CN111640736A - 可挠式发光二极管组件及发光二极管灯泡 - Google Patents
可挠式发光二极管组件及发光二极管灯泡 Download PDFInfo
- Publication number
- CN111640736A CN111640736A CN202010418418.XA CN202010418418A CN111640736A CN 111640736 A CN111640736 A CN 111640736A CN 202010418418 A CN202010418418 A CN 202010418418A CN 111640736 A CN111640736 A CN 111640736A
- Authority
- CN
- China
- Prior art keywords
- led
- emitting diode
- light
- conductive
- flexible
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 29
- 238000006243 chemical reaction Methods 0.000 claims description 7
- 229910052709 silver Inorganic materials 0.000 claims description 3
- 239000004332 silver Substances 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 63
- 239000000463 material Substances 0.000 description 19
- 229920005989 resin Polymers 0.000 description 8
- 239000011347 resin Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 229910000679 solder Inorganic materials 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002223 garnet Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910052693 Europium Inorganic materials 0.000 description 1
- 229910052688 Gadolinium Inorganic materials 0.000 description 1
- 241001465382 Physalis alkekengi Species 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- FNCIDSNKNZQJTJ-UHFFFAOYSA-N alumane;terbium Chemical compound [AlH3].[Tb] FNCIDSNKNZQJTJ-UHFFFAOYSA-N 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- 229910052793 cadmium Inorganic materials 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- OGPBJKLSAFTDLK-UHFFFAOYSA-N europium atom Chemical compound [Eu] OGPBJKLSAFTDLK-UHFFFAOYSA-N 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000012536 packaging technology Methods 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 229910052712 strontium Inorganic materials 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/501—Wavelength conversion elements characterised by the materials, e.g. binder
- H01L33/502—Wavelength conversion materials
- H01L33/504—Elements with two or more wavelength conversion materials
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V3/00—Globes; Bowls; Cover glasses
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/70—Light sources with three-dimensionally disposed light-generating elements on flexible or deformable supports or substrates, e.g. for changing the light source into a desired form
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2109/00—Light sources with light-generating elements disposed on transparent or translucent supports or substrates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Engineering & Computer Science (AREA)
- Led Device Packages (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
本发明公开一种可挠式发光二极管组件及发光二极管灯泡,该发光二极管组件包含有弯曲灯管、基板、发光二极管芯片、导电区段、以及导电线。其中,基板设置于该弯曲灯管内并包含第一表面、第二表面、及终端;发光二极管芯片形成于该第一表面之上;导电区段形成于该第一表面之上;导电线形成于该第一表面之上且向外超出该弯曲灯管,并电连接该发光二极管芯片。
Description
本申请是中国发明专利申请(申请号:201410460339.X,申请日:2014年09月11日,发明名称:可挠式发光二极管组件及发光二极管灯泡)的分案申请。
技术领域
发明涉及一种可挠式发光二极管组件,尤其是涉及可用于全周光应用的发光二极管组件。
背景技术
目前生活上已经可以看到各式各样LED商品的应用,例如交通号志、车尾灯、车头灯、路灯、电脑指示灯、手电筒、LED背光源等。这些商品除了必要的LED芯片制作工艺外,都必须经过重要的封装程序。
LED封装的主要功能在于提供LED芯片电、光、热上的必要支援。LED芯片这样的半导体产品,如果长期暴露在大气中,会受到水汽或是环境中的化学物质影响而老化,造成特性上的衰退。LED封装中,常用环氧树脂来包覆LED芯片作为有效隔绝大气的方法。此外,为了达到更亮更省电的目标,LED封装还需要有良好的散热性以及光萃取效率。如果LED芯片发光时所产生的热没有及时的散出,累积在LED芯片中的热对元件的特性、寿命以及可靠度都会产生不良的影响。光学设计也是LED封装制作工艺中重要的一环,如何更有效的把光导出,发光角度以及方向都是设计上的重点。
