CN110071205B - 发光二极管组件及制作方法 - Google Patents

发光二极管组件及制作方法 Download PDF

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Publication number
CN110071205B
CN110071205B CN201811586001.3A CN201811586001A CN110071205B CN 110071205 B CN110071205 B CN 110071205B CN 201811586001 A CN201811586001 A CN 201811586001A CN 110071205 B CN110071205 B CN 110071205B
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CN
China
Prior art keywords
light
emitting diode
bulb
light emitting
substrate
Prior art date
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CN201811586001.3A
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English (en)
Chinese (zh)
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CN110071205A (zh
Inventor
陈泽澎
郑子淇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaistar Lighting Xiamen Co Ltd
Epistar Corp
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Kaistar Lighting Xiamen Co Ltd
Epistar Corp
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Publication of CN110071205A publication Critical patent/CN110071205A/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
    • H10H20/8512—Wavelength conversion materials
    • H10H20/8513—Wavelength conversion materials having two or more wavelength conversion materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/8506—Containers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/851—Wavelength conversion means
    • H10H20/8515—Wavelength conversion means not being in contact with the bodies
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
    • H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
    • H10H20/80—Constructional details
    • H10H20/85—Packages
    • H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48464—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area also being a ball bond, i.e. ball-to-ball
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/49105—Connecting at different heights
    • H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

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  • Led Device Packages (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
CN201811586001.3A 2013-10-07 2014-09-28 发光二极管组件及制作方法 Active CN110071205B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
TW102136176A TWI610465B (zh) 2013-10-07 2013-10-07 發光二極體組件及製作方法
TW102136176 2013-10-07
CN201410507440.6A CN104517947B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法

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CN201410507440.6A Division CN104517947B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法

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CN110071205A CN110071205A (zh) 2019-07-30
CN110071205B true CN110071205B (zh) 2022-04-26

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CN201811583441.3A Pending CN110047823A (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法
CN201410507440.6A Active CN104517947B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法
CN201811586001.3A Active CN110071205B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法

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CN201410507440.6A Active CN104517947B (zh) 2013-10-07 2014-09-28 发光二极管组件及制作方法

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US (6) US9502622B2 (enExample)
JP (2) JP6581766B2 (enExample)
CN (3) CN110047823A (enExample)
TW (1) TWI610465B (enExample)

