CN110136589B - Display panel, manufacturing method thereof and display device - Google Patents
Display panel, manufacturing method thereof and display device Download PDFInfo
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- CN110136589B CN110136589B CN201910580637.5A CN201910580637A CN110136589B CN 110136589 B CN110136589 B CN 110136589B CN 201910580637 A CN201910580637 A CN 201910580637A CN 110136589 B CN110136589 B CN 110136589B
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- binding
- circuit board
- flexible circuit
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/301—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements flexible foldable or roll-able electronic displays, e.g. thin LCD, OLED
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/20—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes for presentation of an assembly of a number of characters, e.g. a page, by composing the assembly by combination of individual elements arranged in a matrix no fixed position being assigned to or needed to be assigned to the individual characters or partial characters
Abstract
The invention discloses a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises: the array substrate, the flexible circuit board and the driving chip; the array substrate is divided into a display area and a non-display area; in a non-display area at one edge of the array substrate, the flexible circuit board is bound to the non-display area, and the driving chip is bound to one side of the flexible circuit board, which is far away from the non-display area; the driving chip is conducted with the array substrate through a circuit inside the flexible circuit board. The driving chip is bound on the array substrate through the flexible circuit board, the lower step area of the array substrate in the non-display area does not need to be occupied additionally, and narrow frames are achieved. Compared with a flexible circuit board, the lower step area of the array substrate has higher hardness and higher shock resistance, so that the shock resistance reliability of the driving chip can be improved. Meanwhile, the flexible circuit board does not need to be specially widened for binding the driving chip, and the cost is saved.
Description
Technical Field
The present invention relates to the field of display technologies, and in particular, to a display panel, a manufacturing method thereof, and a display device.
Background
With the development of display technology, the fully-screened special-shaped display panel has a large screen ratio and an ultra-narrow frame, so that the visual effect of a viewer can be greatly improved, and the display panel is widely concerned.
In order to reduce the frame of the display screen as much as possible, a common method for the lower step area of the display screen is to transfer the display driver chip from the lower step area to the flexible circuit board for binding, so that the space occupied by binding the display driver chip can be saved in the lower step area, and the total space of the step area is reduced. However, the display driver chip is at risk of breaking and has poor reliability due to the lack of rigidity of the flexible circuit board and the poor support of the display driver chip.
Disclosure of Invention
The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, wherein a driving chip is bound on an array substrate through a flexible circuit board, and the binding reliability of the display panel is improved.
In a first aspect, an embodiment of the present invention provides a display panel, including: the array substrate, the flexible circuit board and the driving chip; the array substrate is divided into a display area and a non-display area;
in a non-display area at one edge of the array substrate, the flexible circuit board is bound to the non-display area, and the driving chip is bound to one side of the flexible circuit board, which is far away from the non-display area;
the driving chip is communicated with the array substrate through a circuit in the flexible circuit board.
In a possible implementation manner, in the display panel provided in an embodiment of the present invention, the array substrate includes: a plurality of first binding pins;
the surface of the flexible circuit board facing one side of the array substrate comprises: a plurality of second binding pins in one-to-one correspondence with the first binding pins, wherein a surface of the flexible circuit board facing one side of the driver chip includes: a plurality of third binding pins corresponding to the second binding pins one to one;
the driving chip includes: a plurality of fourth binding pins corresponding to the third binding pins one to one;
the first binding pin is bound with the corresponding second binding pin, the second binding pin is conducted with the corresponding third binding pin through a circuit in the flexible circuit board, and the third binding pin is bound with the corresponding fourth binding pin.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, the second binding pin and the corresponding third binding pin are conducted through a via hole penetrating through the flexible circuit board;
the hole wall of the via hole is plated with a conductive material; or the inside of the via hole is filled with a conductive material.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, the conductive material is a metal material.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, a diameter of the via is greater than a width of the second bonding pin.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, the second bonding pins are strip pins extending along the same direction and arranged in an array;
the through holes corresponding to two adjacent second binding pins in the row direction are respectively connected with different ends in the extension direction of the corresponding strip-shaped pins.