白光LED的封装技术更是复杂,除了要考虑热的问题之外,还需要考虑色温(colortemperature)、演色系数(color rendering index)、荧光粉等问题。而且,如果白光LED是采用蓝光LED芯片搭配黄绿荧光粉来实施时,因蓝光的波长越短,对人眼的伤害越大,因此需要将蓝光有效阻绝于封装结构之中,避免蓝光外漏。
发明内容
为解决上述问题,本发明的实施例公开有一种可挠式发光二极管组件,其包含有一弯曲灯管、一基板、一发光二极管芯片、一导电区段、以及一导电线。其中,基板设置于该弯曲灯管内并包含一第一表面、一第二表面、及一终端;发光二极管芯片形成于该第一表面之上;导电区段形成于该第一表面之上;导电线形成于该第一表面之上且向外超出该弯曲灯管,并电连接该发光二极管芯片。
为解决上述问题,本发明的实施例公开有一种发光二极管灯泡,其包含有一弯曲灯管、一可挠曲基板、一发光二极管芯片、一导电区段、以及一导电线。其中,弯曲灯管包含一开口;可挠曲基板位于该弯曲灯管内,包含有一表面及一终端超出该开口;一发光二极管芯片设置于该表面之上;一导电区段,设置于该表面之上;以及一导电线,形成于该表面之上且超出该终端,并电连接该发光二极管芯片。
附图说明
图1为本发明的一实施例的LED组件100的立体示意图以及一些位置中的切面图;
图2为图1中,沿着两终端的方向的一种剖视图;
图3A与图3B为图1中的LED组件100的上视图与下视图;
图4为本发明一实施例的LED灯丝的示意图;
图5为本发明另一实施例的LED灯泡的示意图;
图6为本发明又一实施例的LED灯泡的示意图;
图7为本发明一实施例的采用一LED灯丝的一照明装置的示意图。
符号说明
100 LED组件
102、104 表面
105 导电区段
106 可挠式透明基板
108 蓝光LED芯片
110、112 荧光粉层
114、116 终端
120、124 侧壁
130 LED 灯丝
200 LED 灯泡
202 灯泡基座
204 灯罩
206 支撑架
207 导电线
208 LED驱动电路
212 中央旋转轴
300 LED灯泡
400 照明装置
404 导电线
410 半透明弯曲灯管
A、B、C 剖视图
具体实施方式
图1为依据本发明的一实施例的LED组件100的立体示意图以及一些位置中的切面图。如图所示,LED组件100是一种可挠式结构,可卷曲成一个卷带(reel),其视需用情况,可剪成适当的长度,作为一照明装置(譬如说灯泡)其中的主要光源。图1中包含有剖视图A、B与C,分别显示LED组件100在三个不同位置的切面图。
LED组件100包含有一可挠式透明基板106。在一实施例中,可挠式透明基板106为不导电的透明材料所构成,如玻璃或树脂。可挠式透明基板106具有面对相反方向的表面102、104以及位于表面102、104间的侧壁120、124。如同图1所示,可挠式透明基板106大致为一长条状,具有两终端114与116。在此说明书中,透明仅仅用来表示可以透过光线,其可能是完全透明(transparent)或是半透明(translucent,or semitransparent)。可挠式透明基板106在表面102与104之间的厚度,可以是150um或是更薄。
图2为图1中,沿着两终端114与116的方向的一种剖视图。图3A与图3B为图1中的LED组件100的分别针对表面102与表面104的侧视图。
可挠式透明基板106的表面102上形成有导电区段(conductive section)105。举例来说,导电区段105可以通过印刷电路的方式形成在透明基板106的表面102上;或是通过光掩模(mask)的方式将预先设计好的导电层图样形成在表面102之上,步骤包含先在可挠式透明基板106的表面102上先涂布成一导电层后,根据光掩模上预先设计的导电层图案在表面102上通过光致抗蚀剂经过蚀刻的方式,将导电层的图案形成在表面102上,其中导电区段105还可划分出不同的导电区段105。而导电区段105的成分可以为相对于LED组件100所发出的光而言为透光材料的成分,例如ITO或是银薄膜。
在本发明的实施例中,以蓝光LED芯片108为例,固着于表面102的导电区段105上的每一蓝光LED芯片108可仅包含单一发光二极管,其顺向电压约为2~3V(下称「低电压芯片」);或是包含数个串联在一起的发光二极管,其顺向电压大于低电压芯片,例如12V、24V、48V等(下称「高电压芯片」)。具体言之,高电压芯片是通过半导体制作工艺在一共同基板上形成数个彼此电连结的发光二极管单元(即至少具有发光层的发光二极管结构),这多个发光二极管单元无个别基板而是共同形成于一共同基板之上,此共同基板可以为外延成长基板或非外延成长基板。
在其他实施例中,在LED组件100的表面102上还固着有非蓝光的其他种颜色的LED芯片(未显示)。举例来说,在一实施例中,表面102上不仅有蓝光LED芯片108,还包含有一或多种LED芯片(未显示),例如红光LED芯片、绿光LED芯片、黄光LED芯片等,以混成产生适当颜色或色温的光线。此外,全部或部分的LED芯片也可以用LED封装体取代。
在图1、图2、图3A中,蓝光LED芯片108在可挠式透明基板106上沿着两终端114与116形成的纵轴方向排成一列。蓝光LED芯片108的阳极与阴极,分别与两个相邻的导电区段105电连接。因此多个蓝光LED芯片108彼此以导电区段105串联在一起,电性上可以等效为一个具有高顺向电压的发光二极管。但是本发明并不局限于此,在其他实施例中,表面102上包含蓝光LED芯片108或是其他种颜色的LED芯片排列成各种图案,并且各个芯片之间的电连接包含有串联、并联、或是同时具有串联与并联混合的连接方式。
在一实施例中,蓝光LED芯片108是通过锡膏,以倒装的方式将蓝光LED芯片108固着在导电区段105上。锡膏同时提供蓝光LED芯片108在导电区段105上的机械性支撑以及与导电区段105之间的电连接。尽管锡膏几乎不透光,但因为其所占的体积很小,所造成遮光的效应几乎可以忽略。而在另一实施例中,蓝光LED芯片108是通过异方(各向异性)导电胶固着在导电区段105上;在形成导电区段105之后,将异方导电胶涂布在导电区段105上,接着将蓝光LED芯片108以倒装的方式贴附在异方导电胶上,使蓝光LED芯片108以异方导电胶固着在导电区段105上。在其他实施例中,蓝光LED芯片108以共晶合金或银胶,电连接到导电区段105。
在另一实施例中,蓝光LED芯片108也可以是设置于可挠式透明基板106的表面102上没有导电区段105的部分,而再通过其他电连接方式与导电区段105电连接。实施上,例如将蓝光LED芯片108直接固着于基板106的表面102或是基板106上非导电性的散热材料上,接着再以打线的方式电连接导电区段105与蓝光LED芯片108。
在蓝光LED芯片108上方有一荧光粉层110,作为一波长转换层。荧光粉层110的构成材料可以是树脂或是玻璃,其中混合有波长转换材料,如荧光粉或染料,可以受蓝光LED芯片108所发出的部分蓝光(主波长(dominant wavelength)介于430nm-480nm)所激发,而产生黄绿光(主波长介于430nm-480nm),其中黄绿光与剩余的蓝光更适当地混成白光。图1只是一个示意图,在一例子中,LED组件100因为所覆盖着的荧光粉层110中的荧光粉,可能无法如同图1所示的看到荧光粉层110下的蓝光LED芯片108。如果荧光粉层110的构成材料是树脂,此树脂可以是热可塑性树脂、热固性树脂或光固性树脂。在其他实施例中,这树脂可以是环氧材脂、丙烯酸树脂或硅酮树脂。
