CN105208837A - Staggered micro-channel heat sinking device based on sealed micro jet - Google Patents
Staggered micro-channel heat sinking device based on sealed micro jet Download PDFInfo
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- CN105208837A CN105208837A CN201510717842.3A CN201510717842A CN105208837A CN 105208837 A CN105208837 A CN 105208837A CN 201510717842 A CN201510717842 A CN 201510717842A CN 105208837 A CN105208837 A CN 105208837A
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Abstract
The invention provides a staggered micro-channel heat sinking device based on sealed micro jet. The staggered micro-channel heat sinking device comprises a micro jet device, a micropump and an upper cover plate, wherein the micro jet device is divided into a fluid cavity at the lower part and a jet cavity at the upper part; the fluid cavity is communicated with the jet cavity through array microjet holes; the upper cover plate is positioned at the top of the jet cavity; staggered micro-channels are formed in lower surface of the upper cover plate; the upper cover plate is loaded with a heating device; cooling working medium enters the fluid cavity under the action of the micropump and then forms jet flow through the array microjet holes, the formed jet flow enters the jet cavity, and impacts on the upper cover plate to perform heat exchange with the heating device; cooling working medium after heat exchange flows out of the jet cavity; the cooling working medium flowing out of the jet cavity is then cooled through a heat dissipation device or a refrigerating device, and the cooled cooling working medium flows into the fluid cavity again through the micropump. According to the staggered micro-channel heat sinking device based on sealed micro jet, provided by the invention, the heat dissipation capacity of the heat dissipation system of radar electronic equipment is improved, the size of the heat dissipation device is reduced, the weight is reduced, and the maneuvering capability of the radar system is enhanced.
Description
Technical field
The present invention relates to that a kind of body is little, light weight, efficiently New System thermal control technology, be mainly used in the heat radiation of Connectors for Active Phased Array Radar high density radio frequency component of future generation.
Background technology
The life-support systems that radar heat control system is equipped as radar electric, inner and the external environment condition heat exchanging process by radar, carry and ensure that the inner each components and parts of radar all can be in the mission in the temperature range of requirement under various running status, the quality of its performance will directly have influence on service behaviour and the service life of radar.Along with the develop rapidly of electronic technology and microwave device, solid state technology and phased-array technique have become the important topic of field of radar.Along with the development of technical merit, as the radio frequency component of one of Techniques in Solid State Active Phased Array Radar core component gradually towards the future development of Highgrade integration, the heat generation density of submatrix module significantly increases, and the lengthening of the reduction of thermal radiation area, heat-transfer path all makes heat radiation more difficult, be mainly reflected in:
Reducing a. due to device volume, packaging density increases thereupon, and heat dissipation problem is not easily solved, and needs more high efficiency radiation design method to solve problems of excessive heat;
B. after device stack, caloric value sharply increases, and area of dissipation does not but increase thereupon, and therefore, density of heat flow rate will increase substantially;
Although c. many device packages keep former area of dissipation, because thermal source is interconnected, thermal coupling strengthens, and can cause even more serious heat problem;
D. the passive device in embedded set substrate has certain heating problem, and the heat radiation of ceramic substrate and organic substrate is bad, also can produce serious heat problem.
The domestic cooling for high density radio frequency component at present generally adopts the cooling means based on traditional forced air cooling or liquid cold plate, and heat-sinking capability is all difficult to break through 100W/cm
2heat dissipation problem has become the bottleneck difficult problem that restriction high density radio frequency component performance improves further, the development level of heat dissipation technology has also lagged behind the growth requirement of China's electronic technology itself, actual cooling requirement is at least 5 ~ 10 times of the present art, seriously constrains the further innovation of electronic technology.
Because current high density of heat flow rate electronic equipment is to the strict restriction of weight and volume, the cooling means of micro jet flow or micro-channel is adopted day by day to be subject to extensive concern and to be generalized to engineer applied gradually, but all there is shortcoming intrinsic separately in these two kinds of cooling meanss: in micro jet flow cooling means, if cooling fluid to be directly injected to heater members surface, consider the demand of electric insulation, then must adopt electric insulation coolant, according to the form being similar to liquid cold plate, then the thermal interfacial materials such as heat-conducting glue must be adopted in the integrated process of cooling system, increase extra interface resistance.Meanwhile, the existence of flowing in jet impulse process also can produce disturbance to jet impulse main flow, affects heat transfer effect.For micro-channel cooling means, cooling fluid is when flowing through heat sink downstream, and heat transfer effect weakens gradually, and meanwhile, the cooling fluid flowing distance flowed in superfine runner is long, large along stroke pressure loss, higher to the power requirement of pump.Therefore, Development of New Generation body is little, light weight, efficient heat abstractor are extremely urgent.