In a possible implementation manner, in the display panel provided by the embodiment of the present invention, the diameter of the via hole is 39-50 μm.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, the width of the second bonding pin is at least 15 μm, the length of the second bonding pin is at least 100 μm, and a distance between two adjacent second bonding pins is at least 24 μm.
In a possible implementation manner, in the display panel provided in the embodiment of the present invention, a surface of the flexible circuit board facing to the side of the driving chip further includes: a plurality of fifth bonding pins; the driving chip further includes: a plurality of sixth binding pins corresponding to the fifth binding pins one to one;
the third binding pin is an output pin of the flexible circuit board, and the fourth binding pin is an output pin of the driving chip; the fifth binding pin is an input pin of the flexible circuit board, and the sixth binding pin is an input pin of the driver chip.
In a second aspect, an embodiment of the invention provides a display device, including any one of the display panels described above.
In a third aspect, an embodiment of the present invention provides a method for manufacturing a display panel, including:
one side of the flexible circuit board is oppositely bound in a non-display area at one edge of the array substrate;
the driving chip is oppositely bound on one side of the flexible circuit board, which is far away from the non-display area;
the driving chip is conducted with the array substrate through a circuit inside the flexible circuit board.
In a possible implementation manner, in the manufacturing method provided in an embodiment of the present invention, before the binding, the manufacturing method further includes:
forming a plurality of first binding pins in a non-display area at one edge of the array substrate;
forming a plurality of second binding pins corresponding to the first binding pins one to one on the surface of one side of the flexible circuit board facing the array substrate;
forming a plurality of third binding pins corresponding to the second binding pins one to one on the surface of one side of the flexible circuit board, which is far away from the array substrate;
forming a through hole which penetrates through the flexible circuit board and is used for electrically connecting the corresponding second binding pin and the corresponding third binding pin between the second binding pin and the corresponding third binding pin;
and forming a plurality of fourth binding pins corresponding to the third binding pins one to one on the drive chip.
In a possible implementation manner, in the manufacturing method provided by the embodiment of the present invention, the oppositely binding one side of the flexible circuit board in the non-display area at one edge of the array substrate includes:
correspondingly binding each first binding pin with each second binding pin;
the counterpoint of the driving chip is bound on one side of the flexible circuit board departing from the non-display area, and the counterpoint driving chip comprises:
correspondingly binding each third binding pin with each fourth binding pin;
the driver chip passes through the inside circuit of flexible circuit board with the array substrate switches on, includes:
the second binding pins are conducted with the corresponding third binding pins through via holes penetrating through the flexible circuit board.
The invention has the following beneficial effects:
the embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises: the array substrate, the flexible circuit board and the driving chip; the array substrate is divided into a display area and a non-display area; in a non-display area at one edge of the array substrate, the flexible circuit board is bound to the non-display area, and the driving chip is bound to one side of the flexible circuit board, which is far away from the non-display area; the driving chip is conducted with the array substrate through a circuit inside the flexible circuit board. The driving chip is bound on the array substrate through the flexible circuit board, the lower step area of the array substrate in the non-display area does not need to be occupied additionally, and narrow frames are achieved. Compared with a flexible circuit board, the lower step area of the array substrate has higher hardness and higher shock resistance, so that the shock resistance reliability of the driving chip can be improved. Meanwhile, the flexible circuit board does not need to be specially widened for binding the driving chip, and the cost is saved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments of the present invention will be briefly described below, and it is obvious that the drawings described below are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic top view of a display panel in the prior art;
FIG. 2 is a second schematic diagram of a top view structure of a display panel in the prior art;
fig. 3 is a schematic top view of a display panel according to an embodiment of the present invention;
fig. 4 is a schematic cross-sectional view illustrating a display panel according to an embodiment of the invention;
fig. 5 is a schematic top view of a flexible circuit board facing side of the array substrate according to an embodiment of the present invention;
fig. 6 is a schematic top view of a side of the flexible circuit board facing the array substrate according to an embodiment of the present invention;
