CN112102739A

CN112102739A - Electronic equipment

Info

Publication number: CN112102739A
Application number: CN202010975326.1A
Authority: CN
Inventors: 徐磊
Original assignee: Wuhan China Star Optoelectronics Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Technology Co Ltd
Priority date: 2020-09-16
Filing date: 2020-09-16
Publication date: 2020-12-18

Abstract

The invention provides an electronic device, which is a display device, wherein the display device is provided with a display area and a non-display area surrounding the display area; the display device further comprises a substrate, and a plurality of surface acoustic wave devices are arranged on the substrate in the display area. The surface acoustic wave device is arranged in the display panel, so that on one hand, the aim of wireless sensing can be achieved, and the additional value of electronic equipment is increased; on the other hand, the problem of insufficient arrangement space of the electronic equipment is solved, and good economic benefit is obtained.

Description

Electronic equipment

Technical Field

The application relates to the technical field of display, in particular to an electronic device.

Background

Surface Acoustic Wave (SAW) devices are the product of organic integration of Surface Wave theory, piezoelectric research results and microelectronics in modern acoustics. The SAW is an elastic wave with energy concentrated on the surface of a piezoelectric solid (crystal substrate) material and is characterized in that: (1) lower wave speed and shorter wavelength, (2) the energy is concentrated on the surface layer by propagating along the crystal surface, and the electron transfer process in the crystal is not involved. Based on these characteristics, the SAW device has unique and flexible application in wireless sensing integration.

A SAW device generally includes a crystal substrate, input leads, IDT interdigital metal electrodes, an acoustic signal path, and an acoustic absorber. Specifically, the SAW device is mainly composed of a base material having piezoelectric characteristics and a metal thin film interdigital transducer (IDT) fabricated on a polished surface of the material. The sensing principle is as follows: high-frequency electric signals are added at two ends of the IDT electrode, the surface of the piezoelectric material can generate mechanical vibration and simultaneously excite surface acoustic waves with the same frequency as the external electric signals, and the surface acoustic waves can propagate along the surface of the substrate material; if a pair of IDT electrodes is further fabricated on the SAW propagation path, the SAW can be detected and converted into an electrical signal. The working frequency of the SAW device is determined by the width of the IDT finger, wherein, the IDT pattern is deposited by the semiconductor processing technology of 0.2-0.5 μm level, the SAW device with the working frequency of 1500MHz-3GHz can be manufactured, which means that the normal operation of the device can be ensured only if the input frequency is consistent with the working frequency of the device.

If the input end of the SAW device adopts a receiving antenna, the device can only receive and transmit electromagnetic waves with fixed frequency, and therefore screening response of wireless sensing signals is achieved.

As is well known, the size of an electromagnetic wave device is comparable to the electromagnetic wavelength, and similarly, a SAW device is used as a surface acoustic wave analog device of the electromagnetic device, and the size of the SAW device is also comparable to the SAW wavelength. In the same frequency band, the propagation speed and wavelength of the SAW are far smaller than those of electromagnetic waves, so that the size of the SAW device is greatly reduced compared with that of a corresponding electromagnetic wave device, and the weight is greatly reduced. For example, a SAW pressure sensor package for an automotive tire pressure sensing system is only 11mm in size, about 2mm in thickness, and <2g in mass; the Jing porcelain SAW device can reach the minimum chip packaging size of 1.1X 0.9X 0.7 mm. Therefore, SAW devices have the advantage of being more easily integrated than electromagnetic wave devices.

The IDT interdigital metal electrode is manufactured by means of a photoetching technology, and the specific process flow is as follows: substrate cleaning, metal film plating, photoresist coating, developing, etching, photoresist stripping, cutting and packaging. This is largely common to semiconductor display processes, which should be compatible with each otherAnd (6) mixing. In addition, quartz (SiO) is often used as the material of the base wafer₂) Lithium niobate (LiNbO)₃) Potassium niobate (KNbO)₃) Piezoelectric ceramics, etc., wherein SiO₂And is also a common material for manufacturing display panels.

In summary, the SAW device has a simple structure and a small chip size, and can be combined with a semiconductor display process, which provides a possibility of integrating the SAW device into a display panel. The next generation of panel display technology is also moving towards highly integrated sensing.

