CN110059790B - 一种rfid芯片的保护方法及装置 - Google Patents
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Abstract
本发明公开一种RFID芯片的保护方法及装置。方法包括:制备RFID芯片,所述RFID芯片包括透明膜、天线和芯片,所述芯片与所述天线通过导电胶水连接,所述芯片和所述天线位于所述透明膜上;将所述RFID芯片的第一侧面附着在双面胶的第一侧面上,所述RFID芯片的第一侧面为包含所述透明膜、所述天线和所述芯片的面;将所述双面胶的第二侧面与离型材料粘合。采用本发明能够保护RFID芯片免受外部的破坏,扩大RFID芯片的使用范围。
Description
技术领域
本发明涉及RFID芯片保护领域,特别是涉及一种RFID芯片的保护方法及装置。
背景技术
RFID芯片中的天线与芯片通常用一种导电胶相互连接,芯片和天线只通过一个很小面积的导电胶连接,连接处很容易因受到弯折、拍打和高温而发生脱落。因此,这种天线的使用具有局限性。
发明内容
本发明的目的是提供一种RFID芯片的保护方法及装置,能够保护RFID芯片免受外部的破坏,扩大RFID芯片的使用范围。
为实现上述目的,本发明提供了如下方案:
一种RFID芯片的保护方法,包括:
制备RFID芯片,所述RFID芯片包括透明膜、天线和芯片,所述芯片与所述天线通过导电胶水连接,所述芯片和所述天线位于所述透明膜上;
将所述RFID芯片的第一侧面附着在双面胶的第一侧面上,所述RFID芯片的第一侧面为包含所述透明膜、所述天线和所述芯片的面;
将所述双面胶的第二侧面与离型材料粘合。
可选的,所述双面胶的厚度大于所述RFID芯片的厚度。
可选的,所述离型材料采用离型纸或离型膜。
一种RFID芯片的保护装置,包括:依次连接的RFID芯片层、双面胶层和离型材料层,其中,所述RFID芯片层包含透明膜、天线和芯片的一侧与双面胶层连接。
一种RFID芯片的保护方法,包括:
制备RFID芯片,所述RFID芯片包括透明膜、天线和芯片,所述芯片与所述天线通过导电胶水连接,所述芯片和所述天线位于所述透明膜上;
将所述RFID芯片的第一侧面与第二侧面均附着在双面胶的一个侧面上,所述RFID芯片的第一侧面为包含所述透明膜、所述天线和所述芯片的面;
将所述双面胶的另一个侧面与离型材料粘合。
可选的,所述双面胶的厚度大于所述RFID芯片的厚度。
可选的,所述离型材料采用离型纸或离型膜。
一种RFID芯片的保护装置,包括:依次连接的第一离型材料层、第一双面胶层、RFID芯片层、第二双面胶层和第二离型材料层。
根据本发明提供的具体实施例,本发明公开了以下技术效果:本发明提供一种RFID芯片的保护方法,包括:制备RFID芯片,所述RFID芯片包括透明膜、天线和芯片,所述芯片与所述天线通过导电胶水连接,所述芯片和所述天线位于所述透明膜上;将所述RFID芯片的第一侧面附着在双面胶的第一侧面上,所述RFID芯片的第一侧面为包含所述透明膜、所述天线和所述芯片的面;将所述双面胶的第二侧面与离型材料粘合。双面胶具有一定的厚度,能够把芯片凸起的部分包裹起来,使芯片与天线结合成一个整体。同时离型材料的存在使芯片的部位在发生弯折的时候大大减小弯折的角度,由于离型材料和双面胶有一定的厚度,几乎不太可能弯折到天线与芯片的接口部位,从而保护标签不受损坏。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面将对实施例中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动性的前提下,还可以根据这些附图获得其他的附图。
图1为本发明RFID芯片的保护方法实施例一的流程图;
图2为本发明RFID芯片的保护保护装置实施例一的结构图;
图3为本发明RFID芯片的保护方法实施例二的流程图;
图4为本发明RFID芯片的保护保护装置实施例二的结构图。
具体实施方式
