CN110117374A - 液晶聚合物薄膜及具有液晶聚合物薄膜的软性铜箔基板的制造方法 - Google Patents
液晶聚合物薄膜及具有液晶聚合物薄膜的软性铜箔基板的制造方法 Download PDFInfo
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- CN110117374A CN110117374A CN201810895645.4A CN201810895645A CN110117374A CN 110117374 A CN110117374 A CN 110117374A CN 201810895645 A CN201810895645 A CN 201810895645A CN 110117374 A CN110117374 A CN 110117374A
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- liquid crystal
- crystal polymer
- temperature
- polymer film
- powder
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Classifications
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- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
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Abstract
本发明是有关于一种液晶聚合物薄膜的制造方法以及一种具有液晶聚合物薄膜的软性铜箔基板的制造方法。本发明的液晶聚合物薄膜的制造方法包含以下操作:提供一液晶聚合物粉体;将液晶聚合物粉体均匀分散于溶剂中,以形成混和物溶液;将混和物溶液涂布于承载板上,以形成涂层;加热至第一温度,以蒸干涂层中的溶剂;溶剂蒸干后,加热至第二温度,使液晶聚合物粉体熔融成液晶聚合物薄膜。藉由此方法形成的液晶聚合物薄膜具有优异的尺寸安定性。
Description
技术领域
本发明是有关于一种液晶聚合物薄膜的制造方法以及一种具有液晶聚合物薄膜的软性铜箔基板的制造方法。
背景技术
现今的移动装置(mobile device),例如智能手机(smart phone)、平板电脑(tablet computer)以及笔记型电脑(laptop),所使用的中央处理器(Central ProcessingUnit,CPU)的时脉(clock rate)大多在千兆赫兹(gigahertz,GHz)以上,以至于目前的移动装置须要采用高频电路来配合上述千兆赫兹时脉的中央处理器,而为了满足高频电路的需求,现有移动装置需要减少阻容延迟(RCdelay)所产生的不良影响。
由于作为介电材料的液晶聚合物(Liquid Crystal Polymer,LCP)薄膜所具有的介电系数或介电损耗正切的物性在高频区域中是非常稳定,又,吸水率较低,故可应用于高频电路基板或高速传输线用电路中。然而,目前市售的液晶聚合物(liquid-crystallinepolymers)除了昂贵的氟化试剂(fluorinated reagents)外,不能溶解在常见的有机溶剂中。因此,业界制造液晶聚合物薄膜是先将其熔融后,再以例如射出模制、挤压模制、膨胀模制(inflation molding)或吹气模制的方法来制造。但是,由于LCP的分子在排列上具有特定的方向性,因此,上述制造方法所形成的液晶聚合物薄膜内的分子排列是具有高度的同向性,因此薄膜容易因外应力而剥离(peeling)或碎裂(crack)。
发明内容
本发明提供一种液晶聚合物薄膜的制造方法。此方法包含以下操作:首先,提供一液晶聚合物粉体;将液晶聚合物粉体均匀分散于溶剂中,以形成混和物溶液;将混和物溶液涂布于承载板上,以形成涂层;加热至第一温度,以蒸干涂层中的溶剂;以及在蒸干溶剂后,加热至第二温度,使液晶聚合物粉体熔融成液晶聚合物薄膜。
