CN110042393A - 蚀刻液组合物 - Google Patents
蚀刻液组合物 Download PDFInfo
- Publication number
- CN110042393A CN110042393A CN201910275642.5A CN201910275642A CN110042393A CN 110042393 A CN110042393 A CN 110042393A CN 201910275642 A CN201910275642 A CN 201910275642A CN 110042393 A CN110042393 A CN 110042393A
- Authority
- CN
- China
- Prior art keywords
- etchant
- etching
- film
- copper
- titanium
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005530 etching Methods 0.000 claims abstract description 106
- 150000001875 compounds Chemical class 0.000 claims abstract description 20
- NILJXUMQIIUAFY-UHFFFAOYSA-N hydroxylamine;nitric acid Chemical compound ON.O[N+]([O-])=O NILJXUMQIIUAFY-UHFFFAOYSA-N 0.000 claims abstract description 18
- JRKICGRDRMAZLK-UHFFFAOYSA-L peroxydisulfate Chemical compound [O-]S(=O)(=O)OOS([O-])(=O)=O JRKICGRDRMAZLK-UHFFFAOYSA-L 0.000 claims abstract description 16
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 claims abstract description 15
- 229910017604 nitric acid Inorganic materials 0.000 claims abstract description 15
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 55
- 239000010949 copper Substances 0.000 claims description 55
- 229910052802 copper Inorganic materials 0.000 claims description 52
- 239000010936 titanium Substances 0.000 claims description 49
- 229910052719 titanium Inorganic materials 0.000 claims description 49
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 47
- 229910052751 metal Inorganic materials 0.000 claims description 23
- 239000002184 metal Substances 0.000 claims description 23
- UFYKDFXCZBTLOO-TXICZTDVSA-N 2-amino-2-deoxy-D-gluconic acid Chemical compound [O-]C(=O)[C@H]([NH3+])[C@@H](O)[C@H](O)[C@H](O)CO UFYKDFXCZBTLOO-TXICZTDVSA-N 0.000 claims description 16
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 claims description 14
- 239000000203 mixture Substances 0.000 claims description 11
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Chemical compound [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 claims description 10
- ROOXNKNUYICQNP-UHFFFAOYSA-N ammonium persulfate Chemical compound [NH4+].[NH4+].[O-]S(=O)(=O)OOS([O-])(=O)=O ROOXNKNUYICQNP-UHFFFAOYSA-N 0.000 claims description 8
- LBLYYCQCTBFVLH-UHFFFAOYSA-N 2-Methylbenzenesulfonic acid Chemical compound CC1=CC=CC=C1S(O)(=O)=O LBLYYCQCTBFVLH-UHFFFAOYSA-N 0.000 claims description 7
- 229940098779 methanesulfonic acid Drugs 0.000 claims description 6
- LNOPIUAQISRISI-UHFFFAOYSA-N n'-hydroxy-2-propan-2-ylsulfonylethanimidamide Chemical compound CC(C)S(=O)(=O)CC(N)=NO LNOPIUAQISRISI-UHFFFAOYSA-N 0.000 claims description 6
- 229910000881 Cu alloy Inorganic materials 0.000 claims description 5
- 150000003839 salts Chemical class 0.000 claims description 5
- 229910001069 Ti alloy Inorganic materials 0.000 claims description 4
- 229910001870 ammonium persulfate Inorganic materials 0.000 claims description 4
- RGHNJXZEOKUKBD-UHFFFAOYSA-N D-gluconic acid Natural products OCC(O)C(O)C(O)C(O)C(O)=O RGHNJXZEOKUKBD-UHFFFAOYSA-N 0.000 claims description 2
- RGHNJXZEOKUKBD-SQOUGZDYSA-N Gluconic acid Natural products OC[C@@H](O)[C@@H](O)[C@H](O)[C@@H](O)C(O)=O RGHNJXZEOKUKBD-SQOUGZDYSA-N 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- 239000000174 gluconic acid Substances 0.000 claims description 2
- 235000012208 gluconic acid Nutrition 0.000 claims description 2
- AHIBWURJLGCHAY-UHFFFAOYSA-N [S].C1=CC=CC=C1 Chemical compound [S].C1=CC=CC=C1 AHIBWURJLGCHAY-UHFFFAOYSA-N 0.000 claims 1
- OTYBMLCTZGSZBG-UHFFFAOYSA-L potassium sulfate Chemical compound [K+].[K+].[O-]S([O-])(=O)=O OTYBMLCTZGSZBG-UHFFFAOYSA-L 0.000 claims 1
- 229910052939 potassium sulfate Inorganic materials 0.000 claims 1
- 235000011151 potassium sulphates Nutrition 0.000 claims 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 18
- 238000004064 recycling Methods 0.000 abstract description 18
- 239000002699 waste material Substances 0.000 abstract description 16
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 239000004065 semiconductor Substances 0.000 abstract description 13
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 abstract description 11
- 229910001431 copper ion Inorganic materials 0.000 abstract description 11
- 230000008859 change Effects 0.000 abstract description 6
- 239000000758 substrate Substances 0.000 abstract description 5
- 239000000243 solution Substances 0.000 description 17
- 230000000694 effects Effects 0.000 description 15
