CN110021571A - A kind of radiator based on jet stream microchannel - Google Patents
A kind of radiator based on jet stream microchannel Download PDFInfo
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- CN110021571A CN110021571A CN201910328666.2A CN201910328666A CN110021571A CN 110021571 A CN110021571 A CN 110021571A CN 201910328666 A CN201910328666 A CN 201910328666A CN 110021571 A CN110021571 A CN 110021571A
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- ontology
- partition
- jet stream
- pipe
- cooling chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
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- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
A kind of radiator based on jet stream microchannel.It is related to a kind of radiator.A kind of delicate structure, easy to use, easy to process and good heat dissipation effect are proposed, can be widely applied to the radiator based on jet stream microchannel of various electric chipsets.Including ontology, water inlet pipe, outlet pipe and piezoelectric pump, the piezoelectric pump is fixedly connected on the side wall of ontology, the water inlet pipe and outlet pipe be respectively communicated with piezoelectric pump two sides and the two be connected to the ontology；The ontology is in that partition and communicating pipe are equipped in hollow shape and ontology, the hollow parts of the ontology are divided into cooling chamber and vaporization chamber by the partition, the cooling chamber is located at the top of vaporization chamber and for accommodating refrigerant, wear the partition communicating pipe, the base opening of the communicating pipe is located at the top of vaporization chamber and the top opening of communicating pipe is located at the top of cooling chamber.The present invention has the cooling effect strengthened to high heat density chip.
Description
Technical field
The present invention relates to a kind of radiator more particularly to a kind of radiators based on jet stream microchannel.
Background technique
Currently, as the industries such as electronic electric equipment of super large-scale integration, high-density heating are grown rapidly,
It is also higher and higher to radiating requirements, demand of the Section Bar Heat Sinks of heat transfer since high heat flux density can not be solved in time, thermally conductive system
The features such as number is low, thermally conductive slow, it is therefore desirable to which efficient radiator improves working efficiency.
In this regard, it is proposed that there is the micro- logical radiator of jet stream of efficient capacity of heat transmission, however, existing microchannel
Manufacture and mode of jet are complex, in manufacture view using modes, processing cost and processing such as photoetching, laser, chemical attacks
Equipment all has higher cost, uses water pump, cooler, water pipe etc. to cause system complex in terms of jet stream, can not be small-sized
The advantages of changing the densification electric chip of high heat effectively to be applied, how sufficiently combining microchannel and jet stream, reduces
While cost meet miniaturization, high heat flux density electric chip radiating requirements, become the field urgent need to resolve
With the problem captured.
Summary of the invention
The present invention in view of the above problems, propose a kind of delicate structure, easy to use, easy to process and good heat dissipation effect,
It can be widely applied to the radiator based on jet stream microchannel of various electric chipsets.
The technical solution of the present invention is as follows: including ontology, water inlet pipe, outlet pipe and piezoelectric pump, the piezoelectric pump is fixedly connected
On the side wall of ontology, the water inlet pipe and outlet pipe be respectively communicated with piezoelectric pump two sides and the two be connected to the ontology；
The ontology is equipped with partition and communicating pipe in hollow shape and in ontology, by the partition by the hollow part of the ontology
It is divided into cooling chamber and vaporization chamber, the cooling chamber is located at the top of vaporization chamber and for accommodating refrigerant, wears the communicating pipe
If the partition, the base opening of the communicating pipe is located at the top of vaporization chamber and the top opening of communicating pipe is located at the top of cooling chamber；
The center of the bottom surface of the partition offers jet flow groove, and the notch of the jet flow groove is fixedly connected with jet stream cover board, described
Offer several spray-holes on jet stream cover board, be also provided with intake tunnel in the partition, one end of the intake tunnel with into
The water pipe docking and other end is connected to jet flow groove, the side of the top surface of the partition offers effluent trough and exhalant canal, it is described go out
One end of aquaporin is docked with outlet pipe and the other end is connected to effluent trough.
It is fixedly connected with several radiating fins on the top surface of the ontology, is fixedly connected on the top surface of the radiating fin
Fan.
The refrigerant is dehydrated alcohol, freon, water or the suspension containing high thermal conductivity nano material.
Several heat exchange fins are fixedly connected on the bottom surface of the cooling chamber and vaporization chamber, the heat exchange fin is in piece
Shape, cone column, cylinder, cuboid, tetrahedron or zigzag, several heat exchange fins can cross arrangement or array arrangements.