在图2与图3A中,蓝光LED芯片108被荧光粉层110完整覆盖,但荧光粉层110没有覆盖所有的导电区段105。在图2与图3A的实施例中,荧光粉层110包含多种长度与大小的区块,每个区块沿着两终端114与116连结的方向延伸并排列成一直线。区块与区块之间有大约固定的距离,其间显露出导电区段105的部分。如图1中的剖视图C所示,导电区段105没有被荧光粉层110所覆盖而被显露出来。
荧光粉层110可以用贴附的方式贴在蓝光LED芯片108上。在其他实施例中,荧光粉层110是以点胶的方式,形成区块在蓝光LED芯片108上。其中,每个区块可以只覆盖一个或是多个蓝光LED芯片108;也可能某一区块只有覆盖一个蓝光LED芯片108,而另一区块覆盖了多个蓝光LED芯片108。荧光粉层110的材料,可以是树脂或是硅胶,并在其中混杂有单色或多色的荧光粉材料,例如,YAG、TAG或包含有Sr、Ga、S、P、Si、O、Gd、Ce、Lu、Ba、Ca、N、Si、Eu、Y、Cd、Zn、Se、Al等成分的黄色荧光粉材料或绿色荧光粉材料。举例来说,荧光粉层110的材料,可以是环氧材脂、丙烯酸树脂、或硅酮树脂。荧光粉层110中荧光粉材料可以是石榴石荧光粉、硅酸盐荧光粉、氮化合物荧光粉或氧氮化合物荧光粉。荧光粉材料也可以是钇铝石榴石荧光粉(YAG)、铽铝石榴石荧光粉(TAG)、铕活化碱土族硅酸盐荧光粉(Eu-activatedalkaline earth silicate phosphor)、或硅铝氧氮化合物荧光粉(Sialon)。
荧光粉层110的厚度以及所形成的区块大小,会影响LED组件100的可卷曲程度。举例来说,如果荧光粉层110越厚,或是所形成的区块如果越大(覆盖的蓝光LED108越多),那LED组件100就可能越难卷曲或曲率越小。
如同图2与图3B所示,相对于设于表面102上的荧光粉层110,荧光粉层112设于表面104上,并且荧光粉层112的材料与形成方法可以跟荧光粉层110的材料与形成方法类似或是相同,以作为另一波长转换层。在图3B的LED组件100中,荧光粉层112也分成数个区块,排成一列,而彼此的距离大致固定。基本上,每个蓝光LED芯片108所在相对应表面104的位置上,都至少有一区块的荧光粉层112。只是,一区块的荧光粉层112可能对应到单一个蓝光LED芯片108、或是对应多个蓝光LED芯片108、或是对应到单一个区块的荧光粉层110、或是对应到单一个区块的荧光粉层110。简单的说,每个蓝光LED芯片108都会被表面102上的荧光粉层110以及表面104上的荧光粉层112所包夹。在别的实施例中,也可以选择性的只设置荧光粉层110于表面102上而不设置荧光粉层112。并且荧光粉层110与荧光粉层112的材料可以是相同或者不同的材料,或者包含相同化学元素但是受光激发之后可以发出具有不同波长的光的材料。
在一实施例中,表面102上有红光LED芯片(未显示),其被荧光粉层110以及表面104上的荧光粉层112所包夹。在另一个实施例中,覆盖在表面102的红光LED芯片上的,不是荧光粉层110,而是大致上透明且不含或仅含少量(相对于前述实施例)荧光粉的材料层,例如硅胶、环氧树脂等;而红光LED芯片在表面104的相对位置上,没有荧光粉层112或仅有少量(相对于前述实施例)荧光材料。
如同图1中的剖视图所示,可挠式透明基板106上另具有二侧壁120与124,位于表面102与104之间,侧壁120与124上并未覆盖或仅局部覆盖荧光层。
制作上,可以用任何切割工具,譬如剪刀,对LED组件100进行裁切,将荧光粉层110未覆盖处的导电区段105割断。如此,LED组件100可以形成数个LED灯丝,每一LED灯丝是可挠的。图4显示一依据本发明所实施的一LED灯丝130,其两端有两个没有被荧光粉层110所覆盖的导电区段105,用以电连接一驱动电源的正负端,以控制使LED灯丝130中的LED芯片发光。
图5显示一LED灯泡200,其中使用了依据本发明所实施的LED灯丝130。LED灯泡200有一灯泡基座202、一灯罩204、支撑架206、导电线207以及LED灯丝130。灯泡基座202可以是一爱迪生标准螺旋灯座(Edisonbase),其中包含有一LED驱动电路208。灯罩204固着于灯泡基座202上,在灯罩204与灯泡基座202之间形成一容置空间。LED灯丝130被支撑架206固定在容置空间中,支撑架206可以是实质上透明或者对于LED灯丝130所发出光线为大致上透明的材料,以达到减少遮光的效果。LED灯丝130可以弯曲成具有一个小缺口的圆,而此圆大致跟灯泡基座202与灯罩204所在的一中央旋转轴212相垂直。除了支撑架206之外,两导电线207也可以提供LED灯丝130机构上的支撑,并将LED灯丝130两端裸露的导电区段105,电连接到灯泡基座202内的LED驱动电路208。因此,LED驱动电路208可以通过导电线207以及导电区段105,驱动LED灯丝130中的蓝光LED芯片108,使其发光。
LED组件100的优点包含有:
1.可减少蓝光漏光现象:在实施例中,对于每一蓝光LED芯片108所产生的光线而言,光线行进的方向除了在面对侧壁120与124的方向之外,其他的方向会碰到荧光粉层112或荧光粉层110。也就是说,蓝光LED芯片108所产生的光线,在未经荧光粉层的情形下,只有可能从侧壁120与124离开LED组件100。然而,经过本案发明人实验观察,当侧壁120与124够细,亦即表面102与104之间的厚度够薄,譬如小于150um,蓝光LED芯片108所产生的光线就不易由侧壁120与124察觉到。
2.六面发光:每个蓝光LED芯片108的上下左右前后六个方向,都大致上没有不透明物所阻挡,所以可以六面发光。
3.存储方便:制作完成LED组件100后,可以卷成卷带或是滚轴,方便库存管理。
4.长度可调:适当的选择可挠式透明基板106的材质,就可能只要用剪刀或是刀片,就可以裁剪。
5.LED数量可调:依据之后应用所需用的顺向电压,就可以裁切出包含有适当数量LED芯片的一LED灯丝。举例来说,如果每两个裸露导电区段105之间串接有3个蓝光LED芯片108,那很简单的就可以剪裁出带有3的整数倍数量的蓝光LED芯片108的一灯丝。如果每两个裸露导电区段105之间只有一个蓝光LED芯片108,那任何整数的蓝光LED芯片108的一灯丝都可以被剪裁出来。
6.组装简单:可以简单地用焊接的方法固定LED灯丝与导电线207,并可以选择性地设置支撑架206在不同的位置将LED灯丝130支撑在灯泡内部空间之内,再将驱动电源电连接到LED灯丝两端的导电区段105便完成灯具的组装。
7.适于全周光灯具:以图5中的LED灯泡200为例。因为LED灯丝130大致被弯曲成相对于中央旋转轴212而言没有方向性差异的一圆形,而且其中的每个蓝光LED芯片都可以提供六面光,在灯罩204没有被不透明材质覆盖的条件下,LED灯泡200为一基本上可发出全周光的灯具。
尽管图5中的LED灯泡200,其中的LED灯丝130大致被弯曲成圆形,但是本发明并不限于此。LED灯丝130可以被弯曲成任意形状、使用于适合的照明设备。图6显示LED灯泡300,其中的LED灯丝130被弯曲成一曲线形或弧形,由两导电线支撑于一灯泡内部空间中。在图7中的LED灯泡400,包含一个被放置于一透明或半透明弯曲灯管410中的LED灯丝130,其中LED灯丝130顺着灯管410的内部通道而弯曲。位于LED灯丝130两端的导电区段105,则焊接到导电线404或电连接到一插头(未显示)。驱动电源(未显示)可以通过导电线404或插头,使LED灯丝130发光。在另一个实施例中,LED灯丝130也可以作为灯串字(channel letter)的光源。
