CN109980074A - The preparation method of LED headlamp - Google Patents
The preparation method of LED headlamp Download PDFInfo
- Publication number
- CN109980074A CN109980074A CN201711442109.0A CN201711442109A CN109980074A CN 109980074 A CN109980074 A CN 109980074A CN 201711442109 A CN201711442109 A CN 201711442109A CN 109980074 A CN109980074 A CN 109980074A
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- Prior art keywords
- preparation
- white
- lamp bead
- led headlamp
- obtains
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0058—Processes relating to semiconductor body packages relating to optical field-shaping elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0066—Processes relating to semiconductor body packages relating to arrangements for conducting electric current to or from the semiconductor body
Abstract
The present invention provides a kind of preparation methods of LED headlamp, comprising: S1 provides the white chip that surrounding is with white glue；S2 obtains lamp bead in white chip surface rolling silica-gel lens；Lamp bead is attached to the two sides of electrically-conductive backing plate by S3 respectively according to preset position, obtains LED headlamp.It realizes 360 ° of headlight and shines, and simply and easily substitutes existing halogen lamp or xenon lamp, does not need labor intensive and carries out light distribution.
Description
Technical field
The present invention relates to semiconductor light-emitting-diode field, in particular to a kind of preparation method of LED headlamp.
Background technique
As emerging LED (Light Emitting Diode, light emitting diode) lighting area, LED automobile headlight
It has begun and replaces traditional xenon lamp, be applied to middle-to-high end car illumination market, and is gradually universal to low side vehicle.Due to vapour
The reliability and light decay of vehicle product have rigors, and currently only a few producer such as Lumiled, Osram, Nichia obtains
The approval of automobile vendor, the Samsung Soul of South Korea also obtain the approval of vehicle system, South Korea under governmental support.
For filling market after automobile, someone directly makees car light using the LED lamp bead substitution of illumination, need a large amount of time into
Row light distribution, and light distribution effect is bad；Somebody using line style strip car light as car light (120~130 ° of light emitting angle), but
It is not substitute the light emitting angle of halogen lamp or 360 ° of xenon lamp also without all the illumination of lamp bead is used.
Summary of the invention
In view of the above-mentioned problems, the present invention is intended to provide a kind of preparation method of LED headlamp, before effectively solving existing LED
The lesser technical problem of headlight light emitting angle.
In order to achieve the above objectives, technical solution provided by the invention is as follows:
A kind of preparation method of LED headlamp, comprising:
S1 provides the white chip that surrounding is with white glue；
S2 obtains lamp bead in white chip surface rolling silica-gel lens；
Lamp bead is attached to the two sides of electrically-conductive backing plate by S3 respectively according to preset position, obtains LED headlamp.
It is further preferred that in step s 2,180 ° of the lamp bead shine.
It is further preferred that in step s3, the electrically-conductive backing plate with a thickness of 0.5~1.5mm.
It is further preferred that further including the steps that preparing white chip before step S1, comprising:
S01 is regularly arranged on bottom plate by the blue chip prepared, shines face-up；
Silica gel is sprayed on blue chip surface by S02；
Fluorescence diaphragm is affixed on the blue chip surface for being sprayed with silica gel by S03；
White glue is filled up the gap between blue chip using the method vacuumized by S04, obtains white chip.
It is further preferred that the spacing between blue chip is 80~150 μm in step S01.
It is further preferred that in step S01, silica gel with a thickness of 2~8 μm.
It is further preferred that in step S01, fluorescence diaphragm with a thickness of 30~50 μm.
In the preparation method of LED headlamp provided by the invention, in white chip surface rolling silica-gel lens, make to obtain
180 ° of lamp bead shine, the two sides that lamp bead is attached to electrically-conductive backing plate respectively later obtain headlight, realize 360 ° of headlight hairs
Light simply and easily substitutes existing halogen lamp or xenon lamp, does not need labor intensive and carries out light distribution.In addition, in the present invention, it will
Lamp bead is assemblied in the electrically-conductive backing plate surface that tow sides are designed with circuit, and by the setting of the thickness of electrically-conductive backing plate 0.5~
1.5mm greatly strengthens center illumination, improves light efficiency for the LED headlamp that existing light source thickness reaches 2mm.
