CN110033793A - The manufacturing method of hanging base board with circuit and the hanging base board with circuit - Google Patents
The manufacturing method of hanging base board with circuit and the hanging base board with circuit Download PDFInfo
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- CN110033793A CN110033793A CN201811604673.2A CN201811604673A CN110033793A CN 110033793 A CN110033793 A CN 110033793A CN 201811604673 A CN201811604673 A CN 201811604673A CN 110033793 A CN110033793 A CN 110033793A
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- thickness direction
- terminal
- insulating layer
- circuit
- base board
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- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/48—Disposition or mounting of heads or head supports relative to record carriers ; arrangements of heads, e.g. for scanning the record carrier to increase the relative speed
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/62—Record carriers characterised by the selection of the material
- G11B5/72—Protective coatings, e.g. anti-static or antifriction
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
Abstract
The manufacturing method of the present invention offer hanging base board with circuit and the hanging base board with circuit.Hanging base board with circuit has: metal support layer；Conductive pattern has terminal, which is configured at the side on the thickness direction of metal support layer；And insulating layer, so that metal support layer and conductive pattern is insulated.Terminal has: the other end on thickness direction, from metal support layer and insulating layer exposing；And all end faces, it is covered by insulating layer.Insulating layer includes peripheral part, which surrounds around terminal and cover all end faces, and the other end on the thickness direction of terminal is equipped with coating.Coating has: protection portion, is configured at the other end on the thickness direction of terminal；And protruding portion, it is mutually continuous with protection portion and prominent towards the other side on thickness direction in a manner of being meshed with peripheral part.
Description
Technical field
The present invention relates to the manufacturing methods of the hanging base board with circuit and the hanging base board with circuit.
Background technique
A kind of hanging base board with circuit known, the hanging base board with circuit are equipped with head-slider and in order to make magnetic head
Slider displacement and the piezoelectric element that can be stretched.
For example, proposing a kind of hanging base board (referring for example to Japanese Unexamined Patent Publication 2016-9513 bulletin) with circuit, have
Standby: metal support substrate has base openings portion；Base insulating layer is formed on metal support substrate, and the substrate is exhausted
Edge layer has the terminal openings portion being connected with base openings portion；And conductor layer, have via base openings portion and terminal
The connection terminal of opening portion exposure, connection terminal are formed in a manner of falling into the inside in terminal openings portion.
Summary of the invention
Problems to be solved by the invention
However, in the hanging base board with circuit documented by Japanese Unexamined Patent Publication 2016-9513 bulletin, base insulating layer
The peripheral part in terminal openings portion configured in the mode surrounded around connection terminal.
In such a configuration, exist for the raising of the adaptation between all end faces of connection terminal and base insulating layer
The limit, for example, base insulating layer is removed from all end faces of connection terminal sometimes if external force is applied to the hanging base board with circuit
And gap is generated between all end faces of connection terminal and base insulating layer.If in all end faces of connection terminal and base insulating layer
Between generate gap, then exist moisture etc. enter the gap and make connection terminal corrode worry.
The present invention provides a kind of hanging base board and band with circuit that the peripheral part for being able to suppress insulating layer is removed from terminal
The manufacturing method of the hanging base board of circuit.
The solution to the problem
The solution of the present invention (1) includes a kind of hanging base board with circuit, wherein the hanging base board with circuit has:
Metal support layer；Conductive pattern has terminal, which is configured at one on the thickness direction of the metal support layer
Side；And insulating layer, make to insulate between the metal support layer and the conductive pattern, the terminal has: the thickness
Other end on direction, from the metal support layer and the insulating layer exposing；And all end faces, by the insulating layer
Covering, the insulating layer include peripheral part, which surrounds around the terminal and covering all end faces, at the end
Other end on the thickness direction of son is equipped with coating, and the coating has: protection portion is configured at the institute of the terminal
State the other end on thickness direction；And protruding portion, it is mutually continuous with the protection portion, and to be meshed with the peripheral part
Mode it is prominent towards the other side on the thickness direction.
Using such structure, since the protruding portion of coating with the peripheral part surrounded around terminal in a manner of being meshed
It is prominent, therefore be able to suppress peripheral part and removed from terminal.
The solution of the present invention (2) includes the hanging base board with circuit described in scheme (1), wherein the peripheral part is extremely
Few a part is in contact with the week end face, and at least part of the peripheral part is with from the side on the thickness direction
It is gone towards the other side on the thickness direction and top is thinning.
Using such structure, at least part of peripheral part is in contact with all end faces of terminal, and peripheral part is at least
A part from the side on thickness direction towards the other side with going and top is thinning, and therefore, the protruding portion of coating can be with week
It reliably engages the other end on the thinning thickness direction in the top of edge.Therefore, peripheral part can be reliably suppressed from end
Son removing.
(3) of the invention include the hanging base board with circuit described in above-mentioned (1) or above-mentioned (2), wherein week end face packet
It is contained in the 1 opposite side end face configured spaced apart from each other on the orthogonal direction orthogonal with the thickness direction, 1 opposite side end face
Extend respectively along the thickness direction.
However, the side end face of terminal by relative to thickness direction it is inclined in a manner of extend in the case where, there are it is following not
It is good: if being etched to insulating layer and making terminal exposure as described above, the shape and ruler of terminal when being seen from thickness direction
It is very little to be influenced by the etch quantity of insulating layer and generate deviation.Specifically, the size of terminal becomes to compare when etch quantity is fewer
Smaller, when etch quantity is more, the size of terminal becomes bigger.
On the other hand, using the above structure, 1 opposite side end face of terminal extends respectively along thickness direction.Therefore, from thickness
The shape and size of terminal when direction is seen are not influenced by the etch quantity of insulating layer, can precisely be ensured from thickness direction
The shape and size of terminal when seeing.
(4) of the invention include a kind of manufacturing method of hanging base board with circuit, wherein the hanging base board with circuit
Manufacturing method includes the following process: preparing the process of metal support layer；Ash is utilized in a manner of being formed with thick wall portion and thinner wall section
Spend the process that the side being exposed on the thickness direction of the metal support layer forms the 1st insulating layer；On the 1st insulating layer
The process of basis of formation film；The conductive pattern with terminal is formed on the Ranvier's membrane and is being located at described in the thinner wall section
The process of the terminal is formed on the Ranvier's membrane of side on thickness direction；Remove the Ranvier's membrane from the conductor figure
The process of the part of case exposure；In a manner of covering the conductive pattern on the thickness direction of the 1st insulating layer
The process that side forms the 2nd insulating layer；The process for removing the metal support layer and exposing the thinner wall section；It removes described thin
Wall portion and the process for making the Ranvier's membrane exposure of the other side on the thickness direction positioned at the terminal；Remove the base
Plinth film and make on the thickness direction of the terminal other end exposure process；And the thickness in the terminal
The process of other end setting coating on direction, in the process for forming the conductive pattern, by the terminal arrangement be
Space is formed between the thick wall portion on the orthogonal direction orthogonal with the thickness direction, is forming the 2nd insulating layer
In process, the peripheral part for surrounding around the terminal and covering all end faces of the terminal is formed, the coating is being set
Protection portion is formed in process and protruding portion, the protection portion are configured at the other end on the thickness direction of the terminal, it should
Protruding portion and the protection portion are mutually continuous, and towards another on the thickness direction in a manner of being meshed with the peripheral part
Side is prominent.
