C - 热打印头的制造 - Google Patents

热打印头的制造 Download PDF

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Publication number
CN1101754C
CN1101754C CN99806172A CN99806172A CN1101754C CN 1101754 C CN1101754 C CN 1101754C CN 99806172 A CN99806172 A CN 99806172A CN 99806172 A CN99806172 A CN 99806172A CN 1101754 C CN1101754 C CN 1101754C
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China
Prior art keywords
chip
liquid
lead
solid
curable
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Expired - Fee Related
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CN99806172A
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English (en)
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CN1301216A (zh
Inventor
布鲁斯·D·吉布森
珍妮·M·萨尔达尼亚辛格
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Funai Electric Co Ltd
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Lexmark International Inc
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Publication date
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Publication of CN1301216A publication Critical patent/CN1301216A/zh
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Publication of CN1101754C publication Critical patent/CN1101754C/zh
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1601—Production of bubble jet print heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/16—Production of nozzles
    • B41J2/1621—Manufacturing processes
    • B41J2/1623—Manufacturing processes bonding and adhesion
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Particle Formation And Scattering Control In Inkjet Printers (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Die Bonding (AREA)
  • Laminated Bodies (AREA)

Abstract

加热器芯片(1)位于TAB电路带(5)的孔口内而TAB导线(3)则焊接于此芯片之上。将这两者的组合件转动使此导线的底侧面向上，以电绝缘液体涂布并固化成固体层(11)。然后用导热性粘合剂将此芯片的底部接附到热辐射支承体(7)上。导线上的已固化固体层阻止了到达导线的任何粘合剂会导致分流。所形成的打印头能由此支承体将芯片的过量热充分地耗散。

Description

热打印头的制造
本发明涉及喷墨打印头的制造，此打印头中安装着带加热器的半导体芯片，得以耗散过量的热。
在能进行高速打印的热喷墨打印头的设计中，过量的热聚集是其主要的制约条件。此种打印头具有半导体硅片，其中有许多加热器是这些硅片中的嵌入件。这些加热器由电流有选择地驱动以蒸发喷墨中的水，而由此种水蒸汽的力将墨粒喷出。随着这种操作重复的次数与速度加大，从打印头中清除过量的热便成为主要的设计障碍。
本发明通过用导热性粘合剂将硅片接附到辐射体上来除去过量的热。但在此将电路带(一般称作TAB电路，用于带的自动结合)的导线也连接到芯片上。由于导热性粘合剂通常有显著程度的导电性能，这种TAB导线首先沿其整个长度以绝缘材料加以内涂层。
电路带的导线例如通过标准的超声焊或其他连接技术连接到芯片的接线点。这些导线的底侧然后以在固化时为电绝缘的可固化材料涂层。与导线连接点相对的芯片一侧此时便由涂布到芯片与辐射体之间的导热性粘合剂粘附到此导热性辐射体上。
下面将结合附图说明本发明的细节，此附图示明了依据本发明制成的产品同时示明了实施本发明的元件。
半导体芯片1可以完全是标准的热喷墨加热器芯片。这样，此种芯片主要是硅的材料体，它有许多空腔其中有加热器电阻体装在此芯片，还有外部的铝质电接点用来从芯片接收电信号。这种电接点由于是标准的，连接成通过芯片选择和提供加热电流给选择的电阻体。这样一种示例性的芯片其技术细节描述于1995，11，19提交，现在允许付费公布的美国专利申请系列No.08/545126中。此申请所公开的内容综合于此供参考。
图中所示的导线3类似地是标准的，它们是安装在带5之上并从带5上延伸出的薄金属件。带5的中心有孔来纳置芯片1，然后这些导线连接到芯片1上的铝接点。这些在当前是完全标准的电路制造方法，且实质上可以完全由机械手完成。导线3对芯片1上接点的连接通常是由超声带自动结合(TAB)焊合。
特别是当芯片1具有大量的加热器，支承着由这些加热器喷出的大量墨滴时，热的耗散就成为重要的设计目的。为了耗散这种热，上面安装着芯片1的支承体7是由导热材料构成以从芯片1上将热带走。芯片1由粘合剂9连接到支承体7上，此粘合剂也必须是导热的。
但是此导热性粘合剂9同样是固有地和显著地导电或半导电的。本发明防止了粘合剂9与导线3的接触，因为这样的接触将成为旁路或短路而使芯片1不能工作。
于是，图中所示产品的制法如下：芯片1位于带5内而导线3焊接到芯片1上；然后将此组件定位成使得到达接点的TAB成束导线3面朝上，而可固化的液体料例如可热固化或可紫外光固化的液体，它们涂布到导线3的整个暴露底面上会固化成电绝缘固体层11；然后将此已涂层组件用热、紫外辐射或其他适于所用液体的处理方法使之固化；再将导热性粘合剂9涂布于芯片1和支承体7之间，此时最好将支承体7定位成使它支承芯片1的这一表面朝上，将流动性(液体或浆体)粘合剂9涂布到支承体7的上述表面，之后将芯片1与带5的组件下移，使芯片1与粘合剂9接触。在经过所需的固化处理使粘合剂9硬化后，便完成了本发明的组件。某些粘合剂9有时没有到达导线3，但导线3上的底涂层11会防止由于这种情形出现而发生任何的电故障。
形成固体层11的涂层是这样地涂布到导线3上的，即在存在有暴露的导线3处，沿着芯片1各侧的长度。涂布由喷嘴梢来的涂层料滴或用刷子进行刷涂。刷子最好采用小型的尖点式的水彩画笔。
用于固化成固体层11的可固化液体必需对TAB成束的导线3具有良好的粘附性；它必须在固化时不使TAB成束导线不变形；它必须对打印头的墨水中的水、染料、有机潜溶剂和其他组份有良好的稳定性；且必须粘合到芯片1上。作为可固化成固体层11的一种液体材料是FLUORAD FC-725，这是3M公司的一种可热固化的产品。它刷涂到TAB成束导线3和带5的组件上，然后此TAB导线3和芯片1于70℃烘焙15分钟。其他可能的可紫外固化材料系列是UV9000，属于Emmerson and Cummings，Specialty Polymers(National starch andchemiclas company的一家分公司)的产品；以及EMCAST7000系列，属于EMI公司的产品。
相应的各种变更型式，包括采用广范围的合适粘合剂，这些都应是显然的并且是可以预料得到的。

