CN110153780A - 加工装置 - Google Patents
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- CN110153780A CN110153780A CN201910083842.0A CN201910083842A CN110153780A CN 110153780 A CN110153780 A CN 110153780A CN 201910083842 A CN201910083842 A CN 201910083842A CN 110153780 A CN110153780 A CN 110153780A
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Abstract
本发明提供加工装置,能够降低将不满足排水基准的加工废液排水的可能。该加工装置具有:保持单元,其对被加工物进行保持;以及加工单元,其对该保持单元所保持的被加工物进行加工,该加工装置的特征在于,其还具有:加工液提供单元,其在利用该加工单元对该保持单元所保持的被加工物进行加工时至少对被加工物提供包含氧化剂的加工液;加工废液回收部,其对包含从该加工液提供单元提供至被加工物的该加工液的加工废液进行回收;排出路,其将该加工废液从该加工废液回收部排出至该加工装置外;以及处理槽,其配设于该排出路的途中,对利用该加工废液回收部进行回收的加工废液进行贮存,并具有将该加工废液所含的加工液分解的废液处理单元。
Description
技术领域
本发明涉及在对被加工物进行加工时一边提供加工液一边实施加工的切削装置、磨削装置、刀具切削装置等加工装置。
背景技术
当利用切削刀具对具有金属的被加工物进行切削时,在切削刀具产生堵塞,并且在金属部分产生毛刺。产生如下的问题:由于所产生的毛刺而使形成于被加工物的器件的端子间短路;或在被加工物的操作中毛刺落在焊盘上等而产生焊接不良;等等。
为了解决该问题,在日本特开2015-177089号公报中,提出了一边提供包含有机酸和氧化剂的切削液一边对被加工物进行切削的方法。根据该切削方法,通过切削液所含的有机酸对金属进行改质而抑制延展性。其结果是,可抑制毛刺的产生,并且通过切削液含有氧化剂而利用切削液改变形成于金属表面的膜质,从而金属失去延展性而容易被去除,可促进加工性。
专利文献1:日本特开2015-177089号公报
但是,根据切削装置的使用地域的排水基准,不能将包含切削液的切削废液直接排水,通过使用有微生物的生物处理将切削废液中的有机物分解之后进行排水。
但是,当在切削液中含有氧化剂时,有可能由于氧化剂而使在生物处理中使用的微生物死亡,从而无法将切削废液中的有机物分解而将不满足排水基准的切削废液排出。这样的问题不限于切削装置,在使用加工液的磨削装置、刀具切削装置等其他加工装置中也会产生。
发明内容
本发明是鉴于这样的点而完成的,其目的在于提供加工装置,能够降低将不满足排水基准的加工废液排水的可能。
根据本发明,提供加工装置,其具有:保持单元,其对被加工物进行保持;加工单元,其对该保持单元所保持的被加工物进行加工,该加工装置的特征在于,其还具有:加工液提供单元,其在利用该加工单元对该保持单元所保持的被加工物进行加工时至少对被加工物提供包含氧化剂的加工液;加工废液回收部,其对包含从该加工液提供单元提供至被加工物的该加工液的加工废液进行回收;排出路,其将该加工废液从该加工废液回收部排出至该加工装置外;以及处理槽,其配设于该排出路的途中,对利用该加工废液回收部收回的加工废液进行贮存,并具有将该加工废液所含的加工液分解的废液处理单元。
优选氧化剂是双氧水,废液处理单元包含对加工废液照射紫外线的紫外线照射单元。
本发明的加工装置具有处理槽,其对利用加工废液回收部进行回收的加工废液进行贮存,并具有将加工废液所含的加工液分解的废液处理单元,因此能够降低将不满足排水基准的加工废液排水的可能。
附图说明