Using such method, since terminal is configured as in that orthogonal direction with forming space between thick wall portion,
When forming 2 insulating layer in a manner of covering conductive pattern, the 2nd insulating layer also covers position while covering all end faces of terminal
In all end faces of the Ranvier's membrane of the other side on the thickness direction of terminal.Peripheral part is as a result, to surround the side of terminal and Ranvier's membrane
Formula covers all end faces of terminal and all end faces of Ranvier's membrane.
Later, metal support layer, the thinner wall section of the 1st insulating layer and another on the thickness direction of terminal are successively removed
The Ranvier's membrane of side makes the surface exposure of the other side on the thickness direction of terminal.Therefore, the thickness direction of peripheral part can be made
On the other end be located at than the other side of the other end on the thickness direction of terminal on thickness direction far from be located at end
Position after the corresponding distance of thickness of the Ranvier's membrane of the other side on the thickness direction of son.
Then, since coating is arranged in the other end on the thickness direction of terminal, the protruding portion of coating can be made
It is prominent towards the other side on thickness direction in a manner of being meshed with the peripheral part surrounded around terminal.
As a result, it is possible to swimmingly manufacture the hanging base board with circuit for having the protruding portion being meshed with peripheral part.
(5) of the invention include the manufacturing method of the hanging base board with circuit described in above-mentioned (4), wherein described in formation
In the process of 2nd insulating layer, the peripheral part is configured as forming space between the thick wall portion on the orthogonal direction,
In the process for removing the thinner wall section, the thinner wall section is removed from the other side on the thickness direction using wet etching, it will
The peripheral part is formed as, and is in contact with all end faces and with from the side on the thickness direction towards the thickness side
The upward other side is gone and top is thinning.
Using such method, peripheral part is configured as in that orthogonal direction with space is formed between thick wall portion, therefore,
Thinner wall section by wet etching by from another lateral erosion on thickness direction when, after the removal of thinner wall section, etching solution can be into
Enter to the space between peripheral part and thick wall portion.Then, enter the etching solution in the space between peripheral part and thick wall portion so that
Peripheral part from the side on thickness direction towards the other side with going and the thinning mode in top is etched.Therefore, Neng Goushun
Freely form the peripheral part with the thinning shape in top.
Detailed description of the invention
Fig. 1 is the top view of an embodiment of the hanging base board of the invention with circuit, and Fig. 1 shows eliminate to cover
The state of lid insulating layer.
Fig. 2 is the bottom view of the hanging base board shown in FIG. 1 with circuit.
Fig. 3 is the A-A cross-sectional view of the 1st component connection and the 2nd component connection shown in Fig. 2.
Fig. 4 A is the enlarged drawing of the 1st component connection shown in FIG. 1.Fig. 4 B is the 1st component connection shown in Fig. 4 A
The B-B cross-sectional view of son.
Fig. 5 A is the explanation for an embodiment for illustrating the manufacturing method of the hanging base board of the invention with circuit
Figure, and Fig. 5 A indicates to prepare the process of metal support layer.Then Fig. 5 A, expression formation on metal support layer have heavy wall to Fig. 5 B
The process of the base insulating layer of portion and thinner wall section.Fig. 5 C then Fig. 5 B indicates in base insulating layer basis of formation film and in base
The process of plating resist layer is formed on plinth film.Fig. 5 D then Fig. 5 C indicates the process that conductive pattern is formed on Ranvier's membrane.Fig. 5 E is then
Fig. 5 D, the process for indicating the Ranvier's membrane that removal is exposed from conductive pattern.
Then Fig. 5 E, expression form the process for covering insulating layer to Fig. 6 A in a manner of covering conductive pattern.Fig. 6 B then schemes
6A indicates the process processed to the shape of metal support layer.Then Fig. 6 B, expression remove the thin-walled of base insulating layer to Fig. 6 C
Portion and make Ranvier's membrane exposure process.
Then Fig. 6 C, expression remove Ranvier's membrane and make the process of the terminal surface exposure of terminal Fig. 7 A.Fig. 7 B then Fig. 7 A, table
Show the process in the terminal surface setting coating of terminal.
Fig. 8 A is the explanatory diagram for illustrating the process of the hanging base board installation piezoelectric element with circuit shown in Fig. 7 B,
And Fig. 8 A indicates to configure solder composition and so that the side that piezoelectricity terminal is in contact with solder composition on component connection
The process of formula configuration piezoelectric element.Then Fig. 8 A, expression make process of the solder composition melting to form solder layer to Fig. 8 B.
Fig. 9 is the self aligned explanatory diagram for piezoelectric element shown in explanatory diagram 8B.
Specific embodiment
1. the hanging base board with circuit
Referring to Fig.1~Fig. 4 B is i.e. outstanding with circuit come the 1st embodiment for illustrating the hanging base board of the invention with circuit
Hang substrate 1.
As shown in Figure 1, the hanging base board 1 with circuit has the general flat extended along predetermined direction band-like.
In Fig. 1, paper thickness direction is the thickness direction (the 1st direction) of the hanging base board 1 with circuit, paper nearby side
It is the side (side on the 1st direction) on thickness direction, paper depth side is the other side on thickness direction (on the 1st direction
The other side).
In Fig. 1, paper up and down direction is length direction (2 orthogonal with the 1st direction of the hanging base board 1 with circuit
Direction), it is another on length direction on the downside of paper that paper upside, which is the side (side on the 2nd direction) on length direction,
Side (other side on the 2nd direction).
In Fig. 1, paper left and right directions is that the width direction of the hanging base board 1 with circuit (is and the 1st direction and the 2nd side
It is an example of the orthogonal direction orthogonal with thickness direction to the 3rd orthogonal direction), paper right side is in width direction
Side (side on the 3rd direction, the side on orthogonal direction) is the other side in width direction on the left of paper (on the 3rd direction
The other side, the other side on orthogonal direction).Specifically, direction conforms to direction arrow documented by each figure.
As shown in figure 3, the hanging base board 1 with circuit has: metal support layer 2；Conductive pattern 4 is configured at metal branch
Hold the side on the thickness direction of layer 2；And insulating layer 10, make to insulate between metal support layer 2 and conductive pattern 4.Insulation
Layer 10 has exhausted as the base insulating layer 3 of an example of the 1st insulating layer and the covering of an example as the 2nd insulating layer
Edge layer 5.
More specifically, the hanging base board 1 with circuit has lit-par-lit structure, thick from the other side direction on thickness direction
Side on degree direction goes successively have metal support layer 2, base insulating layer 3, conductive pattern 4 and covering insulating layer 5.This
Outside, in Fig. 1, for convenience, covering insulating layer 5 is omitted.
As shown in Fig. 2, metal support layer 2 is the metal support supported to conductive pattern 4 (referring to Fig.1), along length
Direction is spent to extend.Metal support layer 2 includes mounting table 20, main part 21 and linking part 22.
Mounting table 20 is the part supported to sliding block 11 (referring to Fig.1), which is located at metal support layer 2
One end on length direction.Mounting table 20, which has, looks up rectangular shape.
Main part 21 is the part for being supported on load arm (not shown), main part 21 relative to mounting table 20 at spaced intervals
It is configured at the other side on length direction.Main part 21 has what is extended along its length to look up rectangular shape.Main part 21 has
There is opening portion 23.Opening portion 23 is located at the side section on the length direction of main part 21.Opening portion 23 has towards length side
The open concave shape in upward side.One end on the length direction of main part 21 is formed along opening portion 23 to length side
The recessed recess portion 24 in the upward other side.
Linking part 22 extends along its length and by the length of the other end and main part 21 on the length direction of mounting table 20
One end on degree direction links up.