如同先前所述的,依据本发明所实施的LED组件,其中的LED芯片不必然都是蓝色的,也可能是有其他种颜色的LED芯片。此外,并非所有的蓝光LED芯片都必须被同一种荧光粉层所覆盖。在一实施例中,有些蓝光LED芯片108被荧光粉层110所覆盖,而有些蓝光LED芯片被带有不同荧光粉的另一荧光粉层所覆盖。
以上所述仅为本发明的优选实施例,凡依本发明权利要求所做的均等变化与修饰,都应属本发明的涵盖范围。
Claims (9)
1.一种可挠式发光二极管组件,其特征在于,包含:
弯曲灯管;
基板,设置于该弯曲灯管内并包含第一表面、第二表面、及终端;
发光二极管芯片,形成于该第一表面之上;
导电区段,形成于该第一表面之上;以及
导电线,形成于该第一表面之上且向外超出该弯曲灯管,并电连接该发光二极管芯片。
2.如权利要求1所述的可挠式发光二极管组件,其中,该基板可挠曲。
3.如权利要求1所述的可挠式发光二极管组件,其中,还包含波长转换层,形成于该第一表面之上。
4.如权利要求3所述的可挠式发光二极管组件,其中,该导电区段包含未被该波长转换层覆盖的一部分。
5.如权利要求1所述的可挠式发光二极管组件,其中,该导电区段未超出该终端。
6.如权利要求1所述的可挠式发光二极管组件,其中,该导电区段包含ITO或银。
7.一种发光二极管灯泡,其特征在于,包含:
弯曲灯管,包含开口;
可挠曲基板,位于该弯曲灯管内,包含有第一表面及终端超出该开口;
发光二极管芯片,设置于该第一表面之上;
导电区段,设置于该第一表面之上;以及
导电线,形成于该第一表面之上且超出该终端,并电连接该发光二极管芯片。
8.如权利要求7所述的发光二极管灯泡,还包含波长转换层,形成于该第一表面之上,并且该导电区段包含未被该波长转换层覆盖的一部分。
9.如权利要求7所述的发光二极管灯泡,其中,该弯曲灯管包含两个弯曲部分。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW102132806A TWI599745B (zh) | 2013-09-11 | 2013-09-11 | 可撓式發光二極體組件及發光二極體燈泡 |
TW102132806 | 2013-09-11 | ||
CN201410460339.XA CN104425476A (zh) | 2013-09-11 | 2014-09-11 | 可挠式发光二极管组件及发光二极管灯泡 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410460339.XA Division CN104425476A (zh) | 2013-09-11 | 2014-09-11 | 可挠式发光二极管组件及发光二极管灯泡 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN111640736A true CN111640736A (zh) | 2020-09-08 |
CN111640736B CN111640736B (zh) | 2022-07-15 |
Family
ID=52624690
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410460339.XA Pending CN104425476A (zh) | 2013-09-11 | 2014-09-11 | 可挠式发光二极管组件及发光二极管灯泡 |
CN202010418418.XA Active CN111640736B (zh) | 2013-09-11 | 2014-09-11 | 可挠式发光二极管组件及发光二极管灯泡 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201410460339.XA Pending CN104425476A (zh) | 2013-09-11 | 2014-09-11 | 可挠式发光二极管组件及发光二极管灯泡 |
Country Status (4)
Country | Link |
---|---|
US (2) | US9231171B2 (zh) |
JP (2) | JP6494963B2 (zh) |
CN (2) | CN104425476A (zh) |
TW (1) | TWI599745B (zh) |
Families Citing this family (75)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9995474B2 (en) * | 2015-06-10 | 2018-06-12 | Jiaxing Super Lighting Electric Appliance Co., Ltd. | LED filament, LED filament assembly and LED bulb |
US10677396B2 (en) | 2006-07-22 | 2020-06-09 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED light bulb with symmetrical filament |
US10487987B2 (en) | 2015-08-17 | 2019-11-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
US10240724B2 (en) | 2015-08-17 | 2019-03-26 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament |
US10655792B2 (en) | 2014-09-28 | 2020-05-19 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
US10544905B2 (en) | 2014-09-28 | 2020-01-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
US10473271B2 (en) | 2015-08-17 | 2019-11-12 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament module and LED light bulb |
US9166116B2 (en) * | 2012-05-29 | 2015-10-20 | Formosa Epitaxy Incorporation | Light emitting device |
US11525547B2 (en) | 2014-09-28 | 2022-12-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
US11259372B2 (en) | 2015-06-10 | 2022-02-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd | High-efficiency LED light bulb with LED filament therein |
US10982816B2 (en) | 2014-09-28 | 2021-04-20 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having uniform light emmision |