Claims (3)

1.制造热喷墨打印头组件的方法，此方法包括：将电路带的导线连接到热喷墨加热器芯片表面上的接点上；在所述连接上导线之后，将能固化成电绝缘固体的液体涂布到到达所述接点的所述导线的整个暴露侧；在所述涂布液体之后，将所述液体固化成覆盖所述导线整个先前暴露侧的电绝缘固体层；在所述固化上述液体后，用可固化成导热性固体的可固化流动性粘合剂将所述芯片接附到导热性支承体上；在所述接附上述芯片之后将所述流动性粘合剂固化成固体的导热性状态。
2.权利要求1所述方法，其中所述液体固化步骤是用加热完成。
3.权利要求1所述方法，其中所述液体固化步骤是用紫外光照射完成。
CN99806172A 1998-05-14 1999-05-07 热打印头的制造 Expired - Fee Related CN1101754C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/078,912 1998-05-14
US09/078,912 US5980682A (en) 1998-05-14 1998-05-14 Thermal printhead manufacture

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CN1301216A CN1301216A (zh) 2001-06-27
CN1101754C true CN1101754C (zh) 2003-02-19

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US (1) US5980682A (zh)
EP (1) EP1098767B1 (zh)
JP (1) JP2002514534A (zh)
KR (1) KR20010043305A (zh)
CN (1) CN1101754C (zh)
AU (1) AU3976399A (zh)
DE (1) DE69923455T2 (zh)
WO (1) WO1999058338A1 (zh)

Cited By (1)

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Publication number Priority date Publication date Assignee Title
CN102574399A (zh) * 2009-10-28 2012-07-11 惠普发展公司，有限责任合伙企业 用于打印头进给槽的保护涂层

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US6834937B2 (en) * 2002-08-13 2004-12-28 Lexmark International, Inc. Printhead corrosion protection
US7404613B2 (en) * 2004-06-30 2008-07-29 Lexmark International, Inc. Inkjet print cartridge having an adhesive with improved dimensional control
KR100612325B1 (ko) * 2004-07-16 2006-08-16 삼성전자주식회사 접착성 절연층을 갖는 잉크 카트리지, 그 제조 방법 및이를 장착한 화상 형성 장치
JP5404121B2 (ja) * 2009-03-25 2014-01-29 キヤノン株式会社 記録基板、該記録基板の製造方法及び液体吐出ヘッド
US20130192992A1 (en) 2010-10-21 2013-08-01 Peter Mardilovich Adhesion-promoting surface
EP3565721B1 (en) 2017-04-05 2022-08-03 Hewlett-Packard Development Company, L.P. Fluid ejection die heat exchangers

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Publication number Priority date Publication date Assignee Title
US3653959A (en) * 1970-04-14 1972-04-04 Grace W R & Co Encapsulating and potting composition and process
US4881318A (en) * 1984-06-11 1989-11-21 Canon Kabushiki Kaisha Method of manufacturing a liquid jet recording head
US5530282A (en) * 1993-04-15 1996-06-25 Rohm Co., Ltd. Semiconductor device having a multilayer interconnection structure
EP0769379A1 (en) * 1995-10-19 1997-04-23 Lexmark International, Inc. Thermal ink jet cartridge and thermal semiconductor chip
JPH10100410A (ja) * 1996-08-29 1998-04-21 Xerox Corp 半導体チップを含む装置及びその製造方法、並びにサーマルインクジェットプリンタ

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102574399A (zh) * 2009-10-28 2012-07-11 惠普发展公司，有限责任合伙企业 用于打印头进给槽的保护涂层

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Publication number Publication date
EP1098767A1 (en) 2001-05-16
WO1999058338A1 (en) 1999-11-18
DE69923455D1 (de) 2005-03-03
AU3976399A (en) 1999-11-29
JP2002514534A (ja) 2002-05-21
US5980682A (en) 1999-11-09
DE69923455T2 (de) 2006-06-14
EP1098767A4 (en) 2001-10-10
KR20010043305A (ko) 2001-05-25
EP1098767B1 (en) 2005-01-26
CN1301216A (zh) 2001-06-27

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