根据本发明一实施方式,在将液晶聚合物粉体均匀分散于溶剂的操作中,更包含添加一分散剂和/或一添加剂。
根据本发明一实施方式,第二温度至少高于液晶聚合物粉体的液晶态转变(LCTransition)温度。
根据本发明一实施方式,第二温度高于第一温度。
根据本发明一实施方式,液晶聚合物粉体的平均粒径介于1纳米至1000微米之间。
根据本发明一实施方式,液晶聚合物薄膜的厚度介于1微米至2000微米之间。
本发明的另一态样是提供一种具有液晶聚合物薄膜的软性铜箔基板的制造方法。此方法包含以下操作:首先,提供一液晶聚合物粉体;将液晶聚合物粉体均匀分散于溶剂中,以形成混和物溶液;将混和物溶液涂布于第一铜箔上,以形成涂层;加热至第一温度,以蒸干涂层中的溶剂;以及在蒸干溶剂后,加热至第二温度,使液晶聚合物粉体熔融成液晶聚合物薄膜在第一铜箔上。
根据本发明一实施方式,第二温度至少高于液晶聚合物粉体的液晶态转变(LCTransition)温度。
根据本发明一实施方式,第二温度高于第一温度。
根据本发明一实施方式,在使液晶聚合物粉体熔融成液晶聚合物薄膜的操作后,更包含加热至第三温度,接合第二铜箔于液晶聚合物薄膜上,使得液晶聚合物薄膜夹置于第一铜箔与第二铜箔之间。
根据本发明一实施方式,第三温度介于液晶聚合物粉体的玻璃化转变温度(Tg)与熔点(Tm)之间。
根据本发明一实施方式,液晶聚合物粉体的平均粒径介于1纳米至1000微米之间。
根据本发明一实施方式,液晶聚合物薄膜的厚度介于1微米至2000微米之间。
附图说明
为让本发明的上述和其他目的、特征、优点与实施方式能更明显易懂,所附附图的详细说明如下:
图1绘示本发明一实施方式的液晶聚合物薄膜的制造方法的流程图;
图2绘示本发明一实施方式的具有液晶聚合物薄膜的软性铜箔基板的制造方法的流程图;
其中,符号说明:
10、20:方法
S11~S15:操作
S21~S25:操作。
具体实施方式
除非内容中有其他清楚的指称,本文所使用的单数词包含复数的指称对象。通过参考「一实施方式」这样特定的指称,在至少其中之一的本案发明的实施方式中,表示一种特定的特征、结构或特色,因此在各处的「在一实施方式」,这样的片语通过特别的指称出现时,并不需要参考相同的实施方式,更进一步,在一或多实施方式中,这些特别的特征、结构、或特色可以依合适的情况相互组合。
在以下描述中,将详细叙述许多特定细节以使读者能够充分理解以下的实施例。然而,可在无此等特定细节的情况下实践本发明的实施例。
本发明的一态样是提供一种液晶聚合物薄膜的制造方法,相较于传统的介电层,藉由此制造方法所得到的液晶聚合物薄膜具有较低的吸水率、介电常数、损失系数、热膨胀系数(CTE)以及较优异的尺寸安定性、电气性、阻气性、热传导率等优势。图1绘示本发明一实施方式的液晶聚合物薄膜的制造方法10的流程图。如图1所示,方法10包含步骤S11至步骤S15。
首先,在步骤S11中,提供液晶聚合物粉体(powder)。在某些实施例中,例如可使用研磨方式将液晶聚合物研磨成粉体(powder),但不以为限。在某些实施方式中,粉体的平均粒径范围可介于1nm(纳米)至1000μm(微米)之间,例如可为5nm、10nm、15nm、20nm、30nm、50nm、70nm、90nm、100nm、1μm、5μm、10μm、15μm、20μm、50μm、100μm、200μm、300μm、400μm、500μm、600μm、700μm、800μm或900μm。需说明的是,本发明所使用的液晶聚合物为热致型(Thermotropic)液晶聚合物树脂,且热致型液晶聚合物树脂可依据分子量大小区分为液晶高分子(Polymer)树脂和液晶寡聚物(Oligomer)树脂。在一些实施方式中,可以使用液晶高分子树脂和/或液晶寡聚物树脂进行研磨以形成液晶聚合物粉体。在某些实施方式中,市售液晶聚合物包含以下三种类型:1.