In addition, as the development of 5G communication technology, SAW devices are used as core components of radio frequency front ends, and more than 30 SAW devices in 4G mobile phones are increased to more than 91 SAW devices, which greatly reduces the internal space of the mobile phones and affects the integration of other components.

Disclosure of Invention

The invention aims to provide electronic equipment, which achieves the aim of wireless sensing and solves the technical problem of insufficient arrangement space of the electronic equipment.

In order to achieve the above object, the present invention provides an electronic device, which is a display device having a display area and a non-display area surrounding the display area; the display device further comprises a substrate, and a plurality of surface acoustic wave devices are arranged on the substrate in the display area.

Further, the substrate is a non-flexible substrate, and the display device further includes

The first wires and the second wires are arranged on the same side of the non-display area of the substrate at intervals and are bent from the front side of the substrate to the back side of the substrate; the first chip is arranged on the back surface of the substrate and connected to part of the first routing, and the second chip is arranged on the back surface of the substrate and connected to part of the second routing; the first flexible circuit board and the second flexible circuit board are arranged in the non-display area at intervals, the first flexible circuit board is connected with part of the first routing, and the second flexible circuit board is connected with part of the second routing; when the first routing wire and the second routing wire are not bent, the first flexible circuit board is positioned between the first chip and the display area, and the second flexible circuit board is positioned between the second chip and the display area; the surface acoustic wave device is connected to the second chip through the second routing.

Further, the substrate is a flexible substrate, and the display device further includes

The first chip and the second chip are arranged at intervals; the first chip and the second chip are directly arranged in a non-display area of the substrate and are bent to the back of the substrate; the first wirings and the second wirings are arranged on the substrate at intervals, the first wirings are led out from the position of the first chip, and the second wirings are led out from the position of the second chip; the first flexible circuit board and the second flexible circuit board are arranged in the non-display area at intervals, the first flexible circuit board is connected with part of the first routing, and the second flexible circuit board is connected with part of the second routing; when the substrate is not bent, the first chip is positioned between the first flexible circuit board and the display area, and the second chip is positioned between the second flexible circuit board and the display area; the surface acoustic wave device is connected to the second chip through the second routing.

Further, the surface acoustic wave device includes:

a substrate; the interdigital transducer is arranged on the substrate and is provided with an input part and an output part, and a transmission distance of surface acoustic waves is reserved between the input part and the output part; and an antenna connected to the input unit or the output unit; the SAW device is integrated in the display area, and the input portion or the output portion of the SAW device is led out to the second chip through a wire in the second wire.

Further, the electronic equipment comprises micro LED display equipment, mini LED display equipment, OLED display equipment and liquid crystal display equipment.

Further, when the display device is a micro LED display device or an OLED display device, the substrate is an array substrate; the surface acoustic wave device further comprises a protective layer, and the interdigital transducer is arranged on one surface of the substrate away from the substrate.

Further, when the display device is a mini LED display device, the substrate is a backlight module, and the mini LED display device further comprises

A back plate; a plurality of mini LED arrays are arranged on the back plate; the surface acoustic wave device is arranged on one surface of the back plate, which is far away from the mini LED; the surface acoustic wave device further comprises a protective layer, and the interdigital transducer is arranged on one surface of the substrate away from the substrate.

Furthermore, the protective layer is made of silicon oxide and has a thickness of 30-50 nm.

Further, when the display device is a liquid crystal display device, the substrate is a substrate structure of the liquid crystal display device, the substrate structure including

A glass substrate; a light shielding layer disposed on the glass substrate; a buffer layer disposed on the light-shielding layer;

the doped buffer layer is arranged on the buffer layer; the active layer is arranged on the doped buffer layer, and the projection of the active layer on the glass substrate falls into the projection of the light shielding layer on the glass substrate; and an insulating layer disposed on the active layer and the interdigital transducer; the doped buffer layer is a substrate of the surface acoustic wave device, and the interdigital transducer and the active layer are arranged on the same layer.