As the material of metal support layer 2, for example, stainless steel and other metal materials can be enumerated.The thickness example of metal support layer 2
For example 10 μm or more, preferably 15 μm or more, and for example, 35 μm hereinafter, preferably 25 μm or less.
As shown in figure 3, base insulating layer 3 is configured at the side on the thickness direction of metal support layer 2, specifically, should
Base insulating layer 3 is configured at the surface of the side on the thickness direction of metal support layer 2.As shown in Figure 1, base insulating layer 3 has
There is predetermined pattern corresponding with conductive pattern 4.Base insulating layer 3 has mounting table substrate 30 and host matrix 31.
Mounting table substrate 30 configures in mounting table 20.Mounting table substrate 30, which has, overlooks rectangular shape.
Host matrix 31 configures on main part 21.When being seen from thickness direction, in (joining with recess portion 24 for host matrix 31
According to Fig. 2) overlapping position have multiple terminal openings portions 32.Multiple terminal openings portions 32 are with sub with multiple 1st component connections
The corresponding mode of 80 (aftermentioned) configures at spaced intervals in the direction of the width.Multiple terminal openings portions 32 are respectively in thickness direction
It is upper to be connected with recess portion 24.Terminal openings portion 32 has the vertical view rectangular shape extended in the width direction.
As the material of base insulating layer 3, the synthetic resin such as polyimide resin can be enumerated.Base insulating layer 3
Thickness is, for example, 1 μm or more, and preferably 3 μm or more, and for example, 25 μm hereinafter, preferably 15 μm or less.
Conductive pattern 4 have multiple (4) magnetic head connection terminals 40, as terminal an example it is multiple (4) member
Part connection terminal 8, multiple (6) external connection terminals 41, multiple (4) magnetic head wirings 42 and multiple (4) element wirings
43。
When sliding block 11 is installed in the hanging base board 1 with circuit, multiple (4) magnetic head connection terminals 40 are via sliding block 11
The magnetic head (not shown) and conductive material (such as solder etc.) that are had and be electrically connected with sliding block 11.Multiple magnetic head connection terminals 40
It is configured at the side on the thickness direction of mounting table substrate 30 spaced apart from each other in the direction of the width.
When piezoelectric element 12 is installed on the hanging base board 1 with circuit, multiple (4) component connection 8 are via solder
14 (aftermentioned) of layer are electrically connected with piezoelectric element 12.Multiple element connection terminal 8 is connect with multiple element wiring 43 respectively.Multiple members
Part connection terminal 8 includes multiple (two) the 1st component connection 80 and multiple (two) the 2nd component connection 81.
Multiple 1st component connection 80 are arranged respectively in corresponding terminal openings portion 32.1st component connection 80
With vertical view rectangular shape.The length of 1st component connection 80 side in the longitudinal direction and terminal openings portion 32
Another ora terminalis on direction is adjacent.1st component connection 80 extends in a manner of far from adjacent base insulating layer 3
(referring to Fig. 3).1st component connection 80 respectively when being projected in the width direction (referring to Fig. 4 B) and along its length into
(referring to Fig. 3) when row projection, at least part of the 1st component connection 80 is Chong Die with base insulating layer 3.From thickness direction
On the other side see, the 1st component connection 80 from metal support layer 2 and base insulating layer 3 exposure.
On the length direction of the other side of multiple 2nd component connection 81 in the longitudinal direction and mounting table substrate 30
Another ora terminalis is adjacent.Multiple 2nd component connection 81 configure spaced apart from each other in width direction.The connection of 2nd element
Terminal 81, which has, overlooks rectangular shape.2nd component connection 81 is with the side with sub 80 intervals of the 1st component connection
Formula is located at the side on length direction.2nd component connection 81 is far from adjacent (the mounting table substrate of base insulating layer 3
30) mode extends (referring to Fig. 3).2nd component connection 81 when being projected along its length, the connection of the 2nd element
At least part of terminal 81 is Chong Die with base insulating layer 3.It is seen from the other side on thickness direction, the 2nd component connection 81
From metal support layer 2 and the exposure of base insulating layer 3.
On the length direction of component connection 8 (the 1st component connection the 80 and the 2nd component connection of son 81 is respectively)
Size is, for example, 30 μm or more, and preferably 50 μm or more, and for example, 100 μm hereinafter, preferably 90 μm or less.
In the width direction of component connection 8 (the 1st component connection the 80 and the 2nd component connection of son 81 is respectively)
Size is, for example, 120 μm or more, and preferably 210 μm or more, and for example, 250 μm hereinafter, preferably 230 μm or less.
Multiple (6) external connection terminals 41 are configured at the thickness side of the other end on the length direction of host matrix 31
Upward side.Multiple external connection terminals 41 configure spaced apart from each other in the direction of the width.
Multiple (4) magnetic head wirings 42 are by multiple magnetic head connection terminals 40 and identical as multiple 40 quantity of magnetic head connection terminal
External connection terminals 41 be electrically connected.
Multiple (4) element wirings 43 are connected to multiple element connection terminal 8.Specifically, multiple element wiring 43 wraps
Containing the multiple power supply wirings 44 for being connected to multiple 1st component connection 80 and it is connected to multiple 2nd component connection 81
Multiple ground connection wirings 45.
Power supply wiring 44 is connected to the other end on the length direction of the 1st component connection 80, and with the 1st element
The mode that connection terminal 80 forms step extends on host matrix 31 (referring to Fig. 3).Multiple power supply wirings 44 are by multiple 1st yuan
The external connection terminals 41 for being not attached to magnetic head wiring 42 in part connection terminal 80 and multiple external connection terminals 41 are electrically connected.
Ground connection wiring 45 is connected to the one end on the length direction of the 2nd component connection 81, and to connect with the 2nd element
The mode that connecting terminal 81 forms step extends in mounting table substrate 30 (referring to Fig. 3).Multiple ground connection wirings 45 run through mounting table
Substrate 30 simultaneously contacts (ground connection) in mounting table 20.
As the material of conductive pattern 4, the conductor material such as copper can be enumerated.The thickness of conductive pattern 4 be, for example, 1 μm with
On, preferably 3 μm or more, and for example, 20 μm hereinafter, preferably 12 μm or less.
As shown in figure 3, being configured with Ranvier's membrane 46 between such conductive pattern 4 and base insulating layer 3.
Ranvier's membrane 46 has thin film shape, and has pattern corresponding with conductive pattern 4.Material as basic film 46
Material, can enumerate the metal material such as copper, chromium.Ranvier's membrane 46 can both be formed by 1 layer, can also be formed above by two layers.Base
The thickness of plinth film 46 is, for example, 0.01 μm or more, and for example, 1 μm hereinafter, preferably 0.1 μm or less.
In addition, in the thickness direction of component connection 8 (the 80 and the 2nd component connection 81 of the 1st component connection)
On other end be equipped with coating 7.That is, the hanging base board 1 with circuit is also equipped with coating 7.In addition, connecting in multiple magnetic heads
An end face on the thickness direction of connecting terminal 40 and the end face on the thickness direction of multiple external connection terminals 41 also are provided with plating
Layer 7, but it is not shown to this.As the material of coating 7, the metal material such as nickel, gold can be enumerated, gold is preferably enumerated.Coating 7
Thickness is, for example, 0.1 μm or more, and preferably 0.25 μm or more, and for example, 5 μm hereinafter, preferably 2.5 μm or less.