图1的(A)是封装基板的俯视图,图1的(B)是封装基板的后视图,图1的(C)是封装基板的侧视图。
图2是适合对图1所示的封装基板进行切削的切削装置的立体图。
图3是切削装置的切削进给单元和水箱部分的立体图。
图4是具有废液处理单元的处理槽的剖视图。
标号说明
2:封装基板;4:金属框体(引线框);6a、6b、6c:器件区域;8:分割预定线;10:器件芯片搭载部;12:电极;14:模制树脂层;24:防水罩;26:工作台基座;30:波纹管;54:切削刀具;60:水箱;70:排液口;72:切削进给机构;82:排液管;84:废液处理槽;86:LED。
具体实施方式
以下,参照附图对本发明的实施方式进行详细的说明。参照图1的(A),示出适合通过本发明实施方式的切削装置进行加工的封装基板2的一例的俯视图。图1的(B)是封装基板2的后视图,图1的(C)是封装基板2的侧视图。
封装基板2具有矩形状的金属框体(引线框)4,在图示的例子中,在由金属框体4的外周剩余区域5和非器件区域5a围绕的区域存在三个器件区域6a、6b、6c。
在各器件区域6a、6b、6c中,在由按照相互垂直的方式纵横设置的分割预定线8划分的多个区域划分出器件芯片搭载部10,沿着各个器件芯片搭载部10的四边形成有多个电极12。
各电极12彼此通过模制于金属框体4的模制树脂层14绝缘。通过对在第一方向上延伸的分割预定线8和在与第一方向垂直的第二方向上延伸的分割预定线8进行切削,从而在切削槽的两侧出现各器件芯片的电极12。
在器件区域6a、6b、6c的各器件芯片搭载部10的背面上搭载有未图示的器件芯片,各器件芯片所具有的电极与电极12通过焊接线连接。
并且,按照器件区域6a、6b、6c的各器件芯片被树脂密封的方式在各器件区域6a、6b、6c的背面上形成有模制树脂层14。
参照图2,示出本发明实施方式的切削装置20的立体图。图2所示的切削装置20是由作业者将要进行切削的被加工物载置于保持单元上、或从保持单元搬出的手动型的切削装置。
22是切削装置20的基座,在基座22上以能够旋转且能够通过未图示的切削进给机构在X轴方向上往复移动的方式配设有工作台基座26。在工作台基座26的大致中央部分开口有与吸引源连接的吸引口28。
在对封装基板2进行加工时,将日本特开2011-040542号公报所公开的治具工作台搭载于工作台基座26上,借助治具工作台对封装基板20进行吸引保持。即,在本实施方式的切削装置中,由工作台基座和治具工作台构成保持单元。
在工作台基座26的周围配设有防水罩24,在该防水罩24与图3所示的水箱60之间连结有用于保护切削进给机构的轴的波纹管30。
在基座22的后方竖立设置有门型形状的柱32。在柱32上固定有沿Y轴方向延伸的一对导轨34。在柱32上搭载有Y轴移动块36,Y轴移动块36能够通过由滚珠丝杠38和未图示的脉冲电动机构成的Y轴移动机构(分度进给机构)40而沿着导轨34在Y轴方向上移动。
在Y轴移动块36上固定有沿Z轴方向延伸的一对导轨42。在Y轴移动块36上搭载有Z轴移动块44,Z轴移动块44能够通过由滚珠丝杠46和脉冲电动机48构成的Z轴移动机构50而由导轨42引导在Z轴方向上移动。
在Z轴移动块44上安装有作为加工单元的切削单元52,在切削单元52的主轴壳体53中以能够旋转的方式收纳有未图示的主轴,在主轴的前端部以能够装卸的方式安装有切削刀具54。
在切削刀具54的两侧夹着切削刀具54而配设有作为加工液提供单元的一对切削液提供喷嘴56,在保持单元所保持的封装基板2的切削中,一边从切削液提供喷嘴56提供切削液一边利用切削刀具54对封装基板2进行切削。
在Z轴移动块44上还安装有具有显微镜和相机的拍摄单元58。拍摄单元58具有利用可见光线对被加工物进行拍摄的拍摄相机。
当一边从切削水提供喷嘴56提供包含有机酸和氧化剂的切削液一边利用切削刀具54对卡盘工作台26所吸引保持的封装基板2进行切削时,包含切削液和切削屑的切削废液从波纹管30的宽度方向(Y轴方向)的两端向图3所示的水箱60流下。