Furthermore, a plurality of surface acoustic wave devices are arranged on the substrate in an array mode, and the distance between every two adjacent surface acoustic wave devices is 1-2 mm.

The electronic equipment has the technical effects that the surface acoustic wave device is arranged in the display panel, so that on one hand, the aim of wireless sensing can be fulfilled, and the additional value of the electronic equipment is increased; on the other hand, the problem of insufficient arrangement space of the electronic equipment is solved, and good economic benefit is obtained.

Drawings

The technical solution and other advantages of the present application will become apparent from the detailed description of the embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a plan view of an electronic device according to embodiment 1 of the present application.

Fig. 2 is a schematic structural diagram of the surface acoustic wave device according to embodiment 1 of the present application integrated in a display region.

Fig. 3 is a first schematic structural diagram of a surface acoustic wave device according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a surface acoustic wave device according to an embodiment of the present application.

Fig. 5 is a plan view of an electronic device according to embodiment 2 of the present application.

Fig. 6 is a schematic structural diagram of a micro LED display device according to embodiment 3 of the present application.

Fig. 7 is a schematic structural diagram of a mini LED display device according to embodiment 5 of the present application.

Fig. 8 is a schematic structural diagram illustrating a surface acoustic wave device integrated in a backlight module according to embodiment 5 of the present application.

Fig. 9 is a schematic structural diagram of a liquid crystal display device according to embodiment 6 of the present application.

The drawing figures are partially identified as follows:

100a display device; 200 surface acoustic wave devices;

100a micro LED display device; 100b mini LED display device; 100c a liquid crystal display device;

101 a display area; 102 a non-display area; 103a substrate;

104a color film substrate; 105 an encapsulation layer; 106 a first polarizer;

107 an array substrate; 108 a second polarizer; 109 a liquid crystal layer;

201 a substrate; 202 an interdigital transducer; 203 a protective layer;

2021 an input section; 2022 output section;

111a first trace; 111b second trace;

112a first flexible circuit board; 112b a second flexible circuit board;

113a first chip; 113b a second chip;

21a, 104a black matrix; 21b micro LED; 104b pixel units;

103a back plate; 103b mini LED;

301 a substrate structure; a 302 grid electrode; 303 a first dielectric layer;

304 source and drain electrodes; 305 a planar layer; 306a second dielectric layer;

306b a third dielectric layer; 307 an anode layer; 308 a passivation layer;

309 a cathode layer; 401 a liquid crystal layer; 402 a color film substrate;

3011 a glass substrate; 3012 light-shielding layer; 3013 a buffer layer;

3014 doping the buffer layer; 3015 an active layer; 3016 insulating layer.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Example 1

As shown in fig. 1, the present embodiment provides an electronic apparatus, which is a display apparatus 100, the display apparatus 100 having a display area 101 and a non-display area 102 surrounding the display area 101.

As shown in fig. 2, the display apparatus 100 further includes a substrate 103, and a plurality of surface acoustic wave devices 200 are arranged on the substrate 103 in an array and integrated in the display area 101, wherein a distance L between two adjacent surface acoustic wave devices 200 is 1-2mm, and the surface acoustic wave devices 200 prevent the plurality of surface acoustic wave devices 200 from interfering with each other when receiving or transmitting electromagnetic signals of different wave bands. In this embodiment, the substrate 103 is a non-flexible substrate.

As shown in fig. 1, the display device 100 further includes a first trace 111a, a second trace 111b, a first flexible circuit board 112a (fpc), a second flexible circuit board 112b (fpc), a first chip 113a, and a second chip 113 b.

The first trace 111a and the second trace 111b are disposed at the same side of the non-display area 102 of the substrate 103 at intervals, and are bent from the front surface of the substrate 103 to the back surface of the substrate 103.

The first chip 113a is disposed on the back surface of the substrate 103 and connected to a portion of the first trace 111a, and the second chip 113b is disposed on the back surface of the substrate 103 and connected to a portion of the second trace 111 b. The first chip 113a is a touch chip, a driving chip, and the like, and is configured to drive the thin film transistor to operate, and the second chip 113b is a driving chip configured to drive the surface acoustic wave device 200 to operate.

