CN110168723B - 显示装置、显示装置用基板以及显示装置的维修方法 - Google Patents

显示装置、显示装置用基板以及显示装置的维修方法 Download PDF

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Publication number
CN110168723B
CN110168723B CN201880005633.8A CN201880005633A CN110168723B CN 110168723 B CN110168723 B CN 110168723B CN 201880005633 A CN201880005633 A CN 201880005633A CN 110168723 B CN110168723 B CN 110168723B
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China
Prior art keywords
wiring
mounting
emitting diode
sub
light emitting
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Chinese (zh)
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CN110168723A (zh
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洪承植
孙成寿
竹谷元伸
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Seoul Semiconductor Co Ltd
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Seoul Semiconductor Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/83—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
    • H10P74/23—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes
    • H10P74/232—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by multiple measurements, corrections, marking or sorting processes comprising connection or disconnection of parts of a device in response to a measurement
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/01—Manufacture or treatment
    • H10H20/036—Manufacture or treatment of packages
    • H10H20/0364—Manufacture or treatment of packages of interconnections

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  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
CN201880005633.8A 2017-08-02 2018-08-01 显示装置、显示装置用基板以及显示装置的维修方法 Active CN110168723B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2017-0098212 2017-08-02
KR20170098212 2017-08-02
PCT/KR2018/008732 WO2019027248A1 (ko) 2017-08-02 2018-08-01 디스플레이 장치, 디스플레이 장치용 기판 및 디스플레이 장치의 수리 방법

Publications (2)

Publication Number Publication Date
CN110168723A CN110168723A (zh) 2019-08-23
CN110168723B true CN110168723B (zh) 2024-01-30

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CN201880005633.8A Active CN110168723B (zh) 2017-08-02 2018-08-01 显示装置、显示装置用基板以及显示装置的维修方法

Country Status (7)

Country Link
US (4) US11063175B2 (https=)
EP (1) EP3664134A4 (https=)
JP (1) JP7323508B2 (https=)
KR (1) KR102581010B1 (https=)
CN (1) CN110168723B (https=)
MY (1) MY205321A (https=)
WO (1) WO2019027248A1 (https=)

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KR102330553B1 (ko) * 2019-03-27 2021-11-24 엘지전자 주식회사 마이크로 엘이디를 이용한 디스플레이 장치 및 그 제조방법
US11538852B2 (en) * 2019-04-23 2022-12-27 Osram Opto Semiconductors Gmbh μ-LED, μ-LED device, display and method for the same
KR102719903B1 (ko) * 2019-05-29 2024-10-18 삼성디스플레이 주식회사 표시 장치
KR102766414B1 (ko) * 2019-08-09 2025-02-13 삼성전자주식회사 디스플레이 장치 및 그 제조방법
KR102802033B1 (ko) * 2019-10-15 2025-04-30 삼성전자주식회사 디스플레이 장치의 제조 방법, 중계 기판 및 기록 매체에 저장된 컴퓨터 프로그램
CN112928123B (zh) * 2019-11-21 2024-10-15 京东方科技集团股份有限公司 一种驱动背板及其制作方法、显示面板、显示装置
KR102880048B1 (ko) * 2020-11-30 2025-11-03 삼성전자주식회사 디스플레이 모듈 및 그 제조 방법
TWI807544B (zh) * 2021-12-17 2023-07-01 友達光電股份有限公司 顯示面板及其製造方法
TWI855473B (zh) * 2022-12-23 2024-09-11 友達光電股份有限公司 發光顯示面板
EP4714234A1 (en) * 2023-06-29 2026-03-25 ams-OSRAM International GmbH Method of repairing an electronic component and electronic component
TWI881804B (zh) * 2024-04-18 2025-04-21 大陸商北京集創北方科技股份有限公司 一體式led顯示模組及透明led顯示裝置

Citations (1)

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JPH09307225A (ja) * 1996-05-13 1997-11-28 Hitachi Ltd プリント基板

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JPH01302829A (ja) * 1988-05-31 1989-12-06 Canon Inc 電気回路装置
JPH06120417A (ja) * 1992-10-08 1994-04-28 Sharp Corp マルチチップモジュールの実装構造及びその製造方法
JP3462282B2 (ja) * 1994-11-29 2003-11-05 株式会社東芝 樹脂封止型半導体装置、電子回路装置およびこの製造方法
JP3450236B2 (ja) 1999-09-22 2003-09-22 Ｎｅｃエレクトロニクス株式会社 半導体装置及びその製造方法
US6546620B1 (en) * 2000-06-29 2003-04-15 Amkor Technology, Inc. Flip chip integrated circuit and passive chip component package fabrication method
JP4609617B2 (ja) 2000-08-01 2011-01-12 日本電気株式会社 半導体装置の実装方法及び実装構造体
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KR100690245B1 (ko) 2005-04-06 2007-03-12 삼성전자주식회사 저융점 솔더를 이용한 솔더 접합 방법 및 이를 이용한 볼그리드 어레이 패키지의 수리 방법
JP2007156338A (ja) 2005-12-08 2007-06-21 Sharp Corp ディスプレイパネルの修理方法
JP2007298791A (ja) * 2006-05-01 2007-11-15 Mitsubishi Electric Corp 液晶表示装置及びその欠陥修復方法
KR20090045023A (ko) 2007-11-01 2009-05-07 소니 가부시끼 가이샤 액티브 매트릭스형 표시 장치
JP4466755B2 (ja) 2007-11-01 2010-05-26 ソニー株式会社 アクティブマトリックス型表示装置
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WO2013175926A1 (ja) * 2012-05-24 2013-11-28 シャープ株式会社 回路基板及び表示装置
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KR102203103B1 (ko) 2014-04-11 2021-01-15 삼성디스플레이 주식회사 유기 발광 표시 패널, 유기 발광 표시 장치 및 유기 발광 표시 패널의 리페어 방법
CN113035851B (zh) 2014-06-18 2022-03-29 艾克斯展示公司技术有限公司 微组装led显示器
TWI557702B (zh) 2015-06-01 2016-11-11 友達光電股份有限公司 顯示面板及其修補方法
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GB2541970B (en) * 2015-09-02 2020-08-19 Facebook Tech Llc Display manufacture
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Also Published As

Publication number Publication date
JP7323508B2 (ja) 2023-08-08
JP2020529630A (ja) 2020-10-08
KR20190014480A (ko) 2019-02-12
KR102581010B1 (ko) 2023-09-22
US20240088324A1 (en) 2024-03-14
EP3664134A4 (en) 2021-04-21
EP3664134A1 (en) 2020-06-10
CN110168723A (zh) 2019-08-23
WO2019027248A1 (ko) 2019-02-07
MY205321A (en) 2024-10-12
US11063175B2 (en) 2021-07-13
US20210328098A1 (en) 2021-10-21
US20230215971A1 (en) 2023-07-06
US20210135047A1 (en) 2021-05-06
US11605755B2 (en) 2023-03-14
US11978823B2 (en) 2024-05-07

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