fig. 7 is a schematic top view of a side of the flexible circuit board facing the driving chip according to an embodiment of the present invention;
fig. 8 is a schematic top view of a side of the driver chip facing the flexible circuit board according to an embodiment of the present invention;
fig. 9 is a second schematic cross-sectional view illustrating a display panel according to an embodiment of the invention;
fig. 10 is a third schematic cross-sectional view illustrating a display panel according to an embodiment of the invention;
fig. 11 is a schematic top view of a flexible circuit board according to an embodiment of the present invention;
fig. 12 is a second schematic top view of a flexible circuit board according to an embodiment of the present invention;
fig. 13 is a second schematic top view of the flexible circuit board facing the driving chip according to the embodiment of the present invention;
fig. 14 is a second schematic top view of the driving chip facing the flexible circuit board according to the embodiment of the present invention;
fig. 15 is a schematic top view illustrating a display device according to an embodiment of the present invention;
fig. 16 is a flowchart of a method for manufacturing a display panel according to an embodiment of the invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, the present invention is further described with reference to the accompanying drawings and examples. Example embodiments may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their repetitive description will be omitted. The words expressing the position and direction described in the present invention are illustrated in the accompanying drawings, but may be changed as required and still be within the scope of the present invention. The drawings of the present invention are for illustrative purposes only and do not represent true scale.
It should be noted that in the following description, specific details are set forth in order to provide a thorough understanding of the present invention. The invention can be implemented in a number of ways different from those described herein and similar generalizations can be made by those skilled in the art without departing from the spirit of the invention. Therefore, the present invention is not limited to the specific embodiments disclosed below. The description which follows is a preferred embodiment of the present application, but is made for the purpose of illustrating the general principles of the application and not for the purpose of limiting the scope of the application. The protection scope of the present application shall be subject to the definitions of the appended claims.
The following describes a display panel, a manufacturing method thereof, and a display device according to an embodiment of the present invention with reference to the accompanying drawings. The thicknesses and shapes of the respective components in the drawings do not reflect the true scale of the display device, and are merely intended to schematically illustrate the present invention.
In the prior art, two ways of binding a driver Chip to Glass (Chip On Glass, for short, COG) and binding the driver Chip to a flexible circuit board (Chip On Film, for short, COF) are generally adopted for the binding manner of the driver Chip. The binding structure of the COG is shown in fig. 1, and the display panel 1 needs to reserve binding regions for the flexible circuit board 2 and the driver chip 3 in a lower step region shown by a dotted line frame of the lower frame, and bind the flexible circuit board 2 and the driver chip to the lower step region respectively. The binding structure of the COG occupies a large size of the lower step and does not meet the requirement of a narrow frame.
Therefore, a COF bonding structure is proposed, as shown in fig. 2, the COF bonding structure is to bond the flexible circuit board 2 to the lower step area of the display panel 1 shown by the dotted line frame of the lower frame, and then expand the flexible circuit board, so that a part of the area of the flexible circuit board is exclusively used for bonding the driving chip 3. However, the flexible circuit board 2 is made of a flexible film material and lacks rigidity, and when the driving chip 3 is bound on the flexible circuit board 2, the flexible circuit board 2 hardly supports the driving chip, which easily causes the driving chip to break and has poor reliability.
In view of the above, a first aspect of an embodiment of the present invention provides a display panel, fig. 3 is a schematic top view structure diagram of the display panel provided in the embodiment of the present invention, and fig. 4 is a schematic cross-sectional structure diagram of the display panel along a direction II' in fig. 3; as shown in fig. 3, the display panel provided in the embodiment of the present invention includes: an array substrate 100, a flexible circuit board 20 and a driving chip 30; the array substrate is divided into a display area AA and a non-display area NA. As shown in fig. 3, in the non-display area NA1 at one edge of the array substrate 100, the flexible circuit board 20 is bound to the non-display area NA 1; as shown in fig. 4, the driving chip 30 is bonded to a side of the flexible circuit board 20 away from the non-display area NA 1; the driving chip 30 is electrically connected to the array substrate 100 through the line x inside the flexible circuit board 20.
