JP2019091944A - 可撓性発光ダイオードモジュール及び発光ダイオード電球 - Google Patents
可撓性発光ダイオードモジュール及び発光ダイオード電球 Download PDFInfo
- Publication number
- JP2019091944A JP2019091944A JP2019040727A JP2019040727A JP2019091944A JP 2019091944 A JP2019091944 A JP 2019091944A JP 2019040727 A JP2019040727 A JP 2019040727A JP 2019040727 A JP2019040727 A JP 2019040727A JP 2019091944 A JP2019091944 A JP 2019091944A
- Authority
- JP
- Japan
- Prior art keywords
- led
- light emitting
- emitting diode
- light
- filament
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 239000000843 powder Substances 0.000 description 63
- 239000000463 material Substances 0.000 description 24
- 238000000034 method Methods 0.000 description 20
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 12
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 3
- 208000027418 Wounds and injury Diseases 0.000 description 3
- 239000003086 colorant Substances 0.000 description 3
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000017525 heat dissipation Effects 0.000 description 3
- 229920002050 silicone resin Polymers 0.000 description 3
- 239000012780 transparent material Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 108010043121 Green Fluorescent Proteins Proteins 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- FNCIDSNKNZQJTJ-UHFFFAOYSA-N alumane;terbium Chemical compound [AlH3].[Tb] FNCIDSNKNZQJTJ-UHFFFAOYSA-N 0.000 description 2
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 229910017464 nitrogen compound Inorganic materials 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910019655 synthetic inorganic crystalline material Inorganic materials 0.000 description 2
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 2
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- -1 TAG Inorganic materials 0.000 description 1
- OLBVUFHMDRJKTK-UHFFFAOYSA-N [N].[O] Chemical compound [N].[O] OLBVUFHMDRJKTK-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- WUKWITHWXAAZEY-UHFFFAOYSA-L calcium difluoride Chemical compound [F-].[F-].[Ca+2] WUKWITHWXAAZEY-UHFFFAOYSA-L 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000010436 fluorite Substances 0.000 description 1
- 208000014674 injury Diseases 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 150000002830 nitrogen compounds Chemical class 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
Description
102、104 表面
105 導電区域
106 可撓性透明基板
108 藍色光LEDチップ
110、112 蛍光粉末層
114、116 端面
120、124 側面
130 LEDフィラメント
200 LED電球
202 電球口金
204 カバー
206 支持フレーム
207 導電ワイヤ
208 LED駆動回路
212 中央回転軸
300 LED電球
400 LED電球
404 導電ケーブル
410 湾曲パイプ
A、B、C 断面図
Claims (6)
- フィラメントであって、
第一表面、第二表面、及び端面を含む可撓性基板;
前記第一表面の上に形成された発光ダイオードチップ;
前記第一表面の上に形成された導電区域;
前記第一表面の上に形成されており、且つ前記発光ダイオードチップ及び前記導電区域に直接接触する第一波長変更層;及び
前記第一表面の上に形成されており、外へ前記端面を超えており、且つ前記発光ダイオードチップに電気接続される導電ワイヤ
を含む、フィラメント。 - 請求項1に記載のフィラメントであって、
前記第二表面の上に形成された第二波長変更層をさらに含む、フィラメント。 - 請求項1に記載のフィラメントであって、
前記第一表面の上に形成されており、且つ前記導電区域に直接接触する第二波長変更層をさらに含む、フィラメント。 - 請求項1に記載のフィラメントであって、
前記導電区域は、前記第一波長変更層により覆われていない部分を含む、フィラメント。 - 請求項1に記載のフィラメントであって、
前記導電区域は、前記端面を超えていない、フィラメント。 - 請求項1に記載のフィラメントであって、
