RU51188U1 - DEVICE FOR INCREASING HEAT EXCHANGE EFFICIENCY - Google Patents

Abstract

The device relates to computing, in particular, to cooling devices of a central processing unit (CPU), video card, etc. A device for increasing heat transfer efficiency, comprising a radiator consisting of a copper base with internal longitudinal holes, the inlet and outlet of which is connected to the heat pipes, characterized in that a reservoir with a cooling liquid is additionally introduced into it, a pump placed in a reservoir with a cooling liquid; the pump outlet is connected to the inlet of the heat pipes, and the outlet of the heat pipes to the inlet of the coolant reservoir, in addition, an aluminum oxide substrate Al ₂ O ₃ with many longitudinal openings connected to the heat pipes is used as the radiator base.

Description

The device relates to computing, in particular, to cooling devices of a central processing unit (CPU), video card, etc.

With the growth of computing power, modern processors consume more and more energy. Its main part is released in the form of heat. This continuous heat flux can only be taken through a limited area of the processor core. Manufacturers are trying to deal with energy consumption and heat by switching to lower supply voltages and technological standards. With a decrease in micron production rates, power consumption actually decreases, but the crystal area of the core itself decreases, which in turn leads to an increase in heat flux density. And although the heat becomes less, but whether the temperature inside the core of a smaller area will decrease is already in question. With increasing integration and decreasing chip area, heat removal from its surface becomes an increasingly difficult task. Special materials and coolants are required here. A constant increase in clock frequencies suggests an inevitable increase in CPU heat in the future. For processors with clock speeds exceeding 2 GHz, coolers (fans) with copper radiators, or at least with a copper sole on an aluminum radiator, are recommended.

In the case of cooling the system with liquid using radiators, the situation changes radically. Coolant circulates in an isolated space - through flexible tubes of small diameter. Unlike airways, fluid tubes can be configured with virtually any configuration and direction. The volume they occupy is much less than the air ducts at the same or much greater efficiency.

Known liquid cooling devices. Closest to the described technical solution is a device using heat pipes manufactured by Auras (CoolEngine-T6C) (www.auras.com.tw), Poseidon (WCL-02) (www.3rsystem.co.kr), Thermalright (www .thermalright.com) (prototype), comprising a radiator consisting of a copper base with internal longitudinal holes, the inlet and outlet of which is connected to the heat pipes, and on which copper fins are mounted. Moreover, each rib is in contact with the tube over a fairly large area. For this, the holes in the ribs have special “petals” that tightly enclose the tube. As for the base, the quality of its processing is very good.

The fundamental difference between air and liquid cooling is that instead of air, fluid is pumped through the CPU heatsink. Water or other liquids suitable for cooling are characterized by good thermal conductivity and high heat capacity. The circulating fluid provides much better heat dissipation than air flow. This gives not only a lower temperature of the cooled elements, but also smoothes out the sharp temperature drops of devices operating in alternating modes.

A typical liquid cooler for a processor is much smaller than any cooler in use today. The radiator of a small heat exchanger can be compared with the size of a large processor cooler. The tubes do not take up much space inside the case, and they are not disturbed by all those irregularities and protruding elements that are critical to the air flow.

The liquid cooling system, designed in a certain way, not only surpasses the air cooler in efficiency, but also has a more compact size.

The disadvantage of this device is the lack of a circulating fluid flow inside the radiator, as well as a significant amount of copper fins.

The purpose of the utility model is to increase the heat exchange efficiency of a liquid radiator for cooling a central processing unit (CPU).

This goal is achieved by the fact that in the device containing a radiator consisting of a copper base with internal longitudinal holes, the inlet and outlet of which is connected to the heat pipes, a coolant reservoir is additionally introduced, a pump placed in the coolant reservoir; the pump outlet is connected to the inlet of the heat pipes, and the outlet of the heat pipes to the inlet of the coolant reservoir, in addition, an aluminum oxide substrate Al ₂ O ₃ with many longitudinal openings connected to the heat pipes is used as the radiator base.

Comparison with the prototype shows that the inventive device is characterized by the presence of new blocks and their connections between them and a new

structural element. Thus, the claimed device meets the criterion of "novelty."

A comparison of the proposed solution with other technical solutions shows that the addition of blocks and a structural element leads to the solution of a new problem of increasing heat transfer efficiency. This confirms the conformity of the technical solution to the criterion of "significant differences".

Figure 1 presents a General view of the device in question, figure 2 shows a General block diagram of the device, and figure 3 - the structure of the substrate of the radiator.

The device includes: a radiator substrate 1, a coolant reservoir 2, a pump 3, heat pipes 4.

The device operates as follows.

Liquid (in most cases, this is distilled water) is pumped through the substrate of the radiator 1 using a special pump (pump) 3. All components of the structure are interconnected by flexible tubes. Passing through the processor heatsink and, in some cases, other devices, the liquid takes their heat, after which it passes through the tubes into the reservoir with coolant 2, where it is cooled itself. The system is closed and fluid in it circulates constantly. As a new structural element (radiator substrate 1) (Fig. 3), a single crystal Al ₂ O ₃ (sapphire) with microchannel heat exchangers having the highest thermal conductivity comparable to the thermal conductivity of diamond was taken using specially grown technology [1]. Microchannels have a diameter of about 50 microns and are formed by reinforcing the grown crystal with silicon, followed by its removal (etching). This substrate allows you to remove up to 25 W / cm ² thermal power and has a unique combination of physico-chemical properties: high hardness, chemical inertness, high melting point (2050 ° C), low thermal expansion at high temperatures and high resistance to thermal shock.

Thus, the proposed circulation system using a specially grown substrate with microchannel heat exchangers significantly increases the heat transfer efficiency for cooling the central processing unit (CPU), video card, etc.

Literature

1. Prospectus of the Institute of Solid State Physics of the Russian Academy of Sciences.

Claims (1)

A device for increasing heat transfer efficiency, comprising a radiator consisting of a base with internal longitudinal holes, the inlet and outlet of which is connected to heat pipes, characterized in that a reservoir with a cooling liquid is additionally introduced into it, a pump placed in a reservoir with a cooling liquid, and the outlet of the pump is connected with the input of the heat pipes, and the output of the heat pipes with the inlet of the coolant reservoir, in addition, an aluminum oxide substrate Al ₂ O _{3 is} used as the radiator base.