Detailed description of the invention
Fig. 1 is the preparation method flow diagram of LED headlamp in the present invention；
Fig. 2 is that single lamp bead is affixed on copper base positive structure schematic in the present invention；
Fig. 3 is that single lamp bead is affixed on copper base side structure schematic diagram in the present invention.
Specific embodiment
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, Detailed description of the invention will be compareed below
A specific embodiment of the invention.It should be evident that drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, it can also be obtained according to these attached drawings other
Attached drawing, and obtain other embodiments.
To make simplified form, part related to the present invention is only schematically shown in each figure, their not generations
Its practical structures as product of table.
It is as shown in Figure 1 the preparation method flow diagram of LED headlamp provided by the invention, it can be seen from the figure that
It include: that S1 provides the white chip that surrounding is with white glue in the preparation method；S2 in white chip surface rolling silica-gel lens,
Obtain lamp bead；Lamp bead is attached to electrically-conductive backing plate according to preset position by S3 respectively, and (electrically-conductive backing plate two sides is respectively equipped with circuit, thickness
Can be in instances copper base, aluminum substrate etc. for 0.5~1.5mm) two sides, realize that 360 ° of headlight shine, simple side
Just the existing halogen lamp of substitution or xenon lamp do not need labor intensive and carry out light distribution；In addition, being reached relative to existing light source thickness
For the LED headlamp of 2mm, center illumination is greatly strengthened, light efficiency is improved.
In one example, firstly, by blue chip 1 it is regularly arranged on ceramic substrate 2 (ceramic substrate 2 with a thickness of
0.45mm), the spacing between blue chip 1 is 80 μm；Later, the silica gel of 5 μ m-thicks is sprayed on blue chip 1；It later, will be thick
Degree toasts 1h on the blue chip surface for being sprayed with silica gel, and at 150 DEG C for 50 μm of fluorescence diaphragm patch 3.
Later, it will uniformly mix to obtain white glue 4 containing oxides such as TiO2, ZnO, SiO2 according to certain proportion, and
The two sides (two sides in gap between chip and chip) that white glue is poured into blue chip, are put into and vacuumize in case, using vacuumizing
White glue is filled up the gap between chip, and put it into high temperature roaster by air-flow pressure, in 150 DEG C of baking 2h, obtains white light core
Piece.
Later, pressing a silica-gel lens 5 to obtain light emitting angle above ceramic substrate 1 is 180 ° of lamp bead, and by silica gel
Lens 5 solidify.Then obtained whole plate lamp bead is subjected to photoelectricity test, and is cut to single lamp bead after the completion of test.
Finally, lamp bead to be attached to the two sides of the copper base 6 with a thickness of 1.0mm respectively, (single lamp bead is shown as shown in Figure 2
Be affixed on copper base positive structure schematic) and Fig. 3 shown in (single lamp bead is shown and is affixed on copper base side structure schematic diagram), position
Such as halogen lamp or xenon source, LED headlamp is obtained, realizes the replacement to halogen lamp or xenon source.
Claims (7)
1. a kind of preparation method of LED headlamp, which is characterized in that include: in the preparation method
S1 provides the white chip that surrounding is with white glue；
S2 obtains lamp bead in white chip surface rolling silica-gel lens；
Lamp bead is attached to the two sides of electrically-conductive backing plate by S3 respectively according to preset position, obtains LED headlamp.
2. preparation method as described in claim 1, which is characterized in that in step s 2,180 ° of the lamp bead shine.
3. preparation method as described in claim 1, which is characterized in that in step s3, the electrically-conductive backing plate with a thickness of 0.5
~1.5mm.
4. the preparation method as described in claims 1 or 2 or 3, which is characterized in that further include preparing white light core before step S1
The step of piece, comprising:
S01 is regularly arranged on bottom plate by the blue chip prepared, shines face-up；
Silica gel is sprayed on blue chip surface by S02；
Fluorescence diaphragm is affixed on the blue chip surface for being sprayed with silica gel by S03；
White glue is filled up the gap between blue chip using the method vacuumized by S04, obtains white chip.
5. preparation method as claimed in claim 4, which is characterized in that in step S01, the spacing between blue chip is 80
~150 μm.