The first flexible circuit board 112a and the second flexible circuit board 112b are arranged in the non-display area 102 at intervals, the first flexible circuit board 112a is connected to a part of the first wire 111a, and the second flexible circuit board 112b is connected to a part of the second wire 111 b; when the first trace 111a and the second trace 111b are not bent, the first flexible circuit board 112a is located between the first chip 113a and the display area 101, and the second flexible circuit board 112b is located between the second chip 113b and the display area 101. The surface acoustic wave device 200 is connected to the second chip 113b through the second trace 111 b.

At present, Chip packaging mainly adopts three processes of cog (Chip On glass), COF (Chip On Flex, or, Chip On film) and cop (Chip On pi) to package chips. In this embodiment, a chip package is performed by using a COF process. The COG is a traditional packaging method, and the driving chip is directly bound on the glass surface of the liquid crystal display panel for packaging. The COF is also called a chip on film, and the greatest improvement of the COF compared with the COG in the embodiment is a chip on film package which fixes chips and the like on a flexible circuit board, and a packaging technology which uses a flexible additional circuit board as a packaging chip carrier and connects the chips with a flexible substrate circuit is adopted. The more intuitive expression is that the chip is embedded on the flexible circuit board, that is, attached on the flat cable between the screen and the printed circuit board main board.

As shown in fig. 3 to 4, the surface acoustic wave device 200 includes a base 201, an interdigital transducer 202, and an antenna 203.

The material of the substrate 201 is silicon oxide, and the material of the substrate 201 in this embodiment is preferably SiO₂。

The interdigital transducer 202 is provided on the base 201, and has an input section 2021 and an output section 2022, and a transmission distance d of surface acoustic waves exists between the input section 2021 and the output section 2022. Interdigital transducer 202 is formed by a photolithographic process. The input portion 2021 and the output portion 2022 of the interdigital transducer 202 are respectively an input end and an output end of an electrode of the interdigital transducer 202, and the two electrodes can be formed by Chemical Vapor Deposition (CVD), Physical Vapor Deposition (PVD) sputtering, Physical Vapor Deposition (PVD) evaporation, or the like.

As shown in fig. 3, the antenna 203 is connected to the input portion 2021, and the output portion 2022 is led out to the second flexible circuit board 112b through the second trace 111 b.

As shown in fig. 4, the antenna 203 is connected to the output portion 2022, and the input portion 2021 thereof is led out to the second flexible circuit board 112b through the second trace 111 b.

The embodiment provides an electronic device, wherein the packaging mode of the wires of the surface acoustic wave device is consistent with the packaging mode of the wires of the display driver, the problem of insufficient arrangement space of the electronic device is solved to realize the electronic device with a narrow frame, and the goal of wireless sensing can be realized to increase the added value of the electronic device.

Example 2

As shown in fig. 5, the present embodiment provides an electronic apparatus, which is a display apparatus 100, the display apparatus 100 having a display area 101 and a non-display area 102 surrounding the display area 101.

As shown in fig. 2, the display apparatus 100 further includes a substrate 103, a plurality of surface acoustic wave devices 200 integrated on the substrate 103 and integrated in the display area 101, wherein a distance L between two adjacent surface acoustic wave devices 200 is 1-2mm, and the surface acoustic wave devices 200 prevent the plurality of surface acoustic wave devices 200 from interfering with each other when receiving or transmitting electromagnetic signals of different wave bands. In this embodiment, the substrate 103 is a flexible substrate.

Specifically, as shown in fig. 5, the display device 100 further includes a first trace 111a, a second trace 111b, a first flexible circuit board 112a (fpc), a second flexible circuit board 112b (fpc), a first chip 113a, and a second chip 113 b.

Specifically, the first chip 113a and the second chip 113b are disposed in the non-display region 102 at an interval, and the first chip 113a and the second chip 113b are directly disposed in the non-display region 102 of the substrate and bent to the back of the substrate 103. The first chip 113a is a touch chip, a driving chip, and the like, and the second chip 113b is a driving chip for driving the surface acoustic wave device 200 to work.

The plurality of first traces 111a and the plurality of second traces 111b are disposed in the non-display area 102 on the substrate 103 at intervals, the first traces 111a are led out from the first chip 113a, and the second traces 111b are led out from the second chip 113 b.