前記導電区域は、ITO又は銀を含む、フィラメント。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102132806A TWI599745B (zh) | 2013-09-11 | 2013-09-11 | 可撓式發光二極體組件及發光二極體燈泡 |
TW102132806 | 2013-09-11 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014183805A Division JP6494963B2 (ja) | 2013-09-11 | 2014-09-10 | 可撓性発光ダイオードモジュール及び発光ダイオード電球 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2019091944A true JP2019091944A (ja) | 2019-06-13 |
JP6851411B2 JP6851411B2 (ja) | 2021-03-31 |
Family
ID=52624690
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014183805A Active JP6494963B2 (ja) | 2013-09-11 | 2014-09-10 | 可撓性発光ダイオードモジュール及び発光ダイオード電球 |
JP2019040727A Active JP6851411B2 (ja) | 2013-09-11 | 2019-03-06 | 可撓性発光ダイオードモジュール及び発光ダイオード電球 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014183805A Active JP6494963B2 (ja) | 2013-09-11 | 2014-09-10 | 可撓性発光ダイオードモジュール及び発光ダイオード電球 |
Country Status (4)
Country | Link |
---|---|
US (2) | US9231171B2 (ja) |
JP (2) | JP6494963B2 (ja) |
CN (2) | CN104425476A (ja) |
TW (1) | TWI599745B (ja) |
Families Citing this family (75)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10228093B2 (en) * | 2015-08-17 | 2019-03-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb and LED filament thereof |
US10487987B2 (en) | 2015-08-17 | 2019-11-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
US10544905B2 (en) | 2014-09-28 | 2020-01-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
US10677396B2 (en) | 2006-07-22 | 2020-06-09 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb with symmetrical filament |
US9995474B2 (en) * | 2015-06-10 | 2018-06-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED filament, LED filament assembly and LED bulb |
US10655792B2 (en) | 2014-09-28 | 2020-05-19 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
US10473271B2 (en) | 2015-08-17 | 2019-11-12 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament module and LED light bulb |
US10240724B2 (en) | 2015-08-17 | 2019-03-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
US9166116B2 (en) | 2012-05-29 | 2015-10-20 | Formosa Epitaxy Incorporation | Light emitting device |
US11421827B2 (en) | 2015-06-19 | 2022-08-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
US20220078892A1 (en) * | 2014-09-28 | 2022-03-10 | Zhejiang Super Lighting Electric Appliance Co.,Ltd | Led filament and led light bulb |
US10976009B2 (en) | 2014-09-28 | 2021-04-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament light bulb |
US10845008B2 (en) | 2014-09-28 | 2020-11-24 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
US11259372B2 (en) | 2015-06-10 | 2022-02-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd | High-efficiency LED light bulb with LED filament therein |
US11015764B2 (en) | 2014-09-28 | 2021-05-25 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with flexible LED filament having perpendicular connecting wires |
US11073248B2 (en) | 2014-09-28 | 2021-07-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
US10784428B2 (en) | 2014-09-28 | 2020-09-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
US11525547B2 (en) | 2014-09-28 | 2022-12-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