第一型液晶聚合物树脂为高耐热型,其液晶态转变(LCTransition)温度大于约330℃。第一型的液晶聚合物树脂具有很高的拉伸强度和弹性模量,耐化学腐蚀性能好,适用于要求高温性能的场合,但其加工性能略差。2.第二型液晶聚合物树脂为中耐热型,其液晶态转变温度介于约280℃至约320℃。第二型的液晶聚合物树脂具有耐化学腐蚀性和水解稳定性,其电气性及阻燃性都很优异,并具有很强的防渗性,综合性能较佳。3.第三型液晶聚合物树脂为低耐热型,其液晶态转变温度小于约240℃。第三型的液晶聚合物树脂耐热性能略差,但加工性好,价格低。值得注意的是,液晶态转变(LCTransition)温度为热致型液晶聚合物树脂于加热状态下由固态转变为液晶态的某一特定温度。可以理解的是,不同类型的热致型液晶聚合物树脂依据其单体结构的不同而具有不同的液晶态转变温度。
在一实施例中,高耐热型的液晶聚合物树脂包含由对羟基苯甲酸(p-Hydroxybenzoic Acid,又称HBA)、对苯二甲酸(Terephthalic Acid,又称TA)以及4,4’二氧基联苯酚(4,4'-dioxydiphenol,又称DODP)所组成的液晶聚合物树脂。举例来说,市售名称的液晶聚合物树脂具有重复单元结构如下:
在另一实施例中,中耐热型的液晶聚合物树脂包含由对羟基苯甲酸(p-Hydroxybenzoic Acid,又称HBA)以及6-羟基-2-萘甲酸(6-Hydroxy-2-naphthoic Acid,又称HNA)所组成的液晶聚合物树脂。举例来说,市售名称的液晶聚合物树脂具有重复单元结构如下:
在又一实施例中,低耐热型的液晶聚合物树脂包含由聚对苯二甲酸(Polyethylene Terephthalate,又称PET)以及对羟基苯甲酸(p-Hydroxybenzoic Acid,又称HBA)所组成的液晶聚合物树脂。举例来说,市售名称的液晶聚合物树脂具有重复单元结构如下:
接着,在步骤S12中,将上述研磨后的液晶聚合物粉体均匀分散于溶剂中以形成混和物溶液。在些实施方式中,液晶聚合物粉体与溶剂的比值(液晶聚合物粉体/溶剂)可介于1/100至90/100之间,例如10/100至80/100之间、20/100至70/100之间、30/100至60/100之间或40/100至50/100之间。值得注意的是,研磨后的液晶聚合物粉体是不溶或微溶在溶剂中。由于液晶聚合物本身的特性,其在溶剂中具有极佳的分散性。更具体的说,液晶聚合物粉体是悬浮分散于溶剂中而不沉淀。在某些实施方式中,溶剂可包含极性溶剂或非极性溶剂。举例来说,溶剂可以为酰胺(Amide)类溶剂、酸(Acid)类溶剂、醇(Alcohol)类溶剂、酮类溶剂、芳香族(Aromatic)溶剂或水。
在一实施例中,酰胺类溶剂包含N,N-二甲基乙酰胺(N,N-dimethylacetamide,又称DMAC)、六甲基磷酰三胺(Hexamethylphosphoramide,又称HMPA)、N-甲基吡咯烷酮(N-methylpyrrolidone,又称NMP)、N,N,N',N'-四甲基脲(N,N,N’,N’-tetramethylurea)、甲基己内酰胺(N-methylcaprolactam)、N-乙酰基吡咯烷酮(N-acetylpyrrolidone)、N,N-二甲基丙酰胺(N,N-dimethylpropionamide)、N-甲基哌啶酮(N-methylpiperidone)、1,3-二甲基-2-咪唑啉酮(1,3-Dimethylimidazolidinone)、N,N,N',N'-四甲基丙二酰胺(N,N,N’,N’-tetramethylmalonamide)、二甲基甲酰胺(Dimethylformamide,又称DMF),但不以为限。