- 230000000052 comparative effect Effects 0.000 description 14
- 230000008569 process Effects 0.000 description 10
- 230000008901 benefit Effects 0.000 description 8
- -1 cyclic amine compound Chemical class 0.000 description 6
- 238000000605 extraction Methods 0.000 description 6
- SRSXLGNVWSONIS-UHFFFAOYSA-N benzenesulfonic acid Chemical compound OS(=O)(=O)C1=CC=CC=C1 SRSXLGNVWSONIS-UHFFFAOYSA-N 0.000 description 5
- 229940092714 benzenesulfonic acid Drugs 0.000 description 5
- 239000007788 liquid Substances 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- DHMQDGOQFOQNFH-UHFFFAOYSA-N Glycine Chemical compound NCC(O)=O DHMQDGOQFOQNFH-UHFFFAOYSA-N 0.000 description 4
- AVXURJPOCDRRFD-UHFFFAOYSA-N Hydroxylamine Chemical compound ON AVXURJPOCDRRFD-UHFFFAOYSA-N 0.000 description 4
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 4
- 238000004090 dissolution Methods 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 229910021645 metal ion Inorganic materials 0.000 description 4
- 239000012074 organic phase Substances 0.000 description 4
- 239000012071 phase Substances 0.000 description 4
- 230000003244 pro-oxidative effect Effects 0.000 description 4
- 238000011084 recovery Methods 0.000 description 4
- 229910000597 tin-copper alloy Inorganic materials 0.000 description 4
- 239000000470 constituent Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 3
- 229920002120 photoresistant polymer Polymers 0.000 description 3
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 3
- 235000019394 potassium persulphate Nutrition 0.000 description 3
- 230000006641 stabilisation Effects 0.000 description 3
- 238000011105 stabilization Methods 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 239000004471 Glycine Substances 0.000 description 2
- 229910001182 Mo alloy Inorganic materials 0.000 description 2
- 229910004205 SiNX Inorganic materials 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-L Sulfate Chemical compound [O-]S([O-])(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-L 0.000 description 2
- LCKIEQZJEYYRIY-UHFFFAOYSA-N Titanium ion Chemical compound [Ti+4] LCKIEQZJEYYRIY-UHFFFAOYSA-N 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 150000003863 ammonium salts Chemical class 0.000 description 2
- 229910021417 amorphous silicon Inorganic materials 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 229910052791 calcium Inorganic materials 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000004432 carbon atom Chemical group C* 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 229910052804 chromium Inorganic materials 0.000 description 2
- 229910052681 coesite Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 229910052906 cristobalite Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000010790 dilution Methods 0.000 description 2
- 239000012895 dilution Substances 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 229910052749 magnesium Inorganic materials 0.000 description 2
- 229910052748 manganese Inorganic materials 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910052682 stishovite Inorganic materials 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910052905 tridymite Inorganic materials 0.000 description 2
- 229910052726 zirconium Inorganic materials 0.000 description 2
- ODIGIKRIUKFKHP-UHFFFAOYSA-N (n-propan-2-yloxycarbonylanilino) acetate Chemical compound CC(C)OC(=O)N(OC(C)=O)C1=CC=CC=C1 ODIGIKRIUKFKHP-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- PSDYQSWHANEKRV-UHFFFAOYSA-N [S]N Chemical compound [S]N PSDYQSWHANEKRV-UHFFFAOYSA-N 0.000 description 1
- ZXTFQUMXDQLMBY-UHFFFAOYSA-N alumane;molybdenum Chemical compound [AlH3].[Mo] ZXTFQUMXDQLMBY-UHFFFAOYSA-N 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 238000003491 array Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 239000003792 electrolyte Substances 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 230000003628 erosive effect Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 239000003350 kerosene Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 150000007522 mineralic acids Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/18—Acidic compositions for etching copper or alloys thereof
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- C23F1/00—Etching metallic material by chemical means
- C23F1/10—Etching compositions
- C23F1/14—Aqueous compositions
- C23F1/16—Acidic compositions