The first flexible circuit board 112a and the second flexible circuit board 112b are disposed in the non-display area 102 at intervals, the first flexible circuit board 112a is connected to a portion of the first trace 111a, and the second flexible circuit board 112b is connected to a portion of the second trace 111 b. When the substrate 103 is not bent, the first chip 113a is located between the first flexible circuit board 112a and the display area 101, and the second chip 113b is located between the second flexible circuit board 112b and the display area 101. The surface acoustic wave device 200 is connected to the second chip 113b through the second wire 111 b.

In this embodiment, the COP package technology may be regarded as a perfect package solution specially tailored for the flexible display device, that is, the substrate 103 is a flexible substrate, such as polyimide, and the traces and chips may be completely wound around the rear end of the substrate 103 (i.e., the back surface of the substrate).

As shown in fig. 4, the antenna 203 is connected to the output portion 2022, and the input portion 2021 thereof is connected to the second flexible circuit board 112 b.

The present embodiment provides an electronic device, which is different from embodiment 1 in that the present embodiment packages a circuit in a non-display area through a COP process, and embodiment 1 packages a circuit in a non-display area through a COF process, and both of the two packaging manners are to implement an electronic device with an ultra-narrow frame. Therefore, embodiments of the present invention include these two packaging methods but are not limited to other packaging methods.

Example 3

This embodiment provides an electronic device, including all the technical solutions of embodiment 1 or embodiment 2, and its difference is that the electronic device further includes a specific structure of the display device.

As shown in fig. 6, the present embodiment provides an electronic device, which is a display device, and the display device is a micro LED display device 100 a.

The micro LED display device 100a includes an array substrate and a color filter substrate, wherein the substrate 103 in embodiment 1 or embodiment 2 is the array substrate of this embodiment, and the surface acoustic wave device 200 is disposed on a lower surface of the array substrate. The array substrate comprises a plurality of thin film transistors, and each thin film transistor comprises an active layer, a grid electrode, a source electrode, a drain electrode, a scanning line, a data line, an interlayer insulating layer and the like. The color film substrate 104 comprises a black matrix 21a and a plurality of micro LEDs 21b, the micro LEDs 21b comprise red micro LED devices, green micro LED devices and blue micro LED devices, the micro LED devices are directly installed on the array substrate, and the size of each micro LED device is smaller than 100 um.

The micro LED display device 100a further includes an encapsulation layer 105 that can completely cover the micro LEDs 21b to block moisture and oxygen and protect the micro LEDs 21 b. The encapsulation layer 105 generally comprises an organic encapsulation layer and an inorganic encapsulation layer, and the inorganic encapsulation layer has good barrier property to water vapor and oxygen; the existence of the organic packaging layer can ensure that the surface flatness of the device is better, which is beneficial to the formation of a subsequent inorganic packaging layer, and meanwhile, the bending resistance of the organic packaging layer is better.

In this embodiment, the surface acoustic wave device 200 includes a base 201, an interdigital transducer 202, and a protective layer 203. The protective layer 203 is disposed on a surface of the interdigital transducer 202 away from the substrate 201. The material of the protection layer 203 is silicon oxide, and the thickness thereof is 30-50 nm. The protection layer 203 is used to prevent the metal electrode of the interdigital transducer 202 from being oxidized, which affects the etching and damage of the metal electrode in the subsequent manufacturing process of other parts of the micro LED display device and the exposure and oxidation of the metal electrode, which affects the conductivity of the interdigital transducer 202.

In this embodiment, the trace of the surface acoustic wave device is led out from the back surface of the array substrate (i.e., from the lower side of the array substrate), and the display driving trace is led out from the front surface of the array substrate, so that the trace of the surface acoustic wave device and the display driving trace follow the principle of non-overlapping in space, thereby solving the problem of insufficient arrangement space of electronic equipment. It should be noted that the display driving traces refer to traces such as scan lines and data lines.

