CN109982821A - The method of adjustment and mold for resin-molding of mold for resin-molding - Google Patents
The method of adjustment and mold for resin-molding of mold for resin-molding Download PDFInfo
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- CN109982821A CN109982821A CN201880004487.7A CN201880004487A CN109982821A CN 109982821 A CN109982821 A CN 109982821A CN 201880004487 A CN201880004487 A CN 201880004487A CN 109982821 A CN109982821 A CN 109982821A
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- component
- mold
- resin
- molding
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
- B29C45/37—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings
- B29C45/376—Mould cavity walls, i.e. the inner surface forming the mould cavity, e.g. linings adjustable
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
- B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame
- B29C45/1468—Plants therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/565—Moulds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
Abstract
The purpose of the present invention is to provide a kind of can easily be coped in resin seal packaging body resin formation part thickness change mold for resin-molding method of adjustment and mold for resin-molding.Upper mold (1) is made of upper mold mould group (11) and upper mold die sleeve (12).Upper mold mould group (11) is the component for supporting upper mold die sleeve (12).In addition, upper mold die sleeve (12) has stand base (20), bottom plate (30) and packaging body inserts (40).Spring member (60) are configured between pedestal (20) and bottom plate (30), stand base (20) and packaging body inserts (40) are exerted a force downwards.
Description
Technical field
The present invention relates to the method for adjustment of mold for resin-molding and mold for resin-molding.
Background technique
In the past, it carries out manufacturing being insert-molded for resin seal packaging body using electronic components such as resin-encapsulated semiconductors.
In this is insert-molded, electronic component or the substrate of having electronic part etc. are fixed on mould inside, melted to cavity filling
Resin simultaneously makes its hardening, by substrate of having electronic part etc. and ester moulding integrally.
In addition, the formation that electronic component surface is manufactured according to the type of resin seal packaging body have resin part (with
Under, referred to as " resin formation part ") the different product of thickness.In order to cope with the resin formation part thickness change, previous
Resin sealing apparatus in, to the stamping device equipped with mold carry out entire mold or constitute mold part replacement make
Industry.
In any operation of the replacement of such entire mold or the part for constituting mold, generate temporarily from stamping device
It takes apart a die, and mold is fastened by bolts etc. to labour and the time being reinstalled in stamping device again.
In addition, carrying out resin seal after replacement operation since the mold for being re-installed in stamping device is room temperature
When, it needs for mold to be warming up to as forming temperature, the process of the heating needs the time.
In a series of operation in the replacement of the mold, for example, about 8 hours are needed when replacing entire mold,
When replacement constitutes the part of mold, due to also to implement the operation of the decomposition of mold, the replacement of part, the assembling of mold,
The longer time is needed, big influence is caused to production efficiency.
In addition, especially needing to take apart a die from stamping device, by mold during replacement constitutes the part of mold
It is decomposed into substantially the entirety of constituent part, and is substituted for part corresponding from the thickness of different resin formation parts and carries out group again
Dress.Therefore, the working hour of operation is very more, needs the labour of operator.
Moreover, because Die price is high, therefore quasi- to the different each resin seal packaging body of the thickness of resin formation part
Standby this part thing of mold becomes very big burden economically for the user of stamping device.
It given this situation, can in the different sealed package of the thickness in resin formation part to provide one kind
For the purpose of the stamping device of enough sharing dies, such as propose stamping device documented by patent document 1.
Existing technical literature
Patent document
Patent document 1: Japanese Unexamined Patent Publication 2003-53791 bulletin
Summary of the invention
Problems to be solved by the invention
But in the stamping device documented by patent document 1, absolutely not disclose for the thickness with resin formation part
The corresponding specific mechanism of different resin seal packaging bodies.
The present invention is to complete in view of the above problems, is being set it is intended that providing one kind and can easily cope with
The method of adjustment and resin seal of the mold for resin-molding of the change of the thickness of resin formation part are used in rouge sealed package
Mold.
A technical solution to solve project
To achieve the goals above, the method for adjustment of mold for resin-molding of the invention is that the mold of a side includes
One component；And second component, it can be displaced, be configured under die opening state and in pairs another relative to the first component
The mold close position of side, in molding by moving the second component to from the direction that the mold of described another party leaves
It is dynamic, filling sealing resin is formed in the face opposite with the mold of described another party by the first component and the second component
At least part of defined type chamber, wherein the method for adjustment of the mold for resin-molding has to be used under die opening state
In the process for the adjustment for limiting the movement.