- C23F1/26—Acidic compositions for etching refractory metals
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Weting (AREA)
- ing And Chemical Polishing (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
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CN201910275642.5A CN110042393B (zh) | 2019-04-08 | 2019-04-08 | 蚀刻液组合物 |
Applications Claiming Priority (1)
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CN201910275642.5A CN110042393B (zh) | 2019-04-08 | 2019-04-08 | 蚀刻液组合物 |
Publications (2)
Publication Number | Publication Date |
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CN110042393A true CN110042393A (zh) | 2019-07-23 |
CN110042393B CN110042393B (zh) | 2020-11-24 |
Family
ID=67276354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201910275642.5A Active CN110042393B (zh) | 2019-04-08 | 2019-04-08 | 蚀刻液组合物 |
Country Status (1)
Country | Link |
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CN (1) | CN110042393B (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110904456A (zh) * | 2019-12-28 | 2020-03-24 | 苏州天承化工有限公司 | 一种铜蚀刻液及其制备方法和应用 |
CN115613032A (zh) * | 2022-10-11 | 2023-01-17 | 苏州华星光电技术有限公司 | 蚀刻液 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001029284A1 (en) * | 1999-10-15 | 2001-04-26 | Arch Specialty Chemicals, Inc. | Novel composition for selective etching of oxides over metals |
CN101886266A (zh) * | 2009-05-14 | 2010-11-17 | 三星电子株式会社 | 蚀刻剂和使用蚀刻剂制造阵列基板的方法 |
US20110281436A1 (en) * | 2010-05-14 | 2011-11-17 | Fujifilm Corporation | Cleaning composition, method for producing semiconductor device, and cleaning method |
CN102985596A (zh) * | 2010-06-18 | 2013-03-20 | 三菱瓦斯化学株式会社 | 用于包含铜层和钼层的多层结构膜的蚀刻液 |
CN103898509A (zh) * | 2012-12-24 | 2014-07-02 | 东友Fine-Chem股份有限公司 | 刻蚀剂组合物、金属图案的形成方法和阵列基板的制法 |
WO2018028514A1 (zh) * | 2016-08-09 | 2018-02-15 | 叶涛 | 一种高效且环保的印刷线路板碱性氯化铜蚀刻液 |
-
2019
- 2019-04-08 CN CN201910275642.5A patent/CN110042393B/zh active Active
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001029284A1 (en) * | 1999-10-15 | 2001-04-26 | Arch Specialty Chemicals, Inc. | Novel composition for selective etching of oxides over metals |
CN101886266A (zh) * | 2009-05-14 | 2010-11-17 | 三星电子株式会社 | 蚀刻剂和使用蚀刻剂制造阵列基板的方法 |
US20110281436A1 (en) * | 2010-05-14 | 2011-11-17 | Fujifilm Corporation | Cleaning composition, method for producing semiconductor device, and cleaning method |
CN102985596A (zh) * | 2010-06-18 | 2013-03-20 | 三菱瓦斯化学株式会社 | 用于包含铜层和钼层的多层结构膜的蚀刻液 |
CN103898509A (zh) * | 2012-12-24 | 2014-07-02 | 东友Fine-Chem股份有限公司 | 刻蚀剂组合物、金属图案的形成方法和阵列基板的制法 |
WO2018028514A1 (zh) * | 2016-08-09 | 2018-02-15 | 叶涛 | 一种高效且环保的印刷线路板碱性氯化铜蚀刻液 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110904456A (zh) * | 2019-12-28 | 2020-03-24 | 苏州天承化工有限公司 | 一种铜蚀刻液及其制备方法和应用 |
CN115613032A (zh) * | 2022-10-11 | 2023-01-17 | 苏州华星光电技术有限公司 | 蚀刻液 |
Also Published As
Publication number | Publication date |
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CN110042393B (zh) | 2020-11-24 |
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Effective date of registration: 20211215 Address after: 312030 south of Meilin Road, Kebei Industrial Park, Keqiao District, Shaoxing City, Zhejiang Province Patentee after: SHAOXING YONGLE TEXTILE MACHINERY CO.,LTD. Address before: 312030 1 buildings of Dashan West Village, Keqiao District, Shaoxing, Zhejiang Province Patentee before: Shaoxing Ming Huang Science and Technology Ltd. |
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Denomination of invention: Etching solution composition Effective date of registration: 20211224 Granted publication date: 20201124 Pledgee: Zhejiang Shaoxing Ruifeng rural commercial bank Limited by Share Ltd. Qi Xian Branch Pledgor: SHAOXING YONGLE TEXTILE MACHINERY CO.,LTD. Registration number: Y2021330002625 |
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Date of cancellation: 20221009 Granted publication date: 20201124 Pledgee: Zhejiang Shaoxing Ruifeng rural commercial bank Limited by Share Ltd. Qi Xian Branch Pledgor: SHAOXING YONGLE TEXTILE MACHINERY CO.,LTD. Registration number: Y2021330002625 |
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Denomination of invention: Etching solution composition Effective date of registration: 20221205 Granted publication date: 20201124 Pledgee: Zhejiang Shaoxing Ruifeng rural commercial bank Limited by Share Ltd. Qi Xian Branch Pledgor: SHAOXING YONGLE TEXTILE MACHINERY CO.,LTD. Registration number: Y2022330003503 |