US20220086975A1 (en) * | 2014-09-28 | 2022-03-17 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | Led filament and led light bulb |
US11543083B2 (en) | 2014-09-28 | 2023-01-03 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
US11028970B2 (en) | 2014-09-28 | 2021-06-08 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament light bulb having organosilicon-modified polyimide resin composition filament base layer |
US10982816B2 (en) | 2014-09-28 | 2021-04-20 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having uniform light emmision |
US11997768B2 (en) | 2014-09-28 | 2024-05-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
US11085591B2 (en) | 2014-09-28 | 2021-08-10 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
US11686436B2 (en) * | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and light bulb using LED filament |
TWI575184B (zh) * | 2015-08-11 | 2017-03-21 | LED bulb structure | |
US10359152B2 (en) | 2015-08-17 | 2019-07-23 | Zhejiang Super Lighting Electric Appliance Co, Ltd | LED filament and LED light bulb |
US11168844B2 (en) | 2015-08-17 | 2021-11-09 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having filament with segmented light conversion layer |
CN106555942A (zh) * | 2015-09-29 | 2017-04-05 | 上海德士电器有限公司 | Led光源模组及包括其的泡形灯 |
USD789569S1 (en) | 2015-12-06 | 2017-06-13 | GE Lighting Solutions, LLC | Retrofit lamp with LED light source filament |
USD790086S1 (en) | 2015-12-06 | 2017-06-20 | GE Lighting Solutions, LLC | Retrofit lamp with LED light source filament |
USD785821S1 (en) | 2015-12-06 | 2017-05-02 | GE Lighting Solutions, LLC | Retrofit lamp with LED light source filament |
USD780958S1 (en) | 2015-12-06 | 2017-03-07 | GE Lighting Solutions, LLC | Retrofit lamp with LED light source filament |
US9971263B2 (en) * | 2016-01-08 | 2018-05-15 | Canon Kabushiki Kaisha | Toner |
CN205388272U (zh) * | 2016-01-19 | 2016-07-20 | 鹤山建豪电光源有限公司 | 一种led汽车灯泡 |
CN108603637B (zh) * | 2016-02-04 | 2020-07-17 | 奥斯兰姆奥普托半导体有限责任公司 | 发光二极管灯丝和具有发光二极管灯丝的发光体 |
WO2017186150A1 (en) * | 2016-04-27 | 2017-11-02 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Led light bulb |
CN205746257U (zh) * | 2016-05-12 | 2016-11-30 | 广州市五度光电科技有限公司 | 一种可任意弯折和定型的led灯条 |
CN107676637A (zh) * | 2016-08-01 | 2018-02-09 | 漳州立达信光电子科技有限公司 | 全向出光led灯 |
CN109661858A (zh) * | 2016-09-05 | 2019-04-19 | 昕诺飞控股有限公司 | Led丝和包括led丝的照明装置 |
EP3290773B1 (en) * | 2016-09-05 | 2019-05-01 | Double Good Co. | Led light bulb and fabrication method thereof |
TW201705557A (zh) * | 2016-10-26 | 2017-02-01 | Liquidleds Lighting Corp | 具有散熱結構的led燈絲及應用該led燈絲的led燈泡 |
JP6850112B2 (ja) * | 2016-11-28 | 2021-03-31 | 株式会社ディスコ | Led組み立て方法 |
US10535805B2 (en) | 2017-01-13 | 2020-01-14 | Intematix Corporation | Narrow-band red phosphors for LED lamps |
CN110650623B (zh) | 2017-01-20 | 2022-05-27 | 查尔斯·H·奥斯特曼 | 发光结构 |
JP3210623U (ja) * | 2017-03-10 | 2017-06-01 | スワン電器株式会社 | 吊り下げ式装飾灯 |
TWM559977U (zh) * | 2017-03-31 | 2018-05-11 | Liquidleds Lighting Corp | 發光二極體燈具 |
CN107514553A (zh) * | 2017-07-31 | 2017-12-26 | 浙江亿米光电科技有限公司 | 一种带自成型led光源的灯泡 |
DE102017121186A1 (de) * | 2017-09-13 | 2019-03-14 | Eaton Intelligent Power Limited | Signalleuchte und Signalmodul |