US20220086975A1 (en) * | 2014-09-28 | 2022-03-17 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | Led filament and led light bulb |
US11073248B2 (en) * | 2014-09-28 | 2021-07-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED bulb lamp |
US11997768B2 (en) | 2014-09-28 | 2024-05-28 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
US11686436B2 (en) * | 2014-09-28 | 2023-06-27 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and light bulb using LED filament |
US11028970B2 (en) | 2014-09-28 | 2021-06-08 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament light bulb having organosilicon-modified polyimide resin composition filament base layer |
US20220078892A1 (en) * | 2014-09-28 | 2022-03-10 | Zhejiang Super Lighting Electric Appliance Co.,Ltd | Led filament and led light bulb |
US11015764B2 (en) | 2014-09-28 | 2021-05-25 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with flexible LED filament having perpendicular connecting wires |
US12007077B2 (en) | 2014-09-28 | 2024-06-11 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
US11421827B2 (en) | 2015-06-19 | 2022-08-23 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
US10784428B2 (en) | 2014-09-28 | 2020-09-22 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
US11543083B2 (en) | 2014-09-28 | 2023-01-03 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
US11085591B2 (en) | 2014-09-28 | 2021-08-10 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb with curved filament |
US10845008B2 (en) | 2014-09-28 | 2020-11-24 | Zhejiang Super Lighting Electric Appliance Co., Ltd. | LED filament and LED light bulb |
US10976009B2 (en) | 2014-09-28 | 2021-04-13 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED filament light bulb |
TWI575184B (zh) * | 2015-08-11 | 2017-03-21 | LED bulb structure | |
US11168844B2 (en) | 2015-08-17 | 2021-11-09 | Zhejiang Super Lighting Electric Appliance Co., Ltd | LED light bulb having filament with segmented light conversion layer |
US10359152B2 (en) | 2015-08-17 | 2019-07-23 | Zhejiang Super Lighting Electric Appliance Co, Ltd | LED filament and LED light bulb |
GB2543139B (en) * | 2015-08-17 | 2018-05-23 | Jiaxing Super Lighting Electric Appliance Co Ltd | LED light bulb and LED filament thereof |
CN106555942A (zh) * | 2015-09-29 | 2017-04-05 | 上海德士电器有限公司 | Led光源模组及包括其的泡形灯 |
USD780958S1 (en) | 2015-12-06 | 2017-03-07 | GE Lighting Solutions, LLC | Retrofit lamp with LED light source filament |
USD785821S1 (en) | 2015-12-06 | 2017-05-02 | GE Lighting Solutions, LLC | Retrofit lamp with LED light source filament |
USD790086S1 (en) | 2015-12-06 | 2017-06-20 | GE Lighting Solutions, LLC | Retrofit lamp with LED light source filament |
USD789569S1 (en) | 2015-12-06 | 2017-06-13 | GE Lighting Solutions, LLC | Retrofit lamp with LED light source filament |
CN205388272U (zh) * | 2016-01-19 | 2016-07-20 | 鹤山建豪电光源有限公司 | 一种led汽车灯泡 |
WO2017133770A1 (en) * | 2016-02-04 | 2017-08-10 | Osram Opto Semiconductors Gmbh | Led-filament and illuminant with led-filament |
CA3011489A1 (en) * | 2016-04-27 | 2017-11-02 | Jiaxing Super Lighting Electric Appliance Co., Ltd | Led light bulb |
CN205746257U (zh) * | 2016-05-12 | 2016-11-30 | 广州市五度光电科技有限公司 | 一种可任意弯折和定型的led灯条 |
CN107676637A (zh) * | 2016-08-01 | 2018-02-09 | 漳州立达信光电子科技有限公司 | 全向出光led灯 |