在另一实施例中,酸类溶剂包含硫酸(Sulphuric Acid)、氢氟酸(HydrofluoricAcid)、三氟甲烷磺酸(Trifluoromethanesulphonic acid)、三氟乙酸(Trifluoroaceticacid,又称TFA)、三氟乙酸/二氯甲烷的混合溶液(TFA/methylene chloride)、三氟乙酸/二氯甲烷/四氯乙烯的混合溶液(TFA/DCTFAH/methylene chloride/perchloroethylene)及氯磺酸(Chlorosulphonic Acid),但不以为限。
在又一实施例中,酮类溶剂包含环己酮(Cyclohexanone)及丁酮(Methyl EthylKetone,又称MEK),但不以为限。
在又一实施例中,芳香族溶剂包含甲苯(Methylbenzene)、二甲苯(Dimethylbenzene)、对氯苯酚(p-Chlorophenol)、对氯苯酚/四氯乙烷的混合溶液(p-Chlorophenol/tetrachloroethane)、邻二氯苯/对氯苯酚的混合溶液(o-Dichlorobenzene/p-chlorophenol)、苯酚/四氯乙烷/对氯苯酚的混合溶液(Phenol/tetrachloroethane/p-chlorophenol)、苯酚/四氯乙烷的混合溶液(Phenol/tetrachloroethane)、苯酚/三氯甲烷的混合溶液(Phenol/chloroform)、甲酚(m-Cresol)、邻氯苯酚(o-Chlorophenol)、五氟苯酚(Pentafluorophenol)以及对氟苯酚(p-Fluorophenol),但不以为限。
在又一实施例中,醇类溶剂包含六氟异丙醇(Hexafluoroisopropanol),但不以为限。
在其他实施例中,溶剂还包含1,3-二氯-1,1,3,3-四氟丙酮水合物(1,3-Dichloro-1,1,3,3-tetrafluoroacetone hydrate,又称DCTFAH)、DCTFAH/四氯乙烯的混合溶液(DCTFAH/perchloroethylene)、四氯乙烷(Tetrachloroethane)以及二恶烷(Dioxane),但不以为限。
在其他某些实施方式中,可在混和物溶液中选择性地加入不同的添加剂,以对后续生成的液晶聚合物薄膜进行改质,而使之具有某些特性,进而符合所适用的产品的需求。在一些实施例中,添加剂可为安定剂、润滑剂、填充剂、着色剂、硬化剂、塑化剂和/或抗氧化剂,但不以为限。在一实施例中,可以添加经过表面处理的聚四氟乙烯(Polytetrafluoroethylene,又称PTFE)作为添加剂,以提高后续生成的液晶聚合物薄膜的电性,也可以使其介电常数(Dielectric constant,又称Dk)和介质损耗(DissipationFactor,又称Df)降得更低。
在传统LCP薄膜制造方法中,在固定熔融温度下,液晶聚合物即使都成熔融状态,具有不同分子量的液晶聚合物的流变性并不一致,这会导致获取具有均匀厚度的液晶聚合物薄膜变得非常困难。因此,若还要在传统直接对液晶聚合物熔融加工的制造方法中,额外加入添加剂,如聚四氟乙烯,熔融状态的液晶聚合物的流变性会更难控制,进而使成膜之后的液晶聚合物薄膜的品质降低。所以,业界均知在传统制造方法中是不可能加入添加剂来达成LCP薄膜改质的目的。
在其他某些实施方式中,还可以在混和物溶液中选择性地加入分散剂,以利液晶聚合物粉体更均匀且稳定地分散于溶剂中避免液晶聚合物粉体聚集(aggregate)。在一实施例中,分散剂可为甲基丙烯酸磷酸酯(MMP)、三硬脂酸甘油酯或羟丙基甲基纤维素,但不以为限。
在步骤S13中,将上述混和物溶液涂布于承载板上形成一涂层。在一些实施方式中,涂层的厚度可介于10μm(微米)至20000μm之间,例如可为100μm、500μm、1000μm、3000μm、5000μm、7000μm、9000μm、10000μm、13000μm或15000μm。更具体的说,将混和物溶液可经由一狭缝均匀地涂布,例如喷涂,在承载板上。在某些实施方式中,承载板可例如为钢板、陶瓷基板、铜箔和/或金属板,但不以为限。