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI610465B (zh) 2013-10-07 2018-01-01 Epistar Corporation 發光二極體組件及製作方法
US11525547B2 (en) 2014-09-28 2022-12-13 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11686436B2 (en) 2014-09-28 2023-06-27 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and light bulb using LED filament
US11997768B2 (en) * 2014-09-28 2024-05-28 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US20220078892A1 (en) * 2014-09-28 2022-03-10 Zhejiang Super Lighting Electric Appliance Co.,Ltd Led filament and led light bulb
US12313227B2 (en) 2014-09-28 2025-05-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11073248B2 (en) 2014-09-28 2021-07-27 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED bulb lamp
US11543083B2 (en) * 2014-09-28 2023-01-03 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
US12007077B2 (en) 2014-09-28 2024-06-11 Zhejiang Super Lighting Electric Appliance Co., Ltd. LED filament and LED light bulb
US11085591B2 (en) 2014-09-28 2021-08-10 Zhejiang Super Lighting Electric Appliance Co., Ltd LED light bulb with curved filament
US11421827B2 (en) 2015-06-19 2022-08-23 Zhejiang Super Lighting Electric Appliance Co., Ltd LED filament and LED light bulb
CN105098043B (zh) 2015-07-17 2017-12-22 开发晶照明（厦门）有限公司 发光装置复合基板及具有该发光装置复合基板的led模组
TWI568038B (zh) * 2015-07-17 2017-01-21 開發晶照明（廈門）有限公司 發光裝置複合基板及具有該發光裝置複合基板的led模組
JP6850112B2 (ja) * 2016-11-28 2021-03-31 株式会社ディスコ Ｌｅｄ組み立て方法
DE102017112642A1 (de) * 2017-06-08 2018-12-13 Osram Opto Semiconductors Gmbh Led-filament
KR20190101787A (ko) * 2018-02-23 2019-09-02 서울반도체 주식회사 개선된 연색성을 갖는 led 조명 장치 및 led 필라멘트
US10982048B2 (en) 2018-04-17 2021-04-20 Jiaxing Super Lighting Electric Appliance Co., Ltd Organosilicon-modified polyimide resin composition and use thereof
US10828962B2 (en) * 2018-07-13 2020-11-10 Simpson Performance Products, Inc. Compact cooling system for vehicle operators
CN109148402B (zh) * 2018-08-29 2020-09-15 开发晶照明（厦门）有限公司 发光二极管封装结构及其制造方法
CN110335931B (zh) * 2019-07-05 2020-12-01 开发晶照明（厦门）有限公司 光电器件及其制作方法
TWI712188B (zh) 2019-11-13 2020-12-01 隆達電子股份有限公司 發光封裝結構及其製造方法
EP4146979B1 (en) * 2020-05-07 2023-08-30 Signify Holding B.V. An led filament and a lamp
USD1089808S1 (en) 2021-01-20 2025-08-19 Hamamatsu Photonics K.K. Light-emitting element module
USD1083850S1 (en) 2021-01-20 2025-07-15 Hamamatsu Photonics K.K. Light-emitting element module
JP1701619S (enExample) * 2021-01-20 2021-12-06
JP1712335S (ja) 2021-01-20 2022-04-12 発光素子モジュール
JP1701505S (enExample) 2021-01-20 2021-12-06
TWI801122B (zh) * 2022-01-28 2023-05-01 友達光電股份有限公司 封裝結構及其製造方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101852345A (zh) * 2009-03-30 2010-10-06 奇力光电科技股份有限公司 发光二极管光源模块
CN103000786A (zh) * 2012-11-14 2013-03-27 深圳大学 白光发光二极管
CN103052839A (zh) * 2010-11-04 2013-04-17 松下电器产业株式会社 灯泡型灯及照明装置