EP3290773B1 (en) * | 2016-09-05 | 2019-05-01 | Double Good Co. | Led light bulb and fabrication method thereof |
EP3508036A1 (en) * | 2016-09-05 | 2019-07-10 | Signify Holding B.V. | Led-filament and lighting device comprising the led-filament. |
TW201705557A (zh) * | 2016-10-26 | 2017-02-01 | Liquidleds Lighting Corp | 具有散熱結構的led燈絲及應用該led燈絲的led燈泡 |
JP6850112B2 (ja) * | 2016-11-28 | 2021-03-31 | 株式会社ディスコ | Led組み立て方法 |
US10535805B2 (en) | 2017-01-13 | 2020-01-14 | Intematix Corporation | Narrow-band red phosphors for LED lamps |
AU2018210361A1 (en) | 2017-01-20 | 2019-08-08 | Charles Hugo OSTMAN | Light emitting structures |
JP3210623U (ja) * | 2017-03-10 | 2017-06-01 | スワン電器株式会社 | 吊り下げ式装飾灯 |
TWI678495B (zh) * | 2017-03-31 | 2019-12-01 | 液光固態照明股份有限公司 | 發光二極體燈具 |
CN107514553A (zh) * | 2017-07-31 | 2017-12-26 | 浙江亿米光电科技有限公司 | 一种带自成型led光源的灯泡 |
DE102017121186A1 (de) * | 2017-09-13 | 2019-03-14 | Eaton Intelligent Power Limited | Signalleuchte und Signalmodul |
US20190139948A1 (en) * | 2017-11-03 | 2019-05-09 | Xiamen Eco Lighting Co. Ltd. | Led lighting apparatus |
KR102527952B1 (ko) * | 2017-11-10 | 2023-05-03 | 서울반도체 주식회사 | 발광 소자 필라멘트 |
KR102459144B1 (ko) * | 2017-11-20 | 2022-10-27 | 서울반도체 주식회사 | 전구형 광원 |
DE102017127721A1 (de) * | 2017-11-23 | 2019-05-23 | Osram Opto Semiconductors Gmbh | Led-filament mit konversionsschicht |
US10790419B2 (en) | 2017-12-26 | 2020-09-29 | Jiaxing Super Lighting Electric Appliance Co., Ltd | LED filament and LED light bulb |
JP3230017U (ja) | 2017-12-26 | 2021-01-07 | 嘉▲興▼山蒲照明▲電▼器有限公司Jiaxing Super Lighting Electric Appliance Co.,Ltd | 発光ダイオードフィラメント及び発光ダイオード電球 |
CN108269901B (zh) * | 2018-01-16 | 2019-08-23 | 深圳市晨日科技股份有限公司 | 一种用于灯管的led倒装线形光源及其制备方法 |
EP3784954A1 (en) * | 2018-04-26 | 2021-03-03 | Lumileds LLC | Flexible led lighting strip with slanted leds |
US10685941B1 (en) * | 2019-07-09 | 2020-06-16 | Intematix Corporation | Full spectrum white light emitting devices |
US10371325B1 (en) | 2018-06-25 | 2019-08-06 | Intematix Corporation | Full spectrum white light emitting devices |
DE102018118822A1 (de) * | 2018-08-02 | 2020-02-06 | Osram Opto Semiconductors Gmbh | Leuchtfadenvorrichtung und verfahren zur herstellung einer leuchtfadenvorrichtung |
CN110957307A (zh) * | 2018-09-27 | 2020-04-03 | Bgt材料有限公司 | 发光二极管灯丝和发光二极管灯丝灯泡 |
US10752294B2 (en) | 2018-11-28 | 2020-08-25 | Ford Global Technologies, Llc | Vehicle with removable outer body panel and detachable tail lamp support, and corresponding method |
US11781714B2 (en) | 2019-03-18 | 2023-10-10 | Bridgelux, Inc. | LED-filaments and LED-filament lamps |
WO2020190960A1 (en) * | 2019-03-18 | 2020-09-24 | Intematix Corporation | Led-filament |
CN113841238A (zh) | 2019-03-18 | 2021-12-24 | 英特曼帝克司公司 | Led灯丝 |
US11342311B2 (en) | 2019-03-18 | 2022-05-24 | Intematix Corporation | LED-filaments and LED-filament lamps utilizing manganese-activated fluoride red photoluminescence material |
EP3942620A1 (en) | 2019-03-18 | 2022-01-26 | Intematix Corporation | Packaged white light emitting device comprising photoluminescence layered structure |
EP3715699A1 (en) * | 2019-03-29 | 2020-09-30 | GaN Power Technology Co., Ltd. | Led light bulb |
WO2020221653A1 (en) | 2019-05-02 | 2020-11-05 | Signify Holding B.V. | Led filament lamp |
US11887973B2 (en) | 2019-07-09 | 2024-01-30 | Intematix Corporation | Full spectrum white light emitting devices |