水箱60配设于工作台基座26的移动路径下,为了能够使工作台基座26在X轴方向上往复移动,在箱状的部件的底板62的中央部设置有矩形状的开口部63,水箱60包含:作为加工废液回收部的流槽部68,其由底板62、内周壁64和外周壁66构成而接住切削液;以及排液口70,其形成于底板62。在排液口70连接有向水箱60的外部延伸的作为排出路的排液管82的一端。
防水罩24是一对侧板24b从呈平面状形成的上板24a的两端部垂下而构成的,上板24a的端部和两个侧板24b以能够滑动的方式与构成水箱60的内周壁64卡合。
切削进给机构72包含:滚珠丝杠74,其沿X轴方向延伸;一对导轨76,它们与滚珠丝杠74平行地配设;电动机80,其与滚珠丝杠74的一端连结;以及可动板78,其收纳于内部的螺母与滚珠丝杠74螺合,可动板78的底部与导轨76滑动接触。
采用如下的构成:当通过电动机80使滚珠丝杠74旋转时,可动板78由一对导轨76引导而在X轴方向上往复移动。在可动板78上安装有圆筒部件82,在该圆筒部件82的内部收纳有使工作台基座26旋转的旋转机构。
如图2和图4所示,在与水箱60的排液口70连接的排液管(排液路)82的途中配置有处理槽84,其对利用作为加工废液回收部的流槽部68进行回收的加工废液进行贮存,并具有将该加工废液所含的加工液分解的废液处理单元。
在本实施方式中,排液处理单元由配设于处理槽84的底壁和侧壁的多个LED86构成。从LED86照射的紫外光(UV光)的波长优选为340nm以下,更优选为300nm以下。
通过透明板88覆盖LED86,以使得贮存于处理槽84中的加工废液不与LED86接触。由LED86对贮存于处理槽84内的加工废液照射紫外线,从而将加工废液(切削废液)所含的加工液(切削液)分解。
在利用本发明实施方式的切削装置2对图1所示那样的封装基板2进行切削时,一边将包含有机酸和氧化剂的切削液提供至切削刀具54切入封装基板2的加工点一边执行切削。
能够一边通过切削液中所含的有机酸对封装基板2所含的金属进行改质而抑制延展性,一边对封装基板2进行切削。因此,不会因该切削而从金属产生毛刺。另外,通过使用氧化剂,能够使金属的表面氧化而降低金属的延展性,能够提高金属表面的加工性。
作为有机酸,例如可以使用在分子内具有至少一个羧基和至少一个氨基的化合物。在该情况下,氨基中的至少一个优选为仲氨基或叔氨基。另外,用作有机酸的化合物可以具有取代基。
作为可以用作有机酸的氨基酸,可以举出甘氨酸、二羟基乙基甘氨酸、双甘氨肽、羟基乙基甘氨酸、N-甲基甘氨酸、β-丙氨酸、L-丙氨酸、L-2-氨基丁酸、L-正缬氨酸、L-缬氨酸、L-亮氨酸、L-正亮氨酸、L-别异亮氨酸、L-异亮氨酸、L-苯丙氨酸、L-脯氨酸、肌氨酸、L-鸟氨酸、L-赖氨酸、牛磺酸、L-丝氨酸、L-苏氨酸、L-别苏氨酸、L-高丝氨酸、L-甲状腺素、L-酪氨酸、3,5-二碘-L-酪氨酸、β-(3,4-二羟基苯基)-L-丙氨酸、4-羟基-L-脯氨酸、L-半胱氨酸、L-甲硫氨酸、L-乙硫氨酸、L-羊毛硫氨酸、L-胱硫醚、L-胱氨酸、L-磺基丙氨酸、L-谷氨酸、L-天冬氨酸、S-(羧甲基)-L-半胱氨酸、4-氨基丁酸、L-天冬酰胺、L-谷氨酰胺、氮杂丝氨酸、L-刀豆氨酸、L-瓜氨酸、L-精氨酸、δ-羟基-L-赖氨酸、甲胍基乙酸、L-犬尿氨素、L-组氨酸、1-甲基-L-组氨酸、3-甲基-L-组氨酸、L-色氨酸、放线菌素C1、麦角硫因、蜂毒明肽、血管紧张素I、血管紧张素II和抗痛素等。其中,优选甘氨酸、L-丙氨酸、L-脯氨酸、L-组氨酸、L-赖氨酸、二羟基乙基甘氨酸。
另外,作为可以用作有机酸的氨基多元酸,可以举出亚氨基二乙酸、次氮基三乙酸、二亚乙基三胺五乙酸、乙二胺四乙酸、羟基乙基亚氨基二乙酸、次氮基三亚甲基膦酸、乙二胺-N,N,N’,N’-四亚甲基磺酸、1,2-二氨基丙烷四乙酸、乙二醇醚二胺四乙酸、反式环己烷二胺四乙酸、乙二胺邻羟基苯基乙酸、乙二胺二琥珀酸(SS体)、β-丙氨酸二乙酸、N-(2-羧酸乙基)-L-天冬氨酸、N,N’-双(2-羟基苄基)乙二胺-N,N’-二乙酸等。