Here, the mold of a side has first component and second component, when molding, by by first component and second component
It, can be in type chamber in at least part for the defined type chamber for forming filling sealing resin with the opposite face of the mold of another party
Sealing resin is filled, in the upper setting resin formation part such as substrate for the having electronic part being held between mold.In addition, institute here
" at least part of defined type chamber " said refers to the whole and formation for including the case where being formed the type chamber of filling sealing resin
Both the case where part of it.In addition, type chamber herein is to clip having electronic by the mold of a side and the mold of another party
The part between mold and substrate of a side etc. is formed on whens the substrate etc. of part.
In addition, second component can be displaced relative to first component, it is configured under die opening state and in pairs another
The mold close position of side.Therefore, in the state of being opened the mold of the mold of a side and another party, second component is close
The position of the mold of another party becomes the initial position of second component.In addition, " can be displaced " mentioned here is as long as comprising edge
Mold opening and closing direction displacement with regard to enough.
In addition, second component can be displaced relative to first component, it is configured under die opening state and in pairs another
The mold close position of side, in molding, by moving second component to from the direction that the mold of another party leaves, first
Component and second component formed as defined in type chamber at least part, thus, it is possible to change second component from initial position to it is another
The mobile distance in the direction of the mold separation of one side, to change the size of the type chamber on mold opening and closing direction.In addition, institute here
Stage for referring to that the mold of the mold comprising a side and another party are close " when molding " for saying and the mold for carrying out a side with it is another
The mold of side molds and is filled with this both sides of the stage of sealing resin.
In addition, under die opening state, by limitation second component from the position of the mold close to another party to separated
Direction it is mobile, can determine the moving distance from initial position of second component, the size of decision type chamber.
In addition, under die opening state, by carry out for limit second component from the position of the mold close to another party to
The mobile adjustment in separated direction, can change the moving distance from initial position of second component, thus with wishing
The size of the type chamber of prestige is corresponding.
In addition, for limiting in mobile adjustment, in the limitation structure by will be abutted by molding with second component
In the case that part is configured at the region opposite with the mold of another party of second component and carries out, by making limiting member and second
Component abuts, and can limit the movement of second component.In addition, in die sinking, it only can by the operation of configuration limits component
Easily limit the movement of second component.
In addition, for example, in the case where limiting member is not configured in the mold of a side, only by matching in the state of die sinking
Set limiting member, it will be able to type chamber corresponding with the thickness on the mold of limiting member opening and closing direction is formed in molding.Separately
Outside, in the case where the mold arrangement of a side restricted component, direction only is opened and closed by being changed to mold in the state of die sinking
On the different limiting member of thickness, it will be able to the size of type chamber when change molding.Moreover, the mold arrangement in a side is limited
In the case where component processed, also limiting member can be easily removed in the state of die sinking.
In addition, to achieve the goals above, mold for resin-molding of the invention is that the mold of a side includes the first structure
Part；And second component, it can be displaced relative to the first component, in molding by making the second component to from pairs of
The direction that the mold of another party leaves is mobile, by the first component and the second component in the mold phase with described another party
To face formed filling sealing resin defined type chamber at least part, wherein the mold for resin-molding has: third
Component, the position of the mold by the way that the second component to be disposed in proximity to described another party under die opening state, described
The region opposite with the mold of described another party of two components forms defined space；And limiting member, benefit can be configured at
It is abutted, is limited with the second component by molding by being configured at the space with the space that the third component is formed
The movement of the second component.
Here, second component to be configured to the position close with the mold of another party under die opening state by third component
It sets, the initial position that can be configured at second component by third component in the state of die sinking.
In addition, second component can be displaced relative to first component, in molding, by making second component to from another party
The direction left of mold it is mobile, first component and second component formed as defined in type chamber, thus, it is possible to change second component from
At a distance from the direction that initial position leaves to the mold with another party is mobile, to change the big of the type chamber on mold opening and closing direction
It is small.
In addition, third component configures second component in the mold close position with another party under die opening state, from
And defined space is formed in the region opposite with the mold of another party of second component, it is configured at the limitation structure in defined space
Part abuts the movement for limiting second component with second component by molding, and thus, it is possible to the limitation structure on mold opening and closing direction
The thickness of part determines moving distance of the second component from initial position, the size of decision type chamber.