US20190139948A1 (en) * | 2017-11-03 | 2019-05-09 | Xiamen Eco Lighting Co. Ltd. | Led lighting apparatus |
KR102527952B1 (ko) * | 2017-11-10 | 2023-05-03 | 서울반도체 주식회사 | 발광 소자 필라멘트 |
KR102459144B1 (ko) | 2017-11-20 | 2022-10-27 | 서울반도체 주식회사 | 전구형 광원 |
DE102017127721A1 (de) * | 2017-11-23 | 2019-05-23 | Osram Opto Semiconductors Gmbh | Led-filament mit konversionsschicht |
JP3230017U (ja) | 2017-12-26 | 2021-01-07 | 嘉▲興▼山蒲照明▲電▼器有限公司Jiaxing Super Lighting Electric Appliance Co.,Ltd | 発光ダイオードフィラメント及び発光ダイオード電球 |
US10790419B2 (en) | 2017-12-26 | 2020-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
CN108269901B (zh) * | 2018-01-16 | 2019-08-23 | 深圳市晨日科技股份有限公司 | 一种用于灯管的led倒装线形光源及其制备方法 |
WO2019206804A1 (en) * | 2018-04-26 | 2019-10-31 | Lumileds Holding B.V. | Flexible led lighting strip with slanted leds |
US10371325B1 (en) | 2018-06-25 | 2019-08-06 | Intematix Corporation | Full spectrum white light emitting devices |
US10685941B1 (en) * | 2019-07-09 | 2020-06-16 | Intematix Corporation | Full spectrum white light emitting devices |
DE102018118822A1 (de) | 2018-08-02 | 2020-02-06 | Osram Opto Semiconductors Gmbh | Leuchtfadenvorrichtung und verfahren zur herstellung einer leuchtfadenvorrichtung |
CN110957307A (zh) * | 2018-09-27 | 2020-04-03 | Bgt材料有限公司 | 发光二极管灯丝和发光二极管灯丝灯泡 |
US10752294B2 (en) | 2018-11-28 | 2020-08-25 | Ford Global Technologies, Llc | Vehicle with removable outer body panel and detachable tail lamp support, and corresponding method |
WO2020190960A1 (en) * | 2019-03-18 | 2020-09-24 | Intematix Corporation | Led-filament |
CN113841238A (zh) | 2019-03-18 | 2021-12-24 | 英特曼帝克司公司 | Led灯丝 |
US11342311B2 (en) | 2019-03-18 | 2022-05-24 | Intematix Corporation | LED-filaments and LED-filament lamps utilizing manganese-activated fluoride red photoluminescence material |
JP7242894B2 (ja) | 2019-03-18 | 2023-03-20 | インテマティックス・コーポレーション | 光ルミネセンス層状構造体を備えるパッケージ化された白色発光デバイス |
US11781714B2 (en) | 2019-03-18 | 2023-10-10 | Bridgelux, Inc. | LED-filaments and LED-filament lamps |
EP3715699A1 (en) * | 2019-03-29 | 2020-09-30 | GaN Power Technology Co., Ltd. | Led light bulb |
EP4261454A1 (en) | 2019-05-02 | 2023-10-18 | Signify Holding B.V. | Led filament lamp |
US11887973B2 (en) | 2019-07-09 | 2024-01-30 | Intematix Corporation | Full spectrum white light emitting devices |
CN110739382B (zh) * | 2019-09-03 | 2020-12-29 | 浙江凯耀照明有限责任公司 | 一种高显色指数和光效的led发光器件 |
US11796141B2 (en) | 2019-09-17 | 2023-10-24 | Signify Holding B.V. | Lighting device comprising an LED strip |
JP2022548362A (ja) | 2019-09-19 | 2022-11-18 | シグニファイ ホールディング ビー ヴィ | 少なくとも1つの屈曲ユニットを備える発光ダイオードフィラメント構成 |
CN213333738U (zh) * | 2020-08-31 | 2021-06-01 | 杭州杭科光电集团股份有限公司 | 颜色可控的led发光灯 |
CN213394756U (zh) * | 2020-11-10 | 2021-06-08 | 广东欧曼科技股份有限公司 | 基于csp或fc芯片的荧光led灯条 |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3075689U (ja) * | 2000-08-17 | 2001-02-27 | 舶用電球株式会社 | Led電球 |
JP2010087051A (ja) * | 2008-09-29 | 2010-04-15 | Toyoda Gosei Co Ltd | 発光装置 |
WO2011111399A1 (ja) * | 2010-03-11 | 2011-09-15 | パナソニック株式会社 | 発光モジュール、光源装置、液晶表示装置および発光モジュールの製造方法 |