As can be seen from fig. 3, in the display panel provided by the embodiment of the invention, the orthographic projection of the driver chip 30 on the array substrate 100 is located in the binding region of the flexible circuit board 20 in the non-display area NA1 of the array substrate 100, and therefore, the binding of the driver chip 30 does not occupy the lower step region of the array substrate in the non-display area NA1, which is beneficial to realizing a narrow bezel. As can be seen from fig. 4, in the display panel provided in the embodiment of the present invention, the driving chip 30 is electrically connected to the array substrate 100 through the circuit inside the flexible circuit board 20, and the driving chip 30 is finally bound to the lower step area of the array substrate, which has higher hardness and higher impact resistance than the flexible circuit board 20, so that the impact resistance reliability of the driving chip can be improved. Meanwhile, the flexible circuit board 20 does not need to be specially widened for binding the driving chip, so that the cost is saved.
In order to clearly show the binding pins on each component, the embodiment of the present invention disassembles the component with the binding pins from the above components. Fig. 5 is a schematic top view of the array substrate 100 facing the flexible circuit board 20, and as shown in fig. 5, the array substrate 100 includes: a plurality of first bonding pins 11; fig. 6 is a schematic top view of the flexible circuit board 20 facing the array substrate 100, and as shown in fig. 6, the surface of the flexible circuit board 20 facing the array substrate 100 includes: a plurality of second bonding pins 21 corresponding to the first bonding pins 11 one to one; fig. 7 is a schematic top view of the flexible circuit board 20 facing the driving chip 30, and as shown in fig. 7, a surface of the flexible circuit board 20 facing the driving chip 30 includes: a plurality of third bonding pins 22 corresponding to the respective second bonding pins 21 one to one; fig. 8 is a schematic top view of the driving chip 30 facing the flexible circuit board 20, and as shown in fig. 8, the driving chip 30 includes: a plurality of fourth bonding pins 31 corresponding one-to-one to the respective third bonding pins 22. The connection relationship among the array substrate 100, the flexible circuit board 20 and the bonding pins of the driver chip 30 is shown in fig. 9, the first bonding pin 11 is bonded to the corresponding second bonding pin 21, the second bonding pin 21 is connected to the corresponding third bonding pin 22 through a line x inside the flexible circuit board, and the third bonding pin 22 is bonded to the corresponding fourth bonding pin 31.
The second binding pin 21 of the flexible circuit board 20 and the corresponding third binding pin 22 are conducted through a line x inside the flexible circuit board, and then when the fourth binding pin 31 of the driver chip 30 is bound to the third binding pin 22 corresponding to the flexible circuit board and the first binding pin 11 of the array substrate 100 is bound to the second binding pin 21 corresponding to the flexible circuit board 20, the driver chip is conducted with the array substrate through the line inside the flexible circuit board. In practical applications, the array substrate further includes a plurality of data signal lines extending in parallel, and the data signal lines may be used to transmit data signals for lighting up each pixel in the display panel.
Fig. 10 is another schematic cross-sectional structure diagram of the display panel according to the embodiment of the invention, as shown in fig. 10, the second bonding pin 21 and the corresponding third bonding pin 22 can be conducted through a via 23 penetrating through the flexible circuit board 20; wherein, the hole wall of the via hole 23 is plated with a conductive material; alternatively, the interior of the via is filled with a conductive material.
In the embodiment of the present invention, the second bonding pin 21 and the third bonding pin 22 are correspondingly disposed on two surfaces of the flexible circuit board, and the via holes 23 at corresponding positions are electrically connected, so that the driving chip 30 can be electrically connected to the array substrate 100 through the flexible circuit board 20. Compared to the COF bonding technology, the circuit design of the flexible circuit board 20 for connecting the driver chip to the array substrate is much simpler. In practical applications, a conductive material may be plated on the wall of the via 23, or a conductive material may be filled inside the via, so that the second and third bonding pins 21 and 22 may be electrically connected through the conductive material. In addition, a wire may be disposed in the via hole, and two ends of the wire are respectively connected to the second binding pin 21 and the third binding pin 22, and the second binding pin 21 and the third binding pin 22 may also be electrically connected, which is not limited herein.