下面将结合本发明实施例中的附图,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
本发明的目的是提供一种RFID芯片的保护方法及装置,能够保护RFID芯片免受外部的破坏,扩大RFID芯片的使用范围。
为使本发明的上述目的、特征和优点能够更加明显易懂,下面结合附图和具体实施方式对本发明作进一步详细的说明。
实施例1:
图1为本发明RFID芯片的保护方法实施例一的流程图。如图1所示,一种RFID芯片的保护方法包括:
步骤101:制备RFID芯片,所述RFID芯片包括透明膜、天线和芯片,所述芯片与所述天线通过导电胶水连接,所述芯片和所述天线位于所述透明膜上;
步骤102:将所述RFID芯片的第一侧面附着在双面胶的第一侧面上,所述RFID芯片的第一侧面为包含所述透明膜、所述天线和所述芯片的面,所述双面胶的厚度大于所述RFID芯片的厚度,所述双面胶采用有基材双面胶;
步骤103:将所述双面胶的第二侧面与离型材料粘合,所述离型材料采用离型纸或离型膜。
双面胶具有一定的厚度,能够把芯片凸起的部分包裹起来,使芯片与天线结合成一个整体。同时离型材料的存在使芯片的部位在发生弯折的时候大大减小弯折的角度,由于离型材料和双面胶有一定的厚度,几乎不太可能弯折到天线与芯片的接口部位,从而保护标签不受损坏。本发明的方法可以巧妙的运用简单的方法保护RFID芯片中天线和芯片的连接更牢固,几乎不可能出现脱落情况,简单高效率的解决了当前的问题。
图2为本发明RFID芯片的保护保护装置实施例一的结构图。如图2所示,一种RFID芯片的保护装置包括:依次连接的RFID芯片层3、双面胶层2和离型材料层1,其中,所述RFID芯片层包含透明膜、天线和芯片的一侧与双面胶层连接。
本发明的方法保护的产品可以任意放置于其它产品的结构内部,特别是容易弯折的产品。
根据本发明的方法制备的RFID芯片保护装置在实际使用时,在RFID芯片保护装置的一侧切一条小口,切小口处的离型材料部分剥离,粘在产品结构内部。这样产品在弯折的时候,RFID芯片会根据产品弯折自动收缩伸展,不容易受到外力挤压变型,从而避免导致RFID芯片中的芯片与天线的接口部分的导电胶脱离,使产品RFID芯片功能失效。也可以在RFID保护装置中间打孔将RFID芯片保护装置固定在产品的内部,孔的大小结构取决于天线的结构,这种操作方式的作用是固定天线在产品结构内部,不产生偏移,同时也解决热胀冷缩、位移、偏移对RFID芯片的影响,达到保护RFID芯片在产品内部持久使用的目的。
实施例2:
图3为本发明RFID芯片的保护方法实施例二的流程图。如图3所示,一种RFID芯片的保护方法包括:
步骤201:制备RFID芯片,所述RFID芯片包括透明膜、天线和芯片,所述芯片与所述天线通过导电胶水连接,所述芯片和所述天线位于所述透明膜上;
步骤202:将所述RFID芯片的第一侧面与第二侧面均附着在双面胶的一个侧面上,所述RFID芯片的第一侧面为包含所述透明膜、所述天线和所述芯片的面,所述双面胶的厚度大于所述RFID芯片的厚度;
步骤203:将所述双面胶的另一个侧面与离型材料粘合,所述离型材料采用离型纸或离型膜。
图4为本发明RFID芯片的保护保护装置实施例二的结构图。如图4所示,一种RFID芯片的保护装置包括:依次连接的第一离型材料层4、第一双面胶层5、RFID芯片层3、第二双面胶层6和第二离型材料层7。
本说明书中各个实施例采用递进的方式描述,每个实施例重点说明的都是与其他实施例的不同之处,各个实施例之间相同相似部分互相参见即可。对于实施例公开的系统而言,由于其与实施例公开的方法相对应,所以描述的比较简单,相关之处参见方法部分说明即可。
本文中应用了具体个例对本发明的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本发明的方法及其核心思想;同时,对于本领域的一般技术人员,依据本发明的思想,在具体实施方式及应用范围上均会有改变之处。综上所述,本说明书内容不应理解为对本发明的限制。