Family Cites Families (33)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6835960B2 (en) * 2003-03-03 2004-12-28 Opto Tech Corporation Light emitting diode package structure
JP2007165811A (ja) * 2005-12-16 2007-06-28 Nichia Chem Ind Ltd 発光装置
JP5555971B2 (ja) * 2006-07-18 2014-07-23 日亜化学工業株式会社 線状発光装置およびそれを用いた面状発光装置
JP4976974B2 (ja) * 2007-03-28 2012-07-18 パナソニック株式会社 発光装置
JP5220373B2 (ja) * 2007-09-25 2013-06-26 三洋電機株式会社 発光モジュール
KR100998233B1 (ko) * 2007-12-03 2010-12-07 서울반도체 주식회사 슬림형 ｌｅｄ 패키지
US8207553B2 (en) * 2008-03-25 2012-06-26 Bridge Semiconductor Corporation Semiconductor chip assembly with base heat spreader and cavity in base
KR100888236B1 (ko) * 2008-11-18 2009-03-12 서울반도체 주식회사 발광 장치
TWI445156B (zh) * 2009-01-20 2014-07-11 Epistar Corp 發光元件
JP2011035198A (ja) * 2009-08-03 2011-02-17 Ccs Inc Ｌｅｄ発光デバイスの製造方法
JP5485642B2 (ja) * 2009-10-06 2014-05-07 シチズン電子株式会社 発光ダイオード及びその製造方法
JPWO2011136302A1 (ja) * 2010-04-28 2013-07-22 三菱化学株式会社 半導体発光装置用パッケージ及び発光装置
KR20110130851A (ko) * 2010-05-28 2011-12-06 삼성전자주식회사 발광 장치, 이를 포함하는 발광 시스템, 및 이들의 제조 방법
US8322947B2 (en) * 2010-06-11 2012-12-04 Neumann Duane A Flexible skid steer attachment device
CN201820755U (zh) * 2010-07-15 2011-05-04 弘凯光电(深圳)有限公司 发光二极管
JP5189211B2 (ja) * 2010-07-20 2013-04-24 パナソニック株式会社 電球形ランプ
CA2810658C (en) 2010-09-08 2015-02-10 Zhejiang Ledison Optoelectronics Co., Ltd. Led light bulb and led light-emitting strip being capable of emitting 4.pi. light
JP2012099726A (ja) * 2010-11-04 2012-05-24 Stanley Electric Co Ltd Ｌｅｄモジュール及びｌｅｄランプ
JP2012138454A (ja) * 2010-12-27 2012-07-19 Citizen Holdings Co Ltd 半導体発光装置及びその製造方法
WO2012090350A1 (ja) * 2010-12-27 2012-07-05 パナソニック株式会社 発光装置およびランプ
EP2663805B1 (en) * 2011-01-11 2017-07-19 Philips Lighting Holding B.V. Lighting device
CN103080631A (zh) * 2011-01-14 2013-05-01 松下电器产业株式会社 灯及照明装置
US9324924B2 (en) * 2011-03-03 2016-04-26 Cree, Inc. Tunable remote phosphor constructs
KR101865272B1 (ko) * 2011-07-26 2018-06-07 삼성전자주식회사 발광소자 모듈 및 이의 제조방법
JP5848562B2 (ja) * 2011-09-21 2016-01-27 シチズン電子株式会社 半導体発光装置及びその製造方法。
CN104081112B (zh) * 2011-11-07 2016-03-16 克利公司 高电压阵列发光二极管(led)器件、设备和方法
US20130170174A1 (en) * 2011-12-29 2013-07-04 Intematix Technology Center Corp. Multi-cavities light emitting device
TWM433640U (en) 2012-04-12 2012-07-11 Lextar Electronics Corp Package structure of semiconductor light emitting device
JP6139071B2 (ja) * 2012-07-30 2017-05-31 日亜化学工業株式会社 発光装置とその製造方法
TWM459520U (zh) 2013-01-28 2013-08-11 廖旭文 雙面發光之ｌｅｄ燈板結構
CN203205454U (zh) * 2013-02-06 2013-09-18 深圳市蓝科电子有限公司 一种led光源的封装结构
TWM461749U (zh) 2013-02-27 2013-09-11 東莞萬士達液晶顯示器有限公司 光源裝置
TWI610465B (zh) * 2013-10-07 2018-01-01 Epistar Corporation 發光二極體組件及製作方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101852345A (zh) * 2009-03-30 2010-10-06 奇力光电科技股份有限公司 发光二极管光源模块
CN103052839A (zh) * 2010-11-04 2013-04-17 松下电器产业株式会社 灯泡型灯及照明装置
CN103000786A (zh) * 2012-11-14 2013-03-27 深圳大学 白光发光二极管

Also Published As

Publication number Publication date
US20170040504A1 (en) 2017-02-09
CN104517947B (zh) 2019-01-18
CN110047823A (zh) 2019-07-23
US9947839B2 (en) 2018-04-17
US10319886B2 (en) 2019-06-11
US20230012204A1 (en) 2023-01-12
US20150097199A1 (en) 2015-04-09
JP7015278B2 (ja) 2022-02-02
US9502622B2 (en) 2016-11-22
US20190296198A1 (en) 2019-09-26
US20210151640A1 (en) 2021-05-20
TWI610465B (zh) 2018-01-01
JP2015076612A (ja) 2015-04-20
US11450791B2 (en) 2022-09-20
CN104517947A (zh) 2015-04-15
TW201515279A (zh) 2015-04-16
US20180233635A1 (en) 2018-08-16
US10910528B2 (en) 2021-02-02
CN110071205A (zh) 2019-07-30
JP6581766B2 (ja) 2019-09-25
JP2019197906A (ja) 2019-11-14
US11949050B2 (en) 2024-04-02

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