In an actual manufacturing process, the light guide material may be a metal material, and the light guide material and the bonding pin are manufactured by using the same metal material. In addition, according to the requirement, a conductive material made of other materials may be used to fill the via hole, and the second bonding pin 21 and the third bonding pin 22 may also be electrically connected, which is not limited herein in the embodiment of the present invention.
Fig. 11 is another schematic top view of the flexible circuit board according to the embodiment of the present invention, and as shown in fig. 11, the diameter of the via hole 23 may be set to be larger than the width of the second bonding pin 21. The via hole 23 has a larger diameter, which is beneficial for the second binding pin 21 and the third binding pin 22 to be fully connected with the via hole 23, and the diameter of the via hole 23 is larger, so that the fault-tolerant space for the second binding pin 21 and the third binding pin 22 can be relatively larger, and even if the second binding pin 21 and the corresponding third binding pin 22 have a certain dislocation in position, the second binding pin 21 and the third binding pin 22 can be electrically connected through the via hole 23. Further, the larger the diameter of the via hole 23 is set, and the smaller the resistance value by the via hole itself is, the load by the line itself can be reduced.
Fig. 12 is another schematic top view of the flexible circuit board according to the embodiment of the present invention, as shown in fig. 12, the second bonding pins 21 are strip-shaped pins extending along the same direction and arranged in an array; the via holes 23 corresponding to two adjacent second bonding pins 21 in the row direction are respectively connected to different ends in the extending direction of the corresponding strip-shaped pins. The through holes 23 connected with the second binding pins 21 are arranged on different ends of the second binding pins 21 in a staggered manner, so that the space between the second binding pins 21 can be effectively reduced, and the space occupied by the whole binding pins is reduced. As shown in fig. 12, the via holes 23 corresponding to the second bonding pins 21 in the odd-numbered columns are respectively connected to the upper ends of the corresponding second bonding pins 21, and the via holes 23 corresponding to the second bonding pins 21 in the even-numbered columns are respectively connected to the lower ends of the corresponding second bonding pins 21. Adjacent two vias 23 do not overlap each other in the row direction. In practical applications, the pitch between two adjacent second bonding pins 21 can be adaptively adjusted according to the diameter of the via 23.
In practical implementation, the diameter of the via 23 in the embodiment of the present invention may be 39-50 μm, the width of the second bonding pin 21 is at least 15 μm, the length of the second bonding pin is at least 100 μm, and the distance between two adjacent second bonding pins 21 is at least 24 μm. At present, due to the horizontal limitation of the manufacturing process, there is a certain limitation on the lower limit value of the diameter of the manufactured via 23, and it is appropriate to set the diameter of the via 23 within the range of 39-50 μm on the premise of ensuring the manufacturing yield and the diameter of the via 23 to be properly larger than the width of the second bonding pin 21. When the positional relationship between the via 23 and the second bonding pin 21 is as shown in fig. 12, in order to avoid a line short circuit caused by mutual contact between two adjacent vias in the row direction and the column direction, it is necessary to set the length of the second bonding pin 21 to be at least 100 μm and set the pitch between the adjacent second bonding pins 21 to be at least 24 μm. It should be noted that, when the manufacturing process is improved or the actual circuit design is changed, the actual processing size of the via 23 and the second bonding pin 21 may exceed the above-mentioned limit range, and therefore, the embodiment of the present invention does not limit the specific size of the via 23 and the bonding pin.
Fig. 13 is another schematic top view structure diagram of the side of the flexible circuit board 20 facing the driving chip 30 according to the embodiment of the present invention, and correspondingly, fig. 14 is another schematic top view structure diagram of the side of the driving chip 30 facing the flexible circuit board 20 according to the embodiment of the present invention. As shown in fig. 13, the surface of the flexible circuit board 20 facing the side of the driving chip 30 further includes: a plurality of fifth bonding pins 24; as shown in fig. 14, the driving chip further includes: a plurality of sixth bonding pins 32 corresponding to the fifth bonding pins 24 one to one; the third binding pin 22 is an output pin of the flexible circuit board 20, and the fourth binding pin 31 is an output pin of the driver chip 30; the fifth bonding pin 24 is an input pin of the flexible circuit board 20, and the sixth bonding pin 32 is an input pin of the driver chip 30.
