JP2017162543A - Substrate for suspension, suspension, suspension with head and hard disk drive - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a substrate for a suspension capable of improving connection reliability between an external terminal of an external connection substrate and a connection terminal.SOLUTION: A substrate 1 for a suspension of the invention comprises: an insulation layer 10; a metal support layer 20 provided on one surface of the insulation layer 10; a plurality of wirings 31 provided on the other surface of the insulation layer 10; and a plurality of connection terminals 33 provided on a tail area 3 and connected to the wirings 31. The connection terminals 33 can be jointed to an external terminal 132 of an external connection substrate 131 through an anisotropic conductive adhesive 62a. On an area corresponding to a space between the connection terminals 33 on the insulation layer 10, an insulation layer opening part 11 to which the anisotropic conductive adhesive 62a can be distributed, is provided. The metal support layer 20 has an opening communication part 21 communicated to the insulation layer opening part 11.SELECTED DRAWING: Figure 2

Description

  The present invention relates to a suspension substrate, a suspension, a suspension with a head, and a hard disk drive, and in particular, a suspension substrate, a suspension, and a suspension with a head that can improve connection reliability between an external terminal and a connection terminal of an external connection substrate. And hard disk drive.

  In general, a hard disk drive (HDD) includes a suspension board on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. Such a suspension substrate is formed so as to extend from the head region where the magnetic head slider is mounted to the tail region where the external connection substrate (FPC substrate, flexible printed circuit board) is joined, and a metal support layer; And a wiring layer having a plurality of wirings stacked on the metal support layer with an insulating layer interposed therebetween. Data is written to or read from the disk by passing an electric signal through each wiring.

  As described above, the FPC board is bonded to the tail region of the suspension board. That is, a connection terminal connected to each wiring is provided in the tail region of the suspension board, and each connection terminal is joined to the FPC terminal of the FPC board. An example in which an anisotropic conductive adhesive such as an anisotropic conductive film (ACF) is used for joining such a connection terminal and an FPC terminal is disclosed (for example, Patent Document 1). reference). An anisotropic conductive film has a structure in which an adhesive film made of an anisotropic conductive adhesive is interposed between a pair of release films. One of the release films is peeled off to temporarily serve as an FPC terminal. The other release film is peeled off, and then the connection terminal and the FPC terminal are bonded together by pressing the connection terminal and the FPC terminal at a predetermined temperature.

JP 2007-26654 A

  However, since the connection terminal and the FPC terminal are in contact with or close to each other by pressing the connection terminal of the suspension board and the FPC terminal of the FPC board, the anisotropic conductive adhesive present in the region between the connection terminals Is surrounded and confined by connection terminals. For this reason, the trapped anisotropic conductive adhesive is pressurized and exerts a force in a direction that separates the suspension substrate and the FPC substrate from each other. As a result, the suspension substrate is deformed, and there is a problem that the reliability of connection between the connection terminal of the suspension substrate and the FPC terminal of the FPC substrate is lowered.

  The present invention has been made in view of the above points, and the suspension board, suspension, suspension with head, and hard disk drive capable of improving the connection reliability between the external terminal and the connection terminal of the external connection board are provided. The purpose is to provide.

  As a first solution, the present invention provides a suspension substrate that extends from a head region on which a head slider is mounted to a tail region that is attached to an external connection substrate using an anisotropic conductive adhesive. A metal support layer provided on one surface of the insulating layer, a plurality of wirings provided on the other surface of the insulating layer, and a plurality of connection terminals provided in the tail region and connected to the wirings A plurality of the connection terminals that can be joined to the external terminals of the external connection board via the anisotropic conductive adhesive, and corresponding regions between the connection terminals in the insulating layer In addition, an insulating layer opening through which the anisotropic conductive adhesive can flow is provided, and the metal support layer is provided with an opening communication portion communicating with the insulating layer opening. Providing suspension substrates

  In the suspension substrate according to the first solving means described above, it is preferable that the insulating layer opening is separated from the connection terminal in plan view.

  Further, in the suspension substrate according to the first solving means described above, the metal support layer is separated from the metal support layer main body and the metal support layer main body and from each other, and each corresponds to the connection terminal. It is preferable that the plurality of metal support layer separation portions are provided, and the opening communication portion is provided between the metal support layer separation portions.

  In the suspension substrate according to the first solving means described above, it is preferable that the metal support layer separation portion has the same planar shape as the corresponding connection terminal.

  In the suspension substrate according to the first solving means described above, the planar area of the metal support layer separating portion is preferably larger than the planar area of the corresponding connecting terminal.

  Further, in the suspension substrate according to the first solving means described above, a conductive projecting portion projecting from the connection terminal and having conductivity is provided on the surface of the connection terminal opposite to the insulating layer side. It is preferable.

  In the suspension substrate according to the first solving means described above, it is preferable that the conductive protrusion is made of nickel, gold, or the same material as the connection terminal.

  Further, in the suspension substrate according to the first solving means described above, a conductive connection portion that penetrates the insulating layer and electrically connects the connection terminal and the corresponding metal support layer separation portion is provided. It is preferable.

  In the suspension substrate according to the first solving means described above, it is preferable that the conductive connection portion is made of nickel or the same material as the connection terminal.

  In the suspension substrate according to the first solving means described above, it is preferable that gold plating is applied to a surface of the metal support layer separating portion opposite to the insulating layer side.

  In the suspension substrate according to the first solving means described above, it is preferable that the conductive projecting portion and the conductive connecting portion are integrally formed.

  In the suspension substrate according to the first solving means described above, it is preferable that the metal support layer is integrally formed over a region corresponding to each of the connection terminals.

  Further, in the suspension substrate according to the first solving means described above, a conductive projecting portion projecting from the connection terminal and having conductivity is provided on the surface of the connection terminal opposite to the insulating layer side. It is preferable.

  In the suspension substrate according to the first solving means described above, it is preferable that the conductive protrusion is made of nickel, gold, or the same material as the connection terminal.

  In the suspension substrate according to the first solving means described above, the tail region further includes an additional insulating layer provided on a surface of the insulating layer on the wiring side and covering the wiring, and the additional insulating layer It is preferable that an additional insulating layer opening through which the anisotropic conductive adhesive can flow is provided in a region corresponding to the insulating layer opening.

  In the suspension substrate according to the first solving means described above, it is preferable that the connection terminal is provided on a surface of the additional insulating layer opposite to the insulating layer side.

  Further, in the suspension substrate according to the first solving means described above, the plurality of connection terminals are arranged on the opposite side of the first connection terminal and the head region side of the first connection terminal of the suspension substrate. A second connection terminal arranged along a longitudinal direction, wherein the wiring connected to the second connection terminal is arranged adjacent to the first connection terminal, and the first of the insulating layers is the first connection terminal. A second insulating layer opening through which the anisotropic conductive adhesive can flow is provided in a region corresponding to between the one connection terminal and the wiring connected to the second connection terminal; It is preferable that the metal support layer is provided with a second opening communication portion communicating with the second insulating layer opening.

  In the suspension substrate according to the first solving means described above, the metal support layer has an alignment mark including a mark opening provided in a joining region to which the anisotropic conductive adhesive is joined. Preferably, the insulating layer is provided with an insulating layer observation hole corresponding to the mark opening of the alignment mark.

  In the suspension substrate according to the first solution described above, the alignment mark is preferably formed in a ring shape.

  Further, in the suspension substrate according to the first solving means described above, the surface of the insulating layer on the wiring side is formed of the same material as the connection terminal in a region corresponding to the alignment mark, It is preferable that a mark support portion for supporting the alignment mark is provided.