Summary of the invention
In order to overcome the deficiencies in the prior art, the invention provides a kind of stagger arrangement micro-channel heat sink device based on closed micro jet flow, micro jet flow heat dissipation technology is closed in the heat sink middle introducing of stagger arrangement micro-channel, because jet impulse has best collaborative e-commerce in all heat convection modes, flow direction and temperature gradient fit like a glove, thus there is the highest heat transfer efficiency, contribute to the heat-sinking capability improving radar electric device heat dissipation system, reduce heat abstractor size, reduce weight, strengthen the maneuverability of radar system.
The technical solution adopted for the present invention to solve the technical problems is: comprise micro-spray apparatus part, Micropump and upper cover plate.
Described micro-spray apparatus part is divided into the fluid cavity of bottom and the jet chamber on top, and be communicated with by array micro spray jet orifice between fluid cavity and jet chamber, upper cover plate is positioned at jet top of chamber, and lower surface, with stagger arrangement micro-channel, upper cover plate is loaded with heater members; Cooling working medium enters fluid cavity in acting on of Micropump, and form jet by array micro spray jet orifice and enter jet chamber, jet impulse upper cover plate, produce exchange heat with heater members, the cooling working medium after heat exchange flows out jet chamber; Lower the temperature through heat abstractor or refrigerating plant after cooling working medium flows out jet chamber, again pump into fluid cavity by Micropump.
The overall dimensions of described micro-spray apparatus part is 46mm × 46mm × 11mm, and wall thickness is 2mm, and the gateway diameter that cooling working medium passes in and out micro-spray apparatus part is 4mm; The diameter of single micro-injection discharge orifice is 0.5mm, and array micro spray jet orifice adopts 9 × 9 arrays, and adopt in-line arrangement or fork row mode to arrange, the spacing in adjacent jets hole is 4mm, jet orifice degree of depth 2mm; The fin width of stagger arrangement micro-channel and be highly 0.5mm, fin length is 6mm, and adjacent spacing of fins is 3mm, is decreased to 1.5mm at the spacing of fins in micro-spray apparatus part exit.
The invention has the beneficial effects as follows: stagger arrangement micro-channel enhanced heat exchange structure and micro jet flow cooling technology are combined, thus effectively can improve the heat-sinking capability of system, reduce heat abstractor size, reduce weight.Main advantage is as follows:
Jetstream fluid is directly injected to cooled object surface, and flow process is short, and the boundary-layer near jet impulse stagnation region is very thin, and convection transfer rate is high, and heat transfer efficiency is far above traditional type of cooling; The introducing of stagger arrangement micro-channel can improve the heat and mass efficiency of system further, and heat-transfer effect compares conventional yardstick can improve 2 ~ 3 orders of magnitude;
Adopt multiple nozzle to form array micro spray structure in system simultaneously and can obtain uniform Temperature Distribution, meanwhile, system adopts closing form, and gas, liquid even metal liquid etc. all can as working medias, without the need to considering to adopt electric insulation coolant;
The heat sink structure similar to traditional type of cooling can be adopted, compatible and be easy to realize integrated with existing chip-packaging structure, can encapsulating structure be simplified; Cooling fluidic medium directly can impact base plate for packaging, and thermal interfacial material can omit, and obviously can shorten heat-transfer path;
Transfer of heat is effective, is the first-selected type of cooling of the high heat load of reply, especially very good for local radiating effect, can realize forcing cooling, and less demanding to pump power.
Accompanying drawing explanation
Fig. 1 is schematic diagram of the present invention;
In figure, 1 is heater members, and 2 is the upper cover plate being with stagger arrangement micro-channel, and 3 is array micro spray jet orifice, and 4 is micro-spray apparatus part, and 5 is Micropump, and 6 is heat abstractor (or refrigerating units).
Embodiment
Below in conjunction with drawings and Examples, the present invention is further described, the present invention includes but be not limited only to following embodiment.
A kind of stagger arrangement micro-channel heat sink device based on closed micro jet flow, stagger arrangement micro-channel enhanced heat exchange structure and micro jet flow cooling technology is it is characterized in that to combine, effectively can improve the heat-sinking capability of radar heat control system, reduce heat abstractor size, reduce weight.Stagger arrangement micro-channel is a kind of enhanced heat exchange structure, belong to a kind of periodically structure, form by arranging parallel jitty more, the development of thermal boundary layer is destroyed by the interruption of runner and interlaced arrangement, the disturbance that simultaneously can increase crossing current, to reduce the impact of impingement flow and the heat convection of increase crossing current and wall, has significant enhanced heat exchange effect; Micro jet flow cooling adopts jet impulse cooling technology, effective cooling is carried out to the hot components and parts of the height in equipment, rely on the heat convection effect that impact jet flow is good, bring heat into cooling system from the hot components and parts of height thus realize heat radiation, in system, adopting multiple micro-spray can obtain uniform Temperature Distribution simultaneously.