CN110739382B (zh) * | 2019-09-03 | 2020-12-29 | 浙江凯耀照明有限责任公司 | 一种高显色指数和光效的led发光器件 |
CN114423990A (zh) | 2019-09-17 | 2022-04-29 | 昕诺飞控股有限公司 | 包括led条的照明设备 |
US11859775B2 (en) | 2019-09-19 | 2024-01-02 | Signify Holding B.V. | Light-emitting diode filament arrangement comprising at least one bending unit |
CN213333738U (zh) * | 2020-08-31 | 2021-06-01 | 杭州杭科光电集团股份有限公司 | 颜色可控的led发光灯 |
CN213394756U (zh) * | 2020-11-10 | 2021-06-08 | 广东欧曼科技股份有限公司 | 基于csp或fc芯片的荧光led灯条 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201043697Y (zh) * | 2007-04-30 | 2008-04-02 | 陈大庆 | Led图文灯 |
CN102650385A (zh) * | 2011-02-25 | 2012-08-29 | 瑞莹光电股份有限公司 | 发光二极管灯具及其制造方法 |
CN102650380A (zh) * | 2011-02-25 | 2012-08-29 | 瑞莹光电股份有限公司 | 发光二极管灯具及其制造方法 |
US20130111744A1 (en) * | 2011-09-07 | 2013-05-09 | Michael A. Tischler | Broad-area lighting systems |
CN103123949A (zh) * | 2011-11-21 | 2013-05-29 | 展晶科技(深圳)有限公司 | 可挠式发光二极管封装结构及其制造方法 |
Family Cites Families (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5660461A (en) * | 1994-12-08 | 1997-08-26 | Quantum Devices, Inc. | Arrays of optoelectronic devices and method of making same |
JP3075689U (ja) * | 2000-08-17 | 2001-02-27 | 舶用電球株式会社 | Led電球 |
KR100563970B1 (ko) | 2004-05-03 | 2006-03-30 | 이엘코리아 주식회사 | 플렉시블 무기 el 돔시트 및 이를 이용한 플렉시블 무기 el 돔시트 키패드 |
JP2007165811A (ja) * | 2005-12-16 | 2007-06-28 | Nichia Chem Ind Ltd | 発光装置 |
KR100885894B1 (ko) * | 2006-09-29 | 2009-02-26 | 폴리트론 테크놀로지스 인크 | Led 발광 장치의 플래인 구조체 |
US20110019433A1 (en) * | 2008-03-17 | 2011-01-27 | Osram Gesellschaft Mit Beschraenkter Haftung | Led lighting device |
US20090251882A1 (en) * | 2008-04-03 | 2009-10-08 | General Led, Inc. | Light-emitting diode illumination structures |
JP2010087051A (ja) | 2008-09-29 | 2010-04-15 | Toyoda Gosei Co Ltd | 発光装置 |
JP5320627B2 (ja) * | 2009-05-14 | 2013-10-23 | 東芝ライテック株式会社 | 口金付ランプおよび照明器具 |
WO2011111399A1 (ja) | 2010-03-11 | 2011-09-15 | パナソニック株式会社 | 発光モジュール、光源装置、液晶表示装置および発光モジュールの製造方法 |
JP5533183B2 (ja) * | 2010-04-20 | 2014-06-25 | 日亜化学工業株式会社 | Led光源装置及びその製造方法 |
JP2012018865A (ja) * | 2010-07-09 | 2012-01-26 | Panasonic Corp | Ledモジュール、およびledランプ |
EP2597354B1 (en) * | 2010-07-20 | 2016-12-28 | Panasonic Intellectual Property Management Co., Ltd. | Lightbulb shaped lamp |
DK2535640T4 (da) * | 2010-09-08 | 2020-09-28 | Zhejiang Ledison Optoelectronics Co Ltd | LED-pære og LED-belysningsliste til udsendelse af lys over 4 PI |
EP2631958A1 (en) | 2010-10-22 | 2013-08-28 | Panasonic Corporation | Mounting board, light emitting device and lamp |
PL2655956T3 (pl) * | 2010-12-22 | 2020-12-28 | Signify Holding B.V. | Urządzenie oświetleniowe i sposób wytwarzania urządzenia oświetleniowego |
EP2492979A4 (en) * | 2010-12-27 | 2012-11-28 | Panasonic Corp | LIGHT EMITTING DEVICE AND LAMP |
JPWO2012095931A1 (ja) * | 2011-01-14 | 2014-06-09 | パナソニック株式会社 | ランプ及び照明装置 |
US8314566B2 (en) * | 2011-02-22 | 2012-11-20 | Quarkstar Llc | Solid state lamp using light emitting strips |
CN105826311B (zh) | 2011-04-20 | 2019-06-25 | 松下知识产权经营株式会社 | 发光装置、背光单元、液晶显示装置以及照明装置 |
TW201303207A (zh) | 2011-07-05 | 2013-01-16 | Ind Tech Res Inst | 照明裝置 |
US20120175667A1 (en) * | 2011-10-03 | 2012-07-12 | Golle Aaron J | Led light disposed on a flexible substrate and connected with a printed 3d conductor |