  As a second solution, the present invention provides a suspension substrate that extends from a head region on which a head slider is mounted to a tail region that is attached to an external connection substrate via an anisotropic conductive adhesive. A metal support layer provided on one surface of the insulating layer, a plurality of wirings provided on the other surface of the insulating layer, and a plurality of connection terminals provided in the tail region and connected to the wirings A plurality of the connection terminals that can be joined to the external terminals of the external connection substrate via the anisotropic conductive adhesive, and the surface of the connection terminal opposite to the insulating layer side. Further, the present invention provides a suspension substrate, characterized by being provided with a conductive protrusion protruding from the connection terminal and having conductivity.

  In the suspension substrate according to the second solving means described above, it is preferable that the conductive protrusion is formed of the same material as that of nickel, gold, or the connection terminal.

  Further, in the suspension substrate according to the second solving means described above, the metal support layer is separated from the metal support layer main body and the metal support layer main body and from each other, and each corresponds to the connection terminal. A plurality of metal support layer separating portions provided, and through the insulating layer, and electrically connecting the connection terminals and the corresponding metal support layer separating portions are provided. It is preferable.

  In the suspension substrate according to the second solving means described above, it is preferable that the conductive connection portion is made of nickel, gold, or the same material as the connection terminal.

  In the suspension substrate according to the second solving means described above, it is preferable that the surface of the metal support layer separating portion opposite to the insulating layer is plated with gold.

  In the suspension substrate according to the second solving means described above, it is preferable that the conductive projecting portion and the conductive connecting portion are integrally formed.

  As a third solution, the present invention provides a suspension substrate that extends from a head region where a head slider is mounted to a tail region attached to an external connection substrate via an anisotropic conductive adhesive. A metal support layer provided on one surface of the insulating layer, a plurality of wirings provided on the other surface of the insulating layer, and a plurality of connection terminals provided in the tail region and connected to the wirings A plurality of connection terminals that can be joined to external terminals of the external connection substrate via the anisotropic conductive adhesive, and the metal support layer includes a metal support layer body, and the metal A plurality of metal support layer separation portions that are separated from the support layer main body and separated from each other, each corresponding to the connection terminal, penetrating the insulating layer, and corresponding to the connection terminal Separating the metal support layer To provide a suspension substrate, characterized in that the conductive connection portion for electrically connecting are provided and.

  In the suspension substrate according to the third solving means described above, it is preferable that the conductive connection portion is made of nickel, gold, or the same material as the connection terminal.

  In the suspension substrate according to the third solving means described above, it is preferable that gold plating is applied to a surface of the metal support layer separating portion opposite to the insulating layer side.

  As a fourth solution, the present invention provides a suspension substrate that extends from a head region on which a head slider is mounted to a tail region that is attached to an external connection substrate via an anisotropic conductive adhesive. A metal support layer provided on one surface of the insulating layer, a plurality of wirings provided on the other surface of the insulating layer, and a plurality of connection terminals provided in the tail region and connected to the wirings A plurality of connection terminals that can be joined to external terminals of the external connection substrate via the anisotropic conductive adhesive, and the metal support layer includes the anisotropic conductive adhesive. The alignment layer includes an alignment mark including a mark opening, and an insulating layer observation hole corresponding to the mark opening of the alignment mark is provided in the insulating layer. Do To provide a substrate for scan pension.

  In the suspension substrate according to the fourth solving means described above, the alignment mark is preferably formed in a ring shape.

  Further, in the suspension substrate according to the fourth solving means described above, the surface of the insulating layer on the wiring side is formed of the same material as the connection terminal in a region corresponding to the alignment mark, It is preferable that a mark support portion for supporting the alignment mark is provided.

  The present invention provides a suspension comprising: a base plate; and the above-described suspension substrate attached to the base plate via a load beam.

  The present invention provides a suspension with a head, comprising the above-described suspension and the head slider mounted on the suspension.

  The present invention provides a hard disk drive including the above-described suspension with a head.

  According to the present invention, the connection reliability between the external terminal and the connection terminal of the external connection substrate can be improved.

FIG. 1 is a plan view showing an example of a suspension substrate according to the first embodiment of the present invention. FIG. 2 is a plan view showing a tail region in the suspension substrate according to the first embodiment of the present invention. FIG. 3 is a rear view of FIG. 4 is a cross-sectional view taken along line AA in FIG. FIG. 5 is a plan view showing an example of a suspension according to the first embodiment of the present invention. FIG. 6 is a plan view showing an example of a suspension with a head according to the first embodiment of the present invention. FIG. 7 is a perspective view showing an example of the hard disk drive according to the first embodiment of the present invention. FIGS. 8A to 8D are diagrams for explaining a method of joining the connection terminal of the suspension board in the first embodiment of the present invention to the FPC terminal of the FPC board. FIG. 9 is a plan view showing a modified example (modified example 1) of the tail region. FIG. 10 is a rear view of FIG. 11 is a cross-sectional view taken along line BB in FIG. FIG. 12 is a cross-sectional view showing a modified example (modified example 2) of the tail region. FIG. 13 is a back view showing a modified example (modified example 3) of the tail region. FIG. 14 is a plan view showing a modification (Modification 4) of the tail region. FIG. 15 is a plan view showing a modified example (modified example 5) of the tail region. FIG. 16 is a cross-sectional view showing a tail region in the suspension substrate according to the second embodiment of the present invention. FIG. 17 is a cross-sectional view showing a modified example (modified example 6) of the tail region. FIG. 18 is a plan view showing a modification (modification 7) of the tail region. FIG. 19 is a cross-sectional view showing a modified example (modified example 8) of the tail region. FIG. 20 is a cross-sectional view showing a tail region in the suspension substrate according to the third embodiment of the present invention. FIG. 21 is a cross-sectional view showing a modified example (modified example 9) of the tail region. FIG. 22 is a cross-sectional view showing a modified example (modified example 10) of the tail region. FIG. 23 is a rear view showing a tail region in the suspension substrate in the fourth embodiment of the present invention. 24 is a cross-sectional view taken along the line CC of FIG. FIG. 25 is a cross-sectional view showing a modification (Modification 11) of FIG.

  A suspension substrate, a suspension, a suspension with a head, and a hard disk drive according to an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones.

First Embodiment First, a suspension substrate, a suspension, a suspension with a head, and a hard disk drive according to a first embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the suspension board 1 is mounted on an FPC board (external connection board, flexible printed board, see FIG. 8) 131 from a head region 2 where a head slider (see FIG. 6) 112 described later is mounted. The tail region 3 is formed so as to extend. The head region 2 in the present embodiment means a region close to a head terminal 32 (described later) connected to the mounted head slider 112, and the tail region 3 is a connection (described later) connected to the FPC board 131. This means a region close to the terminal 33.

  As shown in FIGS. 1 to 4, the suspension substrate 1 includes an insulating layer 10, a metal support layer 20 provided on one surface of the insulating layer 10, and a wiring provided on the other surface of the insulating layer 10. And a layer 30. Such an insulating layer 10, metal support layer 20 and wiring layer 30 are formed from the head region 2 to the tail region 3. The wiring layer 30 can be bonded to the plurality of wirings 31 including the reading wiring and the writing wiring, the head terminal 32, and the FPC terminal (external terminal) 132 of the FPC board 131 through the anisotropic conductive adhesive 62a. A plurality of connection terminals 33, and the head terminal 32 and the corresponding connection terminal 33 are connected by the wiring 31.

  The anisotropic conductive adhesive 62a is an adhesive in which conductive particles coated with insulation are mixed with a base material mainly composed of a thermosetting resin, and is heated and pressed. By this, it is the adhesive agent which provides electroconductivity performance to a press direction, and maintains insulation performance in the direction orthogonal to a press direction. When the connection terminal 33 and the FPC terminal 132 are bonded using such an anisotropic conductive adhesive 62a, an anisotropic conductive film (ACF) 60 can be preferably used. The anisotropic conductive film 60 has a structure in which an adhesive film 62 made of an anisotropic conductive adhesive 62a is interposed between a pair of release films 61 (see FIG. 8). An anisotropic conductive film “Anisolum: AC-7206U-8” manufactured by Kasei Kogyo Co., Ltd. can be used.

  2 and 3, as an example, five connection terminals 33 (first connection terminal 33a, second connection terminal 33b, third connection terminal 33c, fourth connection terminal 33d, and fifth connection terminal 33e) are provided. The form is shown. Among these, the second connection terminal 33b is arranged on the opposite side of the first connection terminal 33a from the head region 2 side along the longitudinal direction of the suspension substrate 1 (the direction extending from the head region 2 to the tail region 3). Has been. The wiring connected to the second connection terminal 33b is disposed adjacent to the first connection terminal 33a. The third connection terminal 33c is disposed on the side of the first connection terminal 33a (the direction orthogonal to the longitudinal direction of the suspension substrate 1), and the fourth connection terminal 33d and the fifth connection terminal 33e are the third connection terminal 33c. Are arranged in this order along the longitudinal direction of the suspension substrate 1 on the side opposite to the head region 2 side.

  As shown in FIGS. 2 and 3, in the tail region 3, the first insulating layer opening through which the anisotropic conductive adhesive 62 a can flow in the region corresponding to the space between the connection terminals 33 in the insulating layer 10. A portion (insulating layer opening) 11 is provided. In addition, a second region in which the anisotropic conductive adhesive 62a can flow in a region corresponding to the portion between the first connection terminal 33a and the wiring 31 connected to the second connection terminal 33b in the insulating layer 10 is provided. An insulating layer opening 12 is provided. In the present embodiment, the first insulating layer opening 11 and the second insulating layer opening 12 are formed in an elongated rectangular shape. In FIGS. 2 and 3, the second insulating layer opening 12 is provided in a region corresponding to the space between the third connection terminal 33c and the wiring 31 connected to the fourth connection terminal 33d. Although not shown, as shown in FIGS. 9 and 10 to be described later, the second insulating layer opening 12 can also be provided in this region.

  Such insulating layer openings 11 and 12 are separated in plan view from the corresponding connection terminals 33 (arranged next to each other in plan view). That is, the insulating layer 10 has an exposed portion 15 that is provided in a region between the connecting terminal 33 and the corresponding insulating layer openings 11 and 12 and is exposed to the connecting terminal 33 side. The insulating layer openings 11 and 12 are arranged so as to be separated from the corresponding connection terminals 33.

  The metal support layer 20 is provided with a first opening communication portion (opening communication portion) 21 communicating with the first insulating layer opening portion 11. Specifically, the metal support layer 20 is separated from the metal support layer main body 25 extending to the head region 2 side and the metal support layer main body 25 and from the metal support layer main body 25, and each is provided corresponding to the connection terminal 33. A plurality of metal support layer separation portions 26, and the first opening communication portion 21 is provided between the metal support layer separation portions 26 and between the metal support layer separation portions 26 adjacent to each other. It is composed of a space. In this way, the anisotropic conductive adhesive 62 a can flow into the first opening communication portion 21 through the first insulating layer opening 11. In the present embodiment, each metal support layer separation portion 26 has the same planar shape as the corresponding connection terminal 33, and the first opening communication portion 21 is the first insulating layer opening portion. It is larger than 11. Here, the “same” is not strictly determined, but is a concept including an error that may occur due to a manufacturing error or the like.

  Similarly, the metal support layer 20 is provided with a second opening communication portion 22 that communicates with the second insulating layer opening 12, and the anisotropic conductive adhesive 62 a is connected to the second insulating layer opening. 12 can flow into the second opening communication part 22. In addition, the 2nd opening communication part 22 in this Embodiment is comprised by the space of the side of the metal support layer isolation | separation part 26. FIG.

  As shown in FIG. 4, a protective layer 40 for covering the wiring 31 of the wiring layer 30 and preventing the corrosion of the wiring 31 is provided on the surface of the insulating layer 10 on the wiring layer 30 side. In the present embodiment, the protective layer 40 is not provided in the joining region 65 (see FIG. 2) to which the anisotropic conductive adhesive 62a is joined. In the joining region 65, the exposed portion 15 is provided. The insulating layer 10 including the connection terminal 33 is exposed. In FIGS. 1 and 2, the protective layer 40 is omitted for the sake of clarity.

  Next, each component will be described in detail.

  The material of the insulating layer 10 is not particularly limited as long as it is a material having a desired insulating property. For example, it is preferable to use polyimide (PI). Note that the material of the insulating layer 10 can be a photosensitive material or a non-photosensitive material. The thickness of the insulating layer 10 is preferably 5 μm to 30 μm, particularly 8 μm to 10 μm. As a result, it is possible to ensure the insulation performance between the metal support layer 20 and each wiring 31 and to prevent the rigidity of the suspension substrate 1 as a whole from being lost.

  The wiring 31 is configured as a conductor for transmitting an electrical signal. The material of the wiring 31 is not particularly limited as long as it has a desired conductivity, but copper (Cu) is used. Is preferred. In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, it is preferable that the thickness of the wiring 31 is, for example, 1 μm to 18 μm, particularly 9 μm to 12 μm. As a result, it is possible to ensure the transmission characteristics of the wiring 31 and to prevent loss of the flexibility of the suspension substrate 1 as a whole.

  The head terminal 32 and the connection terminal 33 are made of the same material and the same thickness as the wiring 31, and nickel plating and gold plating are applied in this order to form a plating layer 35.

  The material of the metal support layer 20 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel. The thickness of the metal support layer 20 can be 10 μm to 30 μm, especially 15 μm to 20 μm. As a result, the conductivity, rigidity, and elasticity of the metal support layer 20 can be ensured.

  As a material of the protective layer 40, it is preferable to use a resin material, for example, polyimide. The material of the protective layer 40 can be a photosensitive material or a non-photosensitive material.

  Next, the suspension 101 in the present embodiment will be described with reference to FIG. A suspension 101 shown in FIG. 5 includes a base plate 102, a load beam 103 attached on the base plate 102 and holding the metal support layer 20 of the suspension substrate 1, and the suspension substrate 1 attached to the load beam 103. I have.

  Next, the suspension with head 111 in the present embodiment will be described with reference to FIG. A suspension with head 111 shown in FIG. 6 includes the suspension 101 described above and a head slider 112 mounted on the head region 2 of the suspension substrate 1.

  Next, the hard disk drive 121 in this embodiment will be described with reference to FIG. 7 includes a case 122, a disk 123 that is rotatably attached to the case 122, stores data, a spindle motor 124 that rotates the disk 123, and a desired flying height on the disk 123. And a suspension 111 with a head including a head slider 112 that writes and reads data to and from the disk 123. Of these, the suspension with head 111 is movably attached to the case 122, and a voice coil motor 125 that moves the head slider 112 of the suspension with head 111 along the disk 123 is attached to the case 122. Yes. The suspension with head 111 is attached to the voice coil motor 125 via the arm 126 and attached to an FPC board 131 (see FIG. 8) connected to a control unit (not shown) that controls the hard disk drive 121. ing. That is, the FPC terminal 132 provided on the insulating base layer 133 of the FPC board 131 is joined to the connection terminal 33 of the suspension board 1 via the anisotropic conductive adhesive 62a, and the electric signal is transmitted to the suspension board 1. The signal is transmitted between the control unit and the head slider 112 via the substrate 1 and the FPC substrate 131. The FPC board 131 has a structure in which an insulating base layer 133 is laminated on a metal base layer 134 and an FPC terminal 132 is provided on the insulating base layer 133. And the plating layer 135 formed by gold plating is formed.

  Next, the operation of the present embodiment having such a configuration will be described.

  When manufacturing the suspension substrate 1 according to the present embodiment by the subtractive method, first, the insulating layer 10, the metal support layer 20 provided on one surface of the insulating layer 10, and the other surface of the insulating layer 10 are provided. A laminated body (not shown) having a wiring layer 30 provided is prepared. Subsequently, the wiring layer 30 is etched into a desired shape, and the wiring 31, the head terminal 32, and the connection terminal 33 are formed. Next, the protective layer 40 covering each wiring 31 is formed in a desired shape on the insulating layer 10. Next, the insulating layer 10 is etched into a desired shape. At this time, the first insulating layer opening 11 and the second insulating layer opening 12 are formed in the insulating layer 10 in the tail region 3. Subsequently, nickel plating and gold plating are sequentially performed on the head terminal 32 and the connection terminal 33 to form a plating layer 35. Thereafter, the metal support layer 20 is etched to form the metal support layer main body 25, the metal support layer separating portion 26, the first opening communication portion 21, and the second opening communication portion 22. Thus, the suspension substrate 1 in the present embodiment is obtained. The suspension substrate 1 may be manufactured by an additive method.

  The base plate 102 and the load beam 103 are attached to the obtained suspension substrate 1 by welding to obtain the suspension 101 shown in FIG. A head slider 112 is mounted on the head region 2 of the suspension 101 to obtain the suspension with head 111 shown in FIG.

  The suspension with head 111 shown in FIG. 6 is attached to the arm 126, and the suspension board 1 is mounted on the FPC board 131, so that the hard disk drive 121 shown in FIG. 7 is obtained.

  When the suspension substrate 1 is mounted on the FPC substrate 131, first, the anisotropic conductive film 60 cut to a size corresponding to the bonding region 65 is prepared (see FIG. 8A). Subsequently, one release film 61 of the anisotropic conductive film 60 is peeled off and temporarily attached to the FPC terminal 132 (see FIG. 8B). In this case, the anisotropic conductive film 60 from which one release film 61 is peeled may be temporarily attached to the connection terminal 33. Next, the other release film 61 is released (see FIG. 8C).

  Next, the connection terminal 33 is joined to the FPC terminal 132 (see FIG. 8D). At this time, for example, while heating at a temperature of 150 ° C. to 180 ° C., the connection terminal 33 is pressed for 10 minutes at a predetermined pressure using the bonding tool 67. As a result, fluidity is imparted to the anisotropic conductive adhesive 62 a that has formed the adhesive film 62, and the anisotropic conductive adhesive 62 a acts on the insulating layer 10 around the connection terminal 33 and the FPC. It reaches the insulating base layer 133 around the terminal 132. Further, while pressing the connection terminal 33, the surplus portion of the anisotropic conductive adhesive 62 a flows into the first opening communication portion 21 through the first insulating layer opening portion 11 and the second opening. It flows into the second opening communication portion 22 through the insulating layer opening portion 12 (see FIGS. 2 to 4). This can suppress an increase in the pressure of the anisotropic conductive adhesive 62 a confined between the insulating layer 10 of the suspension substrate 1 and the insulating base layer 133 of the FPC substrate 131.

  Also, by pressing the connection terminal 33, the conductive particles of the anisotropic conductive adhesive 62a located between the connection terminal 33 and the FPC terminal 132 are crushed, and the insulating coating is destroyed. As a result, conductive performance is imparted in the pressing direction of the anisotropic conductive adhesive 62a, and the connection terminal 33 and the corresponding FPC terminal 132 are electrically connected. On the other hand, since insulation is maintained in the direction orthogonal to the pressing direction, insulation is maintained between the connection terminals 33 (between the FPC terminals 132).

When writing and reading data in the hard disk drive 121 thus obtained, the head slider 112 of the suspension with head 111 is moved along the disk 123 by the voice coil motor 125 and rotated by the spindle motor 124. A desired flying height is maintained close to the existing disk 123. As a result, data is exchanged between the head slider 112 and the disk 123.
During this time, an electrical signal is transmitted between the control unit and the head slider 112 via the suspension substrate 1 and the FPC substrate 131. At this time, in the suspension substrate 1, an electrical signal is transmitted through each wiring 31 connected to the head terminal 32 and the connection terminal 33, and the connection terminal 33 of the suspension substrate 1 and the FPC substrate 131 bonded thereto are connected. An electrical signal is transmitted to and from the FPC terminal 132.

  As described above, according to the present embodiment, the first insulating layer opening 11 is provided in the region corresponding to the space between the connection terminals 33 in the insulating layer 10, and the first insulating layer opening 11 includes the first insulating layer opening 11. 1 open communication portion 21 communicates. Thus, when the connecting terminal 33 is pressed with the anisotropic conductive adhesive 62 a interposed between the connecting terminal 33 and the FPC terminal 132, the insulating layer 10 of the suspension substrate 1 and the insulating base of the FPC board 131 are used. The surplus of the anisotropic conductive adhesive 62 a confined between the layer 133 can flow into the first opening communication portion 21 through the first insulating layer opening portion 11. For this reason, it can suppress that the pressure of the anisotropic conductive adhesive 62a between the insulating layer 10 and the insulating base layer 133 becomes high. As a result, the suspension substrate 1 can be prevented from being deformed, and the connection reliability between the connection terminal 33 and the FPC terminal 132 can be improved.

  In addition, according to the present embodiment, the exposed portion 15 exposed to the connection terminal 33 side is provided in the region between the connection terminal 33 and the corresponding insulating layer openings 11 and 12 in the insulating layer 10. ing. As a result, the anisotropic conductive adhesive 62a is bonded to the exposed portion 15 of the insulating layer 10, and the bonding strength between the anisotropic conductive adhesive 62a and the suspension substrate 1 is improved. Can do. For this reason, the suspension substrate 1 can be reliably mounted by the FPC substrate 131.

  Further, according to the present embodiment, the metal support layer separation portion 26 has the same planar shape as the corresponding connection terminal 33, and the first opening communication portion 21 is more than the first insulating layer opening portion 11. It is getting bigger. As a result, when the anisotropic conductive adhesive 62a flowing into the first opening communication portion 21 through the first insulating layer opening 11 is solidified, the anisotropic conductive adhesive 62a with respect to the insulating layer 10 is solidified. An anchor effect occurs, and the bonding strength between the anisotropic conductive adhesive 62a and the insulating layer 10 can be improved. For this reason, the connection reliability of the connection terminal 33 and the FPC terminal 132 can be improved.

  Further, according to the present embodiment, the second insulating layer opening 12 is provided in a region corresponding to the space between the first connection terminal 33a and the wiring 31 connected to the second connection terminal 33b. A second opening communication portion 22 communicates with the second insulating layer opening 12. As a result, the surplus portion of the anisotropic conductive adhesive 62 a confined between the insulating layer 10 and the insulating base layer 133 passes through the second insulating layer opening 12 and the second opening communication portion 22. The pressure of the anisotropic conductive adhesive 62a between the insulating layer 10 and the insulating base layer 133 can be further suppressed. In the second insulating layer opening 12 as well, the anchor effect of the anisotropic conductive adhesive 62a is generated in the same manner as the first insulating layer opening 11. Note that the second insulating layer opening 12 may not be provided. Even in this case, the first insulating layer opening 11 and the first opening communication portion 21 may prevent anisotropic conductive adhesion. It can suppress that the pressure of the agent 62a becomes high.

  Furthermore, according to the present embodiment, the first insulating layer opening 11 and the second insulating layer opening 12 are formed in an elongated rectangular shape. As a result, the anisotropic conductive adhesive 62a can be smoothly passed through the opening communication portions 21 and 22, and the pressure of the anisotropic conductive adhesive 62a can be reliably suppressed from increasing.

  Hereinafter, modifications of the first embodiment will be described with reference to FIGS. 9 to 15, the same parts as those of the first embodiment shown in FIGS. 1 to 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

(Modification 1)
As shown in FIGS. 9 to 11, the planar area (area in plan view) of the metal support layer separating portion 26 may be larger than the planar area of the corresponding connection terminal. The embodiment shown in FIGS. 9 to 11 will be described in detail. Between the first connection terminal 33a and the wiring 31 connected to the second connection terminal 33b, and between the third connection terminal 33c and the fourth connection terminal 33d. A second insulating layer opening 12 is provided between the connected wiring 31. Further, the second connection terminal 33b is opposite to the fourth connection terminal 33d side (left side in FIG. 9) and the fourth connection terminal 33d is opposite to the second connection terminal 33b side (right side in FIG. 9). A third insulating layer opening 13 and a third opening communication portion 23 are provided. Similarly to the first insulating layer opening 11 and the second insulating layer opening 12, the third insulating layer opening 13 is connected to the corresponding connection terminal 33 via the exposed portion 15 of the insulating layer 10. They are separated in plan view.

  The width of the metal support layer separation portion 26 (the dimension in the direction orthogonal to the longitudinal direction of the suspension substrate 1) is formed to be larger than the width of the connection terminal 33, and the metal support layer separation portion 26 corresponds. It overlaps with a part of the insulating layer openings 11, 12, and 13 to be performed.

  According to the first modification, when the connection terminal 33 is pressed, the contact area between the bonding tool 67 (see FIG. 8) and the metal support layer separating portion 26 can be increased, and each connection terminal 33 can be made uniform. Can be pressed. In addition, the provision of the third insulating layer opening 13 and the third opening communication portion 23 increases the pressure of the anisotropic conductive adhesive 62a between the insulating layer 10 and the insulating base layer 133. Further suppression can be achieved.

(Modification 2)
As shown in FIG. 12, the connection terminal 33 may be provided on the surface of the additional insulating layer 50 on the side opposite to the insulating layer 10 side. When the form shown in FIG. 12 is specifically described, an additional insulating layer 50 that covers the wiring 31 of the wiring layer 30 is provided on the surface of the insulating layer 10 on the wiring layer 30 side. An additional wiring layer (not shown) is provided on the wiring layer 30 via an additional insulating layer 50. That is, in the above-described first embodiment (see FIGS. 1 to 8) and Modification 1 (see FIGS. 9 to 11), one-stage wiring in which only one wiring layer 30 is stacked on the insulating layer 10. Although the suspension substrate 1 having the structure is described as an example, in the second modification, the wiring layer 30 stacked on the insulating layer 10 and the additional layer stacked on the wiring layer 30 via the additional insulating layer 50 are described. An example of a suspension substrate 1 having a two-stage wiring structure having a wiring layer is shown. In this case, the protective layer 40 is formed on the surface of the additional insulating layer 50 opposite to the insulating layer 10 so as to cover the additional wiring layer. The connection terminal 33 is provided on the surface of the additional insulating layer 50 opposite to the insulating layer 10 side, and a via penetrating the additional insulating layer 50 is formed in the wiring 31 provided on the surface of the insulating layer 10. It is electrically connected via (not shown). That is, the connection terminal 33 forms an additional wiring layer different from the wiring layer 30.

  In the suspension substrate 1 having such an additional insulating layer 50 and the additional wiring layer, after the wiring layer 30 is etched, the additional insulating layer 50 is formed in a desired shape, and then the additional wiring layer is formed on the additional insulating layer 50. Can be obtained in a desired shape by plating.

  Further, a first additional insulating layer opening (additional insulating layer opening) through which the anisotropic conductive adhesive 62a can flow in a region corresponding to the first insulating layer opening 11 in the additional insulating layer 50. 51 is provided. Further, although not shown, a second additional insulating layer opening is provided in a region corresponding to the second insulating layer opening 12 in the additional insulating layer 50.

  According to the second modification, the excess of the anisotropic conductive adhesive 62a confined between the additional insulating layer 50 and the insulating base layer 133 is caused by the first additional insulating layer opening 51 and the first The pressure of the anisotropic conductive adhesive 62a between the additional insulating layer 50 and the insulating base layer 133 can be increased because the first insulating layer opening 11 can flow into the first opening communication portion 21. Can be suppressed. In addition, since the connection terminal 33 is provided on the surface of the additional insulating layer 50 opposite to the insulating layer 10 side, the connection terminal 33 is securely connected to the FPC terminal 132 via the anisotropic conductive adhesive 62a. Can be joined.

(Modification 3)
As shown in FIG. 13, the metal support layer 20 (that is, the metal support layer main body 25) may be integrally formed over a region corresponding to each connection terminal 33. In this case, as shown in FIG. 13, the first opening communication portion 21 is formed in the same shape as the first insulating layer opening portion 11, and the second opening communication portion 22 is the second insulating layer opening portion. It may be formed in the same shape as the portion 12. According to the third modified example, when the connection terminal 33 is pressed, the contact area between the bonding tool 67 and the metal support layer 20 can be increased, and each connection terminal 33 can be pressed uniformly. Become. In addition, the shape of the opening communication portions 21 and 22 in Modification 3 is not limited to the same shape as the insulating layer openings 11 and 12, and any shape as long as it communicates with the insulating layer openings 11 and 12. For example, the insulating layer openings 11 and 12 may have a larger opening. In this case, the anisotropic conductive adhesive 62a can be smoothly passed through the opening communication portions 21 and 22, and the anchor effect of the anisotropic conductive adhesive 62a on the insulating layer 10 can be exhibited.

(Modification 4 and Modification 5)
The first insulating layer opening 11 and the second insulating layer opening 12 can have any shape. For example, as shown in FIG. 14, each of the first insulating layer openings 11 is formed by connecting a plurality of rectangular openings, and the second insulating layer openings 12 are similarly formed in a plurality. These rectangular openings may be provided continuously. Moreover, as shown in FIG. 15, the 1st insulating layer opening part 11 and the 2nd insulating layer opening part 12 can be made into triangular shape and a rhombus shape. In FIG. 15, between the third connection terminal 33c and the wiring 31 connected to the fourth connection terminal 33d, and between the fourth connection terminal 33d and the fifth connection terminal 33e, A second insulating layer opening 12 having a triangular shape is provided therebetween.
A third insulating layer opening 13 having a triangular shape is provided on the left side of the second connection terminal 33b in FIG. 15 and the left side of the fifth connection terminal 33e in FIG. Similarly to the first insulating layer opening 11 and the second insulating layer opening 12, the third insulating layer opening 13 is connected to the corresponding connection terminal 33 via the exposed portion 15 of the insulating layer 10. They are separated in plan view.

Second Embodiment Next, a suspension substrate, a suspension, a suspension with a head, and a hard disk drive according to a second embodiment of the present invention will be described with reference to FIG.

  The second embodiment shown in FIG. 16 is mainly different in that a conductive protrusion having conductivity protruding from the connection terminal is provided on the surface of the connection terminal opposite to the insulating layer side, Other configurations are substantially the same as those of the first embodiment shown in FIGS. In FIG. 16, the same parts as those of the first embodiment shown in FIGS. 1 to 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 16, a conductive protrusion 70 that protrudes from the connection terminal 33 and has conductivity is provided on the surface of the connection terminal 33 opposite to the insulating layer 10 side. Such a conductive protrusion 70 can be formed, for example, by performing nickel plating on the connection terminal 33. In the present embodiment, the plating layer 35 is formed by applying nickel plating and gold plating to the connection terminal 33 and the conductive protrusion 70 in this order after the conductive protrusion 70 is formed. .

As described above, according to the present embodiment, the conductive protrusion 70 made of nickel is provided on the surface of the connection terminal 33 that is to be joined to the FPC terminal 132. As a result, the conductive protrusion 70 is made of a material harder than the FPC terminal 132 (generally formed of copper). Therefore, when the connection terminal 33 is pressed, the conductive protrusion 70 is connected to the FPC terminal 132. As a result, the conductive protrusion 70 and the FPC terminal 132 come into contact with each other.
For this reason, the conduction effect by the conductive protrusion 70 is added to the conduction effect by the anisotropic conductive adhesive 62a, and the connection reliability between the connection terminal 33 and the FPC terminal 132 can be further improved.

  The conductive protrusion 70 may be formed by performing nickel plating and gold plating in this order. In this case, the portion of the conductive protrusion 70 that is in contact with the FPC terminal 132 is formed of a material (gold) that is softer than the FPC terminal 132, so that when the connection terminal 33 is pressed, The gold plating part is deformed according to the shape of the FPC terminal 132. As a result, the contact area between the conductive protrusion 70 and the FPC terminal 132 can be increased, and the connection reliability can be improved.

  Hereinafter, modifications of the second embodiment will be described with reference to FIGS. 17 to 19.

(Modification 6)
As shown in FIG. 17, the conductive protrusion 70 may be formed of the same material as the connection terminal 33. In the sixth modification, the two conductive protrusions 70 are formed by half-etching the connection terminal 33. Also in Modification 6 as described above, when the connection terminal 33 is pressed, the pressing force by the bonding tool 67 can be concentrated on the conductive protrusion 70, and the conductive protrusion 70 can be reliably brought into contact with the FPC terminal 132. For this reason, the conduction effect by the conductive protrusion 70 is added to the conduction effect by the anisotropic conductive adhesive 62a, and the connection reliability between the connection terminal 33 and the FPC terminal 132 can be further improved.

(Modification 7)
The conductive protrusion 70 may be configured as shown in FIG. In this embodiment, as in Modification 2, an additional insulating layer 50 that covers the wiring 31 of the wiring layer 30 is provided on the surface of the insulating layer 10 on the wiring layer 30 side. An additional wiring layer (not shown) is provided on the wiring layer 30 via an additional insulating layer 50. The additional insulating layer 50 is also provided in the joining region 65 where the connecting terminal 33 and the FPC terminal 132 are joined by the anisotropic conductive adhesive 62a. The connecting terminal 33 of the wiring layer 30 is connected to the additional insulating layer 50. It is formed so as not to protrude from.

  Further, a first additional insulating layer opening (additional insulating layer opening) through which the anisotropic conductive adhesive 62a can flow in a region corresponding to the first insulating layer opening 11 in the additional insulating layer 50. 51 is provided. Although not shown, a second additional insulating layer opening is provided in a region corresponding to the second insulating layer opening 12 in the additional insulating layer 50.

  Further, a conductive protrusion 70 protruding from the additional insulating layer 50 is formed on the surface of the connection terminal 33 opposite to the insulating layer 10 side. In other words, the conductive protrusion 70 having the same shape as the connection terminal 33 is provided on the connection terminal 33, and the conductive protrusion 70 protrudes from the additional insulating layer 50. Such a conductive protrusion 70 can be formed by copper plating after the conductive protrusion 70 is formed of the same material as the connection terminal 33, for example, after the connection terminal 33 is formed. The formed conductive protrusions 70 are successively subjected to nickel plating and gold plating to form a plating layer 35.

  According to the modification example 7, the surplus of the anisotropic conductive adhesive 62a confined between the additional insulating layer 50 of the suspension substrate 1 and the insulating base layer 133 of the FPC substrate 131 is the first amount. The additional insulating layer opening 51 and the first insulating layer opening 11 can flow into the first opening communication portion 21, and the anisotropic conductivity between the additional insulating layer 50 and the insulating base layer 133 can be It can suppress that the pressure of the adhesive agent 62a becomes high. Moreover, since the conductive protrusion 70 protrudes from the additional insulating layer 50, the connection terminal 33 can be reliably bonded to the FPC terminal 132 via the anisotropic conductive adhesive 62a.

(Modification 8)
The conductive protrusion 70 may be configured as shown in FIG. In this embodiment, the additional insulating layer 50 is provided in the insulating layer 10 in the same manner as in the modified example 7. Here, the terminal connection portion 33 is provided on the surface of the connection terminal 33 opposite to the insulating layer 10 side. Two conductive protrusions 70 are formed of the same material as the above. Such a conductive protrusion 70 can be formed by, for example, copper plating after the connection terminal 33 is formed. The formed conductive protrusions 70 are successively subjected to nickel plating and gold plating to form a plating layer 35. Also in the modified example 8 as described above, when the connection terminal 33 is pressed against the FPC terminal 132, the conductive protrusion 70 can reliably contact the FPC terminal 132, and the anisotropic conductive adhesive 62a is used. The conduction effect by the conductive protrusion 70 is added to the conduction effect, and the bonding reliability between the connection terminal 33 and the FPC terminal 132 can be improved.

  Further, as a modification of the second embodiment, the insulating layer 10 is not provided with the insulating layer openings 11 and 12, and the metal support layer 20 is not provided with the opening communication portions 21 and 22. Also good. Even in this case, as described above, the conductive protrusion 70 provides an effect of improving the connection reliability between the connection terminal 33 and the FPC terminal 132. Furthermore, the metal support layer 20 is not limited to the example having the metal support layer separation portion 26, and may be integrally formed in a region corresponding to the plurality of connection terminals 33 (see FIG. 13).

Third Embodiment Next, a suspension substrate, a suspension, a suspension with a head, and a hard disk drive in a third embodiment of the present invention will be described with reference to FIG.

  The third embodiment shown in FIG. 20 is mainly different in that a conductive connection portion that penetrates the insulating layer and electrically connects the connection terminal and the corresponding metal support layer separation portion is provided. Other configurations are substantially the same as those of the first embodiment shown in FIGS. In FIG. 20, the same parts as those of the first embodiment shown in FIGS. 1 to 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 20, conductive connection portions (vias) 80 that penetrate the insulating layer 10 and electrically connect the connection terminals 33 and the corresponding metal support layer separation portions 26 are provided. Further, in the present embodiment, a conductive protrusion 70 that protrudes from the connection terminal 33 and has conductivity is provided on the surface of the connection terminal 33 opposite to the insulating layer 10 side. And the conductive connection portion 80 are integrally formed by nickel plating. Such a conductive connection part 80 forms a through hole 81 in the connection terminal 33 when forming the connection terminal 33, and forms a through hole 82 in the insulating layer 10 when etching the insulating layer 10, and then In addition, the through holes 81 and 82 can be formed by nickel plating. In the present embodiment, after the conductive connection portion 80 and the conductive protrusion 70 are formed, the plating layer 35 is subjected to nickel plating and gold plating in this order on the connection terminal 33 and the conductive protrusion 70. It is formed by.

  Thus, according to the present embodiment, the connection terminal 33 and the metal support layer separation part 26 corresponding to the connection terminal 33 are electrically connected by the conductive connection part 80. Thereby, after joining the connection terminal 33 and the FPC terminal 132, the continuity inspection of each set of the connection terminal 33 and the FPC terminal 132 can be easily performed by using the metal support layer separating portion 26. The connection reliability between the FPC terminal 132 and the FPC terminal 33 can be improved.

  Further, according to the present embodiment, the conductive protrusion 70 made of nickel is provided on the surface of the connection terminal 33 that is to be joined to the FPC terminal 132. As a result, the conductive protrusion 70 is made of a material harder than the FPC terminal 132 (generally formed of copper). Therefore, when the connection terminal 33 is pressed, the conductive protrusion 70 is connected to the FPC terminal 132. As a result, the conductive protrusion 70 and the FPC terminal 132 come into contact with each other. For this reason, the conduction effect by the conductive protrusion 70 is added to the conduction effect by the anisotropic conductive adhesive 62a, and the connection reliability between the connection terminal 33 and the FPC terminal 132 can be further improved.

  Hereinafter, a modification of the third embodiment will be described with reference to FIGS. 21 and 22.

(Modification 9)
As shown in FIG. 21, an inspection plating layer 83 formed by applying nickel plating and gold plating in this order is provided on the surface of the metal support layer separating portion 26 opposite to the insulating layer 10 side. May be. According to the ninth modification, the contact resistance between the tester (not shown) and the metal support layer separating portion 26 can be reduced during the continuity test, and the accuracy of the continuity test can be improved. Such a plating layer 83 for inspection may be formed on the entire surface opposite to the insulating layer 10 side of the metal support layer separating portion 26, or even on the side surface. Good.

(Modification 10)
As shown in FIG. 22, the conductive connection portion 80 may be formed of the same material as the connection terminal 33. Such a conductive connection portion 80 can be formed by an additive method. When the insulating layer 10 is formed on the metal support layer 20, a through hole 82 is formed in the insulating layer 10, and then copper plating is performed. Can be formed. In the modified example 10, as in the modified example 7, the two conductive protrusions 70 are formed by half-etching the connection terminal 33.

  Also in the modified example 10, after the connection terminal 33 and the FPC terminal 132 are joined, the continuity inspection of each set of the connection terminal 33 and the FPC terminal 132 is easily performed using the metal support layer separation unit 26. The connection reliability between the connection terminal 33 and the FPC terminal 132 can be improved. Further, when the connection terminal 33 is pressed, the pressing force by the bonding tool 67 can be concentrated on the conductive protrusion 70 so that the conductive protrusion 70 can be brought into contact with the FPC terminal 132 with certainty. For this reason, the conduction effect by the conductive protrusion 70 is added to the conduction effect by the anisotropic conductive adhesive 62a, and the connection reliability between the connection terminal 33 and the FPC terminal 132 can be further improved.

  As a modification of the third embodiment, the insulating layer 10 is not provided with the insulating layer openings 11 and 12, and the metal support layer 20 is not provided with the opening communication portions 21 and 22. Also good. Even in this case, as described above, the effect of improving the connection reliability between the connection terminal 33 and the FPC terminal 132 can be obtained. Furthermore, the conductive protrusion 70 may not be provided. Even in this case, as described above, the continuity test of each set of the connection terminal 33 and the FPC terminal 132 can be easily performed.

Fourth Embodiment Next, with reference to FIGS. 23 and 24, a suspension substrate, a suspension, a suspension with a head, and a hard disk drive in a fourth embodiment of the present invention will be described.

  In the fourth embodiment shown in FIGS. 23 and 24, the metal support layer includes a mark opening provided in a joining region where the connecting terminal and the external terminal are joined by an anisotropic conductive adhesive. The main difference is that an alignment mark is provided, and other configurations are substantially the same as those of the first embodiment shown in FIGS. 23 and 24, the same parts as those of the first embodiment shown in FIGS. 1 to 8 are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 23 and 24, the metal support layer 20 has an alignment mark 90 provided in a joining region 65 to which the anisotropic conductive adhesive 62a is joined. The alignment mark 90 includes a mark opening 91 and is formed in a ring shape. The insulating layer 10 is provided with a circular insulating layer observation hole 92 corresponding to the mark opening 91 of the alignment mark 90. Furthermore, the wiring layer 30 has a mark support portion 93 that is provided in a region corresponding to the alignment mark 90 and supports the alignment mark 90. That is, the mark support portion 93 is provided on the surface of the insulating layer 10 on the wiring 31 side (connection terminal 33 side) and is formed of the same material as the connection terminal 33. The mark support portion 93 is separated from the connection terminal 33. In the present embodiment, the protective layer 40 is also formed in a region corresponding to the alignment mark 90 in the bonding region 65, and the mark support portion 93 is covered with the protective layer 40. The protective layer 40 is provided with protective layer observation holes 94 corresponding to the insulating layer observation holes 92. In the present embodiment, the mark opening 91, the insulating layer observation hole 92, and the protective layer observation hole 94 have the same shape and the same diameter.

  As described above, according to the present embodiment, a mark (not shown) provided on the FPC board 131 is observed through the mark opening 91, the insulating layer observation hole 92, and the protective layer observation hole 94 of the alignment mark 90. can do. Thereby, when joining the connection terminal 33 to the FPC terminal 132, the alignment accuracy between the connection terminal 33 and the FPC terminal 132 can be improved, and the connection reliability between the connection terminal 33 and the FPC terminal 132 is improved. Can be made.

  Further, according to the present embodiment, the mark support portion 93 is provided in the region corresponding to the alignment mark 90. As a result, the alignment mark 90 is supported by the mark support portion 93, and deformation of the alignment mark 90 can be prevented. For this reason, it is possible to reliably improve the alignment accuracy between the connection terminal 33 and the FPC terminal 132.

  Hereinafter, a modification of the fourth embodiment will be described with reference to FIG.

(Modification 11)
As shown in FIG. 25, the diameter of the mark opening 91 of the alignment mark 90 may be smaller than the diameters of the insulating layer observation hole 92 and the protective layer observation hole 94. In this case, the wiring layer ring portion may not be provided. Also in this case, the connection terminal 33 and the FPC terminal 132 can be aligned using the alignment mark 90, and the connection reliability between the connection terminal 33 and the FPC terminal 132 can be improved.

  As a modification of the fourth embodiment, the insulating layer 10 is not provided with the insulating layer openings 11 and 12, and the metal support layer 20 is not provided with the opening communication portions 21 and 22. Also good. Even in this case, as described above, the connection reliability between the connection terminal 33 and the FPC terminal 132 can be improved.

  As described above, the embodiments of the present invention have been described in detail. However, the suspension substrate, the suspension, the suspension with a head, and the hard disk drive according to the present invention are not limited to the above-described embodiments, and the gist of the present invention. Various modifications can be made without departing from the scope of the invention, and the embodiments can be partially combined.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 2 Head area | region 3 Tail area | region 10 Insulating layer 11 1st insulating layer opening part 12 2nd insulating layer opening part 13 3rd insulating layer opening part 15 Exposed part 20 Metal support layer 21 1st opening communication Part 22 Second opening communication part 23 Third opening communication part 25 Metal support layer body 26 Metal support layer separation part 30 Wiring layer 31 Wiring 32 Head terminal 33 Connection terminal 35 Plating layer 40 Protection layer 50 Additional insulating layer 51 First Additional insulating layer opening 60 Anisotropic conductive film 61 Peeling film 62 Adhesive film 62a Anisotropic conductive adhesive 65 Bonding region 67 Bonding tool 70 Conductive protrusion 80 Conductive connecting portion 81 Through hole 82 Through hole 83 Inspection Plating layer 90 Alignment mark 91 Mark opening 92 Insulating layer observation hole 93 Mark support part 94 Protective layer observation hole 1 01 suspension 102 base plate 103 load beam 111 suspension with head 112 head slider 121 hard disk drive 122 case 123 disk 124 spindle motor 125 voice coil motor 126 arm 131 FPC board 132 FPC terminal 133 insulating base layer 134 metal base layer 135 plating layer

Claims (35)

In the suspension substrate that extends from the head region where the head slider is mounted to the tail region attached to the external connection substrate using an anisotropic conductive adhesive,
An insulating layer;
A metal support layer provided on one surface of the insulating layer;
A plurality of wirings provided on the other surface of the insulating layer;
A plurality of connection terminals provided in the tail region and connected to the wiring, the plurality of connection terminals connectable to the external terminals of the external connection substrate via the anisotropic conductive adhesive; With
An insulating layer opening through which the anisotropic conductive adhesive can flow is provided in a region corresponding to between the connection terminals in the insulating layer,
A suspension substrate, wherein the metal support layer is provided with an opening communication portion communicating with the insulating layer opening.   The suspension substrate according to claim 1, wherein the insulating layer opening is separated from the connection terminal in a plan view. The metal support layer includes a metal support layer main body, and a plurality of metal support layer separation portions that are separated from each other and separated from the metal support layer main body, each provided corresponding to the connection terminal. ,
The suspension substrate according to claim 1, wherein the opening communication portion is provided between the metal support layer separation portions.   The suspension substrate according to claim 3, wherein the metal support layer separation portion has the same planar shape as the corresponding connection terminal.   The suspension substrate according to claim 3, wherein a planar area of the metal support layer separation portion is larger than a planar area of the corresponding connection terminal.   6. The conductive protruding portion having conductivity and protruding from the connecting terminal is provided on a surface of the connecting terminal opposite to the insulating layer side. 6. Suspension substrate.   The suspension substrate according to claim 6, wherein the conductive protrusion is made of nickel, gold, or the same material as the connection terminal.   The suspension connection according to claim 6 or 7, further comprising a conductive connection portion that penetrates through the insulating layer and electrically connects the connection terminal and the corresponding metal support layer separation portion. substrate.   9. The suspension substrate according to claim 8, wherein the conductive connection portion is made of nickel or the same material as the connection terminal.   10. The suspension substrate according to claim 8, wherein gold plating is applied to a surface of the metal support layer separating portion opposite to the insulating layer side. 11.   The suspension substrate according to any one of claims 8 to 10, wherein the conductive protruding portion and the conductive connecting portion are integrally formed.   The suspension substrate according to claim 1, wherein the metal support layer is integrally formed over a region corresponding to each of the connection terminals.   13. The suspension substrate according to claim 12, wherein a conductive projecting portion that projects from the connection terminal and has conductivity is provided on a surface of the connection terminal opposite to the insulating layer side.   The suspension substrate according to claim 13, wherein the conductive protrusion is made of nickel, gold, or the same material as the connection terminal. The tail region further includes an additional insulating layer provided on a surface of the insulating layer on the wiring side and covering the wiring,
15. The additional insulating layer opening through which the anisotropic conductive adhesive can flow is provided in a region corresponding to the insulating layer opening in the additional insulating layer. The suspension substrate according to any one of the above.   The suspension board according to claim 15, wherein the connection terminal is provided on a surface of the additional insulating layer opposite to the insulating layer side. The plurality of connection terminals include a first connection terminal, and a second connection terminal disposed along the longitudinal direction of the suspension substrate on the side opposite to the head region side of the first connection terminal. ,
The wiring connected to the second connection terminal is disposed adjacent to the first connection terminal, and of the insulating layer, the first connection terminal and the wiring connected to the second connection terminal; A second insulating layer opening through which the anisotropic conductive adhesive can flow is provided in a region corresponding to
The suspension substrate according to any one of claims 1 to 16, wherein the metal support layer is provided with a second opening communication portion communicating with the second insulating layer opening. The metal support layer has an alignment mark including a mark opening provided in a joining region to which the anisotropic conductive adhesive is joined,
18. The suspension substrate according to claim 1, wherein an insulating layer observation hole corresponding to the mark opening of the alignment mark is provided in the insulating layer.   The suspension substrate according to claim 18, wherein the alignment mark is formed in a ring shape.   A surface of the insulating layer on the wiring side, which is formed of the same material as that of the connection terminal in a region corresponding to the alignment mark, and is provided with a mark support portion that supports the alignment mark. The suspension substrate according to claim 18 or 19. In the suspension substrate extending from the head region where the head slider is mounted to the tail region mounted on the external connection substrate via an anisotropic conductive adhesive,
An insulating layer;
A metal support layer provided on one surface of the insulating layer;
A plurality of wirings provided on the other surface of the insulating layer;
A plurality of connection terminals provided in the tail region and connected to the wiring, the plurality of connection terminals connectable to the external terminals of the external connection substrate via the anisotropic conductive adhesive; With
A suspension substrate, wherein a conductive projecting portion projecting from the connection terminal and having conductivity is provided on a surface opposite to the insulating layer side of the connection terminal.   The suspension substrate according to claim 21, wherein the conductive protrusion is made of nickel, gold, or the same material as the connection terminal. The metal support layer includes a metal support layer main body, and a plurality of metal support layer separation portions that are separated from each other and separated from the metal support layer main body, each provided corresponding to the connection terminal. ,
The suspension connection according to claim 21 or 22, further comprising a conductive connection portion that penetrates the insulating layer and electrically connects the connection terminal and the corresponding metal support layer separation portion. substrate.   The suspension substrate according to claim 23, wherein the conductive connection portion is made of nickel, gold, or the same material as the connection terminal.   25. The suspension substrate according to claim 23 or 24, wherein a surface of the metal support layer separation portion opposite to the insulating layer side is gold-plated.   26. The suspension substrate according to claim 23, wherein the conductive protrusion and the conductive connection portion are integrally formed. In the suspension substrate extending from the head region where the head slider is mounted to the tail region mounted on the external connection substrate via an anisotropic conductive adhesive,
An insulating layer;
A metal support layer provided on one surface of the insulating layer;
A plurality of wirings provided on the other surface of the insulating layer;
A plurality of connection terminals provided in the tail region and connected to the wiring, the plurality of connection terminals connectable to the external terminals of the external connection substrate via the anisotropic conductive adhesive; With
The metal support layer includes a metal support layer main body, and a plurality of metal support layer separation portions that are separated from each other and separated from the metal support layer main body, each provided corresponding to the connection terminal. ,
A suspension substrate, characterized in that a conductive connection portion that penetrates through the insulating layer and electrically connects the connection terminal and the corresponding metal support layer separation portion is provided.   28. The suspension board according to claim 27, wherein the conductive connection portion is made of nickel, gold, or the same material as the connection terminal.   29. The suspension substrate according to claim 27 or 28, wherein a gold plating is applied to a surface of the metal support layer separating portion opposite to the insulating layer side. In the suspension substrate extending from the head region where the head slider is mounted to the tail region mounted on the external connection substrate via an anisotropic conductive adhesive,
An insulating layer;
A metal support layer provided on one surface of the insulating layer;
A plurality of wirings provided on the other surface of the insulating layer;
A plurality of connection terminals provided in the tail region and connected to the wiring, the plurality of connection terminals connectable to the external terminals of the external connection substrate via the anisotropic conductive adhesive; With
The metal support layer has an alignment mark including a mark opening provided in a joining region to which the anisotropic conductive adhesive is joined,
A suspension substrate, wherein an insulating layer observation hole corresponding to the mark opening of the alignment mark is provided in the insulating layer.   The suspension substrate according to claim 30, wherein the alignment mark is formed in a ring shape.   A surface of the insulating layer on the wiring side, which is formed of the same material as that of the connection terminal in a region corresponding to the alignment mark, and is provided with a mark support portion that supports the alignment mark. The suspension substrate according to claim 30 or 31. A base plate;
A suspension comprising the suspension substrate according to any one of claims 1 to 32 attached to the base plate via a load beam. The suspension of claim 33;
A suspension with a head, comprising: the head slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 34.

Images