In addition, third component configures second component in the mold close position with another party and shape under die opening state
At space, limiting member is configured to be configured at the space formed using third component, thus in molding by making to limit
Component is abutted with second component, can limit the movement of second component.In addition, only passing through configuration limits component in die sinking
Operation can easily limit the movement of second component.
In addition, third component is elastic component, by second component towards another party mold direction force and by the
In the case that two components are configured at the mold close position with another party, in die sinking, the effect of elastic component can be utilized
Power and so that second component is located at initial position.
In addition, in first component and second component by elastic component connection and in integrated situation, it can be by elasticity
Component keeps second component by first component.That is, for example in the case where the mold of a side is upper mold and the mold of pairs of another party is
In the case where mould, second component can be kept by first component by elastic component and not fallen off.In addition, in molding and to type
When chamber fills sealing resin, the active force of elastic component can be applied to second component and facilitate second component and limitation structure
The movement that part abuts.
In addition, under die opening state, it is chimeric in first component and second component, and second component is configured in close to another
In the case that the state of the position of the mold of side can be kept by third component, in die sinking by making first component and the second structure
Part is chimeric, is able to maintain second component.That is, being for example upper mold in the mold of a side and the mold of pairs of another party is lower die
In the case of, it can not be fallen off by chimeric be kept into second component by first component of first component and second component.
Invention effect
The method of adjustment and mold for resin-molding of mold for resin-molding of the invention can easily be coped in resin
The change of the thickness of resin formation part in sealed package.
Detailed description of the invention
Fig. 1 is the schematic sectional view for indicating to apply the first embodiment of mold for resin-molding of the invention.
Fig. 2 is the schematic sectional view for indicating state when having used the forming of mold for resin-molding shown in FIG. 1.
Fig. 3 is the skeleton diagram for indicating the structure of bottom plate and spacer.
Fig. 4 is the schematic sectional view for indicating to have replaced the state of spacer in mold for resin-molding shown in Fig. 1.
Fig. 5 is the schematic sectional view for indicating state when having used the forming of mold for resin-molding shown in Fig. 4.
Fig. 6 is the schematic sectional view for indicating to apply the second embodiment of mold for resin-molding of the invention.
Fig. 7 is the schematic sectional view for indicating state when having used the forming of mold for resin-molding shown in fig. 6.
Fig. 8 is the schematic sectional view for indicating to apply the third embodiment of mold for resin-molding of the invention.
Fig. 9 is the schematic sectional view for indicating state when having used the forming of mold for resin-molding shown in Fig. 8.
Specific embodiment
Hereinafter, being illustrated referring to attached drawing to mode for carrying out the present invention (hereinafter referred to as " embodiment ").
[first embodiment]
First embodiment described below be to be changed to others from spacer 50 is loaded into the state of upper mold 1 between
Spacing body 51 carrys out the content in case where the height of adjusting type chamber.Therefore, in the first embodiment, firstly, between to being incorporated with
Construction (referring to Fig. 2) when the construction (referring to Fig.1) of the upper mold 1 of spacing body 50 and the use upper mold 1 molding is illustrated.Then,
To from spacer 50 to the change of spacer 51 and be changed to spacer 51 upper mold 1 construction (referring to Fig. 4), using change
Construction (referring to Fig. 5) when being molded for the upper mold 1 of spacer 51 is illustrated.
Fig. 2 is the skeleton diagram for illustrating to apply an example of mold for resin-molding of the invention, mould depicted herein
Tool A is made of upper mold 1 and lower die 2 (referring to Fig. 2).Upper mold 1 and lower die 2 are increase lower die 2,
The substrate etc. of clamping band electronic component between mold hardens it for the thermosetting resin of manufacture filling and makes having electronic
The mold of substrate of part etc. and resin seal packaging body made of ester moulding integrally.
In addition, in the present embodiment, lower die 2 is known as "lower" or " lower section " relative to the position of upper mold 1, by upper mold 1
Position relative to lower die 2 is known as "upper" or " top ".
As shown in Figure 1, upper mold 1 is made of upper mold mould group 11 and upper mold die sleeve 12.Upper mold mould group 11 is to maintain upper mold die sleeve
12 component.