然后,在步骤S14中,加热至第一温度,将涂层中的溶剂蒸干。可以理解的是,根据选用的溶剂类型,适当地调整第一温度(即参考溶剂的沸点进行调整和选择),以蒸干涂层中的溶剂。在此需说明的是,所选用的液晶聚合物粉体的液晶态转变温度必须高于其搭配的溶剂的沸点温度,以在蒸干溶剂的操作之后,使得承载板上残留均匀分散的液晶聚合物粉体。
在步骤S15中,在蒸干溶剂之后,继续加热至第二温度,使液晶聚合物粉体熔融成液晶聚合物薄膜。在此需说明的是,当固态的液晶聚合物加热至玻璃化转变温度(Tg)时,液晶聚合物的内部分子链开始做局部运动。当温度由玻璃化转变温度继续升温至液晶态转变(LC Transition)温度时,液晶聚合物开始转变成为既有双折射性又有流动性的液晶态,处于液晶态的液晶聚合物的内部分子排列仍具有如晶体结构的方向性。当温度由液晶态转变温度继续升温至熔点(Tm),液晶态的液晶聚合物又转变成为各向同性的液态,此时的液晶聚合物的内部分子如同液体一样随机排列且杂乱无章的。在某些实施方式中,此第二温度至少需高于液晶聚合物的液晶态转变(LC Transition)温度;可以介于液晶态转变(LCTransition)温度与熔点(Tm)之间;亦可以高于熔点(Tm)。
在一些实施方式中,将液晶聚合物薄膜缓慢降温以冷却成型此液晶聚合物薄膜。在某些实施方式中,冷却成型后的液晶聚合物薄膜的厚度可介于1μm(微米)至2000μm之间,例如可为10μm、50μm、100μm、300μm、500μm、700μm、900μm、1000μm、1300μm或1500μm。在其他实施方式中,使成型后的液晶聚合物薄膜从承载板上移除,并收集成卷。
本发明的另一态样是提供一种具有液晶聚合物薄膜的软性铜箔基板的制造方法。图2绘示本发明一实施方式的具有液晶聚合物薄膜的软性铜箔基板的制造方法20的流程图。如图2所示,方法20包含步骤S21至步骤S25。
首先,在步骤S21中,提供液晶聚合物粉体(powder)。在某些实施例中,例如可使用研磨方式将液晶聚合物研磨成粉体(powder),但不以为限。在某些实施方式中,粉体的粒径范围可介于1nm(纳米)至1000μm(微米)之间,例如可为5nm、10nm、15nm、20nm、30nm、50nm、70nm、90nm、100nm、1μm、5μm、10μm、15μm、20μm、50μm、100μm、200μm、300μm、400μm、500μm、600μm、700μm、800μm或900μm。需说明的是,本发明所使用的液晶聚合物为热致型(Thermotropic)液晶聚合物树脂,且热致型液晶聚合物树脂可依据分子量区分为液晶高分子(Polymer)树脂和液晶寡聚物(Oligomer)树脂。在一些实施方式中,可以使用液晶高分子树脂和/或液晶寡聚物树脂进行研磨以形成液晶聚合物粉体。在某些实施方式中,市售液晶聚合物包含以下三种类型:1.第一型液晶聚合物树脂为高耐热型,其液晶态转变(LCTransition)温度大于约330℃。第一型的液晶聚合物树脂具有很高的拉伸强度和弹性模量,耐化学腐蚀性能好,适用于要求高温性能的场合,但其加工性能略差。2.第二型液晶聚合物树脂为中耐热型,其液晶态转变温度介于约280℃至约320℃。第二型的液晶聚合物树脂具有耐化学腐蚀性和水解稳定性,其电气性及阻燃性都很优异,并具有很强的防渗性,综合性能较好。3.第三型液晶聚合物树脂为低耐热型,其液晶态转变温度小于约240℃。第三型的液晶聚合物树脂耐热性能略差,但加工性好,价格低。值得注意的是,液晶态转变(LCTransition)温度为液晶聚合物树脂于加热状态下由固态转变为液晶态的某一特定温度。可以理解的是,不同类型的液晶聚合物树脂依据其单体结构的不同而具有不同的液晶态转变温度。以上三种类型的液晶聚合物树脂的实施例已详述于上文,故于此不再赘述。