Jet stream (i.e. refrigerant enters in vaporization chamber in the form sprayed) of the present invention and microchannel (including water outlet is logical
Road, outlet pipe, water inlet pipe, intake tunnel) it is designed in conjunction；On the one hand, using high-speed jet mode by chip high heat flux density,
The heat of high heating rate is taken away heat by the flow at high speed of coolant media, reduces rapidly chip temperature；On the other hand, interior
Portion is designed using microchannel structure, increases the exchange capability of heat of coolant media and radiating fin, enables chip temperature maximum uniformly
Distribution, improve radiating efficiency, while vaporization chamber, cooling chamber, refrigerant fluidic channel being separated, interfere with each other, keep away between reduction
Exempt from part and " dryouies " phenomenon.Piezoelectric pump and radiator co-design reduce system complexity, are combined into one, and improve entire heat dissipation
The cost and processing cost of device operation, realize the application of miniaturization jet stream microchannel heat sink.
The features such as present invention is concentrated for existing chip heat flow density, and calorific value is big, and heating rate is fast cools down in conjunction with jet stream
The advantages such as fast, the microchannel cooling efficiency height of rate, strengthen the cooling effect to high heat density chip.
Detailed description of the invention
The structural schematic diagram of this case of Fig. 1,
Fig. 2 is the top view of Fig. 1,
Fig. 3 is the perspective view one of Fig. 1,
Fig. 4 is the perspective view two of Fig. 1；
Fig. 5 be in Fig. 1 A-A to partial sectional view,
Fig. 6 be in Fig. 1 B-C to partial sectional view,
Fig. 7 be in Fig. 1 C-C to partial sectional view,
Fig. 8 be in Fig. 1 D-D to partial sectional view,
Fig. 9 be in Fig. 1 E-E to partial sectional view；
1 ontology in figure, 11 be partition, and 111 be jet flow groove, and 112 be spray-hole, and 113 be intake tunnel, and 114 be effluent trough,
115 be exhalant canal, and 12 be communicating pipe, and 13 be cooling chamber, and 14 be vaporization chamber, and 10 be heat exchange fin, and 2 be water inlet pipe, and 3 be water outlet
Pipe, 4 be radiating fin.
Specific embodiment
The present invention as shown in figs 1-9, including ontology 1, water inlet pipe 2, outlet pipe 3 and piezoelectric pump (its side for being fixed on ontology
On wall, and between water inlet pipe, outlet pipe, guarantee in figure it is clear, therefore pair skilled artisans appreciate that and multiple
The piezoelectric pump of system is not drawn), the piezoelectric pump is fixedly connected on the side wall of ontology 1, the water inlet pipe 2 and outlet pipe 3
Be respectively communicated with piezoelectric pump two sides and the two be connected to the ontology 1；
The ontology 1 is equipped with partition 11 and communicating pipe 12 in hollow shape and in ontology 1, by the partition 11 by the ontology 1
Hollow parts be divided into cooling chamber 13 and vaporization chamber 14, the cooling chamber 13 is located at the top of vaporization chamber 14 and for accommodating
Refrigerant, wears the partition 11 communicating pipe 12, and the base opening of the communicating pipe 12 is located at top and the communicating pipe of vaporization chamber 14
12 top opening is located at the top of cooling chamber 13；
The center of the bottom surface of the partition 11 offers jet flow groove 111, and the notch of the jet flow groove 111 is fixedly connected with jet stream lid
Plate offers several spray-holes 112 on the jet stream cover board, intake tunnel 113, the water inlet is also provided in the partition 11
The one end in channel 113 is docked with water inlet pipe 2 and the other end is connected to jet flow groove 111, and the side of the top surface of the partition 11 offers
One end of effluent trough 114 and exhalant canal 115, the exhalant canal 115 is docked with outlet pipe 3 and the other end is connected to effluent trough
114.In this way, the refrigerant being stored in cooling chamber can flow into piezoelectric pump from effluent trough, exhalant canal, outlet pipe, and in piezoelectricity
It is rapidly entered in jet flow groove under the action of pump from water inlet pipe, intake tunnel, to finally be entered in vaporization chamber in the form of injection；
And the refrigerant in vaporization chamber will vaporize after heat exchange, and enter in cooling chamber from communicating pipe and condensed.