Claims (6)
1.一种RFID芯片的保护方法,其特征在于,包括:
制备RFID芯片,所述RFID芯片包括透明膜、天线和芯片,所述芯片与所述天线通过导电胶水连接,所述芯片和所述天线位于所述透明膜上;
将所述RFID芯片的第一侧面附着在双面胶的第一侧面上,所述RFID芯片的第一侧面为包含所述透明膜、所述天线和所述芯片的面;
将所述双面胶的第二侧面与离型材料粘合;
所述双面胶的厚度大于所述RFID芯片的厚度;
双面胶具有一定的厚度,能够把芯片凸起的部分包裹起来,使芯片与天线结合成一个整体,同时离型材料的存在使芯片的部位在发生弯折时减小弯折的角度,由于离型材料和双面胶有一定的厚度,避免弯折到天线与芯片的接口部位,从而保护标签不受损坏。
2.根据权利要求1所述的RFID芯片的保护方法,其特征在于,所述离型材料采用离型纸或离型膜。
3.一种根据权利要求1-2中任意一项所述的RFID芯片的保护方法制备的RFID芯片的保护装置,其特征在于,包括:依次连接的RFID芯片层、双面胶层和离型材料层,其中,所述RFID芯片层包含透明膜、天线和芯片的一侧与双面胶层连接。
4.一种RFID芯片的保护方法,其特征在于,包括:
将所述RFID芯片的第一侧面与第二侧面均附着在双面胶的一个侧面上,所述RFID芯片的第一侧面为包含透明膜、天线和所述芯片的面;
将所述双面胶的另一个侧面与离型材料粘合;
所述双面胶的厚度大于所述RFID芯片的厚度;
双面胶具有一定的厚度,能够把芯片凸起的部分包裹起来,使芯片与天线结合成一个整体,同时离型材料的存在使芯片的部位在发生弯折时减小弯折的角度,由于离型材料和双面胶有一定的厚度,避免弯折到天线与芯片的接口部位,从而保护标签不受损坏。
5.根据权利要求4所述的RFID芯片的保护方法,其特征在于,所述离型材料采用离型纸或离型膜。
6.一种根据权利要求4-5中任意一项所述的RFID芯片的保护方法制备的RFID芯片的保护装置,其特征在于,包括:依次连接的第一离型材料层、第一双面胶层、RFID芯片层、第二双面胶层和第二离型材料层。
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US16/506,182 US20200334510A1 (en) | 2019-04-22 | 2019-07-09 | Rfid chip protecting method and apparatus |
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CN101239604A (zh) * | 2007-02-09 | 2008-08-13 | 纽奥奇有限公司 | 电子车牌 |
CN202089924U (zh) * | 2011-06-23 | 2011-12-28 | 温州格洛博电子有限公司 | 一种带rfid芯片的双面胶 |
CN206877359U (zh) * | 2017-07-07 | 2018-01-12 | 上海优比科电子科技有限公司 | 一种用于太阳能板的rfid标签 |
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CN101239604A (zh) * | 2007-02-09 | 2008-08-13 | 纽奥奇有限公司 | 电子车牌 |
CN202089924U (zh) * | 2011-06-23 | 2011-12-28 | 温州格洛博电子有限公司 | 一种带rfid芯片的双面胶 |
CN207459190U (zh) * | 2015-01-15 | 2018-06-05 | 株式会社村田制作所 | 天线装置 |
CN206877359U (zh) * | 2017-07-07 | 2018-01-12 | 上海优比科电子科技有限公司 | 一种用于太阳能板的rfid标签 |
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