另外,作为可以用作有机酸的羧酸,可以举出甲酸、乙醇酸、丙酸、乙酸、丁酸、戊酸、己酸、草酸、丙二酸、戊二酸、己二酸、苹果酸、琥珀酸、庚二酸、巯基乙酸、乙醛酸、氯乙酸、乙酰甲酸、乙酰乙酸、戊二酸等饱和羧酸;丙烯酸、甲基丙烯酸、丁烯酸、富马酸、马来酸、中康酸、柠康酸、乌头酸等不饱和羧酸;苯甲酸类、甲基苯甲酸、邻苯二甲酸类、萘甲酸类、均苯四甲酸、萘二酸等环状不饱和羧酸等。
作为氧化剂,例如可以使用过氧化氢、过氧化物、硝酸盐、碘酸盐、高碘酸盐、次氯酸盐、亚氯酸盐、氯酸盐、高氯酸盐、过硫酸盐、重铬酸盐、高锰酸盐、铈酸盐、钒酸盐、臭氧水和银(II)盐、铁(III)盐及其有机络盐等。
另外,可以在切削液中混合防蚀剂。通过混合防蚀剂,能够防止QFN基板10所含的金属的腐蚀(溶出)。作为防蚀剂,例如优选使用在分子内具有三个以上氮原子且具有稠环结构的芳杂环化合物、或者在分子内具有四个以上氮原子的芳杂环化合物。另外,优选芳香环化合物包含羧基、磺基、羟基、烷氧基。具体而言,优选为四唑衍生物、1,2,3-三唑衍生物和1,2,4-三唑衍生物。
作为可用作防蚀剂的四唑衍生物,可以举出:在形成四唑环的氮原子上不具有取代基并且在四唑的5位上导入有选自由磺基、氨基、氨基甲酰基、碳酰胺基、氨磺酰基以及磺酰胺基组成的组中的取代基、或者被选自由羟基、羧基、磺基、氨基、氨基甲酰基、碳酰胺基、氨磺酰基以及磺酰胺基组成的组中的至少1种取代基所取代的烷基的物质。
另外,作为可用作防蚀剂的1,2,3-三唑衍生物,可以举出在形成1,2,3-三唑环的氮原子上不具有取代基并且在1,2,3-三唑的4位和/或5位上导入有选自由羟基、羧基、磺基、氨基、氨基甲酰基、碳酰胺基、氨磺酰基以及磺酰胺基组成的组中的取代基、或者被选自由羟基、羧基、磺基、氨基、氨基甲酰基、碳酰胺基、氨磺酰基以及磺酰胺基组成的组中的至少1种取代基所取代的烷基或芳基的物质。
另外,作为可用作防蚀剂的1,2,4-三唑衍生物,可以举出在形成1,2,4-三唑环的氮原子上不具有取代基并且在1,2,4-三唑的2位和/或5位上导入有选自由磺基、氨基甲酰基、碳酰胺基、氨磺酰基以及磺酰胺基组成的组中的取代基、或者被选自由羟基、羧基、磺基、氨基、氨基甲酰基、碳酰胺基、氨磺酰基以及磺酰胺基组成的组中的至少1种取代基所取代的烷基或芳基的物质。
如上所述,在从切削液提供喷嘴56提供的切削液中含有氧化剂,因此,在以往的使用有微生物的生物处理中由于该氧化剂使微生物死亡,无法将切削废液中的有机物分解,有可能将不满足排液基准的切削废液排液。
但是,在本实施方式中,在排液管82的途中设置有具有废液处理单元的废液处理槽84,因此由多个LED86对贮存于处理槽84内的切削废液照射紫外线而能够将切削废液中的有机物分解,因此能够防止将不满足排液基准的切削废液排液的可能。
在上述的实施方式中,对采用封装基板2作为被加工物的例子进行了说明,但被加工物并不限于封装基板,包含层叠有作为背面电极的厚度数μm的导电体膜(由Ti、Ni、Au等构成的多层金属膜)的晶片、在正面的间隔道上形成有TEG的晶片等。
在利用具备具有作为废液处理单元的LED86的废液处理槽84的切削装置20一边提供包含有机酸和氧化剂的切削液一边对封装基板2进行切削时,对于氧化剂的分解,利用具有分解波长的光能而不是添加剂,从而不需要添加剂或温度管理而能够将运行成本抑制得较低。
在上述的实施方式中,对将由LED86照射紫外线的废液处理槽84用于切削装置的废液处理的例子进行了说明,但废液处理槽84并不限于应用于切削装置,也可以同样地应用于磨削装置、刀具切削装置等其他加工装置。
Claims (2)
1.一种加工装置,其具有:
保持单元,其对被加工物进行保持;以及加工单元,其对该保持单元所保持的被加工物进行加工,该加工装置的特征在于,其还具有:
加工液提供单元,其在利用该加工单元对该保持单元所保持的被加工物进行加工时至少对被加工物提供包含氧化剂的加工液;
加工废液回收部,其对包含从该加工液提供单元提供至被加工物的该加工液的加工废液进行回收;