WO2012053134A1 (ja) * | 2010-10-22 | 2012-04-26 | パナソニック株式会社 | 実装用基板、発光装置及びランプ |
WO2012085736A1 (en) * | 2010-12-22 | 2012-06-28 | Koninklijke Philips Electronics N.V. | Lighting device and method for manufacturing a lighting device |
WO2012095931A1 (ja) * | 2011-01-14 | 2012-07-19 | パナソニック株式会社 | ランプ及び照明装置 |
WO2012144126A1 (ja) * | 2011-04-20 | 2012-10-26 | パナソニック株式会社 | 発光装置、バックライトユニット、液晶表示装置及び照明装置 |
Family Cites Families (26)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5660461A (en) * | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
KR100563970B1 (ko) | 2004-05-03 | 2006-03-30 | 이엘코리아 주식회사 | 플렉시블 무기 el 돔시트 및 이를 이용한 플렉시블 무기 el 돔시트 키패드 |
JP2007165811A (ja) * | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | 発光装置 |
KR100885894B1 (ko) * | 2006-09-29 | 2009-02-26 | 폴리트론 테크놀로지스 인크 | Led 발광 장치의 플래인 구조체 |
CN201043697Y (zh) * | 2007-04-30 | 2008-04-02 | 陈大庆 | Led图文灯 |
EP2255125A1 (de) * | 2008-03-17 | 2010-12-01 | Osram Gesellschaft mit beschränkter Haftung | Led-leuchtvorrichtung |
US20090251882A1 (en) * | 2008-04-03 | 2009-10-08 | General Led, Inc. | Light-emitting diode illumination structures |
JP5320627B2 (ja) * | 2009-05-14 | 2013-10-23 | 東芝ライテック株式会社 | 口金付ランプおよび照明器具 |
JP5533183B2 (ja) * | 2010-04-20 | 2014-06-25 | 日亜化学工業株式会社 | Led光源装置及びその製造方法 |
JP2012018865A (ja) * | 2010-07-09 | 2012-01-26 | Panasonic Corp | Ledモジュール、およびledランプ |
WO2012011279A1 (ja) * | 2010-07-20 | 2012-01-26 | パナソニック株式会社 | 電球形ランプ |
EP2535640B2 (en) * | 2010-09-08 | 2020-09-23 | Zhejiang Ledison Optoelectronics Co., Ltd. | Led lamp bulb and led lighting bar capable of emitting light over 4 pi |
CN202721174U (zh) * | 2010-12-27 | 2013-02-06 | 松下电器产业株式会社 | 发光装置及灯 |
US8314566B2 (en) * | 2011-02-22 | 2012-11-20 | Quarkstar Llc | Solid state lamp using light emitting strips |
CN102650385A (zh) * | 2011-02-25 | 2012-08-29 | 瑞莹光电股份有限公司 | 发光二极管灯具及其制造方法 |
CN102650380A (zh) * | 2011-02-25 | 2012-08-29 | 瑞莹光电股份有限公司 | 发光二极管灯具及其制造方法 |
US20130010463A1 (en) | 2011-07-05 | 2013-01-10 | Industrial Technology Research Institute | Illumination device |
US20130056749A1 (en) * | 2011-09-07 | 2013-03-07 | Michael Tischler | Broad-area lighting systems |
US20120175667A1 (en) * | 2011-10-03 | 2012-07-12 | Golle Aaron J | Led light disposed on a flexible substrate and connected with a printed 3d conductor |
TW201320412A (zh) * | 2011-11-14 | 2013-05-16 | Evergreen Optronics Inc | 發光二極體封裝 |
CN103123949A (zh) * | 2011-11-21 | 2013-05-29 | 展晶科技(深圳)有限公司 | 可挠式发光二极管封装结构及其制造方法 |
US9482416B2 (en) | 2011-11-23 | 2016-11-01 | 3M Innovative Properties Company | Flexible light emitting semiconductor device having a three dimensional structure |
JP5895166B2 (ja) * | 2012-02-13 | 2016-03-30 | パナソニックIpマネジメント株式会社 | 発光モジュール、ランプ及び照明装置 |
TWM459520U (zh) | 2013-01-28 | 2013-08-11 | Xu-Wen Liao | 雙面發光之led燈板結構 |
JP6210830B2 (ja) * | 2013-05-27 | 2017-10-11 | シチズン時計株式会社 | Led電球 |
TWI626395B (zh) | 2013-06-11 | 2018-06-11 | 晶元光電股份有限公司 | 發光裝置 |
-
2013
- 2013-09-11 TW TW102132806A patent/TWI599745B/zh active
-
2014
- 2014-09-08 US US14/480,084 patent/US9231171B2/en not_active Ceased
- 2014-09-10 JP JP2014183805A patent/JP6494963B2/ja active Active