Covering insulating layer 5 is configured at base insulating layer in a manner of covering multiple magnetic head wirings 42 and multiple element wiring 43
Side on 3 thickness direction is specifically configured at the surface of the side on the thickness direction of base insulating layer 3.In addition, from
Side on thickness direction sees that magnetic head connection terminal 40 and the exposure of external connection terminals 41, component connection 8 is capped to insulate
Layer 5 covers.In addition, the covering insulating layer 5 not only end face on the thickness direction of cladding element connection terminal 8, but also cover member
All end faces of part connection terminal 8, are detailed in this aftermentioned.As the material of covering insulating layer 5, such as polyimide resin can be enumerated
Equal synthetic resin.The thickness of covering insulating layer 5 can be suitably set.
2. the detailed construction of component connection
Next, illustrating the detailed content of component connection 8 referring to Fig. 4 A and Fig. 4 B.Further, since the 1st element connects
It is in symmetrical knot that connecting terminal 80 and the 2nd component connection 81, which have relative to the axis of symmetry extended along width direction,
Therefore structure explains the 1st component connection 80 in detail, omit the description the 2nd component connection 81.
1st component connection 80 includes covering surface 82, terminal surface 83 and all end faces 84.
Covering surface 82 is the end face on the thickness direction of the 1st component connection 80.Covering surface 82 is capped insulating layer 5
Covering.
Terminal surface 83 is the other end on the thickness direction of the 1st component connection 80.Terminal surface 83 is located in thickness
Position on direction relative to 82 interval of covering surface.Terminal surface 83 extends along width direction.Terminal surface 83 is from metal branch
Hold layer 2 and insulating layer 10 (base insulating layer 3 and covering insulating layer 5) exposure.
All end faces 84 are covered by insulating layer 10, are detailed in this aftermentioned.All end faces 84 have rear end face 88, front end face 87 and
1 opposite side end face 86.
1 opposite side end face 86 is a part of all end faces 84, and be the 1st component connection 80 width direction on end
Face.1 opposite side end face 86 configures spaced apart from each other in the direction of the width.1 opposite side end face 86 extends respectively along thickness direction.
One end on the thickness direction of each side end face 86 is connected to the end in the width direction of covering surface 82, the thickness of each side end face 86
The other end on degree direction is connected to the end in the width direction of terminal surface 83.
It as shown in figure 3, front end face 87 is a part of all end faces 84, and is the length direction of the 1st component connection 80
On an end face.Rear end face 88 is a part of all end faces 84, and be the 1st component connection 80 length direction on it is another
End face.Front end face 87 and rear end face 88 configure spaced apart from each other in the longitudinal direction.
In the 1st component connection 80, front end face 87 extends along thickness direction, and rear end face 88 is along base insulating layer
3 ora terminalis is tilted relative to thickness direction.In addition, front end face 87 is along base insulating layer 3 in the 2nd component connection 81
Ora terminalis tilted relative to thickness direction, rear end face 88 extends along thickness direction.
3. the detailed construction of insulating layer
As shown in Figure 4 A and 4 B shown in FIG., insulating layer 10 includes peripheral part 16, the week of the 16 embracing element connection terminal 8 of peripheral part
It encloses and covers all end faces 84.Specifically, insulating layer 10 includes multiple peripheral parts corresponding with multiple element connection terminal 8
16.Further, since the peripheral part 16 surrounded around the 1st component connection 80 and the week for surrounding the 2nd component connection 81
It is in symmetrical structure that the peripheral part 16 enclosed, which has relative to the symmetry axis extended along width direction, therefore is described in detail and surrounds
Peripheral part 16 around 1st component connection 80 omits the description the peripheral part surrounded around the 2nd component connection 81
16。
As shown in figs. 3 and 4b, peripheral part 16 includes 1 pair of the 1st edge part 17, the 2nd edge part 18 and the 3rd edge part
19.In the peripheral part 16 surrounded around the 1st component connection 80,1 pair of the 1st edge part 17 and the 2nd edge part 18 include
Base insulating layer 3 is contained in covering the 5, the 3rd edge part 19 of insulating layer.
As shown in Figure 4 B, 1 pair of the 1st edge part 17 is configured at the outside in width direction relative to 1 opposite side end face 86, and covers
1 opposite side end face 86 of lid.
Each 1st edge part 17 is seen from length direction with wedge-type shape.Each 1st edge part 17 is respectively provided with: width direction
On inner side end 17A, be in contact with corresponding side end face 86；And the end face outside 17B in width direction, relative to
Inner side end 17A is located at the side opposite with the sub 8 place sides of component connection.
The inner side end 17A of each 1st edge part 17 extends along thickness direction.The end face outside 17B of each 1st edge part 17
It is tilted with being gone from the side on thickness direction towards the other side towards the inside in width direction.Also, each 1st edge part
On the thickness direction of the end face outside 17B of 1 edge part 17 of the other end and Ge on the thickness direction of 17 inner side end 17A
The other end be interconnected to form the top 17C of the 1st edge part 17.
Each 1st edge part 17 is pushed up with going from the side on thickness direction towards the other side on thickness direction as a result,
It holds thinning.In addition, the top 17C of each 1st edge part 17 is located at the position of the other side than terminal surface 83 on thickness direction.
As shown in figure 3, the 2nd edge part 18 is configured at the side on length direction relative to front end face 87, and cover front end
Face 87.
2nd edge part 18 is seen from width direction with wedge-type shape.2nd edge part 18 includes another on length direction
End face 18A is in contact with front end face 87；And the end face 18B on length direction, it is located at relative to other end 18A
The side opposite with the sub 8 place sides of component connection.
The other end 18A of 2nd edge part 18 extends along thickness direction.One end face 18B of the 2nd edge part 18 is with certainly
Side on thickness direction is gone towards the other side and is tilted towards the other side on length direction.Also, the 2nd edge part 18 is another
The other end on the thickness direction of the one end face 18B of the other end and the 2nd edge part 18 on the thickness direction of one end face 18A
It is interconnected to form the top 18C of the 2nd edge part 18.
The 2nd edge part 18 is gone and top with from the side on thickness direction towards the other side on thickness direction as a result,
It is thinning.In addition, the top 18C of the 2nd edge part 18 is located at the position of the other side than terminal surface 83 on thickness direction.
3rd edge part 19 is configured at the other side on length direction relative to rear end face 88.In the 3rd edge part 19 and rear end
Ranvier's membrane 46 is configured between face 88.
3rd edge part 19 is seen from width direction with wedge-type shape.3rd edge part 19 includes one end on thickness direction
Face 19A is in contact with Ranvier's membrane 46；And the other end 19B on thickness direction, relative to an end face 19A be located at
The opposite side in 8 place sides of component connection.
One end face 19A of the 3rd edge part 19 extends along rear end face 88, and with from the other side direction on length direction
Side is gone and the other side inclination on thickness direction.The other end 19B of 3rd edge part 19 alongst extends.
Also, the other end of one end and the 3rd edge part 19 on the length direction of an end face 19A of the 3rd edge part 19
One end on the length direction of face 19B is interconnected to form the top 19C of the 3rd edge part 19.
The 3rd edge part 19 from the other side on length direction towards side with going and top is thinning as a result,.In addition, the 3rd
The top 19C of edge part 19 is located at the position of the other side than terminal surface 83 on thickness direction.
In addition, seen from the other side on thickness direction, the top 19C of the 3rd edge part 19, the 2nd edge part 18 top 18C
And the top 17C of 1 pair of the 1st edge part 17 rectangular frame-shaped in a manner of surrounding terminal surface 83 is mutually continuous.