排出路,其将该加工废液从该加工废液回收部排出至该加工装置外;以及
处理槽,其配设于该排出路的途中,对利用该加工废液回收部进行回收的加工废液进行贮存,并具有将该加工废液所含的加工液分解的废液处理单元。
2.根据权利要求1所述的加工装置,其中,
该氧化剂为过氧化氢,该废液处理单元包含对该加工废液照射紫外线的紫外线照射单元。
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007319974A (ja) * | 2006-05-31 | 2007-12-13 | Nomura Micro Sci Co Ltd | 半導体研磨用スラリーの回収方法及び回収システム並びに再生方法及び再生システム |
CN101239759A (zh) * | 2007-02-09 | 2008-08-13 | 锋霈企业股份有限公司 | 半导体制造工艺尾气处理设备的废水回收系统和方法 |
JP2010021464A (ja) * | 2008-07-14 | 2010-01-28 | Disco Abrasive Syst Ltd | 加工装置のチャックテーブル |
CN101993134A (zh) * | 2009-08-19 | 2011-03-30 | 株式会社迪思科 | 加工废液处理装置 |
CN103811330A (zh) * | 2012-11-06 | 2014-05-21 | 株式会社迪思科 | 切削装置的卡盘工作台 |
JP2014205103A (ja) * | 2013-04-12 | 2014-10-30 | 宇部興産株式会社 | 過酸化水素を含む被処理水の処理方法および過酸化水素除去装置 |
CN104916582A (zh) * | 2014-03-12 | 2015-09-16 | 株式会社迪思科 | 加工方法 |
CN104934308A (zh) * | 2014-03-17 | 2015-09-23 | 株式会社迪思科 | 切削方法 |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63218293A (ja) * | 1987-03-06 | 1988-09-12 | Haruna:Kk | トリクロロエチレン含有排水の処理方法 |
JPH0975993A (ja) * | 1995-09-19 | 1997-03-25 | Taiyo Kagaku Kogyo Kk | 有機物含有廃水の処理方法及びその装置 |
JPH11267692A (ja) * | 1998-03-24 | 1999-10-05 | Jgc Corp | 洗濯廃液の処理方法 |
JP2000073084A (ja) | 1998-08-28 | 2000-03-07 | Osaka Kiko Co Ltd | 切削油処理方法及び装置 |
JP3068405U (ja) | 1999-10-21 | 2000-05-12 | 株式会社東京フローメータ研究所 | 溶存オゾン分解装置 |
KR20050004156A (ko) * | 2002-05-17 | 2005-01-12 | 가부시키가이샤 에바라 세이사꾸쇼 | 기판처리장치 및 기판처리방법 |
JP4472391B2 (ja) | 2004-03-17 | 2010-06-02 | 野村マイクロ・サイエンス株式会社 | 使用済み半導体研磨用スラリーの再生方法 |
JP2009214193A (ja) * | 2008-03-07 | 2009-09-24 | Disco Abrasive Syst Ltd | 加工廃液処理装置 |
JP4580433B2 (ja) | 2008-04-14 | 2010-11-10 | 野村マイクロ・サイエンス株式会社 | 研磨用スラリーの再生方法 |
JP5340804B2 (ja) | 2009-05-20 | 2013-11-13 | 株式会社ディスコ | 紫外線分解装置 |