接着,在步骤S22中,将上述研磨后的液晶聚合物粉体均匀分散于溶剂中以形成混和物溶液。在些实施方式中,液晶聚合物粉体与溶剂的比值(液晶聚合物粉体/溶剂)可介于1/100至90/100之间,例如10/100至80/100之间、20/100至70/100之间、30/100至60/100之间或40/100至50/100之间。值得注意的是,研磨后的液晶聚合物粉体是不溶或微溶在溶剂中。由于液晶聚合物本身的特性,其在溶剂中具有极佳的分散性。更具体的说,液晶聚合物粉体是悬浮分散于溶剂中而不沉淀。在某些实施方式中,溶剂可包含极性溶剂或非极性溶剂。举例来说,溶剂可以为酰胺(Amide)类溶剂、酸(Acid)类溶剂、醇(Alcohol)类溶剂、酮类溶剂、芳香族(Aromatic)溶剂或水。以上各种溶剂的实施例已详述于上文,故于此不再赘述。
在其他某些实施方式中,可在混和物溶液中选择性地加入不同的添加剂,以对后续生成的液晶聚合物薄膜进行改质,而使之具有某些特性,进而符合所适用的产品的需求。在一些实施例中,添加剂可为安定剂、润滑剂、填充剂、着色剂、硬化剂、塑化剂和/或抗氧化剂,但不以为限。在一实施例中,可以添加经过表面处理的聚四氟乙烯(Polytetrafluoroethylene,又称PTFE)作为添加剂,以提高后续生成的液晶聚合物薄膜的电性,也可以使其介电常数(Dielectric constant,又称Dk)和介质损耗(DissipationFactor,又称Df)降得更低。
在传统LCP薄膜制造方法中,在固定融溶温度下,液晶聚合物即使都成熔融状态,具有不同分子量的液晶聚合物的流变性并不一致,这会导致获取具有均匀厚度的液晶聚合物薄膜变得非常困难。因此,若还要在传统直接对液晶聚合物粉体熔融加工的制造方法中,额外加入添加剂,如聚四氟乙烯,熔融状态的液晶聚合物的流变性会更难控制,进而使成膜之后的液晶聚合物薄膜的品质降低。所以,业界均知在传统制造方法中是不可能加入添加剂来达成LCP薄膜改质的目的。
在其他某些实施方式中,还可以在混和物溶液中选择性地加入分散剂,以利液晶聚合物粉体更均匀且稳定地分散于溶剂中避免液晶聚合物粉体聚集(aggregate)。在一实施例中,分散剂可为甲基丙烯酸磷酸酯(MMP)、三硬脂酸甘油酯或羟丙基甲基纤维素,但不以为限。
在步骤S23中,将上述混和物溶液涂布于第一铜箔上形成一涂层。在一些实施方式中,涂层的厚度可介于10微米至20000微米之间,例如可为100μm、500μm、1000μm、3000μm、5000μm、7000μm、9000μm、10000μm、13000μm或15000μm。更具体的说,将混和物溶液可经由一狭缝均匀地涂布,例如喷涂,在第一铜箔上。
然后,在步骤S24中,加热至第一温度,将涂层中的溶剂蒸干。可以理解的是,根据选用的溶剂类型,适当地调整第一温度(即参考溶剂的沸点进行调整和选择),以蒸干涂层中的溶剂。在此需说明的是,所选用的液晶聚合物粉体的液晶态转变温度必须高于其搭配的溶剂的沸点温度,以在蒸干溶剂的操作之后,使得承载板上残留均匀分散的液晶聚合物粉体。
在步骤S25中,在蒸干溶剂之后,继续加热至第二温度,使液晶聚合物粉体熔融成液晶聚合物薄膜。在此需说明的是,当固态的液晶聚合物加热至玻璃化转变温度(Tg)时,液晶聚合物的内部分子链开始做局部运动。当温度由玻璃化转变温度继续升温至液晶态转变(LC Transition)温度时,液晶聚合物开始转变成为既有双折射性又有流动性的液晶态,处于液晶态的液晶聚合物的内部分子排列仍具有如晶体结构的方向性。当温度由液晶态转变温度继续升温至熔点(Tm),液晶态的液晶聚合物又转变成为各向同性的液态,此时的液晶聚合物的内部分子如同液体一样随机排列且杂乱无章的。在某些实施方式中,此第二温度至少须高于是介于液晶聚合物的液晶态转变(LC Transition)温度;可以介于液晶态转变(LC Transition)温度与熔点(Tm)之间;亦可以高于熔点(Tm)。
在某些实施方式中,将液晶聚合物薄膜缓慢降温以冷却成型此液晶聚合物薄膜。在某些实施方式中,冷却成型后的液晶聚合物薄膜的厚度可介于1μm(微米)至2000之间,例如可为10μm、50μm、100μm、300μm、500μm、700μm、900μm、1000μm、1300μm或1500μm。于此,即可形成单面的软性铜箔基板(Single-side Flexible Copper Clad Laminate)。