4. the detailed construction of coating
As shown in figs. 3 and 4b, coating 7 is set to the terminal surface 83 of component connection 8.Further, since being set to the 1st element
The coating 7 of the terminal surface 83 of connection terminal 80 and set on the 2nd component connection 81 terminal surface 83 coating 7 have relative to
It is in symmetrical structure along the symmetry axis that width direction extends, therefore explains in detail set on the 1st component connection 80
The coating 7 of terminal surface 83, omits the description the coating 7 of the terminal surface 83 set on the 2nd component connection 81.
Coating 7 has protective layer 70 and protruding portion 71.
Protective layer 70 is configured at the other end on the thickness direction of component connection 8 i.e. terminal surface 83.Protective layer 70
It is directly contacted with thin film shape, and with entire terminal surface 83.
Protruding portion 71 and protection portion 70 are mutually continuous, and towards another on thickness direction in a manner of being meshed with peripheral part 16
Side is prominent.More specifically, protruding portion 71 is mutually continuous with the entire peripheral part of protective layer 70 on the outside, and with peripheral part 16
Thickness direction on the mode that is meshed of the other end it is prominent towards the other side on thickness direction.
Protruding portion 71 has 73,1 pairs of the 3rd protruding portion 74, the 2nd protruding portion the 1st protruding portions 72.
As shown in Figure 4 B, the both ends in the width direction of 1 pair of 72 self-insurance sheath 70 of the 1st protruding portion are towards on thickness direction
The other side it is prominent.Each 1st protruding portion 72 is seen from length direction with hook-like shape.Each 1st protruding portion 72 and protective layer 70
End in width direction is mutually continuous, and the outside in a manner of the top 17C across the 1st edge part 17 in width direction is prolonged
It stretches.Outboard end in the width direction of each 1st protruding portion 72 is located on the end face outside 17B of the 1st edge part 17.It is each as a result,
1st protruding portion 72 is meshed with the other end on the thickness direction of the 1st edge part 17.
As shown in figure 3, one end on the length direction of 73 self-insurance sheath 70 of the 2nd protruding portion is towards another on thickness direction
Side is prominent.2nd protruding portion 73 is seen from width direction with hook-like shape.The length direction of 2nd protruding portion 73 and protective layer 70
On one end it is mutually continuous, and side in a manner of the top 18C across the 2nd edge part 18 on length direction extends.2nd
One end part on the length direction of protruding portion 73 is on an end face 18B of the 2nd edge part 18.2nd protruding portion 73 and as a result,
The other end on the thickness direction of 2 edge parts 18 is meshed.
The other end on the length direction of 3rd protruding portion, 74 self-insurance sheath 70 is towards another pleurapophysis on thickness direction
Out.3rd protruding portion 74 is seen from width direction with hook-like shape.3rd protruding portion 74 with it is another on the length direction of protective layer 70
One end is mutually continuous, and the other side in a manner of the top 19C across the 3rd edge part 19 on length direction extends.3rd is prominent
The other end on the length direction in portion 74 is located on the other end 19B of the 3rd edge part 19 out.As a result, the 3rd protruding portion 74 with
One end on the length direction of 3rd edge part 19 is meshed.
In addition, seen from the other side on thickness direction, protruding portion 71 (the 3rd protruding portion 74,73,1 pair the 1st of the 2nd protruding portion it is prominent
Portion 72 out) rectangular frame-shaped is mutually continuous in a manner of surrounding protective layer 70.
5. the manufacturing method of the hanging base board with circuit
Next, illustrating the manufacturing method of the hanging base board 1 with circuit referring to Fig. 5 A~Fig. 7 B.Hanging base board with circuit
1 manufacturing method includes the following process: preparing the process (Fig. 5 A) of metal support layer 2；Form the process (figure of base insulating layer 3
5B)；The process (Fig. 5 C) of basis of formation film 46；Form the process (Fig. 5 D) of conductive pattern 4；Remove Ranvier's membrane 46 from conductor figure
The process (Fig. 5 E) of the part of the exposure of case 4；Form the process (Fig. 6 A) of covering insulating layer 5；The shape of metal support layer 2 is carried out
The process (Fig. 6 B) of processing；The process (Fig. 6 C) that thinner wall section 34 is etched；Make the exposure of terminal surface 83 of component connection 8
Process (Fig. 7 A)；And form the process (Fig. 7 B) of coating 7.
In the manufacturing method of the hanging base board 1 with circuit, firstly, as shown in Figure 5A, preparing metal support layer 2.
Then, as shown in Figure 5 B, utilize gradation exposure in metal branch in a manner of being formed with thick wall portion 33 and thinner wall section 34
The side (the specifically surface of the side on thickness direction) held on the thickness direction of layer 2 forms base insulating layer 3.
Specifically, the varnish containing photosensitive synthetic resin is coated on metal support layer 2 and is made it dry,
And form substrate overlay film.Later, gradation exposure is carried out to substrate overlay film across photomask (not shown), later, to substrate overlay film
Develop, is heating and curing as needed.
Thick wall portion 33 is formed in part corresponding with above-mentioned base insulating layer 3 as a result,.Thinner wall section 34 be formed in it is above-mentioned
The corresponding part of multiple element connection terminal 8.
Then, as shown in Fig. 5 C~Fig. 5 E, such as the side shape by additive process on the thickness direction of base insulating layer 3
At conductive pattern 4.
More specifically, as shown in Figure 5 C, the basis of formation film 46 in base insulating layer 3.
As the forming method of basic film 46, for example, sputtering, plating or chemical plating etc. can be enumerated, sputtering is preferably enumerated.
Then, the plating resist layer 6 with the pattern opposite with conductive pattern 4 is formed on Ranvier's membrane 46.
Specifically, being layered in dry film photoresist on Ranvier's membrane 46, later, exposed across photomask (not shown)
Light then develops.
Be formed with plating resist layer 6 as a result, the plating resist layer 6 have wiring corresponding with element wiring 43 opening 60 and with member
The corresponding terminal openings 61 of part connection terminal 8.Wiring opening 60 is located at the side on the thickness direction of thick wall portion 33.Terminal is opened
Mouth 61 is located at the side on the thickness direction of thinner wall section 34, and is located relative to 33 interval of thick wall portion in the direction of the width
Position.
Then, as shown in Figure 5 D, in Ranvier's membrane 46 from the part of the exposure of plating resist layer 6, for example, (preferably using plating
Be electro-coppering) formed conductive pattern 4.In addition, conductive pattern 4 is formed as above-mentioned pattern.
Specifically, element wiring 43 is formed from the part of 60 exposure of wiring opening in Ranvier's membrane 46, in Ranvier's membrane
Component connection 8 is formed on 46 part exposed from terminal openings 61.
That is, make component connection 8 by the direction of the width between thick wall portion 33 formed space in a manner of shape
On Ranvier's membrane 46 at the side on the thickness direction for being located at thinner wall section 34.Component connection 8 is formed as above-mentioned and matches as a result,
It sets.
More specifically, two thickness of the 1st component connection 80 in multiple element connection terminal 8 in the direction of the width
It is formed on Ranvier's membrane 46 in a manner of being respectively formed space between two thick wall portions 33 between wall portion 33.In addition, as above-mentioned
Like that, component connection 8 have covering surface 82, terminal surface 83 and all end faces 84 (1 opposite side end face 86, front end face 87 and
Rear end face 88).
Later, plating resist layer 6 is removed.
Then, as shown in fig. 5e, using well known etching (such as wet etching etc.) removal Ranvier's membrane 46 from conductive pattern 4
Exposed part.That is, Ranvier's membrane 46 in addition to when the through-thickness of Ranvier's membrane 46 is projected with 4 weight of conductive pattern
Part other than folded part is removed.On the other hand, the basis of the other side on the thickness direction of component connection 8
(the hereinafter referred to as terminal Ranvier's membrane 46A of film 46.) be not etched, and left behind.