The micro LED display device of this embodiment may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

The embodiment provides an electronic device, wherein a surface acoustic wave device is arranged in a display panel, so that on one hand, the goal of wireless sensing can be achieved, and the additional value of the electronic device is increased; on the other hand, the problem of insufficient arrangement space of the electronic equipment is solved, and good economic benefit is obtained.

Example 4

The embodiment provides an electronic device, which includes most technical solutions of embodiment 3, and the difference is that the display device is an OLED display device, the OLED display device prepares a quantum dot light-emitting unit in the array substrate to replace a micro LED, where the quantum dot light-emitting unit includes a red quantum dot light-emitting unit, a green quantum dot light-emitting unit, and a blue quantum dot light-emitting unit. In addition, as for the specific structure of the OLED display device, reference may be made to the structure of the existing OLED display device, which is not described herein again.

This embodiment provides an electronic device, where the trace of the surface acoustic wave device is also led out from the back side of the array substrate (i.e., below the array substrate), and the trace of the display driver is led out from the front side of the array substrate, so that the trace of the surface acoustic wave device and the trace of the display driver follow a non-overlapping principle in space. It should be noted that the display driving traces refer to traces such as scan lines and data lines.

The OLED display device of this embodiment may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

Example 5

As shown in fig. 7, the present embodiment provides an electronic apparatus, which is a display apparatus, and the display apparatus is a mini LED display apparatus 100 b.

The mini LED display device 100b includes a backlight module, a first polarizer 106, an array substrate 107, a color film substrate 104, a second polarizer 108, and a liquid crystal layer 109. The substrate 103 in embodiment 1 or embodiment 2 is the backlight module in this embodiment, and the surface acoustic wave device is disposed on the lower surface of the back plate.

As shown in fig. 8, the backlight module 103 includes a back plate 103a and a plurality of mini LEDs 103b, wherein a plurality of mini LEDs 103b are arranged on the upper surface of the back plate 103 a. The surface acoustic wave device 200 is provided on the side of the back plate 103a remote from the mini LED103 b.

Specifically, the surface acoustic wave device 200 includes a base 201, an interdigital transducer 202, and a protective layer 203. The protective layer 203 is disposed on a surface of the interdigital transducer 202 away from the substrate 201. The material of the protection layer 203 is silicon oxide, and the thickness thereof is 30-50 nm. The protective layer 203 is used to prevent the metal electrode of the interdigital transducer 202 from being oxidized, which affects the etching and damage of the metal electrode in the subsequent process of manufacturing other parts of the mini LED display device, and the exposure and oxidation of the metal electrode, which affects the conductivity of the interdigital transducer 202.

As shown in fig. 7, the first polarizer 106 and the array substrate 107 are sequentially disposed on the backplane, the array substrate 107 is disposed opposite to the color filter substrate 104, the liquid crystal layer 109 is disposed between the array substrate 107 and the color filter substrate 104, and the second polarizer 108 is disposed on the color filter substrate 104. The array substrate 107 includes a plurality of thin film transistors, each of which includes an active layer, a gate electrode, a source electrode, a drain electrode, a scan line, a data line, and an interlayer insulating layer. The color film substrate 104 includes a black matrix 104a and a plurality of pixel units 104b, where the pixel units include a red sub-pixel unit, a green sub-pixel unit, and a white sub-pixel unit. The black matrix 104a is positioned between any two of the red, green, and white sub-pixel units. The color conversion material of the red sub-pixel unit, the green sub-pixel unit and the white sub-pixel unit can be fluorescent powder or quantum dots. Fluorescent powder or quantum dots are not arranged in the white sub-pixel unit, and blue light directly passes through the white sub-pixel unit to emit blue light.

In this embodiment, the trace of the surface acoustic wave device 200 is led out from the backlight module side (i.e. the back side of the array substrate), and the trace of the display driver is led out from the front side of the array substrate, so that the trace of the surface acoustic wave device 200 and the trace of the display driver spatially follow the principle of non-overlapping, thereby solving the problem of insufficient arrangement space of the electronic device. It should be noted that the display driving traces refer to traces such as scan lines and data lines.

The micro LED display device 100b of the present embodiment may be: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

Example 6

This embodiment provides an electronic device including most of the technical solutions of embodiment 1, and is different in that an interdigital transducer of the saw device is disposed on the same layer as an active layer, and includes a specific structure of the display device.