在另一变化实施方式中,将上述单面软性铜箔基板加热至第三温度,并接合一第二铜箔于单面软性铜箔基板的液晶聚合物薄膜上,使得液晶聚合物薄膜夹置于第一铜箔与第二铜箔之间。更详细的说,此第三温度至少需高于液晶聚合物的玻璃转化温度(Tg);可以介于玻璃转化温度(Tg)至熔点(Tm)之间;亦可以介于液晶态转变(LC Transition)温度与熔点(Tm)之间。在某些实施例中,加热至液晶聚合物的玻璃转化温度以上,可以使液晶聚合物薄膜的表面软化,而更容易与第二铜箔接合。于此,即可形成双面的软性铜箔基板(Double-sides Flexible Copper Clad Laminate)。
在又一变化实施方式中,在液晶聚合物薄膜尚未降温成型之前,温度仍维持在第二温度(至少高于液晶聚合物的液晶态转变温度)时,直接贴合第二铜箔于液晶聚合物薄膜上,使得液晶聚合物薄膜夹置于第一铜箔与第二铜箔之间。于此,亦可形成双面的软性铜箔基板(Double-sides Flexible Copper Clad Laminate)。
相较于传统的聚酰亚胺(PI)薄膜,藉由本发明揭露的液晶聚合物薄膜的制造方法所形成的液晶聚合物薄膜,其具有更低的吸水率、介电常数、损失系数、热膨胀系数(CTE)以及较优异的尺寸安定性、电气性、阻气性、热传导率,另外还具有耐酸、耐碱及耐化学药品性。因此,液晶聚合物薄膜极适合加工应用于高频通信等构装产品。具有液晶聚合物薄膜的软性铜箔基板可较佳地应用于电脑及周边设备、通讯产品、数码相机、消费性电子产品、汽车、军事等领域。
虽然本发明已以实施方式揭露如上,以上所述仅为本发明的较佳实施方式,并非用以限定本发明,任何熟习此技艺者,在不脱离本发明的精神和范围内,当可作各种的均等变化与修饰,皆应属本发明的涵盖范围,因此本发明的保护范围当视后附的申请专利范围所界定者为准。
Claims (13)
1.一种液晶聚合物薄膜的制造方法,其特征在于,包含以下操作:
提供液晶聚合物粉体;
将该液晶聚合物粉体均匀分散于溶剂中,以形成混和物溶液;
将该混和物溶液涂布于承载板上,以形成涂层;
加热至第一温度,以蒸干该涂层中的该溶剂;以及
蒸干该溶剂后,加热至第二温度,使该液晶聚合物粉体熔融成液晶聚合物薄膜。
2.如权利要求1所述的制造方法,其特征在于,其中在将该液晶聚合物粉体均匀分散于溶剂的操作中,更包含添加分散剂和/或添加剂。
3.如权利要求1所述的制造方法,其特征在于,其中该第二温度至少高于该液晶聚合物粉体的液晶态转变(LC Transition)温度。
4.如权利要求1所述的制造方法,其特征在于,其中该第二温度高于该第一温度。
5.如权利要求1所述的制造方法,其特征在于,其中该液晶聚合物粉体的平均粒径介于1纳米至1000微米之间。
6.如权利要求1所述的制造方法,其特征在于,其中该液晶聚合物薄膜的厚度介于1微米至2000微米之间。
7.一种具有液晶聚合物薄膜的软性铜箔基板的制造方法,其特征在于,包含以下操作:
提供液晶聚合物粉体;
将该液晶聚合物粉体均匀分散于溶剂中,以形成混和物溶液;
将该混和物溶液涂布于第一铜箔上,以形成涂层;
加热至第一温度,以蒸干该涂层中的该溶剂;以及
在蒸干该溶剂后,加热至第二温度,使该液晶聚合物粉体熔融成一液晶聚合物薄膜在该第一铜箔上。
8.如权利要求7所述的制造方法,其特征在于,其中该第二温度至少高于该液晶聚合物粉体的液晶态转变(LC Transition)温度。
9.如权利要求8所述的制造方法,其特征在于,其中该第二温度高于该第一温度。
10.如权利要求7所述的制造方法,其特征在于,其中在使该液晶聚合物粉体熔融成该液晶聚合物薄膜的操作后,更包含加热至第三温度,接合第二铜箔于该液晶聚合物薄膜上,使得该液晶聚合物薄膜夹置于该第一铜箔与该第二铜箔之间。