In addition, upper mold die sleeve 12 has stand base 20, bottom plate 30 and packaging body inserts 40 (referring to Fig.1).Bracket base
Seat 20 and bottom plate 30 are fixed by bolt component, the construction for being integrally formed.In addition, stand base 20 has type chamber bar 23.
In addition, be kept into packaging body inserts 40 by spring member 21 (referring to Fig.1) will not be downward for stand base 20
Side falls off.In addition, spring member 21 applies the power pulled upwards to packaging body inserts 40.
Therefore, spring member 21 in molding also as facilitate the upper surface of aftermentioned connector 41 and spacer 50,
The component for the movement that 51 lower end surface abuts functions.Packaging body inserts 40 is configured to can with the opening and closing of mold A
It is displaced in the up-down direction independently of 20 ground of stand base.
In addition, bottom plate 30 is to be configured in upper mold mould group 11 and bracket with the component in the region for being packed into spacer 50,51
Between pedestal 20.
In addition, being provided with flange receiving portion 31 on bottom plate 30.The flange part 43 on the top of aftermentioned connector 41 with it is convex
Edge receiving portion 31 is chimeric.Packaging body inserts 40 is kept into and will not be fallen off downwards in die sinking by each connector 41.
In addition, the position chimeric with flange part 43 of flange receiving portion 31 be in die sinking, it can be in the upper surface of connector 41
Form gap between the lower end surface of spacer 50,51, also, in the up-down direction, the upper surface of connector 41 become with
The lower end surface close position of spacing body 50,51.
As shown in Figure 1, packaging body inserts 40 is disposed adjacently with type chamber bar 23, multiple connectors 41 are by bolt component
It is fixed in the upper surface of packaging body inserts 40.The construction of packaging body inserts 40 and 41 being integrally formed of connector, can
It is independently displaced in the up-down direction relative to type chamber bar 23.In addition, type chamber bar 23 mentioned here is equivalent to the application right
It is required that first component.In addition, packaging body inserts 40 mentioned here and connector 41 are equivalent to the claim of this application
Second component.
In addition, by 40 setting area 44 (referring to Fig.1) of type chamber bar 23 and packaging body inserts.In the up and down direction in region 44
Size moving up and down and change with packaging body inserts 40.In molding, in recess portion 44 with lower die 2 and recess portion 44 phase
To face (omit appended drawing reference) between shape forming cavity 13 (referring to Fig. 2).
In addition, being equipped with flange part 43 in the upper end of connector 41, which is formed diameter greater than connector
41 ontology.Flange part 43 is the component that end face is abutted with spacer 50 thereon in molding.The shape from bottom to up on bottom plate 30
At there is through hole 32 (referring to the lower-left figure of Fig. 3), insert has the connector 41 including flange part 43 in the through hole 32
Top (referring to Fig.1).
In the molding of mold A, the lower end of the upper surface of the flange part 43 of connector 41 with the spacer 50 opposite with it
The region in face abuts, the depth (thickness of the resin formation part of resin seal packaging body) of decision type chamber 13 (referring to Fig. 3).About
The detailed content of the change of the depth of type chamber 13 is described below.In addition, spacer 50,51 is equivalent to the claim of this application
Limiting member.
As shown in Figure 1, spring member 60 is configured between stand base 20 and bottom plate 30, by stand base 20 and encapsulation
Body inserts 40 exerts a force (close to the direction of lower die 2) downwards.The force ratio of the spring member 60 inlays above-mentioned packaging body
The active force for the spring member 21 that inserts 40 is kept upwards is big.In addition, spring member 60 mentioned here is equivalent to the application
The third component of claim.
In the state of being opened mold A, by stand base 20 and packaging body inserts 40 by spring member 60
Active force presses downwards, becomes upper surface in the flange part 43 of connector 41 and the spacer 50,51 that is incorporated in bottom plate 30
Lower end surface between be formed with the construction in gap.
In this way, in the state of die sinking, due to the shape between the upper surface of flange part 43 and the lower end surface of spacer 50,51
At there is gap, therefore as shown in the lower-left figure of Fig. 3, spacer 50 can be unloaded from bottom plate 30.In addition, as described above,
When carrying out the molding of mold A, the upper surface of the flange part 43 of connector 41 is the same as the lower end surface in the spacer 50 opposite with it
Region abuts, and the depth (referring to Fig. 2) of decision type chamber 13, which disappears.