6. preparation method as claimed in claim 4, which is characterized in that in step S01, silica gel with a thickness of 2~8 μm.
7. preparation method as claimed in claim 4, which is characterized in that in step S01, fluorescence diaphragm with a thickness of 30~50
μm。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711442109.0A CN109980074A (en) | 2017-12-27 | 2017-12-27 | The preparation method of LED headlamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711442109.0A CN109980074A (en) | 2017-12-27 | 2017-12-27 | The preparation method of LED headlamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109980074A true CN109980074A (en) | 2019-07-05 |
Family
ID=67071514
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711442109.0A Pending CN109980074A (en) | 2017-12-27 | 2017-12-27 | The preparation method of LED headlamp |
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| Country | Link |
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| CN (1) | CN109980074A (en) |
Citations (14)
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|---|---|---|---|---|
| CN1577907A (en) * | 2003-07-09 | 2005-02-09 | 日亚化学工业株式会社 | Light emitting device, method of manufacturing the same and lighting equipment |
| CN103165796A (en) * | 2013-03-01 | 2013-06-19 | 上海嘉塘电子有限公司 | Fluorescent lampshade type light-emitting diode (LED) white light module |
| CN203586033U (en) * | 2013-12-12 | 2014-05-07 | 惠州市英吉尔光电科技有限公司 | 360-degree non-light-tight car lamp |
| CN204333029U (en) * | 2015-01-14 | 2015-05-13 | 广州市尤特新材料有限公司 | A kind of 360 degree of emitting led board structures and LED light source |
| CN104990020A (en) * | 2015-08-04 | 2015-10-21 | 苏州晶品新材料股份有限公司 | Double-face light-extraction slice type LED automobile headlamp |
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| CN206040705U (en) * | 2016-08-30 | 2017-03-22 | 河北神通光电科技有限公司 | White light LED collection moulding piece of independent encapsulation |
| CN206210837U (en) * | 2016-06-17 | 2017-05-31 | 深圳市兆驰节能照明股份有限公司 | Wafer-level package light-emitting device |
| CN106848031A (en) * | 2015-12-04 | 2017-06-13 | 财团法人工业技术研究院 | The encapsulating structure of ultraviolet light-emitting diodes |
| CN206332049U (en) * | 2016-12-28 | 2017-07-14 | 厦门市三安光电科技有限公司 | A kind of UV LED encapsulating structure |
| CN107013867A (en) * | 2017-06-01 | 2017-08-04 | 广州市日雄电子科技有限公司 | A kind of automobile LED headlamp |
| CN206379350U (en) * | 2016-12-12 | 2017-08-04 | 晶能光电（江西）有限公司 | A kind of polycrystalline LED and a kind of LED lamp of automobile |
| CN206505946U (en) * | 2017-02-17 | 2017-09-19 | 深圳市莱帝森环保节能科技有限公司 | A kind of LED/light source of specular removal |
| CN107339652A (en) * | 2016-04-28 | 2017-11-10 | 苏州科医世凯半导体技术有限责任公司 | A kind of automobile front component based on LED filament |
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2017
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Patent Citations (14)
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| CN1577907A (en) * | 2003-07-09 | 2005-02-09 | 日亚化学工业株式会社 | Light emitting device, method of manufacturing the same and lighting equipment |
| CN103165796A (en) * | 2013-03-01 | 2013-06-19 | 上海嘉塘电子有限公司 | Fluorescent lampshade type light-emitting diode (LED) white light module |
| CN203586033U (en) * | 2013-12-12 | 2014-05-07 | 惠州市英吉尔光电科技有限公司 | 360-degree non-light-tight car lamp |
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| CN204333029U (en) * | 2015-01-14 | 2015-05-13 | 广州市尤特新材料有限公司 | A kind of 360 degree of emitting led board structures and LED light source |
| CN104990020A (en) * | 2015-08-04 | 2015-10-21 | 苏州晶品新材料股份有限公司 | Double-face light-extraction slice type LED automobile headlamp |
| CN106848031A (en) * | 2015-12-04 | 2017-06-13 | 财团法人工业技术研究院 | The encapsulating structure of ultraviolet light-emitting diodes |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190705 |
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| RJ01 | Rejection of invention patent application after publication |