11.如权利要求10所述的制造方法,其特征在于,其中该第三温度介于该液晶聚合物粉体的玻璃化转变温度(Tg)与熔点(Tm)之间。
12.如权利要求7所述的制造方法,其特征在于,其中该液晶聚合物粉体的平均粒径介于1纳米至1000微米之间。
13.如权利要求7所述的制造方法,其特征在于,其中该液晶聚合物薄膜的厚度介于1微米至2000微米之间。
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CN111497173A (zh) * | 2020-04-29 | 2020-08-07 | 江苏裕兴薄膜科技股份有限公司 | 液晶聚合物薄膜的制备方法 |
CN112172210A (zh) * | 2020-09-18 | 2021-01-05 | 江苏中际信通讯材料有限公司 | 一种低介电常数和低介电损耗的液晶聚合物膜材制备方法 |
CN113844149A (zh) * | 2020-06-27 | 2021-12-28 | 普洛梅特库株式会社 | 层压体的制造方法 |
WO2022047837A1 (zh) * | 2020-09-04 | 2022-03-10 | 瑞声声学科技(深圳)有限公司 | 液晶聚合物薄膜的热处理方法及改性液晶聚合物薄膜 |
CN115023466A (zh) * | 2020-02-21 | 2022-09-06 | 引能仕株式会社 | 复合物、浆料组合物、膜以及金属箔层叠板 |
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CN111808616A (zh) | 2019-04-12 | 2020-10-23 | 佳胜科技股份有限公司 | 改质液晶高分子的制作方法、液晶高分子组合物及改变液晶高分子的熔点的方法 |
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WO2022030494A1 (ja) * | 2020-08-07 | 2022-02-10 | 住友化学株式会社 | 液状組成物、液状組成物の製造方法、液晶ポリエステルフィルムの製造方法及び積層体の製造方法 |
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CN115023466A (zh) * | 2020-02-21 | 2022-09-06 | 引能仕株式会社 | 复合物、浆料组合物、膜以及金属箔层叠板 |
CN111497173A (zh) * | 2020-04-29 | 2020-08-07 | 江苏裕兴薄膜科技股份有限公司 | 液晶聚合物薄膜的制备方法 |
CN113844149A (zh) * | 2020-06-27 | 2021-12-28 | 普洛梅特库株式会社 | 层压体的制造方法 |
WO2022047837A1 (zh) * | 2020-09-04 | 2022-03-10 | 瑞声声学科技(深圳)有限公司 | 液晶聚合物薄膜的热处理方法及改性液晶聚合物薄膜 |
CN112172210A (zh) * | 2020-09-18 | 2021-01-05 | 江苏中际信通讯材料有限公司 | 一种低介电常数和低介电损耗的液晶聚合物膜材制备方法 |
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KR102233641B1 (ko) | 2021-04-01 |
US20190240957A1 (en) | 2019-08-08 |
US11376816B2 (en) | 2022-07-05 |
JP6821907B2 (ja) | 2021-01-27 |
KR20190095145A (ko) | 2019-08-14 |
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