JP5598841B2 (ja) | 2010-02-23 | 2014-10-01 | 国立大学法人岩手大学 | 機械加工システム |
JP6360441B2 (ja) | 2015-01-13 | 2018-07-18 | 株式会社ディスコ | 貯水槽 |
JP6410619B2 (ja) | 2015-01-21 | 2018-10-24 | 株式会社ディスコ | 純水精製装置 |
CN205237703U (zh) * | 2015-11-13 | 2016-05-18 | 西尾康明 | 在金属加工中不使用冷却液的系统 |
CN206898878U (zh) * | 2017-04-01 | 2018-01-19 | 上海舜玉机电科技有限公司 | 一种自动加工中心清屑装置 |
JP2019126746A (ja) | 2018-01-22 | 2019-08-01 | 株式会社ディスコ | 加工装置 |
-
2018
- 2018-02-14 JP JP2018024394A patent/JP7150390B2/ja active Active
-
2019
- 2019-01-29 CN CN201910083842.0A patent/CN110153780A/zh active Pending
- 2019-01-31 KR KR1020190012508A patent/KR20190098697A/ko not_active IP Right Cessation
- 2019-02-13 TW TW108104693A patent/TWI801498B/zh active
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007319974A (ja) * | 2006-05-31 | 2007-12-13 | Nomura Micro Sci Co Ltd | 半導体研磨用スラリーの回収方法及び回収システム並びに再生方法及び再生システム |
CN101239759A (zh) * | 2007-02-09 | 2008-08-13 | 锋霈企业股份有限公司 | 半导体制造工艺尾气处理设备的废水回收系统和方法 |
JP2010021464A (ja) * | 2008-07-14 | 2010-01-28 | Disco Abrasive Syst Ltd | 加工装置のチャックテーブル |
CN101993134A (zh) * | 2009-08-19 | 2011-03-30 | 株式会社迪思科 | 加工废液处理装置 |
CN103811330A (zh) * | 2012-11-06 | 2014-05-21 | 株式会社迪思科 | 切削装置的卡盘工作台 |
JP2014205103A (ja) * | 2013-04-12 | 2014-10-30 | 宇部興産株式会社 | 過酸化水素を含む被処理水の処理方法および過酸化水素除去装置 |
CN104916582A (zh) * | 2014-03-12 | 2015-09-16 | 株式会社迪思科 | 加工方法 |
CN104934308A (zh) * | 2014-03-17 | 2015-09-23 | 株式会社迪思科 | 切削方法 |
Non-Patent Citations (1)
Title |
---|
乌锡康等, 华东化工学院出版社 * |
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JP2019136844A (ja) | 2019-08-22 |
TW201934252A (zh) | 2019-09-01 |
TWI801498B (zh) | 2023-05-11 |
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