In actual use, the bottom surface of ontology in this case can be arranged on chip, and is powered in chip same for this case
When so that piezoelectric pump obtain it is electric；In this way, the refrigerant sprayed into vaporization chamber under piezoelectricity pumping action will carry out fastly with the bottom of vaporization chamber
Speed heat exchange (since the bottom surface of ontology is contacted with chip, the process be complete and chip heat exchange), thus after vaporization
Take away a large amount of heat；Hereafter, the refrigerant after vaporization will enter in cooling chamber from communicating pipe, and outer with ontology in cooling chamber
Boundary exchanges heat, to finally condense, be stored in cooling chamber, forms circulation, guarantees continuity heat dissipation.
Jet stream used by this case (i.e. refrigerant enters in vaporization chamber in the form sprayed) and microchannel (including water outlet is logical
Road, outlet pipe, water inlet pipe, intake tunnel) it is designed in conjunction；On the one hand, using high-speed jet mode by chip high heat flux density,
The heat of high heating rate is taken away heat by the flow at high speed of coolant media, reduces rapidly chip temperature；On the other hand, interior
Portion is designed using microchannel structure, increases the exchange capability of heat of coolant media and radiating fin, enables chip temperature maximum uniformly
Distribution, improve radiating efficiency, while vaporization chamber, cooling chamber, refrigerant fluidic channel being separated, interfere with each other, keep away between reduction
Exempt from part and " dryouies " phenomenon.Piezoelectric pump and radiator co-design reduce system complexity, are combined into one, and improve entire heat dissipation
The cost and processing cost of device operation, realize the application of miniaturization jet stream microchannel heat sink.
The features such as present invention is concentrated for existing chip heat flow density, and calorific value is big, and heating rate is fast cools down in conjunction with jet stream
The advantages such as fast, the microchannel cooling efficiency height of rate, strengthen the cooling effect to high heat density chip.
It is fixedly connected with several radiating fins 4 on the top surface of the ontology 1, is fixedly connected on the top surface of the radiating fin
Have fan (in figure for guarantee it is clear, therefore pair skilled artisans appreciate that and replicate fan do not draw).From
And make cooling chamber and the external world that there is preferable heat exchange efficiency, so that there is faster condensation rate after refrigerant vaporization.
The refrigerant is dehydrated alcohol, freon, water or the suspension containing high thermal conductivity nano material.
Several heat exchange fins 10, the heat exchange fin are fixedly connected on the bottom surface of the cooling chamber 13 and vaporization chamber 14
In the form of sheets, column, cylinder, cuboid, tetrahedron or zigzag are bored, several heat exchange fins can cross arrangement or array arrangement.
To be obviously improved refrigerant and vaporization chamber bottom, in other words with the heat exchange efficiency of chip, i.e., further improve to chip
Radiating efficiency.
Claims (4)
1. a kind of radiator based on jet stream microchannel, which is characterized in that including ontology, water inlet pipe, outlet pipe and piezoelectric pump, institute
It states piezoelectric pump to be fixedly connected on the side wall of ontology, the water inlet pipe and outlet pipe are respectively communicated in the two sides and two of piezoelectric pump
Person is connected to the ontology；
The ontology is equipped with partition and communicating pipe in hollow shape and in ontology, by the partition by the hollow part of the ontology
It is divided into cooling chamber and vaporization chamber, the cooling chamber is located at the top of vaporization chamber and for accommodating refrigerant, wears the communicating pipe
If the partition, the base opening of the communicating pipe is located at the top of vaporization chamber and the top opening of communicating pipe is located at the top of cooling chamber；
The center of the bottom surface of the partition offers jet flow groove, and the notch of the jet flow groove is fixedly connected with jet stream cover board, described
Offer several spray-holes on jet stream cover board, be also provided with intake tunnel in the partition, one end of the intake tunnel with into
The water pipe docking and other end is connected to jet flow groove, the side of the top surface of the partition offers effluent trough and exhalant canal, it is described go out
One end of aquaporin is docked with outlet pipe and the other end is connected to effluent trough.
2. a kind of radiator based on jet stream microchannel according to claim 1, which is characterized in that the top surface of the ontology
On be fixedly connected with several radiating fins, be fixedly connected with fan on the top surface of the radiating fin.
3. a kind of radiator based on jet stream microchannel according to claim 1, which is characterized in that the refrigerant is anhydrous
Ethyl alcohol, freon, water or the suspension containing high thermal conductivity nano material.