In a specific implementation, while the third bonding pin 22 is bonded to the corresponding fourth bonding pin 31, the fifth bonding pin 24 needs to be bonded to the corresponding sixth bonding pin 32. The sixth binding pin 32 of the driver chip 30 and the fifth binding pin 24 of the flexible circuit board 20 are both input pins, the fifth binding pin 24 is connected to an internal circuit in the flexible circuit board 20 and is finally connected to a processing chip or other devices in a motherboard of the display device, the fifth binding pin 24 is used for transmitting a control signal at one side of the motherboard to the driver chip 30 through the connected sixth binding pin 32, so that the driving chip 30 outputs a data signal for display to the display panel side according to the control signal, the data signal may be transmitted to the first bonding pin 11 of the array substrate 100 through the third bonding pin 22 of the connected flexible circuit board 20, the via 23 and the second bonding pin 21 through the fourth bonding pin 31 of the driver chip 30, thereby transmitting to a circuit within the array substrate through the data signal line connected to the first bonding pin 11.
In a second aspect of the embodiments of the present invention, a display device is provided, where the display device includes the display panel provided in the embodiments of the present invention, or the display device includes the touch display panel provided in the embodiments of the present invention; the display device may be a display device such as a liquid crystal panel, a liquid crystal display, a liquid crystal television, an Organic Light Emitting Diode (OLED) panel, an OLED display, an OLED television, or electronic paper. Fig. 15 is a schematic top view of a display device according to an embodiment of the present invention, and as shown in fig. 15, the display device may also be a mobile device such as a mobile phone, a tablet computer, and an electronic album. Since the principle of the display device to solve the problem is similar to that of the display panel, the display device can be implemented by the display panel, and repeated descriptions are omitted.
In a third aspect of the embodiments of the present invention, a method for manufacturing a display panel is provided, and fig. 16 is a flowchart of the method for manufacturing a display panel according to the embodiments of the present invention, as shown in fig. 16, the method for manufacturing a display panel includes:
s10, one side of the flexible circuit board is oppositely bound in the non-display area at one edge of the array substrate;
s20, oppositely binding the driving chip on one side of the flexible circuit board, which is far away from the non-display area;
the driving chip is conducted with the array substrate through a circuit inside the flexible circuit board.
According to the manufacturing method provided by the embodiment of the invention, the driving chip can be bound on the array substrate through the flexible circuit board, the lower step area of the array substrate in the non-display area is not required to be occupied additionally, and the narrow frame is favorably realized. Compared with a flexible circuit board, the lower step area of the array substrate has higher hardness and higher shock resistance, so that the shock resistance reliability of the driving chip can be improved. Meanwhile, the flexible circuit board does not need to be specially widened for binding the driving chip, and the cost is saved.
In specific implementation, before the bonding of each bonding pin, the manufacturing method provided in the embodiment of the present invention further includes:
forming a plurality of first binding pins in a non-display area at one edge of the array substrate;
forming a plurality of second binding pins corresponding to the first binding pins one to one on the surface of one side of the flexible circuit board facing the array substrate;
a plurality of third binding pins which correspond to the second binding pins one to one are formed on the surface of one side, away from the array substrate, of the flexible circuit board;
forming a through hole which penetrates through the flexible circuit board and is used for electrically connecting the corresponding second binding pin and the corresponding third binding pin between the second binding pin and the corresponding third binding pin;
and forming a plurality of fourth binding pins corresponding to the third binding pins one to one on the drive chip.