TW201320412A (zh) * | 2011-11-14 | 2013-05-16 | Evergreen Optronics Inc | 發光二極體封裝 |
KR20140097404A (ko) | 2011-11-23 | 2014-08-06 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 3차원 구조를 갖는 가요성 발광 반도체 디바이스 |
JP5895166B2 (ja) * | 2012-02-13 | 2016-03-30 | パナソニックIpマネジメント株式会社 | 発光モジュール、ランプ及び照明装置 |
TWM459520U (zh) | 2013-01-28 | 2013-08-11 | Xu-Wen Liao | 雙面發光之led燈板結構 |
JP6210830B2 (ja) * | 2013-05-27 | 2017-10-11 | シチズン時計株式会社 | Led電球 |
TWI626395B (zh) | 2013-06-11 | 2018-06-11 | 晶元光電股份有限公司 | 發光裝置 |
-
2013
- 2013-09-11 TW TW102132806A patent/TWI599745B/zh active
-
2014
- 2014-09-08 US US14/480,084 patent/US9231171B2/en not_active Ceased
- 2014-09-10 JP JP2014183805A patent/JP6494963B2/ja active Active
- 2014-09-11 CN CN201410460339.XA patent/CN104425476A/zh active Pending
- 2014-09-11 CN CN202010418418.XA patent/CN111640736B/zh active Active
-
2018
- 2018-01-05 US US15/863,710 patent/USRE49031E1/en active Active
-
2019
- 2019-03-06 JP JP2019040727A patent/JP6851411B2/ja active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201043697Y (zh) * | 2007-04-30 | 2008-04-02 | 陈大庆 | Led图文灯 |
CN102650385A (zh) * | 2011-02-25 | 2012-08-29 | 瑞莹光电股份有限公司 | 发光二极管灯具及其制造方法 |
CN102650380A (zh) * | 2011-02-25 | 2012-08-29 | 瑞莹光电股份有限公司 | 发光二极管灯具及其制造方法 |
US20130111744A1 (en) * | 2011-09-07 | 2013-05-09 | Michael A. Tischler | Broad-area lighting systems |
CN103123949A (zh) * | 2011-11-21 | 2013-05-29 | 展晶科技(深圳)有限公司 | 可挠式发光二极管封装结构及其制造方法 |
Also Published As
Publication number | Publication date |
---|---|
JP2019091944A (ja) | 2019-06-13 |
TW201510440A (zh) | 2015-03-16 |
US9231171B2 (en) | 2016-01-05 |
USRE49031E1 (en) | 2022-04-12 |
TWI599745B (zh) | 2017-09-21 |
US20150069442A1 (en) | 2015-03-12 |
CN111640736B (zh) | 2022-07-15 |
JP6851411B2 (ja) | 2021-03-31 |
CN104425476A (zh) | 2015-03-18 |
JP2015056667A (ja) | 2015-03-23 |
JP6494963B2 (ja) | 2019-04-03 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN111640736B (zh) | 可挠式发光二极管组件及发光二极管灯泡 | |
US11543081B2 (en) | LED assembly with omnidirectional light field | |
JP4989936B2 (ja) | 照明装置 | |
US9488345B2 (en) | Light emitting device, illumination apparatus including the same, and mounting substrate | |
US7918581B2 (en) | Lighting device and lighting method | |
US20110089815A1 (en) | Light-emitting device | |
US8421102B2 (en) | Semiconductor light-emitting device having a member in a periphery made of a material whose color, transparency or adhesiveness changes overtime due to light or heat emission from the emitting element | |
US10096749B2 (en) | Illumination light source, illumination apparatus, outdoor illumination apparatus, and vehicle headlight | |
TWI613391B (zh) | 發光二極體組件及應用此發光二極體組件的發光二極體燈泡 | |
JP2007258620A (ja) | 発光装置 | |
KR20190128870A (ko) | Led 장치 및 이를 이용한 led 램프 | |
JP2008244468A (ja) | 発光装置 | |
TWI620895B (zh) | 可撓式發光二極體組件及發光二極體燈泡 | |
JP2008244469A (ja) | 発光装置 | |
US10096747B2 (en) | Lumen maintenance factor deterioration suppressing LED module | |
TWI632322B (zh) | 可撓式發光二極體組件及發光二極體燈泡 | |
TWI655395B (zh) | 可撓式發光二極體組件及發光二極體燈泡 | |
TWI599746B (zh) | 可撓式發光二極體組件及發光二極體燈泡 | |
JP2016058650A (ja) | 発光装置、照明用光源、及び照明装置 | |
CN208846103U (zh) | 一种灯丝 | |
KR20130027653A (ko) | Led 백색 광원모듈 | |
TWI713236B (zh) | 發光二極體組件及製作方法 | |
KR100864476B1 (ko) | 발광 다이오드 조명 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |