JP5704485B2 - Printed wiring board connection structure, head stack assembly including the printed wiring board connection structure, magnetic disk device including the head stack assembly, and method for manufacturing the printed wiring board connection structure - Google Patents

Description

  The present invention relates to a printed wiring board connection structure, a head stack assembly including the printed wiring board connection structure, a magnetic disk device including the head stack assembly, and a method of manufacturing the printed wiring board connection structure.

In a magnetic disk device such as a hard disk drive, a head stack assembly (hereinafter referred to as HSA) is used for writing recording data recorded on the magnetic disk and reading (recording / reproducing) recording data. .) Is used.
In recent years, with the miniaturization and high density of magnetic disk devices, a printed wiring board comprising a suspension-side printed wiring board terminal and an actuator assembly-side printed wiring board constituting an HSA is connected. The electrical and mechanical strength of the connection structure has become an important factor affecting the reliability of HSA.
Conventionally, such a printed wiring board connection structure is formed by forming a terminal of the printed wiring board on the suspension side as a so-called flying lead and ultrasonically connecting the terminal of the printed wiring board on the actuator assembly side with a bonding tool or the like. What was formed by this was common.
As a prior art showing the connection structure of such a printed wiring board, for example, there is Patent Document 1 below.

JP 2007-173362 A

The above-mentioned patent document 1 is an invention relating to a flying lead bonding method, and has an advantage that the bonding property between the flying lead and the substrate pad is ensured and ultrasonic bonding can be efficiently performed using a bonding tool.
However, in a conventional printed wiring board connection structure in which a flying lead as shown in Patent Document 1 is formed and a printed wiring board connection structure is formed using ultrasonic connection, the suspension side formed as a flying lead is used. These terminals are generally connected to terminals on the actuator assembly side formed at the bottom of a recess formed by opening an insulating layer. Therefore, since the flying lead has a bent shape (substantially U-shape) pushed into the recess, the connection between the terminals may be peeled off due to the restoring force (spring back) of the flying lead. There was a problem that connection reliability was low.

  Therefore, the present invention solves the above-described conventional problems and can improve the electrical and mechanical connection reliability, and a printed circuit board connection structure, a head stack assembly including the printed circuit board connection structure, It is an object of the present invention to provide a method of manufacturing a magnetic disk device having the head stack assembly and a printed wiring board connection structure.

The printed wiring board connection structure of the present invention is a method in which a flying lead provided on a first printed wiring board and an exposed lead provided on a second printed wiring board are ultrasonicated through a metal plating layer. In the printed wiring board connection structure formed by connecting, the exposed lead is configured to be exposed in a recess formed by opening a part of an insulating layer laminated on a base material, and The metal plating layer includes a nickel (Ni) plating layer or a copper (Cu) plating layer that covers the exposed lead, and the second printed wiring in the first printed wiring board extends beyond the depth of the recess. The first feature is that the exposed lead is formed on the surface of the exposed lead with a thickness greater than the distance from the contact surface with the plate to the position where the flying lead is provided .

According to the first feature of the present invention, the printed wiring board connection structure includes a flying lead provided on the first printed wiring board and an exposed lead provided on the second printed wiring board. A printed wiring board connection structure formed by ultrasonic connection through a metal plating layer, wherein the exposed lead is exposed in a recess formed by opening a part of an insulating layer laminated on a substrate. And the metal plating layer includes a nickel (Ni) plating layer or a copper (Cu) plating layer that covers the exposed lead, and exceeds the depth of the recess. since the contact surface between the second printed circuit board in the wiring board, with a distance more than the thickness up to the position where the flying leads are provided, it is formed on the surface of the exposed lead off Ing lead does not become a bent shape that is pushed into the side of the second printed circuit board (substantially U-shaped).

Therefore, it is possible to reliably prevent the restoring force (spring back) of the flying lead from acting in the direction in which the connection between the flying lead and the exposed lead is peeled off.

It is possible to improve the care and mechanical connection reliability of electricity in Tsu good.

Connection structure of a printed wiring board of the present invention also includes, in addition to the first feature of the present invention, the metal plating layer is a second feature that you have configured at least the surface layer as a gold plating layer .

According to the second feature of the present invention, in addition to the operational effects of the first feature of the present invention, the metal plating layer is good because at least the surface layer is configured as a gold plating layer. Electrical conductivity and cost saving can be achieved.

The head stack assembly of the present invention is in that it comprises a connection structure of a printed wiring board according to the first or second aspect of the present invention and the third aspect.

According to the third aspect of the present invention, since the head stack assembly includes the printed wiring board connection structure according to the first or second aspect of the present invention, electrical and mechanical Connection reliability can be improved.
Also, good electrical conductivity and cost saving can be achieved.

The magnetic disk apparatus of the present invention is that it comprises a head stack assembly according to the third aspect of the present invention as a fourth aspect.

According to the fourth aspect of the present invention, since the magnetic disk drive includes the head stack assembly according to the third aspect of the present invention, the electrical and mechanical connection reliability is improved. be able to.
Also, good electrical conductivity and cost saving can be achieved.

Moreover, the manufacturing method of the connection structure of the printed wiring board of this invention is the process of preparing the 1st printed wiring board provided with a flying lead on a base material, and the base material on the base material under the said 1st printed wiring board. A step of preparing a second printed wiring board having an exposed lead for receiving the flying lead in a recess formed by opening a part of a laminated insulating layer; and a surface of the exposed lead exceeding a depth of the recess. Nickel (Ni) covering the exposed lead with a thickness greater than the distance from the contact surface of the first printed wiring board with the second printed wiring board to the position where the flying lead is provided forming a metal plating layer comprising a plating layer or copper (Cu) plated layer, from above the first printed circuit board, and said flying lead using an ultrasonic connection means A serial exposure leads are the fifth, comprising the step of ultrasonic bonding.

According to the fifth aspect of the present invention, the printed wiring board connection structure manufacturing method includes the steps of preparing a first printed wiring board having a flying lead on a substrate, and the first printed wiring board. A step of preparing a second printed wiring board having an exposed lead for receiving the flying lead in a recess formed by opening a part of an insulating layer laminated on a base material; and a surface of the exposed lead The exposure with a thickness greater than the distance from the contact surface of the first printed wiring board with the second printed wiring board beyond the depth of the recess to the position where the flying lead is provided. forming a metal plating layer including nickel (Ni) plating layer or copper (Cu) plated layer covering the lead, from above the first printed circuit board, prior to using the ultrasonic bonding means Flying lead and the said exposed lead from further comprising the step of ultrasonic bonding, never flying lead is bent shape that is pushed into the side of the second printed circuit board (substantially U-shaped).
Therefore, it is possible to effectively prevent or suppress the restoring force (spring back) of the flying lead in the direction in which the connection between the flying lead and the exposed lead is peeled off.
Therefore, electrical and mechanical connection reliability can be improved.

According to the printed wiring board connection structure of the present invention, the head stack assembly including the printed wiring board connection structure, and the magnetic disk device including the head stack assembly, the electrical and mechanical connection reliability is improved. It can be improved, and good electrical conductivity and cost saving can be achieved.
Moreover, according to the method for manufacturing a printed wiring board connection structure of the present invention, electrical and mechanical connection reliability can be improved.

It is a top view which shows the internal structure of the hard disk drive to which the connection structure of the printed wiring board which concerns on embodiment of this invention is applied. FIGS. 2A and 2B are diagrams illustrating a head stack assembly of the hard disk device illustrated in FIG. 1, in which FIG. 1A is an overall plan view, and FIG. is there. It is a figure which shows the principal part of the connection structure of the printed wiring board which concerns on embodiment of this invention, (a) is a perspective view which shows the state in which the connection structure of the printed wiring board was formed, (b) is a connection of a printed wiring board It is a disassembled perspective view of a structure. It is a figure which shows the principal part of the connection structure of the printed wiring board which concerns on embodiment of this invention, (a) is a top view which shows the state in which the connection structure of the printed wiring board was formed, (b) is A of (a). It is sectional drawing in the -A line direction. It is a figure which shows the principal part of the connection structure of a printed wiring board, (a) is sectional drawing in the BB line direction of FIG. These are sectional drawings in the connection structure of the conventional printed wiring board. It is sectional drawing which simplifies and shows the manufacturing method of the connection structure of the printed wiring board which concerns on embodiment of this invention. It is sectional drawing which simplifies and shows the manufacturing method of the connection structure of the printed wiring board which concerns on embodiment of this invention. It is sectional drawing which shows the modification 1 of the connection structure of the printed wiring board which concerns on embodiment of this invention. It is sectional drawing which shows the modification 2 of the connection structure of the printed wiring board which concerns on embodiment of this invention.

  With reference to the following drawings, a printed wiring board connection structure according to an embodiment of the present invention, a head stack assembly including the printed wiring board connection structure, a magnetic disk device including the head stack assembly, and the above A method for manufacturing a printed wiring board connection structure will be described to provide an understanding of the present invention. However, the following description is an embodiment of the present invention, and does not limit the contents described in the claims.

  1 to 5, a printed wiring board connection structure according to an embodiment of the present invention, a head stack assembly including the printed wiring board connection structure, and a magnetic disk including the head stack assembly The apparatus will be described.

A printed wiring board connection structure 1000 according to an embodiment of the present invention forms a head stack assembly 300 constituting a hard disk device 1 of a computer as a magnetic disk device shown in FIG. is there.
As shown in FIG. 1, the hard disk device 1 includes a plurality of magnetic disks 200 in which information is recorded and rotatably supported by a motor in a case 100 serving as a main body, and information with respect to the magnetic disks 200. And a head core (not shown) for reading and writing. The head core is held by the head stack assembly 300 so as to be able to swing on the surface of the magnetic disk 200, and is electrically connected to a fixed portion 400 that is connected to external wiring.

  Referring also to FIG. 2A, the head stack assembly 300 includes a magnetic head unit 310, a suspension 320, an actuator assembly 330, and a voice coil motor 340.

The magnetic head unit 310 is for writing and reading information, and includes a head core (not shown).
Although not shown in detail in FIG. 2A, the head core is connected to a suspension printed wiring board 321 provided along the suspension 320, and information is transmitted via the suspension printed wiring board 321. Exchanged.

The suspension 320 has a function of supporting the magnetic head unit 310 and applying an elastic force to the magnetic head unit 310 in the direction of the magnetic disk 200.
As shown in FIG. 2A, the suspension 320 includes a suspension printed wiring board 321 serving as a first printed wiring board in the printed wiring board connection structure 1000.

The suspension printed wiring board 321 is a flexible printed wiring board for transmitting sense current, write information, and read information.
As shown in FIGS. 3 to 5, the suspension printed wiring board 321 mainly includes a base material 321a, leads 321b, and an insulating layer 321c.

The base material 321a serves as a base of the suspension printed wiring board 321 and is formed of an insulating resin film.
As a resin film, what consists of a resin material excellent in the softness | flexibility is used. For example, any film may be used as long as it is normally used as a resin film for forming a flexible printed wiring board, such as a polyimide film or a polyester film.
In particular, those having high heat resistance in addition to flexibility are desirable. For example, polyamide resin films, polyimide resin films such as polyimide and polyamideimide, and polyethylene naphthalate can be preferably used.
Further, as the heat resistant resin, any resin may be used as long as it is normally used as a heat resistant resin for forming a flexible printed wiring board, such as a polyimide resin or an epoxy resin.
The thickness of the base material 321a is desirably about 9 μm to 11 μm.

The lead 321b is a conductive layer constituting circuit wiring, terminals, and the like of the suspension printed wiring board 321.
In the present embodiment, as shown in FIG. 3B, the three leads 321b formed particularly in the terminal region T1 are formed in parallel at predetermined intervals as the flying leads F.
2 (b) and FIG. 3, a part of the electrode assembly (not shown) formed in the head region H is a magnetic head portion 310 and a flying lead F formed in the terminal region T1 is an actuator assembly described later. It is electrically connected to the exposed lead E formed in the terminal region T2 (so-called connection pad portion) of the printed wiring board 333 for use.

Here, “flying lead” means aerial wiring using only a conductor.
The lead 321b can be formed by using a known forming method such as etching a conductive metal foil laminated on the base material 321a.
Moreover, copper (Cu) can be used as the conductive metal foil. Of course, it is not limited to copper (Cu), and any material may be used as long as it is normally used as a conductive metal foil for forming a conductive layer of a flexible printed wiring board.
Although not shown, the surface of the connection region S connected to the exposed lead E through the metal plating layer M to be described later in the flying lead F is a well-known method such as electroless plating, electrolytic plating, or vacuum deposition. The gold plating layer is formed using the forming method.
Note that the thickness of the lead 321b is desirably about 8 μm to 13 μm.

The insulating layer 321c is a layer for ensuring insulation of the suspension printed wiring board 321.
The insulating layer 321c is made of a coverlay, a solder resist, or the like, and can be formed using a known forming method.
Note that the thickness of the insulating layer 321c is desirably about 3 μm to 7 μm, more preferably about 3 μm to 5 μm.

The actuator assembly 330 mainly holds the magnetic head portion 310 and the suspension 320 in a swingable manner, and electrically connects the suspension printed wiring board 321 and the fixing portion 400.
As shown in FIG. 2A, the actuator assembly 330 mainly transmits an actuator unit 331 for swingably holding the magnetic head unit 310 and the suspension 320, and a rotational force of the voice coil motor 340. Pivot shaft 332 and actuator assembly printed wiring board 333.

The actuator assembly printed wiring board 333 is a flexible printed wiring board serving as the second printed wiring board in the printed wiring board connection structure 1000, and the electrical connection between the suspension printed wiring board 321 and the fixing portion 400. It is used for.
As shown in FIGS. 3 and 4, the actuator assembly printed wiring board 333 is mainly composed of a base material 333a, leads 333b, and an insulating layer 333c.
In addition, since the base material 333a, the lead 333b, and the insulating layer 333c respectively perform the same member and the same function as the base material 321a, the lead 321b, and the insulating layer 321c described above, The description will be omitted.

The lead 333b is a conductive layer constituting circuit wiring, terminals, and the like of the printed wiring board 333 for actuator assembly.
In the present embodiment, in particular, the lead 333b formed in the terminal region T2 is an insulating layer 333c stacked on the base material 333a so as to receive the flying lead F formed in the terminal region T1 of the printed wiring board 321 for suspension. Three of the exposed leads E are formed in parallel at a predetermined interval in a recess U formed by opening a part of the lead.
In addition, as for the width W1 of the recessed part U shown to Fig.4 (a), it is desirable to set it as about 3 mm-20 mm.
2B and 3, the exposed lead E formed in the terminal region T 2 has the flying lead F formed in the terminal region T 1 of the suspension printed wiring board 321 and the connector region K. An electrode (not shown) formed on the electrode is electrically connected to the fixing portion 400. As a result, a control signal, a signal to be recorded on the magnetic disk 200 and power are supplied to the flexible printed wiring board 321 for suspension, and a signal reproduced from the magnetic disk 200 is received.

In the present embodiment, as shown in FIGS. 3 to 5, the flying lead F formed in the terminal region T1 of the suspension printed wiring board 321 and the terminal region T2 of the actuator assembly printed wiring board 333 are formed. The exposed lead E is ultrasonically connected through a metal plating layer M formed on the surface of the exposed lead E.
More specifically, as shown in FIGS. 3 to 5, a metal plating layer M is formed on the surface of the exposed lead E, and the suspension printed wiring board 321 is positioned so that the connection region S is positioned above the exposed lead E. In the state in which the printed wiring board connection structure 1000 is formed by ultrasonically connecting the flying lead F and the exposed lead E using an ultrasonic connection means 500 described later.
As shown in FIGS. 3 to 5, in the present embodiment, the metal plating layer M is formed on the surface of the exposed lead E with a thickness greater than the depth of the recess U. More specifically, as shown in FIG. 5, the thickness of the portion of the metal plating layer M beyond the recess U is such that the flying lead from the contact surface of the suspension printed wiring board 321 with the actuator assembly printed wiring board 333. The metal plating layer M is formed so as to have the same thickness as the distance D to the position where F is provided.

By adopting such a configuration, as shown in FIG. 5A, the flying lead F is not bent, and the exposed lead E is electrically and mechanically connected through the metal plating layer M in a flat state. Can be connected to.
Therefore, it is possible to reliably prevent the restoring force (spring back) from acting on the flying lead F.
Therefore, the printed wiring board connection structure 1000 can improve electrical and mechanical connection reliability.

On the other hand, in the conventional printed wiring board connection structure 10000, as shown in FIG. 5B, the lead 3210b formed in the terminal region of the suspension printed wiring board 3210 is formed as the flying lead F, and the actuator- The conductor 3330b formed in the terminal region of the assembly printed wiring board 3330 is formed as the exposed lead E, and is formed by applying ultrasonic vibration using an ultrasonic connection means such as a bonding tool and connecting (ultrasonic connection). Things were common.
Further, as shown in FIG. 5B, it is common to form the exposed lead E by exposing the lead 3330b by forming the recess U in the insulating layer 3330c.
Therefore, since the flying lead F is ultrasonically connected to the exposed lead E formed on the bottom surface of the recess U by using an ultrasonic connection means (not shown), as shown in FIG. The lead F is pushed into the recess U. That is, the connection region S has a bent shape (substantially U-shaped) that is pushed and bent toward the actuator assembly printed wiring board 3330 side.
Accordingly, a restoring force (spring back) acts on the flying lead F in a direction in which the connection between the exposed lead E and the flying lead F is peeled off. Therefore, there is a possibility that the connection between the flying lead F and the exposed lead E is peeled off, and there is a problem that the electrical and mechanical connection reliability is low.

Conventionally, there is also a printed wiring board connection structure that is configured to be connected to the second printed wiring board in a flat state without bending the first printed wiring board by interposing the solder in the concave portion U. there were.
However, in the printed wiring board connection structure having such a configuration, a plurality of flying leads F are formed in the terminal area of the suspension printed wiring board, and a plurality of exposed leads E are formed in the terminal area of the actuator assembly printed wiring board. In some cases, a configuration for ensuring insulation between adjacent flying leads F and exposed leads E is required, which complicates the manufacturing process and increases costs.
In addition, since solder has surface tension, there is a problem that the joint surface with the flying lead F is difficult to be flat, and electrical and mechanical connection reliability is lacking.
In the conventional printed wiring board connection structure 10000, the same members and the same functions as those of the printed wiring board connection structure 1000 in the embodiment of the present invention have the same three-digit number and the same number as the alphabet. An alphabet is attached and the following description is omitted.

Therefore, by adopting the configuration of the printed wiring board connection structure 1000 according to the embodiment of the present invention, the surface of the metal plating layer M to be a joint surface with the flying lead F can be made a flat surface with high accuracy. The exposed lead E can be electrically and mechanically connected through the metal plating layer M in a flat state without bending the flying lead F.
Therefore, the printed wiring board connection structure 1000 can improve electrical and mechanical connection reliability.

The metal plating layer M is for electrically and mechanically connecting the flying lead F and the exposed lead E.
The metal plating layer M is not shown in detail, but after forming a nickel (Ni) plating layer or a copper (Cu) plating layer on the surface of the exposed lead E, gold plating that becomes the surface layer of the metal plating layer M It is configured by forming a layer.
With such a configuration, it is possible to obtain a printed wiring board connection structure 1000 capable of achieving good electrical conductivity and cost saving.
The thickness of the gold plating layer constituting the surface layer of the metal plating layer M is preferably about 0.05 μm to 10 μm.
Moreover, as a formation method of the metal plating layer M, well-known formation methods, such as electroless plating, electrolytic plating, and vacuum evaporation, can be used.

  The voice coil motor 340 is a motor for swinging the magnetic head unit 310 and the suspension 320 held by the actuator unit 331.

  The fixing portion 400 is disposed in the case 100 serving as a main body, mainly responsible for connection with external wiring, and is connected to the actuator assembly printed wiring board 333 by a connector (not shown).

  Next, with reference to FIG. 6, FIG. 7, the manufacturing method of the connection structure 1000 of the printed wiring board which concerns on embodiment of this invention is demonstrated.

First, referring to FIG. 6A, a suspension printed wiring board 321 which is a first printed wiring board having flying leads F in a terminal region T1 is prepared.
Next, referring to FIG. 6 (b), under the printed wiring board 321 for suspension, an exposure for receiving the flying lead F in a recess U formed by opening a part of the insulating layer 333c laminated on the base material 333a. A printed wiring board 333 for actuator assembly, which is a second printed wiring board having leads E, is prepared.
Next, referring to FIG. 6C, a metal plating layer M is formed on the surface of the exposed lead E by using a known forming method such as electroless plating, electrolytic plating, vacuum deposition or the like.
More specifically, a nickel (Ni) plating layer or a copper (Cu) plating layer is first formed on the surface of the exposed lead E so that the thickness of the metal plating layer M is equal to or greater than the depth of the recess U. Thereafter, a gold plating layer to be a surface layer of the metal plating layer M is formed on the surface of the nickel (Ni) plating layer or the copper (Cu) plating layer.
More specifically, as shown in FIG. 5A, the thickness of the portion of the metal plating layer M beyond the concave portion U is a contact surface with the printed wiring board 333 for actuator assembly in the printed wiring board 321 for suspension. The nickel (Ni) plating layer, the copper (Cu) plating layer, and the gold plating layer are formed so as to have the same thickness as the distance D from the position where the flying lead F is provided.
The thickness of the gold plating layer is preferably about 0.05 μm to 10 μm.
Next, referring to FIG. 7A, the flying lead F and the exposed lead E are ultrasonically connected through the metal plating layer M using the ultrasonic connection means 500.
Through the above steps, the printed wiring board connection structure 1000 shown in FIG. 7B is formed.

Thus, with the configuration of the printed wiring board connection structure 1000 according to the embodiment of the present invention, the exposed lead E and the exposed lead E can be connected via the metal plating layer M in a flat state without bending the flying lead F. It can be connected electrically and mechanically.
Therefore, it is possible to reliably prevent the restoring force (spring back) from acting on the flying lead F.
Therefore, the printed wiring board connection structure 1000 can improve electrical and mechanical connection reliability.

The printed wiring board connection structure 1000 formed in this manner is disposed inside the hard disk device 1 in a state where the head stack assembly 300 is formed.
The method for manufacturing the printed wiring board connection structure 1000 is not limited to the manufacturing order described above, and can be changed as appropriate.

Next, with reference to FIG. 8, the modification 1 of the connection structure of the printed wiring board which concerns on embodiment of this invention is demonstrated.
In the printed wiring board connection structure 2000 according to the first modification, the thickness of the portion of the metal plating layer M beyond the recess U is from the contact surface of the suspension printed wiring board 321 with the actuator assembly printed wiring board 333. The metal plating layer M is formed to have a thickness exceeding the distance D to the position where the flying lead F is provided.
Other configurations are the same as those of the printed wiring board connection structure 1000 according to the embodiment of the present invention described above.
Accordingly, the same members and the same functions as those of the printed wiring board connection structure 1000 according to the embodiment of the present invention are denoted by the same numbers and the same alphabets, and the following description is omitted.

With this configuration, the flying lead F is shaped so that the outer side of the connection region S with the exposed lead E is on the side of the printed wiring board 333 for the actuator assembly (direction of connection with the exposed lead E). ) To be bent (substantially mountain-shaped).
Therefore, the restoring force (spring back) of the flying lead F can be applied to the actuator assembly printed wiring board 333 side (connection direction with the exposed lead E) as the second printed wiring board. Therefore, it is possible to effectively prevent the connection between the flying lead F and the exposed lead E from being peeled off, and to achieve a printed wiring board connection structure 2000 that can further improve the electrical and mechanical connection reliability. be able to.

Next, with reference to FIG. 9, the modification 2 of the connection structure of the printed wiring board which concerns on embodiment of this invention is demonstrated.
In the printed wiring board connection structure 3000 according to the second modification, the thickness of the portion of the metal plating layer M beyond the concave portion U is determined from the contact surface of the suspension printed wiring board 321 with the actuator assembly printed wiring board 333. The metal plating layer M is formed to have a thickness less than the distance D to the position where the flying lead F is provided.
Other configurations are the same as those of the printed wiring board connection structure 1000 according to the embodiment of the present invention described above.
Accordingly, the same members and the same functions as those of the printed wiring board connection structure 1000 according to the embodiment of the present invention are denoted by the same numbers and the same alphabets, and the following description is omitted.

With such a configuration, as shown in FIG. 9, the shape of the flying lead F becomes a bent shape (substantially U-shaped) that is pushed and bent toward the actuator assembly printed wiring board 333 side. However, it is possible to reliably prevent the flying lead F from being pushed into the recess U.
Therefore, it is possible to effectively prevent the restoring force (spring back) from acting on the flying lead F in the direction in which the connection between the exposed lead E and the flying lead F is peeled off.
Therefore, the printed wiring board connection structure 3000 can improve electrical and mechanical connection reliability as compared with the conventional printed wiring board connection structure 10000 described above.
Preferably, however, the thickness of the metal plating layer M beyond the recess U is from the contact surface of the suspension printed wiring board 321 to the actuator assembly printed wiring board 333 to the position where the flying lead F is provided. It is desirable that the thickness be equal to or greater than the distance D.

In the printed wiring board connection structure according to the embodiment of the present invention and the modifications 1 and 2 thereof, the suspension printed wiring board 321 as the first printed wiring board and the actuator assembly as the second printed wiring board are used. The printed wiring board 333 is a flexible printed wiring board. However, the printed wiring board 333 is not necessarily limited to such a configuration, and a printed wiring board having another configuration may be used.
Moreover, in the connection structure of the printed wiring board according to the embodiment of the present invention and the first and second modifications thereof, the flying lead F and the exposed lead E are ultrasonically connected through the metal plating layer M. It is not restricted to such a structure.
For example, an anisotropic conductive material such as an anisotropic conductive paste or anisotropic conductive film is disposed on the surface of the metal plating layer M, and the flying lead F and the exposed lead E are thermocompression bonded via the anisotropic conductive material. It can be set as the structure made to do. With such a configuration, a printed wiring board connection structure that is easier to manufacture can be obtained.
Further, the thickness of the metal plating layer M is not limited to that of the connection structure of the printed wiring board according to the embodiment of the present invention and its modifications 1 and 2, and at least the thickness of the metal plating layer M is equal to or greater than the depth of the recess U. If it becomes the thickness of, it can be changed appropriately. However, the thickness of the gold plating layer constituting the surface layer of the metal plating layer M is desirably about 0.05 μm to 10 μm.
Further, in the printed wiring board connection structure according to the embodiment of the present invention, as shown in FIG. 4B, the width W2 of the flying lead F and the width W3 of the exposed lead E are set to the same width. However, the configuration is not necessarily limited to such a configuration, and the width W2 and the width W3 may be different from each other.

  According to the present invention, since the electrical and mechanical connection reliability can be improved in the printed wiring board connection structure, the head stack assembly including the printed wiring board connection structure, the head stack Industrial applicability is high in the field of magnetic disk devices having assemblies.

DESCRIPTION OF SYMBOLS 1 Hard disk drive 100 Case 200 Magnetic disk 300 Head stack assembly 310 Magnetic head part 320 Suspension 321 Printed wiring board for suspension 321a Base material 321b Lead 321c Insulating layer 330 Actuator assembly 331 Actuator unit 332 Pivot shaft 333 Actuator assembly print Wiring board 333a Base material 333b Lead 333c Insulating layer 400 Fixed portion 500 Ultrasonic connection means 1000 Printed wiring board connection structure 2000 Printed wiring board connection structure 3000 Printed wiring board connection structure 3210 Suspension printed wiring board 3210a Base material 3210b Lead 3210c Insulating layer 3330 Printed wiring board for actuator assembly 333 a substrate 3330b read 3330c insulating layer 10000 printed circuit board connection structure D distance E exposed lead F flying lead H head region K connector region M metal plating layer S connecting region T1 terminal region T2 terminal region U recess W1 width W2 width W3 width

Claims (5)

A printed wiring board connection structure in which a flying lead provided on the first printed wiring board and an exposed lead provided on the second printed wiring board are ultrasonically connected through a metal plating layer. The exposed lead is configured to be exposed in a recess formed by opening a part of the insulating layer laminated on the base material, and the metal plating layer covers the exposed lead. The flying lead includes a nickel (Ni) plating layer or a copper (Cu) plating layer, and extends from the contact surface of the first printed wiring board with the second printed wiring board beyond the depth of the recess. A printed wiring board connection structure, characterized in that the printed wiring board is formed on the surface of the exposed lead with a thickness equal to or greater than the distance to the position where the wire is provided. The printed wiring board connection structure according to claim 1, wherein at least a surface layer of the metal plating layer is configured as a gold plating layer . 3. A head stack assembly, wherein the printed wiring board connection structure according to claim 1 is used. A magnetic disk apparatus using the head stack assembly according to claim 3. A step of preparing a first printed wiring board having flying leads on a base material, and a recess formed by opening a part of an insulating layer laminated on the base material below the first printed wiring board Preparing a second printed wiring board having an exposed lead for receiving the flying lead; and the second printed wiring in the first printed wiring board on a surface of the exposed lead exceeding a depth of the recess. A metal plating layer including a nickel (Ni) plating layer or a copper (Cu) plating layer covering the exposed lead with a thickness equal to or greater than a distance from a contact surface with the plate to a position where the flying lead is provided. Forming a step, and ultrasonically connecting the flying lead and the exposed lead from above the first printed wiring board using ultrasonic connection means. Method for producing a connection structure of a printed wiring board, wherein.

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