In specific implementation, the bonding pins on the array substrate and the driving chip can be manufactured in a copper plating and etching mode, and the bonding pins on the flexible circuit board can be manufactured by printing a circuit on a rubber plate by an additive method and plating a copper circuit pattern on the rubber plate by a chemical copper plating method to form a printed plate with a chemical copper plating layer as a circuit. The addition method has high requirements on chemical copper plating and strict requirements on the binding force of copper plating and a matrix, and the method has simple process and does not need a copper-clad plate, so the problem of poor electroplating dispersion capability is avoided. The alignment mark for alignment can be formed while the binding pins are formed, so that when binding is performed, alignment can be performed between the array substrate and the flexible circuit board and between the flexible circuit board and the driving chip, and the binding of the binding pins is performed after the alignment is successful.
After the bonding pins are formed, the flexible circuit board and the driver chip are bonded, wherein in step S10, the bonding of the one-side alignment of the flexible circuit board in the non-display area at the one edge of the array substrate includes:
correspondingly binding each first binding pin with each second binding pin;
in step S20, the method for bonding the driver chip to the flexible circuit board opposite to the non-display area includes:
and correspondingly binding each third binding pin with each fourth binding pin.
The drive chip is conducted with the array substrate through the inside circuit of flexible circuit board, includes:
the second binding pins are conducted with the corresponding third binding pins through via holes penetrating through the flexible circuit board.
The first binding pins of the array substrate correspond to the second binding pins of the flexible circuit board one by one, and after binding, each first binding pin is electrically connected with each corresponding second binding pin; the second binding pins of the flexible circuit board correspond to the third binding pins one by one, the positions of the second binding pins correspond to those of the third binding pins, and the second binding pins and the third binding pins are electrically connected through via holes penetrating through the flexible circuit board; and each third binding pin of the flexible circuit board corresponds to a fourth binding pin of the drive chip one by one, and after binding, each fourth binding pin is electrically connected with the corresponding third binding pin, so that the drive chip can be connected onto the array substrate through the flexible circuit board, and the binding of the drive chip and the flexible circuit board is realized.
The embodiment of the invention provides a display panel, a manufacturing method thereof and a display device, wherein the display panel comprises: the array substrate, the flexible circuit board and the driving chip; the array substrate is divided into a display area and a non-display area; in a non-display area at one edge of the array substrate, the flexible circuit board is bound to the non-display area, and the driving chip is bound to one side of the flexible circuit board, which is far away from the non-display area; the driving chip is conducted with the array substrate through a circuit inside the flexible circuit board. The driving chip is bound on the array substrate through the flexible circuit board, the lower step area of the array substrate in the non-display area does not need to be occupied additionally, and narrow frames are achieved. Compared with a flexible circuit board, the lower step area of the array substrate has higher hardness and higher shock resistance, so that the shock resistance reliability of the driving chip can be improved. Meanwhile, the flexible circuit board does not need to be specially widened for binding the driving chip, and the cost is saved.
While preferred embodiments of the present invention have been described, additional variations and modifications in those embodiments may occur to those skilled in the art once they learn of the basic inventive concepts. Therefore, it is intended that the appended claims be interpreted as including preferred embodiments and all such alterations and modifications as fall within the scope of the invention.
It will be apparent to those skilled in the art that various changes and modifications may be made in the present invention without departing from the spirit and scope of the invention. Thus, if such modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include such modifications and variations.
Claims (8)
1. A display panel, comprising: the array substrate, the flexible circuit board and the driving chip; the array substrate is divided into a display area and a non-display area;
in a non-display area at one edge of the array substrate, the flexible circuit board is bound to the non-display area, and the driving chip is bound to one side of the flexible circuit board, which is far away from the non-display area; the driving chip is communicated with the array substrate through a circuit in the flexible circuit board;
the array substrate includes: a plurality of first binding pins; the surface of the flexible circuit board facing one side of the array substrate comprises: a plurality of second binding pins in one-to-one correspondence with the first binding pins, wherein a surface of the flexible circuit board facing one side of the driver chip includes: a plurality of third binding pins corresponding to the second binding pins one to one; the driving chip includes: a plurality of fourth binding pins corresponding to the third binding pins one to one; the first binding pins are bound with the corresponding second binding pins, the second binding pins are conducted with the corresponding third binding pins through via holes penetrating through the flexible circuit board, and the third binding pins are bound with the corresponding fourth binding pins;
the diameter of the via hole is larger than the width of the second binding pin;
the second binding pins are strip pins which extend along the same direction and are arranged in an array; the through holes corresponding to two adjacent second binding pins in the row direction are respectively connected with different ends in the extension direction of the corresponding strip-shaped pins.