In addition, support column 22 (referring to Figures 1 and 2) is fixed on the upper surface of stand base 20 by bolt component.It should
The upper surface of support column 22 is abutted with the lower end surface of bottom plate 30, which becomes clamping force when bearing molding, inhibits to be filled in
The part of the resin leakage of the sealing resin of type chamber 13.
In this way, can be changed since spacer can be replaced in the state of die sinking as resin seal packaging body
Resin formation part type chamber depth.
More specifically, for example, the region opposite with the upper surface of flange part 43 in the lower end surface of spacer 50 is arranged
In the case where having groove portion 50a (figure on the upside of Fig. 3 bottom-right graph and Fig. 3), in molding, the upper surface and interval of flange part 43
The groove portion 50a of part 50 is chimeric, thus the depth of decision type chamber 13.Pass through the depth with the part for being formed as being equivalent to groove portion 50a
Degree (length of up and down direction) different spacer is replaced, and the depth of type chamber can be changed.In addition, on the upside of Fig. 3 shown in figure
Spacer 50 indicate up and down direction is overturn after state.
Here, the depth change of the part for being equivalent to groove portion 50a of spacer not only includes the side for changing the depth of groove portion
Formula further includes the change to the spacer of not formed groove portion.That is, the different spacer of the depth that can not only carry out groove portion is each other
Between replacement, but also be able to carry out the mutual replacement of the spacer different because of the presence or absence of groove portion.
For example, by spacer 51 that spacer 50 is changed to be formed with the groove portion than groove portion 50a depth (referring to Fig. 4 and
Fig. 5), in molding, the case where upper surface ratio of the flange part 43 of connector 41 is abutted with spacer 50, just moves further up
It is dynamic.
As a result, forming type chamber 14 corresponding with spacer 51 (referring to Fig. 5).Type chamber 14 is deeper than type chamber 13.Therefore, by type
The resin formation part for the resin seal packaging body that chamber 14 shapes is formed as the tree than the resin seal packaging body shaped by type chamber 13
Rouge forming section is thick.
In addition, as shown in Figure 1, protrusion 11a is provided in upper mold mould group 11, in the opposite with protrusion 11a of stand base 20
Position be provided with recess portion 20a.Protrusion 11a is chimeric with recess portion 20a, and limit bracket pedestal 20 and packaging body inserts 40 cannot
It is just moved further up from the position.By the Qian He of protrusion 11a and recess portion 20a, in the state of die sinking, also ensure
For enabling formation of the spacer 50 from the gap that bottom plate 30 unloads.
Hereinafter, opening and closing and spacer 50,51 to the mold A in the first embodiment of the invention with above structure
Replacement be illustrated.
[die sinking of mold A]
In the state that upper mold 1 and lower die 2 are opened, as described above, by being configured between bottom plate 30 and stand base 20
Spring member 60 stand base 20 and packaging body inserts 40 are exerted a force downwards.Stand base 20 and packaging body as a result,
Inserts 40 becomes the state floated downwards relative to the entirety of upper mold 1.
The active force of stand base 20 and packaging body inserts 40 is applied to by the spring member 60, in connector 41
The upper surface of flange part 43 and the lower end surface of spacer 50 between form gap, spacer 50 can be unloaded from bottom plate 30 and
It is changed to other spacers 51 (referring to Fig. 4 and Fig. 5).
In addition, being applied using spring member 21 to packaging body inserts 40 in the state that upper mold 1 and lower die 2 are opened
Power, packaging body inserts 40 are located at the position more against the top than type chamber bar 23 on the basis of lower die 2.
[molding of mold A]
Increase lower die 2 using mold closing mechanism, by upper mold 1 and the molding of lower die 2 (referring to Fig. 4).Pass through the conjunction between the mold
The power of mould shifts stand base 20 and packaging body inserts 40 onto support column while bending spring member 60 upwards
The position that 22 upper surface is abutted with the lower end surface of bottom plate 30.In the molding, packaging body inserts 40 and type chamber bar 23 become
Integrally it is moved upward.
In addition, 40 one side of packaging body inserts and the rising of stand base 20 link, the convex of connector 41 is risen on one side
The position that the upper surface of edge 43 is abutted with the lower end surface of spacer 51, the region for becoming type chamber become larger in the up-down direction
(referring to Fig. 5).After the upper surface of flange part 43 is abutted with the lower end surface of spacer 51, packaging body inserts 40 is relative to type
Chamber bar 23 declines, and packaging body inserts 40 is located at the position than type chamber bar 23 on the lower.