Then, as shown in Figure 6A, the side in a manner of covering conductive pattern 4 on the thickness direction of base insulating layer 3
Specifically the surface of the side on the thickness direction of base insulating layer 3 forms covering insulating layer 5.In addition, covering insulating layer 5
Be formed as above-mentioned pattern.
Specifically, the varnish containing photosensitive synthetic resin is coated on base insulating layer 3 and conductive pattern 4 (no
Include magnetic head connection terminal 40 and external connection terminals 41) on and make it dry, formed cover film.Later, cover film is carried out
It exposes and develops, and be heating and curing as needed.
At this point, in the direction of the width, being formed with space between component connection 8 and thick wall portion 33, therefore, covering is exhausted
All end faces of the sub- Ranvier's membrane 46A of capped end are gone back while the covering surface 82 of 5 cladding element connection terminal 8 of edge layer and all end face 84.
Peripheral part 16, the 16 embracing element connection terminal 8 of peripheral part and terminal Ranvier's membrane 46A and covering member are formed as a result,
All end faces 84 of part connection terminal 8.
In addition, in the direction of the width, being formed with space between the 1st edge part 17 of peripheral part 16 and thick wall portion 33.?
That is peripheral part 16 is configured as forming space between thick wall portion 33 in the direction of the width.
It then, as shown in Figure 6B, is above-mentioned pattern by the sharp processing of metal support layer 2.As a result, positioned at thinner wall section 34
The metal support layer 2 of the other side on thickness direction is removed, other side exposure of the thinner wall section 34 from thickness direction.
Then, as shown in Figure 6 C, thin from the other side removal on thickness direction using well known etching, preferably wet etching
Wall portion 34.Make terminal Ranvier's membrane 46A exposure as a result,.
At this point, etching solution can enter between the 1st edge part 17 and thick wall portion 33 after the removal of thinner wall section 34
Space.Then, the etching solution in the space between the 1st edge part 17 and thick wall portion 33 is entered so that the 1st edge part 17 is with certainly
Side on thickness direction is gone towards the other side and the thinning mode in top is etched.In addition, the 2nd edge part of peripheral part 16
18 and the 1st edge part 17 is identically formed as the thinning shape in top, but not shown to this.
Then, as shown in Figure 7 A, using well known engraving method, terminal Ranvier's membrane is removed preferably by sodium hydroxide
46A。
Make the exposure of terminal surface 83 of component connection 8 as a result,.The terminal surface 83 of component connection 8 is located at than periphery
The position of side of the other end on thickness direction on the thickness direction in portion 16.
Then, as shown in Figure 7 B, it is arranged by well known method for plating (such as plating, chemical plating etc.) in terminal surface 83 and is plated
Layer 7.
At this point, until the top (top 17C, top 18C and top 19C) of peripheral part 16 is crossed in the peripheral part of coating 7
Until carry out plating, and form protective layer 70 and protruding portion 71, which is configured at terminal surface 83, the protruding portion 71 with
70 phase of protective layer is continuous and prominent towards the other side on thickness direction in a manner of being meshed with peripheral part 16.
The hanging base board 1 with circuit is made as a result,.
6. installation of the piezoelectric element relative to the hanging base board with circuit
Next, illustrating installation of the piezoelectric element 12 relative to the hanging base board 1 with circuit referring to Fig. 8 A and Fig. 8 B.
As shown in Figure 1, piezoelectric element 12 is the driver that can be stretched along its length, it is powered, and passes through
The voltage is controlled, to keep piezoelectric element 12 flexible.In the present embodiment, pacify on the hanging base board 1 with circuit
There are two piezoelectric elements 12 for dress.
Piezoelectric element 12 is by for example well known piezoelectric material, more specifically by piezoelectric ceramics (such as Pb (Zr, Ti) O3
(lead zirconate titanate (PZT)) etc.) etc. formed.
In addition, as shown in Figure 8 A, piezoelectric element 12 has and 8 corresponding piezoelectricity terminal 12A of component connection.Piezoelectricity
Terminal 12A in a manner of corresponding with sub 80 and the 2nd component connection 81 of the 1st component connection in the longitudinal direction mutually every
Opening compartment of terrain configuration, there are two (referring to Fig. 9).Piezoelectricity terminal 12A, which is overlooked, to be had and the sub 8 identical shapes of component connection and ruler
It is very little.
In installation of such piezoelectric element 12 relative to the hanging base board 1 with circuit, as shown in Figure 8 A, firstly, quasi-
Standby solder composition 13.
Solder composition 13 preferably only contains Sn, Ag, Cu for example containing Sn, Ag, Cu.Hereinafter, making solder composition 13
Sn-Ag-Cu brazing filler metal composition.Specifically, the pricker for being expressed as Sn-3Ag-0.5Cu can be enumerated as solder composition
Feed composition.As such solder composition, it is able to use commercially available product.
The fusing point of such solder composition is, for example, 200 DEG C or more, and preferably 210 DEG C or more, and for example, 230 DEG C
Hereinafter, preferably 220 DEG C or less.
Then, using well known method (for example, using the printing of well known printing machine progress, distributor is utilized to carry out
Coating etc.) solder composition 13 is configured to the terminal surface 83 of component connection 8, it is specifically configured at and is set in terminal surface 83
The surface of the other side on the thickness direction for the coating 7 set.
Then, piezoelectricity terminal 12A is configured by piezoelectric element 12 to contact with solder composition 13.
Then, as shown in Figure 8 B, Reflow Soldering is carried out to the hanging base board 1 with circuit configured with piezoelectric element 12.
Reflow Soldering temperature is, for example, 230 DEG C or more, preferably 240 DEG C or more, and for example, 260 DEG C hereinafter, preferably
250 DEG C or less.The Reflow Soldering time is, for example, 3 seconds or more, preferably 5 seconds or more, and for example, 300 seconds hereinafter, preferably 200
Second or less.
At this point, solder composition 13 is to soften the terminal surface 83 for expanding to component connection 8 specifically in terminal surface
The mode of the whole surface of the other side on the thickness direction of the coating 7 of 83 settings melts.
Then, piezoelectric element 12 is self-aligned.Specifically, in the process of configuration piezoelectric element 12, as shown in figure 9,
Sometimes piezoelectric element 12 is configured to deviate from predetermined position and tilt to width direction.In this case, it is seen from thickness direction, the
The center of 1 component connection 80 and the center of corresponding piezoelectricity terminal 12A are located at the position offset with one another and the 2nd element connects
The center of connecting terminal 81 and the center of corresponding piezoelectricity terminal 12A are located at the position offset with one another.
Then, if carrying out Reflow Soldering, solder composition 13 to the hanging base board 1 with circuit configured with piezoelectric element 12
To soften the thickness for the coating 7 for extending to component connection 8 (the 80 and the 2nd component connection 81 of the 1st component connection)
The mode of entire other end on direction melts.
At this point, under the action of the surface tension of the solder composition 13 of melting, to 12 applied force of piezoelectric element, so that from
Thickness direction sees that the center of the 1st component connection 80 and the center of corresponding piezoelectricity terminal 12A are consistent, and the 2nd element connects
The center of connecting terminal 81 and the center of corresponding piezoelectricity terminal 12A are consistent.As a result, as shown in Figure 1, piezoelectric element 12 is predetermined from oneself
The state that position is deviateed is self-aligned towards predetermined position.