2. The display panel of claim 1, wherein the walls of the vias are plated with a conductive material; or the inside of the via hole is filled with a conductive material.
3. The display panel according to claim 2, wherein the conductive material is a metal material.
4. The display panel of claim 1, wherein the via has a diameter of 39-50 μ ι η.
5. The display panel of claim 1, wherein the width of the second bonding pin is at least 15 μm, the length of the second bonding pin is at least 100 μm, and a distance between two adjacent second bonding pins is at least 24 μm.
6. The display panel according to claim 1, wherein a surface of the flexible circuit board on a side facing the driver chip further comprises: a plurality of fifth bonding pins; the driving chip further includes: a plurality of sixth binding pins corresponding to the fifth binding pins one to one;
the third binding pin is an output pin of the flexible circuit board, and the fourth binding pin is an output pin of the driving chip; the fifth binding pin is an input pin of the flexible circuit board, and the sixth binding pin is an input pin of the driver chip.
7. A display device comprising the display panel according to any one of claims 1 to 6.
8. A method for manufacturing a display panel is characterized by comprising the following steps:
one side of the flexible circuit board is oppositely bound in a non-display area at one edge of the array substrate;
the driving chip is oppositely bound on one side of the flexible circuit board, which is far away from the non-display area;
the driving chip is conducted with the array substrate through a circuit in the flexible circuit board;
the manufacturing method further comprises the following steps before binding:
forming a plurality of first binding pins in a non-display area at one edge of the array substrate;
forming a plurality of second binding pins corresponding to the first binding pins one to one on the surface of one side of the flexible circuit board facing the array substrate;
forming a plurality of third binding pins corresponding to the second binding pins one to one on the surface of one side of the flexible circuit board, which is far away from the array substrate;
forming a through hole which penetrates through the flexible circuit board and is used for electrically connecting the corresponding second binding pin and the corresponding third binding pin between the second binding pin and the corresponding third binding pin, wherein the diameter of the through hole is larger than the width of the second binding pin;
forming a plurality of fourth binding pins corresponding to the third binding pins one to one on the drive chip;
the second binding pins are strip pins which extend along the same direction and are arranged in an array; the through holes corresponding to two adjacent second binding pins in the row direction are respectively connected with different ends in the extension direction of the corresponding strip-shaped pins;
the one side counterpoint of with the flexible circuit board is bound in the non-display area of an edge of array substrate, includes:
correspondingly binding each first binding pin with each second binding pin;
the counterpoint of the driving chip is bound on one side of the flexible circuit board departing from the non-display area, and the counterpoint driving chip comprises:
correspondingly binding each third binding pin with each fourth binding pin;
the driver chip passes through the inside circuit of flexible circuit board with the array substrate switches on, includes:
the second binding pins are conducted with the corresponding third binding pins through via holes penetrating through the flexible circuit board.
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| CN112102739A (en) * | 2020-09-16 | 2020-12-18 | 武汉华星光电技术有限公司 | Electronic equipment |
| CN112382650B (en) * | 2020-11-26 | 2022-09-30 | 昆山国显光电有限公司 | Display panel assembly and display device |
| CN113223411B (en) * | 2021-04-27 | 2022-12-06 | 昆山国显光电有限公司 | Display panel and display device |
| CN116034413A (en) * | 2021-06-30 | 2023-04-28 | 京东方科技集团股份有限公司 | Display module and display device |
| CN114067694A (en) * | 2021-12-08 | 2022-02-18 | Tcl华星光电技术有限公司 | Display mother board and preparation method thereof |
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