- 2014-09-11 CN CN201410460339.XA patent/CN104425476A/zh active Pending
- 2014-09-11 CN CN202010418418.XA patent/CN111640736B/zh active Active
-
2018
- 2018-01-05 US US15/863,710 patent/USRE49031E1/en active Active
-
2019
- 2019-03-06 JP JP2019040727A patent/JP6851411B2/ja active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3075689U (ja) * | 2000-08-17 | 2001-02-27 | 舶用電球株式会社 | Led電球 |
JP2010087051A (ja) * | 2008-09-29 | 2010-04-15 | Toyoda Gosei Co Ltd | 発光装置 |
WO2011111399A1 (ja) * | 2010-03-11 | 2011-09-15 | パナソニック株式会社 | 発光モジュール、光源装置、液晶表示装置および発光モジュールの製造方法 |
WO2012053134A1 (ja) * | 2010-10-22 | 2012-04-26 | パナソニック株式会社 | 実装用基板、発光装置及びランプ |
WO2012085736A1 (en) * | 2010-12-22 | 2012-06-28 | Koninklijke Philips Electronics N.V. | Lighting device and method for manufacturing a lighting device |
WO2012095931A1 (ja) * | 2011-01-14 | 2012-07-19 | パナソニック株式会社 | ランプ及び照明装置 |
WO2012144126A1 (ja) * | 2011-04-20 | 2012-10-26 | パナソニック株式会社 | 発光装置、バックライトユニット、液晶表示装置及び照明装置 |
Also Published As
Publication number | Publication date |
---|---|
JP6494963B2 (ja) | 2019-04-03 |
CN104425476A (zh) | 2015-03-18 |
US9231171B2 (en) | 2016-01-05 |
TWI599745B (zh) | 2017-09-21 |
USRE49031E1 (en) | 2022-04-12 |
CN111640736B (zh) | 2022-07-15 |
TW201510440A (zh) | 2015-03-16 |
US20150069442A1 (en) | 2015-03-12 |
CN111640736A (zh) | 2020-09-08 |
JP6851411B2 (ja) | 2021-03-31 |
JP2015056667A (ja) | 2015-03-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6851411B2 (ja) | 可撓性発光ダイオードモジュール及び発光ダイオード電球 | |
US11543081B2 (en) | LED assembly with omnidirectional light field | |
JP7015278B2 (ja) | 発光ダイオードモジュール及びその製造方法 | |
JP6616065B2 (ja) | 発光モジュール及びそれに関する照明装置 | |
US9157579B2 (en) | LED assembly with omnidirectional light field | |
US20110089815A1 (en) | Light-emitting device | |
JP6616088B2 (ja) | Ledアセンブリー及びこのledアセンブリーを用いたled電球 | |
JP6107067B2 (ja) | 発光装置 | |
JP2007258620A (ja) | 発光装置 | |
JP2008244468A (ja) | 発光装置 | |
TWI620895B (zh) | 可撓式發光二極體組件及發光二極體燈泡 | |
US20070075346A1 (en) | Light emitting diode and the package structure thereof | |
JP6135199B2 (ja) | 発光装置 | |
TWI655395B (zh) | 可撓式發光二極體組件及發光二極體燈泡 | |
TWI599746B (zh) | 可撓式發光二極體組件及發光二極體燈泡 | |
TWI632322B (zh) | 可撓式發光二極體組件及發光二極體燈泡 | |
TWI713236B (zh) | 發光二極體組件及製作方法 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20190306 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200407 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200707 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20200901 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20201224 |
|
C60 | Trial request (containing other claim documents, opposition documents) |
Free format text: JAPANESE INTERMEDIATE CODE: C60 Effective date: 20201224 |
|
A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20210107 |
|
C21 | Notice of transfer of a case for reconsideration by examiners before appeal proceedings |
Free format text: JAPANESE INTERMEDIATE CODE: C21 Effective date: 20210112 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20210209 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20210309 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6851411 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |