JP6128439B2 - Multi-sided suspension board, suspension board, suspension, suspension with head and hard disk drive - Google Patents

Description

  The present invention relates to a suspension substrate with multiple surfaces, a suspension substrate, a suspension, a suspension with a head, and a hard disk drive. Related suspensions and hard disk drives.

  In general, a hard disk drive (HDD) includes a suspension board on which a magnetic head slider for writing and reading data to and from a disk storing data is mounted. Such a suspension substrate is formed so as to extend from the head region where the magnetic head slider is mounted to the tail region where the external connection substrate (FPC substrate, flexible printed circuit board) is joined, and a metal support layer; And a wiring layer having a plurality of wirings stacked on the metal support layer with an insulating layer interposed therebetween. Data is written to or read from the disk by passing an electric signal through each wiring.

  As described above, the FPC board is bonded to the tail region of the suspension board. That is, a connection terminal connected to each wiring is provided in the tail region of the suspension board, and each connection terminal is joined to the FPC terminal of the FPC board. An example in which an anisotropic conductive adhesive such as an anisotropic conductive film (ACF) is used for joining such a connection terminal and an FPC terminal is disclosed (for example, Patent Document 1). reference). An anisotropic conductive film has a structure in which an adhesive film made of an anisotropic conductive adhesive is interposed between a pair of release films. One of the release films is peeled off to temporarily serve as an FPC terminal. The other release film is peeled off, and then the connection terminal and the FPC terminal are bonded together by pressing the connection terminal and the FPC terminal at a predetermined temperature.

JP 2007-26654 A

  As described above, the connection terminal and the FPC terminal are connected by pressing the connection terminal of the suspension board and the FPC terminal of the FPC board. At this time, if the strength of the tail region of the suspension board is insufficient, When the connection terminal and the FPC terminal are pressed, the tail region may be broken. Such tail region breakage occurs particularly at the periphery of the tail region.

  The present invention has been made in consideration of such points, and when the strength of the tail region is increased to connect the external terminal and the connection terminal of the external connection board, the tail region is not broken. An object is to provide a suspension substrate, a suspension substrate, a suspension, a suspension with a head, and a hard disk drive.

  The present invention includes a frame and a plurality of suspension substrates disposed in the frame and arranged in multiple faces, the suspension substrate including a head region on which a head slider is mounted, a metal support layer, a first insulating layer, A main substrate region having a first wiring layer and a protective layer; connected to the main substrate region and attached to the external connection substrate; and a first insulating layer, a first wiring layer, and a second insulating layer; And a tail region having a second wiring layer, wherein the protective layer of the main substrate region facing the tail region extends from the boundary between the tail region and the main substrate region further into the tail region. This is a multi-surface suspension substrate.

  In the present invention, the frame has a metal support layer, a first insulating layer, a first wiring layer, and a protective layer, and the protective layer of the frame facing the tail region is separated from the boundary between the tail region and the frame. Further, the suspension substrate is a multi-surface suspension board that extends into the tail region.

  The present invention is the multi-surface suspension substrate, wherein the second wiring layer in the tail region has a connection terminal connected to the external connection substrate.

  The present invention is the suspension substrate with multiple surfaces, wherein the main substrate region has a second insulating layer and a second wiring layer disposed between the first wiring layer and the protective layer.

  The present invention includes a head region on which a head slider is mounted, a main substrate region having a metal support layer, a first insulating layer, a first wiring layer, and a protective layer, connected to the main substrate region, and external A protective layer for the main substrate region facing the tail region is mounted on the connection substrate and includes a tail region having a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer. The suspension substrate is characterized in that it extends further from the boundary between the tail region and the main substrate region into the tail region.

  The present invention is the suspension substrate, wherein the second wiring layer in the tail region has a connection terminal connected to the external connection substrate.

  The present invention is the suspension substrate, wherein the main substrate region has a second insulating layer and a second wiring layer disposed between the first wiring layer and the protective layer.

  The present invention is a suspension comprising a base plate and the above-described suspension substrate attached to the base plate via a load beam.

  The present invention is a suspension with a head comprising the above-described suspension and the head slider mounted on the suspension.

  The present invention is a hard disk drive including the above-described suspension with a head.

  According to the present invention, when the external terminal and the connection terminal of the external connection board are connected, the tail region can be prevented from being broken.

FIG. 1 is a plan view showing an example of a multi-surface suspension substrate in an embodiment of the present invention. FIG. 2 is an enlarged view of part A in FIG. FIG. 3 is an enlarged view of a portion B in FIG. 4 is a cross-sectional view taken along line VI-VI in FIG. 5 is a cross-sectional view taken along line VV in FIG. 6 is a cross-sectional view taken along line VI-VI in FIG. FIG. 7 is a diagram showing an example of a suspension in the embodiment of the present invention. FIG. 8 is a plan view showing an example of the suspension with a head according to the embodiment of the present invention. FIG. 9 is a perspective view showing an example of a hard disk drive according to the embodiment of the present invention. FIGS. 10A to 10D are views for explaining a method of joining the connection terminal of the suspension board in the first embodiment of the present invention to the FPC terminal of the FPC board.

  A multi-surface suspension substrate, a suspension substrate, a suspension, a suspension with a head, and a hard disk drive according to an embodiment of the present invention will be described with reference to the drawings. In the drawings attached to the present specification, for the sake of illustration and ease of understanding, the scale, the vertical / horizontal dimension ratio, and the like are appropriately changed and exaggerated from those of the actual ones.

  First, a multi-surface suspension substrate, a suspension substrate, a suspension, a suspension with a head, and a hard disk drive according to an embodiment of the present invention will be described with reference to FIGS.

  As shown in FIG. 1, the multi-surface suspension substrate 1A includes a rectangular frame 1B and a plurality of multi-surface suspension substrates 1 arranged in the frame 1B, and each suspension substrate 1 is attached to the frame 1B. It is connected via the connecting part 1C. Among these, each suspension substrate 1 is a tail region mounted on an FPC substrate (external connection substrate, flexible printed circuit board, see FIG. 10) from a head region 2 on which a head slider (see FIG. 8) 112 described later is mounted. 3 to extend to 3. The head region 2 in the present embodiment means a region close to a head terminal 32 (described later) connected to the mounted head slider 112, and the tail region 3 is a connection (described later) connected to the FPC board 131. This means a region close to the terminal 33.

  In the suspension substrate 1 shown in FIGS. 1 to 6, the region from the head region 2 to immediately before the tail region 3 is the main substrate region 2A, and eventually the main substrate region 2A including the head region 2 and the tail region. 3 constitutes a suspension substrate 1.

  The main substrate region 2 </ b> A of the suspension substrate 1 is provided on the insulating layer (first insulating layer) 10, the metal support layer 20 provided on one surface of the insulating layer 10, and the other surface of the insulating layer 10. A wiring layer (first wiring layer) 30 is provided.

  If necessary, the main substrate region 2A includes an additional insulating layer (second insulating layer) 50 provided on the first wiring layer 30 and an additional wiring layer (first insulating layer) including wiring provided on the additional insulating layer 50. 2 wiring layers) 55.

  In this case, the first wiring layer 30 is connected to the second wiring layer 55 through a conductor portion 58 provided so as to penetrate the second insulating layer 50.

  The first wiring layer 30 includes a plurality of wirings 31 including a reading wiring and a writing wiring, and a head terminal 32.

  Further, a protective layer 40 that covers the second wiring layer 55 is provided on the second wiring layer 55. As described above, the main substrate region 2A includes the second insulating layer 50 provided on the first wiring layer 30 and the second wiring layer 55 provided on the second insulating layer 50. It is not necessary to provide the second insulating layer 50 and the second wiring layer 55 in the region 2A, and the first wiring layer 30 may be directly covered with the protective layer 40.

  In FIG. 1, the cover layer 40 is removed from the main substrate region 2A of the suspension substrate 1 for convenience.

  5 and 6, the tail region 3 of the suspension substrate 1 includes an insulating layer (first insulating layer) 10, and a wiring layer (first wiring layer) 30 provided on the insulating layer 10. And an additional insulating layer (second insulating layer) 50 provided on the wiring layer 30 and a connection terminal 33 provided on the additional insulating layer 50, and a plating layer 35 is formed on the connection terminal 33. Yes.

  In FIG. 5 and FIG. 6, the first wiring layer 30 and the connection terminal 33 are connected via a conductor portion 58 provided so as to penetrate the second insulating layer 50. The connection terminal 33 can be connected to an FPC terminal (external terminal) 132 of the FPC board 131 via an anisotropic adhesive 62a. The connection terminal 33 is a wiring 55a of the additional wiring layer 55 in the main board region 2A. In addition, the second wiring layer is formed.

  By the way, the frame 1B that constitutes the suspension substrate 1A with multiple surfaces and surrounds and supports each suspension substrate 1 includes an insulating layer 10, a metal supporting layer 20 provided on one surface of the insulating layer 10, and an insulating layer 10B. A wiring layer 30 provided on the other surface of the layer 10, an additional insulating layer 50 provided on the wiring layer 30, and a protective layer 40 provided on the additional insulating layer 50 are provided.

  In the portion of the main substrate region 2A that faces the tail region 3, the protective layer 40 of the main substrate region 2A extends further from the boundary X1 between the main substrate region 2A and the tail region 3 into the tail region 3. (See FIG. 5). In FIG. 5, the edge of the protective layer 40 extending from the main substrate region 2A to the tail region 3 is indicated by Y1.

  Similarly, in a portion of the frame 1B facing the tail region 3, the protective layer 40 of the frame 1B extends further from the boundary X2 between the frame 1B and the tail region 3 into the tail region 3 (see FIG. 6). In FIG. 6, the edge of the protective layer 40 extending from the frame 1B into the tail region 3 is indicated by Y2.

  As shown in FIGS. 5 and 6, the protective layer 40 in the main substrate region 2A is extended from the boundary X1 between the main substrate region 2A and the tail region 3 further into the tail region 3, and the edge Y1 of the protective layer 40 is tailed. By bringing it into the region 3, the strength of the tail region 3 can be improved. Similarly, by extending the protective layer 40 of the frame 1B from the boundary X2 between the frame 1B and the tail region 3 further into the tail region 3, and bringing the edge Y2 of the protective layer 40 into the tail region 3, the tail region 3 The strength of can be improved.

  That is, when the connection terminal 33 of the tail region 3 is connected to the external terminal 132 of the FPC board 131 as described later, the external terminal 132 and the connection terminal 33 of the tail region 3 are pressed against each other. In this case, the strength of the tail region 3 is increased while the connection terminal 33 in the tail region 3 is exposed outwardly by extending the protective layer 40 into the tail region 3 beyond the boundary X1 on the main substrate region 2A side. Can be improved. For this reason, when the external terminal 132 and the connection terminal 33 are connected, it is possible to prevent the tail region 3 from being damaged or broken.

  Further, by extending the protective layer 40 further into the tail region 3 beyond the boundary X2 on the frame 1B side, the protection of the tail region 3 supported by the frame 1B can be enhanced.

  Next, a connection structure between the connection terminal 33 and the external terminal 132 in the tail region 3 will be described.

  The connection terminal 33 and the external terminal 132 are bonded by an anisotropic conductive adhesive 62a. Here, the anisotropic conductive adhesive 62a is an adhesive in which conductive particles coated with insulation are mixed with a base material having adhesiveness mainly composed of a thermosetting resin, and is heated and pressed. By doing so, it is an adhesive that imparts conductive performance in the pressing direction and maintains insulation performance in the direction orthogonal to the pressing direction. When the connection terminal 33 and the FPC terminal 132 are bonded using such an anisotropic conductive adhesive 62a, an anisotropic conductive film (ACF) 60 can be preferably used. The anisotropic conductive film 60 has a structure in which an adhesive film 62 made of an anisotropic conductive adhesive 62a is interposed between a pair of release films 61 (see FIG. 10). An anisotropic conductive film “Anisolum: AC-7206U-8” manufactured by Kasei Kogyo Co., Ltd. can be used.

  1 and 3 show an example in which five connection terminals 33 are provided.

  Next, each component will be described in detail.

  The material of the first insulating layer 10 and the second insulating layer 50 is not particularly limited as long as the material has a desired insulating property. For example, it is preferable to use polyimide (PI). The material of the first insulating layer 10 and the second insulating layer 50 can be a photosensitive material or a non-photosensitive material. Moreover, it is preferable that the thickness of the 1st insulating layer 10 and the 2nd insulating layer 50 is 5 micrometers-30 micrometers, especially 8 micrometers-10 micrometers. As a result, the insulation performance between the metal support layer 20 and the first wiring layer 30 and between the first wiring layer 30 and the second wiring layer 55 is ensured, and the rigidity of the suspension substrate 1 as a whole is increased. It can be prevented from being lost.

  The wiring 31 of the first wiring layer 30 is configured as a conductor for transmitting an electrical signal, and the material of the wiring 31 is not particularly limited as long as it is a material having desired conductivity. It is preferable to use copper (Cu). In addition to copper, any material having electrical characteristics similar to pure copper can be used. Here, it is preferable that the thickness of the wiring 31 is, for example, 1 μm to 18 μm, particularly 9 μm to 12 μm. As a result, it is possible to ensure the transmission characteristics of the wiring 31 and to prevent loss of the flexibility of the suspension substrate 1 as a whole. In addition, the wiring 55 a of the second wiring layer 55 has the same structure as the wiring 31 of the first wiring layer 30.

  The head terminal 32 of the first wiring layer 30 and the connection terminal 33 of the second wiring layer 55 are made of the same material and the same thickness as the wiring 31 of the first wiring layer 30 and the wiring 55a of the second wiring layer 55, respectively. On the head terminal 32 and the connection terminal 33, nickel plating and gold plating are applied in this order to form a plating layer 35.

  The material of the metal support layer 20 is not particularly limited as long as it has desired conductivity, elasticity, and strength. For example, stainless steel, aluminum, beryllium copper, or other copper alloys are used. It is preferable to use stainless steel. The thickness of the metal support layer 20 can be 10 μm to 30 μm, especially 15 μm to 20 μm. As a result, the conductivity, rigidity, and elasticity of the metal support layer 20 can be ensured.

  As a material of the protective layer 40, it is preferable to use a resin material, for example, polyimide. The material of the protective layer 40 can be a photosensitive material or a non-photosensitive material. Moreover, the thickness of the protective layer 40 can be 3 micrometers-10 micrometers.

  Next, the suspension 101 in the present embodiment will be described with reference to FIG. The suspension 101 shown in FIG. 7 includes a base plate 102, a load beam 103 attached on the base plate 102 and holding the metal support layer 20 of the suspension substrate 1, and the suspension substrate 1 attached to the load beam 103. I have.

  Next, the suspension with head 111 in the present embodiment will be described with reference to FIG. A suspension with head 111 shown in FIG. 8 includes the suspension 101 described above and a head slider 112 mounted on the head region 2 of the suspension substrate 1.

  Next, the hard disk drive 121 in this embodiment will be described with reference to FIG. The hard disk drive 121 shown in FIG. 9 has a case 122, a disk 123 that is rotatably attached to the case 122 and stores data, a spindle motor 124 that rotates the disk 123, and a desired flying height on the disk 123. And a suspension 111 with a head including a head slider 112 that writes and reads data to and from the disk 123. Of these, the suspension with head 111 is movably attached to the case 122, and a voice coil motor 125 that moves the head slider 112 of the suspension with head 111 along the disk 123 is attached to the case 122. Yes. The suspension with head 111 is attached to the voice coil motor 125 via the arm 126 and attached to an FPC board 131 (see FIG. 10) connected to a control unit (not shown) that controls the hard disk drive 121. ing. That is, the FPC terminal 132 provided on the insulating base layer 133 of the FPC board 131 is joined to the connection terminal 33 of the suspension board 1 via the anisotropic conductive adhesive 62a, and the electric signal is transmitted to the suspension board 1. The signal is transmitted between the control unit and the head slider 112 via the substrate 1 and the FPC substrate 131. The FPC board 131 has a structure in which an insulating base layer 133 is laminated on a metal base layer 134 and an FPC terminal 132 is provided on the insulating base layer 133. And the plating layer 135 formed by gold plating is formed.

  Next, the operation of the present embodiment having such a configuration will be described.

  First, a suspension substrate 1A having a frame 1B and a plurality of suspension substrates 1 arranged in the frame 1B and connected to the frame 1B is manufactured by a subtractive method or an additive method (see FIG. 1). In this case, each suspension substrate 1 of the multi-surface suspension substrate 1A is coupled to the frame 1B via the coupling portion 1C on the head region 2 side, and directly coupled to the frame 1B on the tail region 3 side.

  Next, each suspension substrate 1 is separated from the frame 1B by breaking the breaking line L1 on the head region 2 side, and separated from the frame 1B by breaking the breaking line L2 in the tail region 3.

  In this way, each suspension substrate 1 is separated from the frame 1B via the fracture lines L1 and L2.

  Next, the base plate 102 and the load beam 103 are attached to the obtained suspension substrate 1 by welding to obtain the suspension 101 shown in FIG. A head slider 112 is mounted on the head region 2 of the suspension 101, and the suspension with head 111 shown in FIG. 8 is obtained.

  The suspension with head 111 shown in FIG. 8 is attached to the arm 126, and the suspension board 1 is mounted on the FPC board 131, so that the hard disk drive 121 shown in FIG. 9 is obtained.

  When the suspension substrate 1 is mounted on the FPC substrate 131, first, an anisotropic conductive film 60 cut to a size corresponding to the joining region 65 covering the connection terminal 33 in the tail region 3 is prepared (see FIG. 1 and FIG. 10 (a)). Subsequently, one release film 61 of the anisotropic conductive film 60 is peeled off and temporarily attached to the FPC terminal 132 (see FIG. 10B). In this case, the anisotropic conductive film 60 from which one release film 61 is peeled may be temporarily attached to the connection terminal 33. Next, the other release film 61 is peeled (see FIG. 10C).

  Next, the connection terminal 33 is joined to the FPC terminal 132 (see FIG. 10D). At this time, for example, while heating at a temperature of 150 ° C. to 180 ° C., the connection terminal 33 is pressed for 10 minutes at a predetermined pressure using the bonding tool 67. As a result, fluidity is imparted to the anisotropic conductive adhesive 62 a that has formed the adhesive film 62, and the anisotropic conductive adhesive 62 a is connected to the second insulating layer 50 around the connection terminal 33. , And reaches the insulating base layer 133 around the FPC terminal 132.

  When writing and reading data in the hard disk drive 121 thus obtained, the head slider 112 of the suspension with head 111 is moved along the disk 123 by the voice coil motor 125 and rotated by the spindle motor 124. A desired flying height is maintained close to the existing disk 123. As a result, data is exchanged between the head slider 112 and the disk 123. During this time, an electrical signal is transmitted between the control unit and the head slider 112 via the suspension substrate 1 and the FPC substrate 131. At this time, in the suspension substrate 1, an electrical signal is transmitted through each wiring 31 connected to the head terminal 32 and the connection terminal 33, and the connection terminal 33 of the suspension substrate 1 and the FPC substrate 131 bonded to the connection terminal 33. An electrical signal is transmitted to and from the FPC terminal 132.

  As described above, since the tail region 3 of the suspension substrate 1 is pressed and connected to the external terminal 132 of the FPC substrate 131, the structure has no metal support layer 20 in order to provide flexibility.

  According to the present embodiment, when the suspension substrate 1 is connected to the FPC substrate 131, the protective layer 40 in the main substrate region 2A extends beyond the boundary X1 with the tail region 3 and further into the tail region 3. The strength of the tail region 3 can be improved while the connection terminal 33 in the tail region 3 is exposed to the outside. Therefore, when the FPC terminal (external terminal) 132 of the FPC board 131 and the connection terminal 33 of the tail region 3 are connected, even if the FPC terminal 132 and the connection terminal 33 are pressed against each other, the tail region 3 is damaged or broken. Can be prevented in advance.

  In particular, when the FPC terminal and the connection terminal 33 are pressed, there is a high possibility that the stress is applied to the vicinity of the boundary X1 between the main substrate region 2A with the metal support layer and the tail region 3 without the metal support layer, and the fracture occurs. By extending the protective layer 40 in the main substrate region 2A beyond the boundary X1 and into the tail region 3, protection in the vicinity of the boundary X1 can be enhanced.

  Further, in the state where the suspension substrate 1 is supported by the frame 1B, the protective layer 40 of the frame 1B extends beyond the boundary X2 with the tail region 3 and further into the tail region 3, so that it is supported by the frame 1B. It is possible to enhance protection of the tail region 3. In particular, when the suspension substrate 1 is supported by the frame 1B, the stress concentrates on the boundary X2 where the metal support layer is interrupted, and there is a high possibility of fracture near the boundary X2 between the tail region 3 and the frame 1B. By extending the protective layer 40 of the frame 1B beyond the boundary X2 and into the tail region 3, protection in the vicinity of the boundary X2 can be enhanced.

DESCRIPTION OF SYMBOLS 1 Suspension board | substrate 1A Multi-surface suspension board | substrate 1B Frame 1C Connection part 2 Head area | region 2A Main board | substrate area | region 3 Tail area | region 10 1st insulating layer 20 Metal support layer 30 1st wiring layer 31 Wiring 32 Head terminal 33 Connection terminal 35 Plating layer 40 protective layer 50 second insulating layer 55 second wiring layer 58 conductive portion 60 anisotropic conductive film 61 release film 62 adhesive film 62a anisotropic conductive adhesive 65 bonding area 67 bonding tool 101 suspension 102 base plate 103 load Beam 111 Suspension with head 112 Head slider 121 Hard disk drive 122 Case 123 Disk 124 Spindle motor 125 Voice coil motor 126 Arm 131 FPC board 132 FPC terminal 133 Insulating base layer 134 Metal base Layer 135 plated layer X1 boundary X2 boundaries Y1 edge Y2 edge

Claims (10)

Frame,
A plurality of suspension boards arranged in a frame and multi-faced,
The suspension substrate includes a head region on which the head slider is mounted, and a main substrate region having a metal support layer, a first insulating layer, a first wiring layer, and a protective layer;
A tail region connected to the main substrate region and attached to the external connection substrate and having a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer;
The multi-surface suspension substrate according to claim 1, wherein the protective layer of the main substrate region facing the tail region extends further from the boundary between the tail region and the main substrate region into the tail region.   The frame includes a metal support layer, a first insulating layer, a first wiring layer, and a protective layer. The protective layer of the frame facing the tail region is further in the tail region from the boundary between the tail region and the frame. 2. The multi-surface suspension substrate according to claim 1, wherein the suspension substrate extends to the surface.   3. The multi-surface suspension substrate according to claim 1, wherein the second wiring layer in the tail region has a connection terminal connected to the external connection substrate. 4.   4. The multi-surface suspension substrate according to claim 1, wherein the main substrate region has a second insulating layer and a second wiring layer disposed between the first wiring layer and the protective layer. . A main substrate region including a head region on which the head slider is mounted and having a metal support layer, a first insulating layer, a first wiring layer, and a protective layer;
A tail region connected to the main substrate region and attached to the external connection substrate and having a first insulating layer, a first wiring layer, a second insulating layer, and a second wiring layer;
A suspension substrate, wherein the protective layer of the main substrate region facing the tail region extends further from the boundary between the tail region and the main substrate region into the tail region.   6. The suspension substrate according to claim 5, wherein the second wiring layer in the tail region has a connection terminal connected to the external connection substrate.   The suspension substrate according to claim 5 or 6, wherein the main substrate region has a second insulating layer and a second wiring layer disposed between the first wiring layer and the protective layer. A base plate;
A suspension comprising: the suspension substrate according to any one of claims 5 to 7 attached to the base plate via a load beam. The suspension according to claim 8;
A suspension with a head, comprising: the head slider mounted on the suspension.   A hard disk drive comprising the suspension with a head according to claim 9.

Images