4. a kind of radiator based on jet stream microchannel according to claim 1, which is characterized in that the cooling chamber and vapour
Change and be fixedly connected to several heat exchange fins on the bottom surface of chamber, the heat exchange fin in the form of sheets, bore column, cylinder, cuboid, four sides
Body or zigzag, several heat exchange fins can cross arrangement or array arrangements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910328666.2A CN110021571B (en) | 2019-04-23 | 2019-04-23 | Radiator based on jet flow micro-channel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910328666.2A CN110021571B (en) | 2019-04-23 | 2019-04-23 | Radiator based on jet flow micro-channel |
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| CN110021571A true CN110021571A (en) | 2019-07-16 |
| CN110021571B CN110021571B (en) | 2022-04-29 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111863748A (en) * | 2020-08-17 | 2020-10-30 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Integrated micro cooler and cooling system |
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| US5263536A (en) * | 1991-07-19 | 1993-11-23 | Thermo Electron Technologies Corp. | Miniature heat exchanger |
| CN2894209Y (en) * | 2006-04-19 | 2007-04-25 | 哈尔滨工程大学 | Micro-jet flow matrix impact radiator |
| CN101645430A (en) * | 2009-09-03 | 2010-02-10 | 浙江大学 | Chip cooling device |
| CN102271485A (en) * | 2011-05-12 | 2011-12-07 | 南京理工大学 | Heat exchange method based on combination of jet array and hot cooling coupling under high heat-flow density condition |
| CN103096687A (en) * | 2011-11-07 | 2013-05-08 | 微邦科技股份有限公司 | Air-liquid circulation heat-dissipation device |
| US20150359133A1 (en) * | 2014-06-05 | 2015-12-10 | Toyota Motor Engineering & Manufacturing North America, Inc. | Two-phase cooling systems, power electronics modules, and methods for extending maximum heat flux |
| CN105208837A (en) * | 2015-10-29 | 2015-12-30 | 中国电子科技集团公司第二十研究所 | Staggered micro-channel heat sinking device based on sealed micro jet |
| CN107329546A (en) * | 2017-07-13 | 2017-11-07 | 电子科技大学 | The experimental system and method for a kind of heat abstractor, cooling system and heat abstractor |
| CN108167792A (en) * | 2017-12-27 | 2018-06-15 | 常州大学 | A kind of closed micro jet flow fine channel LED cooling devices |
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2019
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Patent Citations (9)
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|---|---|---|---|---|
| US5263536A (en) * | 1991-07-19 | 1993-11-23 | Thermo Electron Technologies Corp. | Miniature heat exchanger |
| CN2894209Y (en) * | 2006-04-19 | 2007-04-25 | 哈尔滨工程大学 | Micro-jet flow matrix impact radiator |
| CN101645430A (en) * | 2009-09-03 | 2010-02-10 | 浙江大学 | Chip cooling device |
| CN102271485A (en) * | 2011-05-12 | 2011-12-07 | 南京理工大学 | Heat exchange method based on combination of jet array and hot cooling coupling under high heat-flow density condition |
| CN103096687A (en) * | 2011-11-07 | 2013-05-08 | 微邦科技股份有限公司 | Air-liquid circulation heat-dissipation device |
| US20150359133A1 (en) * | 2014-06-05 | 2015-12-10 | Toyota Motor Engineering & Manufacturing North America, Inc. | Two-phase cooling systems, power electronics modules, and methods for extending maximum heat flux |
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| CN107329546A (en) * | 2017-07-13 | 2017-11-07 | 电子科技大学 | The experimental system and method for a kind of heat abstractor, cooling system and heat abstractor |
| CN108167792A (en) * | 2017-12-27 | 2018-06-15 | 常州大学 | A kind of closed micro jet flow fine channel LED cooling devices |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111863748A (en) * | 2020-08-17 | 2020-10-30 | 武汉第二船舶设计研究所(中国船舶重工集团公司第七一九研究所) | Integrated micro cooler and cooling system |
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| CN110021571B (en) | 2022-04-29 |
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Address after: No.96 Anlin Road, Yangzhou City, Jiangsu Province 225006 Applicant after: Yangzhou Wanfang Technology Co.,Ltd. Address before: No.96 Anlin Road, Yangzhou City, Jiangsu Province 225006 Applicant before: YANGZHOU WANFANG ELECTRONIC TECHNOLOGY LLC |
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