Then, as shown in Figure 8 B, solder composition 13 forms solder layer 14, and by the 1st component connection 80 and corresponds to
Piezoelectricity terminal 12A be joined together, 81 and corresponding piezoelectricity terminal 12A of the 2nd component connection is joined together.Band as a result,
The hanging base board 1 and piezoelectric element 12 of circuit are electrically connected.
The thickness of solder layer 14 is, for example, 3 μm or more, preferably 10 μm or more, and for example, 30 μm hereinafter, preferably
15 μm or less.
Manufacture is equipped with the hanging base board 1 with circuit of piezoelectric element 12 (hereinafter referred to as with circuit in the above manner
Hanging base board component 15.).Hanging base board component 15 with circuit has the hanging base board 1 with circuit, piezoelectric element 12 and pricker
The bed of material 14.It, can also be in addition, as shown in Figure 1, the hanging base board component 15 with circuit can both have the sliding block 11 with magnetic head
Do not have sliding block 11.
In such hanging base board 1 with circuit, as shown in Figure 4 B, the protruding portion 71 of coating 7 with embracing element to connect
The mode that peripheral part 16 around connecting terminal 8 is meshed is prominent.Therefore, even if external force is applied to the hanging base board 1 with circuit,
Also peripheral part 16 is able to suppress to remove from component connection 8.
In addition, the 1st edge part 17 of peripheral part 16 is in contact with the side end face 86 of component connection 8, and peripheral part 16
The 1st edge part 17 with being gone from the side on thickness direction towards the other side and top is thinning.Therefore, the 1st of coating 7 the is prominent
Portion 72 can be thinning with the top of peripheral part 16 thickness direction on the other end reliably engage.As a result, it is possible to reliable
Ground inhibits peripheral part 16 to remove from component connection 8.
In addition, side end face 86 extends along thickness direction.Therefore, the shape of component connection 8 when being seen from thickness direction
Shape and size are not influenced by the etch quantity of insulating layer 10, can precisely ensure component connection when seeing from thickness direction
The shape and size of son 8.
In addition, as shown in fig. 5e, in the manufacturing method of the hanging base board 1 with circuit, component connection 8 is configured as
Space is formed between thick wall portion 33 in the direction of the width.Therefore, as shown in Figure 6A, when forming covering insulating layer 5, covering is exhausted
All end faces of the sub- Ranvier's membrane 46A of capped end are gone back while all end faces 84 of 5 cladding element connection terminal 8 of edge layer.Week is formed as a result,
Edge 16, all end faces of the peripheral part 16 embracing element connection terminal 8 and terminal Ranvier's membrane 46A and cladding element connection terminal 8
84。
Later, as shown in Fig. 6 B~Fig. 7 A, metal support layer 2, the thinner wall section 34 of base insulating layer 3 and end are successively removed
Sub- Ranvier's membrane 46A makes the exposure of terminal surface 83 of component connection 8.Therefore, can make another on the thickness direction of peripheral part 16
One end part is separate with terminal Ranvier's membrane 46A's in the other side of the terminal surface 83 than component connection 8 on thickness direction
Position after the corresponding distance of thickness.
Then, since coating 7 is arranged in the terminal surface 83 in component connection 8, the protruding portion 71 of coating 7 can be made
It is prominent towards the other side on thickness direction in a manner of being meshed with the peripheral part 16 around embracing element connection terminal 8.
As a result, it is possible to swimmingly manufacture the hanging base board 1 with circuit for having the protruding portion 71 being meshed with peripheral part 16.
In addition, as shown in Figure 7 A, when thinner wall section 34 passes through wet etching by from another lateral erosion on thickness direction, thin
After the removal of wall portion 34, etching solution can enter the space between peripheral part 16 and thick wall portion 33.Then, periphery is entered
The etching solution in the space between portion 16 and thick wall portion 33 so that peripheral part 16 with from the side on thickness direction towards the other side
It goes and the thinning mode in top is etched.Therefore, the peripheral part 16 with the thinning shape in top can swimmingly be formed.
In addition, above description is provided as embodiment illustrated of the invention, but it is only illustrated, without limiting
Explain to property.The right that apparent variation of the invention is contained in the application for the those skilled in the art is wanted
It asks in book.
Claims (5)
1. a kind of hanging base board with circuit, which is characterized in that
The hanging base board with circuit has:
Metal support layer；
Conductive pattern has terminal, which is configured at the side on the thickness direction of the metal support layer；And
Insulating layer makes to insulate between the metal support layer and the conductive pattern,
The terminal has:
Other end on the thickness direction, from the metal support layer and the insulating layer exposing；And
All end faces are covered by the insulating layer,
The insulating layer includes peripheral part, which surrounds around the terminal and covering all end faces,
Other end on the thickness direction of the terminal is equipped with coating,
The coating has:
Protection portion is configured at the other end on the thickness direction of the terminal；And
Protruding portion, it is mutually continuous with the protection portion, and towards the thickness direction in a manner of being meshed with the peripheral part
On the other side it is prominent.
2. the hanging base board according to claim 1 with circuit, which is characterized in that
At least part of the peripheral part is in contact with all end faces, and at least part of the peripheral part is with from institute
State that the side on thickness direction is gone towards the other side on the thickness direction and top is thinning.
3. the hanging base board according to claim 1 with circuit, which is characterized in that
The week end face includes 1 contralateral side configured spaced apart from each other on the orthogonal direction orthogonal with the thickness direction
Face,
1 opposite side end face extends along the thickness direction respectively.
4. a kind of manufacturing method of the hanging base board with circuit, which is characterized in that
The manufacturing method of the hanging base board with circuit includes the following process:
Prepare the process of metal support layer；
In a manner of being formed with thick wall portion and thinner wall section utilize gradation exposure on the thickness direction of the metal support layer one
The process that side forms the 1st insulating layer；
The process of basis of formation film on the 1st insulating layer；
The conductive pattern with terminal is formed on the Ranvier's membrane and on the thickness direction for being located at the thinner wall section
The process of the terminal is formed on the Ranvier's membrane of side；
The process for removing the part from conductive pattern exposure of the Ranvier's membrane；
Side in a manner of covering the conductive pattern on the thickness direction of the 1st insulating layer forms the 2nd insulation
The process of layer；
The process for removing the metal support layer and exposing the thinner wall section；
It removes the thinner wall section and exposes the Ranvier's membrane of the other side on the thickness direction of the terminal
Process；
The process for removing the Ranvier's membrane and exposing the other end on the thickness direction of the terminal；And
The process of other end setting coating on the thickness direction of the terminal,
It is in the orthogonal direction orthogonal with the thickness direction by the terminal arrangement in the process for forming the conductive pattern
On between the thick wall portion form space,
In the process for forming the 2nd insulating layer, all end faces for surrounding around the terminal and covering the terminal are formed
Peripheral part,
Protection portion is formed in the process that the coating is set and protruding portion, the protection portion are configured at the thickness of the terminal
Other end on direction, the protruding portion and the protection portion are mutually continuous, and the direction in a manner of being meshed with the peripheral part
The other side on the thickness direction is prominent.