Be further characterized in that whole heat abstractor comprises micro-spray apparatus part (containing array micro spray jet orifice), Micropump, heat abstractor (or refrigerating units), the upper cover plate being with stagger arrangement micro-channel and pipe-line system.
Described micro-spray apparatus part mainly completes heat exchange process, and comprise the fluid cavity of bottom and the jet chamber on top, overall dimensions is 46mm × 46mm × 11mm, and surrounding wall thickness is 2mm.Cooling working medium water enters fluid cavity by micro-spray apparatus part entrance, and micro-spray apparatus part inlet diameter is 4mm.Cooling working medium water forms strong jet by array micro spray jet orifice under pressure and enters jet chamber, Jetstream fluid directly impacts the upper cover plate being loaded with heater members be positioned at directly over jet chamber, exchange heat is produced with heater members, cooling working medium water after heat exchange enters pipe-line system by micro-spray apparatus part outlet outflow, and micro-spray apparatus part outlet diameter is 4mm.
The diameter of single micro-injection discharge orifice is 0.5mm, and array micro spray jet orifice adopts 9 × 9 arrays, and adopt in-line arrangement or fork row mode to arrange (being determined by optimum results), adjacent jets hole is transversely 4mm with the spacing of longitudinal direction, jet orifice degree of depth 2mm.
The circulation that described Micropump is mainly cooling working medium water in heat abstractor provides power, makes it enter micro-spray apparatus part and be ejected into device surface to be cooled, reaches the object of exchange heat.Micropump adopts electromagnetic principle to drive, and can change flow by adjustment input voltage.
Described heat abstractor (or refrigerating units) mainly completes the heat exchanging process of the cooling working medium water after intensification and environment, and its temperature is declined, and sub-cooled working-medium water reenters in Micropump the circulation starting next one.
Upper cover plate and the existing chip-packaging structure of described band stagger arrangement micro-channel can realize compatible design, do not adopt thermal interfacial material, reduce interface resistance.Stagger arrangement micro-channel fin width and be highly 0.5mm, fin length is 6mm, and adjacent spacing of fins is 3mm, and carrying out local cypher near micro-spray apparatus part exit to fin, spacing can be decreased to 1.5mm, close being staggered in arrangement after dredging before being formed.The backflow that the existence of stagger arrangement micro-channel both can be fluid provides passage, certain flow-disturbing effect can be played again, the development of thermal boundary layer is destroyed by the interruption of runner and interlaced arrangement, the disturbance increasing crossing current, to reduce the impact of impingement flow and the heat convection of increase crossing current and wall, has significant enhanced heat exchange effect.
Described pipe-line system adopts stainless steel pipes, and the connection of pipeline adopts snap joint, facilitates the injection of cooling working medium water and improves the sealing of pipe-line system.
See Fig. 1, as shown in specific embodiment wherein, before system cloud gray model, first inject cooling working medium water by connector and enter system, then seal each connector in case the leakage of cooling working medium.After Micropump 5 is started working, fluid is by the entrance incoming fluid chamber of micro-spray apparatus part 4, form strong jet by array micro spray jet orifice 3 under pressure and enter jet chamber, Jetstream fluid is loaded with the upper cover plate of heater members directly over directly impacting, produce strong heat convection effect, the heat that heater members 1 produces is absorbed by Jetstream fluid, its temperature declines, and Jetstream fluid raises owing to absorbing thermal temperature, Jetstream fluid after intensification is flowed out by micro-spray apparatus part outlet, enter pipe-line system, under the effect of heat abstractor (or refrigerating units) 6, Jetstream fluid after being heated and environment generation exchange heat, its temperature declines, Jetstream fluid after cooling flows in Micropump 5 again, the circulation of heat sink beginning next one is again entered under the effect of Micropump 5.
Claims (2)
1. the stagger arrangement micro-channel heat sink device based on closed micro jet flow, comprise micro-spray apparatus part, Micropump and upper cover plate, it is characterized in that: described micro-spray apparatus part is divided into the fluid cavity of bottom and the jet chamber on top, be communicated with by array micro spray jet orifice between fluid cavity and jet chamber, upper cover plate is positioned at jet top of chamber, lower surface, with stagger arrangement micro-channel, upper cover plate is loaded with heater members; Cooling working medium enters fluid cavity in acting on of Micropump, and form jet by array micro spray jet orifice and enter jet chamber, jet impulse upper cover plate, produce exchange heat with heater members, the cooling working medium after heat exchange flows out jet chamber; Lower the temperature through heat abstractor or refrigerating plant after cooling working medium flows out jet chamber, again pump into fluid cavity by Micropump.