As shown in fig. 9, the present embodiment provides an electronic apparatus, which is a display apparatus that is a liquid crystal display apparatus 100 c.

The liquid crystal display device 100c includes a substrate structure 301, and the substrate structure 301 includes a glass substrate 3011, a light-shielding layer 3012, a buffer layer 3013, a doped buffer layer 3014, an active layer 3015, and an insulating layer 3016. The light-shielding layer 3012, the buffer layer 3013, the doped buffer layer 3014, and the active layer 3015 are provided in this order on the glass substrate 3011.

The active layer 3015 is LTPS, and its projection on the glass substrate 3011 falls within the projection of the light-shielding layer 3012 on the glass substrate 3011.

The buffer layer 3013 is a silicon nitride compound, preferably made of SiN_XTo block water vapor and oxygen, and improve the water and oxygen blocking capability of the liquid crystal display device 100 c.

The doped buffer layer 3014 is made of silicon oxide, and the material thereof is preferably SiO₂。

The surface acoustic wave device 200 includes a base body, an interdigital transducer, and a protective layer. In this embodiment, the doped buffer layer 3014 serves as a substrate of the saw device 200, the interdigital transducer 202 and the active layer 3015 are disposed on the same layer, and the insulating layer 3016 serves as a protective layer of the saw device 200. The insulating layer 3016 is disposed on the active layer 3015 and the interdigital transducer 202, and is made of silicon oxide with a thickness of 30-50 nm. The insulating layer 3016 is used to prevent the metal electrode of the interdigital transducer 202 from being oxidized, which may affect the etching damage of the metal electrode in the subsequent process of manufacturing other parts of the liquid crystal display device 100c and the exposure of the metal electrode to be oxidized, which may affect the conductivity of the interdigital transducer 202.

The liquid crystal display device 100c further includes a gate 302, a first dielectric layer 303, a source/drain 304, a planarization layer 305, a second dielectric layer 306a, a third dielectric layer 306b, an anode layer 307, a passivation layer 308, a cathode layer 309, a liquid crystal layer 401, and a color filter substrate 402. The gate 302 is disposed on the substrate structure 301 and opposite the active layer 3015. The first dielectric layer 303 is disposed on the gate electrode 302, and the source/drain electrode 304 penetrates the first dielectric layer 303 and is connected to the active layer or the gate line of the gate electrode layer. A planarization layer 305, a second dielectric layer 306a, an anode layer 307, and a passivation layer 308 are sequentially disposed on the source/drain 304. A cathode layer 309 is disposed on the passivation layer 308 and connected to the source and drain electrodes 304 by vias. The substrate structure 301, the gate 302, the first dielectric layer 303, the source/drain 304, the planarization layer 305, the second dielectric layer 306a, the third dielectric layer 306b, the anode layer 307, the passivation layer 308, and the cathode layer 309 form an array substrate of the liquid crystal display device 100 c. The array substrate and the color film substrate 402 are arranged oppositely, and the liquid crystal layer 401 is arranged between the array substrate and the color film substrate 402. In this embodiment, the metal layer above the substrate structure 301 is a display driving trace of the array substrate, and the metal layer includes a gate 302, a source/drain 304, an anode layer 307, a cathode layer 309, and the like.

The liquid crystal display device 100c of the present embodiment is: any product or component with a display function, such as a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, a navigator and the like.

The present embodiment provides an electronic device, and the interdigital transducer of the surface acoustic wave device and the active layer are disposed on the same layer, so that the surface acoustic wave device is integrated in the electronic device, and the manufacturing process of the surface acoustic wave device and the manufacturing process of the semiconductor (i.e., the active layer) have similarity and commonality, which can increase the integration level and the added value of the electronic device, and provide a cushion for the development of a new display integration technology in the future. Furthermore, the routing of the surface acoustic wave device and the routing of the display driver are located in different layers, and the principle that the routing of the surface acoustic wave device and the routing of the display driver are not overlapped in space is followed, so that the problem that the arrangement space of the electronic equipment is insufficient is solved.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.