Also, in the position shape forming cavity 14 that flange part 43 is abutted with spacer 51, determine the tree of resin sealed package
The thickness of rouge forming section (referring to Fig. 5).By being filled into type chamber 14 while melting thermosetting resin, and to resin
It carries out pressure maintaining and makes its hardening, to form resin formation part.
As shown in Figure 4 and Figure 5, by the way that spacer 50 is changed to spacer 51, according to the groove portion for being formed in spacer 51
Depth, the distance of the rising of the connector 41 when molding generates variation.Also, in the position that flange part 43 is abutted with spacer 51
Shape forming cavity 14 is set, the thickness of the resin formation part of resin seal packaging body is changed.
[second embodiment]
Then, the second embodiment for applying mold for resin-molding of the invention is illustrated.In addition, hereinafter,
For with the duplicate structure of content in the first embodiment that is explained, omit detailed description, with structure with
First embodiment is illustrated centered on different parts.
As shown in FIG. 6 and 7, in the second embodiment for applying mold for resin-molding of the invention, in upper mold
Identical as above-mentioned upper mold 1 in 101 construction, stand base 120 keeps packaging body inserts 140 by spring member 121
At will not fall off downwards.
In addition, upper mold 101 with upper mold 1 the difference is that, flange receiving portion is not provided on bottom plate 130, even
Flange part is not provided on fitting 141.That is, becoming the guarantor for undertaking packaging body inserts 140 by spring member 121 in upper mold 101
The construction of the auxiliary of the abutting of the lower end surface of the upper surface and spacer 50 of connector 141 when holding and molding.
[third embodiment]
In turn, the third embodiment for applying mold for resin-molding of the invention is illustrated.In addition, hereinafter,
For with the duplicate structure of content in the first embodiment and second embodiment that are explained, omit detailed
Explanation, be illustrated centered on the part different from first embodiment and second embodiment by structure.
Here, as shown in Figure 8 and Figure 9, in the third embodiment for applying mold for resin-molding of the invention,
It is identical as above-mentioned upper mold 1 in the construction of upper mold 201, flange receiving portion 231 is provided on bottom plate 230.In addition, connecting
The top of part 241 is provided with flange part 243.
The flange receiving portion 231 is chimeric with flange part 243, and in die sinking, packaging body inserts 240 is retained will not be to
Lower section falls off.
In addition, upper mold 201 with upper mold 1 the difference is that, be not provided with inlaying packaging body in stand base 220
The spring member this point that part 240 is kept upwards.That is, becoming in upper mold 201 through flange receiving portion 231 and flange part
The upper surface of connector 241 when 243 chimeric holding and molding to undertake packaging body inserts 240 and spacer 50
The structure of the auxiliary of the abutting of lower end surface.In this way, in applying mold for resin-molding of the invention, about remaining potted body
The construction of inserts, be also possible to the construction merely with spring member, merely with flange carrier and flange part chimeric structure
It makes.
As described above, the method for adjustment of mold for resin-molding of the invention becomes the thickness in manufacture resin formation part
The method of the change of the thickness of resin formation part can be easily coped with when different type.
In addition, mold for resin-molding of the invention is in the different type of thickness for manufacturing resin formation part, Neng Gourong
It changes places and copes with the change of the thickness of resin formation part.
Description of symbols
1 upper mold
2 lower dies
11 upper mold mould groups
The protrusion 11a
12 upper mold die sleeves 12
13 type chambers
14 type chambers
20 stand base
20a recess portion
21 spring members
22 support columns
23 type chamber bars
30 bottom plates
31 flange receiving portions
32 through holes
40 packaging body inserts
41 connectors
43 flange parts
44 regions
50 spacers
50a groove portion
51 spacers
60 spring members
101 upper molds
120 stand base
121 spring members
130 bottom plates
140 packaging body inserts
141 connectors
201 upper molds
230 bottom plates
231 flange receiving portions
220 stand base
240 packaging body inserts
241 connectors
243 flange parts
Claims (5)
1. a kind of method of adjustment of mold for resin-molding,
The mold of one side includes first component；And second component, it can be displaced relative to the first component, in die opening state
Under be configured in mold close position with pairs of another party,
By make the mold of described another party to the mold of the party it is mobile and carry out molding when, by making described first
Component and the second component are moved to from the direction that the mold of described another party leaves, by the first component and described second
Component fills at least part of the defined type chamber of sealing resin being formed with the opposite face of the mold of described another party,
It is characterized in that,
The method of adjustment of the mold for resin-molding has the work that the adjustment for limiting the movement is carried out under die opening state
Sequence,
Pass through molding and second structure by the region configuration opposite with the mold of described another party in the second component
The limiting member that part abuts, carries out the adjustment for limiting the movement.