2. the stagger arrangement micro-channel heat sink device based on closed micro jet flow according to claim 1, it is characterized in that: the overall dimensions of described micro-spray apparatus part is 46mm × 46mm × 11mm, wall thickness is 2mm, and the gateway diameter that cooling working medium passes in and out micro-spray apparatus part is 4mm; The diameter of single micro-injection discharge orifice is 0.5mm, and array micro spray jet orifice adopts 9 × 9 arrays, and adopt in-line arrangement or fork row mode to arrange, the spacing in adjacent jets hole is 4mm, jet orifice degree of depth 2mm; The fin width of stagger arrangement micro-channel and be highly 0.5mm, fin length is 6mm, and adjacent spacing of fins is 3mm, is decreased to 1.5mm at the spacing of fins in micro-spray apparatus part exit.
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Cited By (11)
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| CN107155284A (en) * | 2017-06-15 | 2017-09-12 | 华南理工大学 | One kind is based on jet microchannel mixing heat sink |
| CN107329546A (en) * | 2017-07-13 | 2017-11-07 | 电子科技大学 | The experimental system and method for a kind of heat abstractor, cooling system and heat abstractor |
| WO2017215169A1 (en) * | 2016-06-16 | 2017-12-21 | 广东合一新材料研究院有限公司 | Cooling system of working medium contact type for high-power electromagnetic wave generator and working method thereof |
| CN107791676A (en) * | 2017-09-22 | 2018-03-13 | 西安理工大学 | A kind of variable wavelength UV LED light solidification equipments |
| CN108167792A (en) * | 2017-12-27 | 2018-06-15 | 常州大学 | A kind of closed micro jet flow fine channel LED cooling devices |
| CN110021571A (en) * | 2019-04-23 | 2019-07-16 | 扬州万方电子技术有限责任公司 | A kind of radiator based on jet stream microchannel |
| CN110381701A (en) * | 2019-06-25 | 2019-10-25 | 南京理工大学 | A kind of spray cooling device that vapor chamber is combined with composite microstructure |
| CN111146544A (en) * | 2019-12-30 | 2020-05-12 | 电子科技大学 | Efficient cooling structure for small high-power millimeter wave device |
| CN113840523A (en) * | 2021-10-09 | 2021-12-24 | 中国电子科技集团公司第二十六研究所 | Active heat exchange shell and manufacturing method thereof |
| CN116017950A (en) * | 2023-01-09 | 2023-04-25 | 深圳市深汕特别合作区虹菱电器有限公司 | LED panel conference machine |
| WO2023070342A1 (en) * | 2021-10-27 | 2023-05-04 | 华为技术有限公司 | Heat dissipation system, electronic device, and liquid cooling system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107329546A (en) * | 2017-07-13 | 2017-11-07 | 电子科技大学 | The experimental system and method for a kind of heat abstractor, cooling system and heat abstractor |
| CN107791676A (en) * | 2017-09-22 | 2018-03-13 | 西安理工大学 | A kind of variable wavelength UV LED light solidification equipments |
| CN108167792A (en) * | 2017-12-27 | 2018-06-15 | 常州大学 | A kind of closed micro jet flow fine channel LED cooling devices |
| CN110021571B (en) * | 2019-04-23 | 2022-04-29 | 扬州万方科技股份有限公司 | Radiator based on jet flow micro-channel |
| CN110021571A (en) * | 2019-04-23 | 2019-07-16 | 扬州万方电子技术有限责任公司 | A kind of radiator based on jet stream microchannel |
| CN110381701A (en) * | 2019-06-25 | 2019-10-25 | 南京理工大学 | A kind of spray cooling device that vapor chamber is combined with composite microstructure |
| CN111146544A (en) * | 2019-12-30 | 2020-05-12 | 电子科技大学 | Efficient cooling structure for small high-power millimeter wave device |
| CN113840523A (en) * | 2021-10-09 | 2021-12-24 | 中国电子科技集团公司第二十六研究所 | Active heat exchange shell and manufacturing method thereof |
| CN113840523B (en) * | 2021-10-09 | 2022-07-29 | 中国电子科技集团公司第二十六研究所 | Active heat exchange shell and manufacturing method thereof |
| WO2023070342A1 (en) * | 2021-10-27 | 2023-05-04 | 华为技术有限公司 | Heat dissipation system, electronic device, and liquid cooling system |
| CN116017950A (en) * | 2023-01-09 | 2023-04-25 | 深圳市深汕特别合作区虹菱电器有限公司 | LED panel conference machine |
| CN116017950B (en) * | 2023-01-09 | 2023-10-31 | 深圳市深汕特别合作区虹菱电器有限公司 | LED panel conference machine |
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Application publication date: 20151230 |