5. the manufacturing method of the hanging base board according to claim 4 with circuit, which is characterized in that
In the process for forming the 2nd insulating layer, the peripheral part is configured as on the orthogonal direction with the heavy wall
Space is formed between portion,
In the process for removing the thinner wall section, the thin-walled is removed from the other side on the thickness direction using wet etching
Portion,
The peripheral part is formed as, is in contact with all end faces and with from described in the side direction on the thickness direction
The other side on thickness direction is gone and top is thinning.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017250989A JP6951240B2 (en) | 2017-12-27 | 2017-12-27 | Manufacturing method of suspension board with circuit and suspension board with circuit |
| JP2017-250989 | 2017-12-27 |
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| Publication Number | Publication Date |
|---|---|
| CN110033793A true CN110033793A (en) | 2019-07-19 |
| CN110033793B CN110033793B (en) | 2021-12-03 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811604673.2A Active CN110033793B (en) | 2017-12-27 | 2018-12-26 | Suspension board with circuit and method for manufacturing suspension board with circuit |
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| Country | Link |
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| JP (1) | JP6951240B2 (en) |
| CN (1) | CN110033793B (en) |
Citations (19)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101620858A (en) * | 2008-07-04 | 2010-01-06 | 日东电工株式会社 | Suspension board with circuit and producing method thereof |
| US7710677B2 (en) * | 2006-12-22 | 2010-05-04 | Tdk Corporation | Thermally assisted magnetic head |
| CN102280111A (en) * | 2010-05-20 | 2011-12-14 | 日东电工株式会社 | Suspension board with circuit and producing method thereof |
| US20120069538A1 (en) * | 2010-09-16 | 2012-03-22 | Nitto Denko Corporation | Printed circuit board, printed circuit board assembly sheet and method of manufacturing the same |
| CN102446513A (en) * | 2010-10-12 | 2012-05-09 | 日东电工株式会社 | Suspension board with circuit and producing method thereof |
| US20120175151A1 (en) * | 2011-01-12 | 2012-07-12 | Nitto Denko Corporation | Suspension board with circuit and producing method thereof |
| CN103096614A (en) * | 2011-10-27 | 2013-05-08 | 日东电工株式会社 | Wired circuit board |
| CN103325391A (en) * | 2012-03-23 | 2013-09-25 | 日东电工株式会社 | Wired circuit board |
| CN104703400A (en) * | 2013-12-04 | 2015-06-10 | 日东电工株式会社 | Producing method of suspension board with circuit |
| US20150245472A1 (en) * | 2014-02-25 | 2015-08-27 | Nitto Denko Corporation | Wired circuit board and producing method thereof |
| CN105096970A (en) * | 2014-05-21 | 2015-11-25 | 日本发条株式会社 | Terminal connection structure |
| CN105206287A (en) * | 2014-06-26 | 2015-12-30 | 日东电工株式会社 | Suspension Board With Circuit And Producing Method Thereof |
| CN105939572A (en) * | 2015-03-03 | 2016-09-14 | 日东电工株式会社 | Wired circuit board |
| CN105979700A (en) * | 2015-03-10 | 2016-09-28 | 日东电工株式会社 | Suspension board with circuit and producing method thereof |
| CN106233386A (en) * | 2014-04-21 | 2016-12-14 | 日东电工株式会社 | Wired circuit board |
| CN107017008A (en) * | 2015-12-07 | 2017-08-04 | 日东电工株式会社 | The manufacture method of hanging base board with circuit and the hanging base board with circuit |
| CN107306475A (en) * | 2016-04-18 | 2017-10-31 | 日东电工株式会社 | Wired circuit board and its manufacture method |
| US20170339786A1 (en) * | 2015-12-11 | 2017-11-23 | Nitto Denko Corporation | Suspension board with circuit and producing method thereof |
| CN107393567A (en) * | 2016-05-12 | 2017-11-24 | 日东电工株式会社 | Hanging base board and its manufacture method with circuit |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3935309B2 (en) * | 2000-06-08 | 2007-06-20 | 日東電工株式会社 | Wiring circuit board and manufacturing method thereof |
| CN100592412C (en) * | 2003-12-29 | 2010-02-24 | 新科实业有限公司 | Making process for flexible printed circuit suspended rack assembly |
| JP5147591B2 (en) * | 2008-08-06 | 2013-02-20 | 日東電工株式会社 | Suspension board with circuit, manufacturing method thereof, and positioning method of suspension board with circuit |
| JP6543559B2 (en) * | 2015-11-18 | 2019-07-10 | 新光電気工業株式会社 | WIRING BOARD, SEMICONDUCTOR DEVICE, AND WIRING BOARD MANUFACTURING METHOD |
| JP6597886B2 (en) * | 2016-03-30 | 2019-10-30 | 株式会社村田製作所 | Electronic devices |
| JP2017162543A (en) * | 2017-06-08 | 2017-09-14 | 大日本印刷株式会社 | Substrate for suspension, suspension, suspension with head and hard disk drive |
-
2017
- 2017-12-27 JP JP2017250989A patent/JP6951240B2/en active Active
-
2018
- 2018-12-26 CN CN201811604673.2A patent/CN110033793B/en active Active
Patent Citations (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7710677B2 (en) * | 2006-12-22 | 2010-05-04 | Tdk Corporation | Thermally assisted magnetic head |
| CN101620858A (en) * | 2008-07-04 | 2010-01-06 | 日东电工株式会社 | Suspension board with circuit and producing method thereof |
| CN102280111A (en) * | 2010-05-20 | 2011-12-14 | 日东电工株式会社 | Suspension board with circuit and producing method thereof |
| US20120069538A1 (en) * | 2010-09-16 | 2012-03-22 | Nitto Denko Corporation | Printed circuit board, printed circuit board assembly sheet and method of manufacturing the same |
| CN102446513A (en) * | 2010-10-12 | 2012-05-09 | 日东电工株式会社 | Suspension board with circuit and producing method thereof |
| CN105355215A (en) * | 2011-01-12 | 2016-02-24 | 日东电工株式会社 | Suspension board with circuit |
| US20120175151A1 (en) * | 2011-01-12 | 2012-07-12 | Nitto Denko Corporation | Suspension board with circuit and producing method thereof |
| CN103096614A (en) * | 2011-10-27 | 2013-05-08 | 日东电工株式会社 | Wired circuit board |
| CN103325391A (en) * | 2012-03-23 | 2013-09-25 | 日东电工株式会社 | Wired circuit board |
| CN104703400A (en) * | 2013-12-04 | 2015-06-10 | 日东电工株式会社 | Producing method of suspension board with circuit |
| US20150245472A1 (en) * | 2014-02-25 | 2015-08-27 | Nitto Denko Corporation | Wired circuit board and producing method thereof |
| CN106233386A (en) * | 2014-04-21 | 2016-12-14 | 日东电工株式会社 | Wired circuit board |
| CN105096970A (en) * | 2014-05-21 | 2015-11-25 | 日本发条株式会社 | Terminal connection structure |
| CN105206287A (en) * | 2014-06-26 | 2015-12-30 | 日东电工株式会社 | Suspension Board With Circuit And Producing Method Thereof |
| CN105939572A (en) * | 2015-03-03 | 2016-09-14 | 日东电工株式会社 | Wired circuit board |
| CN105979700A (en) * | 2015-03-10 | 2016-09-28 | 日东电工株式会社 | Suspension board with circuit and producing method thereof |
| CN107017008A (en) * | 2015-12-07 | 2017-08-04 | 日东电工株式会社 | The manufacture method of hanging base board with circuit and the hanging base board with circuit |
| US20170339786A1 (en) * | 2015-12-11 | 2017-11-23 | Nitto Denko Corporation | Suspension board with circuit and producing method thereof |
| CN107306475A (en) * | 2016-04-18 | 2017-10-31 | 日东电工株式会社 | Wired circuit board and its manufacture method |
| CN107393567A (en) * | 2016-05-12 | 2017-11-24 | 日东电工株式会社 | Hanging base board and its manufacture method with circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| CN110033793B (en) | 2021-12-03 |
| JP6951240B2 (en) | 2021-10-20 |
| JP2019117674A (en) | 2019-07-18 |
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