2. a kind of mold for resin-molding,
The mold of one side includes first component；And second component, it can be displaced relative to the first component,
By make the mold of described another party to the mold of the party it is mobile and carry out molding when, by making described first
Component and the second component are to mobile from the direction that the mold of pairs of another party leaves, by the first component and described the
Two components fill at least part of the defined type chamber of sealing resin being formed with the opposite face of the mold of described another party,
It is characterized in that,
The mold for resin-molding has:
Third component, the position of the mold by the way that the second component to be disposed in proximity to described another party under die opening state,
Defined space is formed in the region opposite with the mold of described another party of the second component；And
Limiting member can be configured at and pass through molding by being configured at the space using the space that the third component is formed
And abutted with the second component, limit the movement of the second component.
3. mold for resin-molding according to claim 2, which is characterized in that
The third component is elastic component, is exerted a force towards the direction of the mold of described another party to the second component, by this
Second component is disposed in proximity to the position of the mold of the another party.
4. mold for resin-molding according to claim 2 or 3, which is characterized in that
The first component and the second component are linked integrated by elastic component.
5. the mold for resin-molding according to any one of claim 2~4, which is characterized in that
Under die opening state, the first component and the second component are chimeric, can be kept by the third component this second
Component is configured in the state of the position of the mold close to described another party.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017-141916 | 2017-07-21 | ||
| JP2017141916A JP6296195B1 (en) | 2017-07-21 | 2017-07-21 | Resin sealing mold adjustment method and resin sealing mold |
| PCT/JP2018/024875 WO2019017186A1 (en) | 2017-07-21 | 2018-06-29 | Resin sealing mold adjusting method and resin sealing mold |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109982821A true CN109982821A (en) | 2019-07-05 |
| CN109982821B CN109982821B (en) | 2021-01-22 |
Family
ID=61629186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880004487.7A Active CN109982821B (en) | 2017-07-21 | 2018-06-29 | Method for adjusting resin sealing mold and resin sealing mold |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP6296195B1 (en) |
| KR (1) | KR102188767B1 (en) |
| CN (1) | CN109982821B (en) |
| TW (1) | TWI720327B (en) |
| WO (1) | WO2019017186A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112976666A (en) * | 2019-12-12 | 2021-06-18 | 东莞市天贺电子科技有限公司 | Dynamic balance buffer mechanism applied to compression forming die |
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- 2017-07-21 JP JP2017141916A patent/JP6296195B1/en active Active
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2018
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- 2018-06-29 CN CN201880004487.7A patent/CN109982821B/en active Active
- 2018-06-29 KR KR1020197014113A patent/KR102188767B1/en active IP Right Grant
- 2018-07-12 TW TW107124002A patent/TWI720327B/en active
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| JPH10258445A (en) * | 1997-03-19 | 1998-09-29 | Oki Electric Ind Co Ltd | Mold for resin sealing of semiconductor device |
| CN1378254A (en) * | 2001-03-27 | 2002-11-06 | 冲电气工业株式会社 | Method for producing chip, seal device, metal mold and runner and semiconductor device |
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| CN112976666A (en) * | 2019-12-12 | 2021-06-18 | 东莞市天贺电子科技有限公司 | Dynamic balance buffer mechanism applied to compression forming die |
| CN112976666B (en) * | 2019-12-12 | 2022-07-26 | 东莞市天贺电子科技有限公司 | Dynamic balance buffer mechanism applied to compression forming die |
Also Published As
| Publication number | Publication date |
|---|---|
| CN109982821B (en) | 2021-01-22 |
| WO2019017186A1 (en) | 2019-01-24 |
| KR20190070949A (en) | 2019-06-21 |
| JP6296195B1 (en) | 2018-03-20 |
| TW201908103A (en) | 2019-03-01 |
| TWI720327B (en) | 2021-03-01 |
| KR102188767B1 (en) | 2020-12-08 |
| JP2019018530A (en) | 2019-02-07 |
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