The foregoing describes in detail an electronic device provided in an embodiment of the present application, and a specific example is applied to explain the principle and the implementation of the present application, and the description of the foregoing embodiment is only used to help understand the technical solution and the core idea of the present application; those of ordinary skill in the art will understand that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the present disclosure as defined by the appended claims.

Claims

1. An electronic device, wherein the electronic device is a display device having a display area and a non-display area surrounding the display area;

the display device further comprises

And the substrate is arranged on the display area, and the plurality of surface acoustic wave devices are arranged on the substrate.

2. The electronic device of claim 1, wherein the substrate is a non-flexible substrate, the display device further comprising

The first wires and the second wires are arranged on the same side of the non-display area of the substrate at intervals and are bent from the front side of the substrate to the back side of the substrate;

the first chip is arranged on the back surface of the substrate and connected to part of the first routing, and the second chip is arranged on the back surface of the substrate and connected to part of the second routing; and

the first flexible circuit board and the second flexible circuit board are arranged in the non-display area at intervals, the first flexible circuit board is connected with part of the first wires, and the second flexible circuit board is connected with part of the second wires; when the first routing wire and the second routing wire are not bent, the first flexible circuit board is positioned between the first chip and the display area, and the second flexible circuit board is positioned between the second chip and the display area;

the surface acoustic wave device is connected to the second chip through the second routing.

3. The electronic device of claim 1, wherein the substrate is a flexible substrate, the display device further comprising a first chip and a second chip spaced apart from each other; the first chip and the second chip are directly arranged in a non-display area of the substrate and are bent to the back of the substrate;

the first wirings and the second wirings are arranged on the substrate at intervals, the first wirings are led out from the position of the first chip, and the second wirings are led out from the position of the second chip; and

the first flexible circuit board and the second flexible circuit board are arranged in the non-display area at intervals, the first flexible circuit board is connected with part of the first wires, and the second flexible circuit board is connected with part of the second wires; when the substrate is not bent, the first chip is positioned between the first flexible circuit board and the display area, and the second chip is positioned between the second flexible circuit board and the display area;

4. The electronic device according to claim 2 or 3, wherein the surface acoustic wave device comprises:

a substrate;

the interdigital transducer is arranged on the substrate and is provided with an input part and an output part, and a transmission distance of surface acoustic waves is reserved between the input part and the output part; and

an antenna connected to the input unit or the output unit;

the SAW device is integrated in the display area, and the input portion or the output portion of the SAW device is led out to the second chip through the second routing wire.

5. Electronic device according to claim 1, characterized in that it comprises a micro LED display device, a mini LED display device, an OLED display device, a liquid crystal display device.

6. The electronic device of claim 4,

when the display device is a micro LED display device or an OLED display device, the substrate is an array substrate;

the surface acoustic wave device further includes

And the protective layer is arranged on one surface of the interdigital transducer, which is far away from the substrate.

7. The electronic device of claim 4,

when the display equipment is mini LED display equipment, the substrate is a backlight module, and the mini LED display equipment further comprises

A back plate;

a plurality of mini LED arrays are arranged on the back plate;

the surface acoustic wave device is arranged on one surface of the back plate, which is far away from the mini LED;

the surface acoustic wave device further includes

8. The electronic device of claim 6 or 7,

the protective layer is made of silicon oxide and has a thickness of 30-50 nm.

9. The electronic device of claim 4,

when the display device is a liquid crystal display device, the substrate is a substrate structure of the liquid crystal display device, the substrate structure comprises

A glass substrate;

a light shielding layer disposed on the glass substrate;

a buffer layer disposed on the light-shielding layer;

the doped buffer layer is arranged on the buffer layer;

the active layer is arranged on the doped buffer layer, and the projection of the active layer on the glass substrate falls into the projection of the light shielding layer on the glass substrate; and

the insulating layer is arranged on the active layer and the interdigital transducer;

the doped buffer layer is a substrate of the surface acoustic wave device, and the interdigital transducer and the active layer are arranged on the same layer.

10. The electronic device of claim 1,

the surface acoustic wave devices are arranged on the substrate in an array mode, and the distance between every two adjacent surface acoustic wave devices is 1-2 mm.